WO2005107341A1 - プラズマ処理方法及びその装置 - Google Patents
プラズマ処理方法及びその装置 Download PDFInfo
- Publication number
- WO2005107341A1 WO2005107341A1 PCT/JP2004/012471 JP2004012471W WO2005107341A1 WO 2005107341 A1 WO2005107341 A1 WO 2005107341A1 JP 2004012471 W JP2004012471 W JP 2004012471W WO 2005107341 A1 WO2005107341 A1 WO 2005107341A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- discharge
- plasma
- plasma processing
- electrodes
- magnetic field
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J19/087—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy
- B01J19/088—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/47—Generating plasma using corona discharges
- H05H1/471—Pointed electrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J2219/0803—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy
- B01J2219/0805—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges
- B01J2219/0807—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges involving electrodes
- B01J2219/0809—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges involving electrodes employing two or more electrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J2219/0803—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy
- B01J2219/0805—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges
- B01J2219/0807—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges involving electrodes
- B01J2219/0824—Details relating to the shape of the electrodes
- B01J2219/0826—Details relating to the shape of the electrodes essentially linear
- B01J2219/0828—Wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J2219/0803—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy
- B01J2219/0805—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges
- B01J2219/0807—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges involving electrodes
- B01J2219/0824—Details relating to the shape of the electrodes
- B01J2219/0826—Details relating to the shape of the electrodes essentially linear
- B01J2219/083—Details relating to the shape of the electrodes essentially linear cylindrical
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J2219/0803—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy
- B01J2219/0805—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges
- B01J2219/0807—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges involving electrodes
- B01J2219/0837—Details relating to the material of the electrodes
- B01J2219/0841—Metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J2219/0803—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy
- B01J2219/0805—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges
- B01J2219/0845—Details relating to the type of discharge
- B01J2219/0849—Corona pulse discharge
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J2219/0873—Materials to be treated
- B01J2219/0879—Solid
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/47—Generating plasma using corona discharges
Definitions
- the present invention mainly relates to hydrophilicity of water repellency on the surface of a resin such as polyethylene, polypropylene, polyester (PET), and PTFE (polytetrafluoroethylene) when a paint is applied or printed. It is applied to various surface treatments such as cleaning, sterilization, sterilization and etching of organic substances attached to the surface of glass, ceramics, metals, semiconductors, etc., or gas decomposition processes. Specifically, the surface of the object to be treated is irradiated with excited species such as excited molecules, radicals, and ions generated as a result of molecular dissociation by plasma generated by corona discharge to perform surface treatment such as reforming.
- the present invention relates to a corona discharge type plasma processing method and an apparatus therefor.
- the corona discharge plasma surface treatment method eliminates the use of an ignition gas such as helium, argon, or hydrogen, which is necessary in the case of a glow discharge plasma surface treatment method under atmospheric pressure. It is widely used for surface treatments such as surface modification because it has the advantage of reducing processing costs by improving safety and reducing gas consumption.
- an ignition gas such as helium, argon, or hydrogen
- the present invention has been made in view of the above situation, and has as its object to provide a plasma processing method and apparatus capable of supplying power supplied to a plurality of discharge units with a single transformer.
- a plasma processing method provides a plasma processing method in which a pulse voltage is applied between discharge electrodes positioned opposite to each other and a corona discharge is caused between the tips of the discharge electrodes.
- a corona discharge is generated between the discharge electrodes in each discharge unit.
- a pulse voltage is applied to opposing discharge electrodes to generate corona discharge between the tips of the discharge electrodes, and the corona discharge is generated by the corona discharge.
- a plasma surface treatment apparatus configured to perform surface treatment by irradiating the surface of an object with excited species containing plasma to be processed, and branches an output circuit derived from one of the secondary terminals of a transformer.
- a rectifier is arranged in each branch circuit, and this branch circuit is connected to one discharge electrode of a different discharge unit, and the other of the secondary terminals of the transformer is branched to form another discharge electrode of a different discharge unit.
- a corona discharge is generated between the discharge electrodes based on a pulse voltage applied between the discharge electrodes in each discharge unit.
- a plurality of discharge units are supplied with a pulse voltage from one transformer to discharge the discharge units. Even if a plurality of discharge units are arranged to increase the area, only one transformer is required, so that the device can be downsized and the equipment cost can be kept low. Force also generates corona discharge alternately with a pair of discharge units Therefore, it is possible to treat both sides of the object to be treated with the power supply from the same transformer.
- the pulse voltage applied to the discharge electrode may be a rectangular wave pulse voltage as described in claim 2, or a pulse voltage as described in claim 3.
- any of the panel voltages composed of a plurality of pulsating waves obtained by rectifying the AC voltage in both waves may be used.
- a special pulse voltage generation power supply is not required, and a combination of a commercial or ultrasonic AC power supply and a rectifier such as a diode is required.
- a pulse voltage is applied to the discharge electrode to generate a corona discharge between both electrodes.
- the excited species including the plasma generated by the corona discharge are present in the magnetic field, and the force pushing out the charged particles of the plasma moving in the magnetic field from the magnetic field, that is, The Lorentz force acts, so that the excited species can be irradiated almost uniformly over a wide area, vibrating toward the surface of the object.
- the magnetic field forming means in the corona discharge type plasma processing apparatus includes a permanent magnet, a pair of magnetic bodies, and a pair of pole pieces forming a gap between end faces. Or a combination of an electromagnet connected to a DC power supply, a pair of magnetic bodies, and a pair of pole pieces forming a gap between end faces, as described in claim 9. There may be.
- permanent magnets When permanent magnets are used, production costs can be reduced and power consumption can be reduced.
- the manufacturing cost and power consumption are increased as compared with the case where a permanent magnet is used.
- the low sinker and, consequently, the plasma are reduced by adjusting the magnetic flux density of the gap between the end faces of the pole pieces. Easy and arbitrarily control the irradiation power and irradiation diffusion range of the excited species, including the surface morphology of the object to be processed. It can be further improved.
- argon, nitrogen, and carbon dioxide When a reactive gas such as gas or air is introduced between discharge electrodes at or near atmospheric pressure, excited species including plasma are radiated toward the surface of the workpiece by the flow of the gas, and the It can be used for various surface treatments by irradiating the surface with irradiation amount, irradiation area and irradiation uniformity, and irradiating the excited gas flow including plasma with the pushing force (Lorentz force) that receives from the magnetic field. It is possible to do.
- a reactive gas such as gas or air
- excited species including plasma are radiated toward the surface of the workpiece by the flow of the gas, and the It can be used for various surface treatments by irradiating the surface with irradiation amount, irradiation area and irradiation uniformity, and irradiating the excited gas flow including plasma with the pushing force (Lorentz force) that receives from the magnetic field. It is possible to do.
- FIG. 1 is a partially omitted longitudinal sectional front view showing an embodiment of a plasma processing apparatus according to the present invention.
- FIG. 2 is a partially cutaway perspective view of the device of FIG. 1.
- FIG. 1 is a schematic longitudinal front view showing an embodiment of a plasma surface treatment apparatus to which the method of the present invention is applied
- FIG. 2 is a partially cutaway perspective view.
- This plasma surface treatment apparatus has a plate-shaped insulating member (3) in which a number of gas ejection holes (1) are arranged in a row and a gas reservoir (2) communicating with the upper end of each gas ejection hole is formed.
- a discharge electrode (4) supported by a plate-shaped insulating member (3), a pair of ceramic insulating spacers (5) formed so as to sandwich the discharge electrode (4) from front and rear, and a ceramic.
- Pole pieces (6) and (7) arranged outside the insulating spacer (5) made of magnets, and magnets (8) magnetically connected and connected to the pole pieces (6) and (7), respectively And a connecting rod (9) made of a magnetic material for connecting upper ends of the magnet (8), and a power supply (10) for applying a discharge voltage to the discharge electrode (4).
- the discharge electrode (4) includes a first electrode (11) formed in a substantially L shape, and a substantially L-shaped second electrode (12) disposed in a state facing the first electrode (11). ). These electrodes (11X12) are made of heat-resistant metal such as tungsten or molybdenum.
- the power supply device (10) includes an AC power supply (14), a transformer (15) for boosting AC, and a capacitor of a voltage doubler rectifier circuit arranged on a secondary side of the transformer (15).
- a pulse voltage applying means (16) consisting of a double-wave rectifier circuit, which is removed.
- An output circuit (17) for electrically connecting the two is formed in a branched manner, and the branched output circuits (17) are connected to first electrodes (11) of different discharge units.
- a second high-voltage rectifier diode (19X20) is interposed in each of the second output circuits (18) for electrically connecting the other of the secondary terminals of the transformer (15) and the second electrode (12). is there.
- the high-voltage rectifier diode (19) and the high-voltage rectifier diode (20) are arranged with their flow directions reversed, and in one of the discharge units, the second electrode (12) is opposed to the first electrode (11). Discharge starts when a high voltage is output, and in the other discharge unit, discharge starts when the second electrode (12) outputs a low voltage to the first electrode (11). .
- the panel voltage application means (16) alternately applies half-wave rectified positive and negative pulsating wave S-pulse voltages on the positive and negative voltage sides, respectively, and the first electrode (11) and the second electrode ( A corona discharge is generated between the tips of 12), and excited species including plasma are generated by the corona discharge.
- the power supply device (10) includes a transformer (15) that boosts a 50 Hz- ⁇ AC power supply into a sine wave having a peak value Vp of 5 to 15 KV, and converts the boosted sine wave to a sine wave having a peak value of 5 to 15 KV.
- a magnetic field forming means for forming a magnetic field along a horizontal plane orthogonal to the flow of the gas containing the charged particles in the plasma generated by the corona discharge is provided immediately near the tip of the discharge electrode (4). Have been.
- the magnetic field forming means is connected to the permanent magnet (8) disposed above the base end of the discharge electrode (4) and to the N and S poles of the permanent magnet (8) to form a pair of discharge electrodes (4).
- a pair of soft magnetic materials such as pure iron, extended to near the point and A pair of pole pieces (6, 7) made of pure iron, etc., which are integrally connected to the tip of the body and form a gap for forming a magnetic field between the end faces facing each other across the point of the discharge electrode (4)
- the extruding force that is, the Lorentz force acts, and the excited species including the plasma are configured to be irradiated toward the surface of the workpiece as shown by the arrow X in FIGS. 1 and 2. .
- the Lorentz force F is as follows, where Q is the particle charge, v is the velocity, and B is the magnetic flux density of the gap between the end faces of the pole pieces.
- a reactive gas or air such as argon, nitrogen, oxygen, carbon dioxide, or the like is supplied from the gas ejection holes (1) formed on the plate-shaped insulating member (3) to the atmospheric pressure or near the atmospheric pressure. It is configured to be introduced between a pair of discharge electrodes below to irradiate a flow of an exciting gas containing plasma toward the surface of the workpiece with Lorentz force from a magnetic field. Therefore, the applicability of the surface treatment can be expanded.
- the pole pieces (6) and (7) connected to the N and S poles of the permanent magnet (8) via a soft magnetic material are used.
- a magnetic field (magnetic field) composed of an effective magnetic flux and a leakage magnetic flux is formed in the gap between the first electrode (11) and the second electrode (12).
- a positive or negative pulse voltage with a pulse frequency of 10-200 Hz is applied between the electrodes and a corona discharge is generated alternately between the tips of both electrodes (11X12), the plasma generated by this corona discharge is included.
- Excited species are present in the magnetic field, and charged particles in the plasma moving in the magnetic field are subjected to the above-mentioned Lorentz force F from the magnetic field. Power will be given.
- a plurality of pulsating currents obtained by rectifying an AC voltage are applied to the first electrode (11) and the second electrode (12) constituting the pair of discharge electrodes (4).
- Each uses a positive or negative pulse voltage composed of waves, for example, a multivibrator ⁇ Schmidt 'trigger
- No special pulse voltage generation power supply such as a circuit and a blocking oscillator is required, and a pulse voltage of a desired period and duty is used while using a commercial AC power supply or a simple power supply consisting of an ultrasonic power supply and a rectifier such as a diode. It is possible to reduce the introduction cost and running cost of the entire apparatus by using a permanent magnet (8), which has a low production cost and consumes no power, as the magnetic field forming means.
- the permanent magnet (8) is used as the magnetic field forming means (M).
- the magnetic field forming means may be an electromagnet.
- an electromagnet is used as the magnetic field forming means (M)
- the Lorentz force F can be controlled, and the force perpendicular to the magnetic field applied to the excited species including plasma can be adjusted.
- a magnetic field is formed between the end faces opposing each other with the pointed end of the discharge electrode (4) therebetween, and a reactive gas or air is ejected between the end faces. Force Magnetic field formation and gas introduction are good, even if only one is wrong.
- the pulse voltage applying means is configured by the AC power supply and the rectifier circuit that generates a pulse voltage composed of a plurality of pulsating waves obtained by rectifying the AC voltage in both waves.
- the pulse voltage applying means may be a pulse wave generating power supply for generating a rectangular pulse voltage.
- the present invention mainly provides hydrophilicity to the water repellency of the surface of a resin such as polyethylene, polypropylene, polyester (PET), or PTFE (polytetrafluoroethylene) when a paint is applied or printed.
- a resin such as polyethylene, polypropylene, polyester (PET), or PTFE (polytetrafluoroethylene)
- PET polypropylene
- PTFE polytetrafluoroethylene
- Plasma generated by various surface treatments such as modifying the surface properties, cleaning, sterilizing, sterilizing, etching, etc. organic substances attached to the surface of glass, ceramics, metals, semiconductors, etc., and corona discharge It can be applied to the gas dissociation process using molecular dissociation.
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Toxicology (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Plasma Technology (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Drying Of Semiconductors (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA002554976A CA2554976A1 (en) | 2004-02-17 | 2004-08-30 | Plasma processing method and system therefor |
AU2004319231A AU2004319231A1 (en) | 2004-02-17 | 2004-08-30 | Plasma processing method and system therefor |
EP04772427A EP1725086A1 (en) | 2004-02-17 | 2004-08-30 | Plasma processing method and system therefor |
US10/589,732 US20070175747A1 (en) | 2004-02-17 | 2004-08-30 | Plasma processing method and apparatus thereof |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-040272 | 2004-02-17 | ||
JP2004040272A JP2005235448A (ja) | 2004-02-17 | 2004-02-17 | プラズマ処理方法及びその装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005107341A1 true WO2005107341A1 (ja) | 2005-11-10 |
Family
ID=35018191
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/012471 WO2005107341A1 (ja) | 2004-02-17 | 2004-08-30 | プラズマ処理方法及びその装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US20070175747A1 (ja) |
EP (1) | EP1725086A1 (ja) |
JP (1) | JP2005235448A (ja) |
KR (1) | KR20060111684A (ja) |
CN (1) | CN1918950A (ja) |
AU (1) | AU2004319231A1 (ja) |
CA (1) | CA2554976A1 (ja) |
WO (1) | WO2005107341A1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4782529B2 (ja) * | 2005-10-06 | 2011-09-28 | エア・ウォーター株式会社 | 表示装置の製造方法 |
KR101147349B1 (ko) | 2010-09-17 | 2012-05-23 | 인제대학교 산학협력단 | 누설 전류형 변압기를 이용한 플라즈마 처리장치 |
CN103732530A (zh) * | 2011-06-24 | 2014-04-16 | Jtw有限责任公司 | 用于使金属纳米簇生长的先进纳米技术 |
CN102647843A (zh) * | 2012-04-17 | 2012-08-22 | 中国科学院等离子体物理研究所 | 用于灭菌消毒的大气压等离子体发生装置 |
JP2015189007A (ja) | 2014-03-27 | 2015-11-02 | セイコーエプソン株式会社 | 造形物の製造方法 |
US11629860B2 (en) | 2018-07-17 | 2023-04-18 | Transient Plasma Systems, Inc. | Method and system for treating emissions using a transient pulsed plasma |
EP3824223B1 (en) | 2018-07-17 | 2024-03-06 | Transient Plasma Systems, Inc. | Method and system for treating cooking smoke emissions using a transient pulsed plasma |
US10933662B2 (en) | 2018-07-31 | 2021-03-02 | Ricoh Company, Ltd. | Image forming method, image forming apparatus, and image-formed matter |
EP3966845A4 (en) | 2019-05-07 | 2023-01-25 | Transient Plasma Systems, Inc. | NON-THERMAL PULSED ATMOSPHERIC PRESSURE PLASMA TREATMENT SYSTEM |
CN112118664B (zh) * | 2020-09-08 | 2021-11-19 | 西安交通大学 | 一种双路单间隙等离子体喷射装置及其应用 |
WO2022187226A1 (en) | 2021-03-03 | 2022-09-09 | Transient Plasma Systems, Inc. | Apparatus and methods of detecting transient discharge modes and/or closed loop control of pulsed systems employing same |
CN115235301B (zh) * | 2022-07-09 | 2024-06-14 | 南京理工大学 | 一种低功率空心阴极微等离子体的点火装置及点火方法 |
Citations (8)
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JPH0559198A (ja) * | 1991-02-02 | 1993-03-09 | Softal Elektron Gmbh | 種々な形状及び厚さをもつた導電性及び非導電性材料の間接的コロナ処理装置 |
JPH07226395A (ja) * | 1994-02-15 | 1995-08-22 | Matsushita Electric Ind Co Ltd | 真空プラズマ処理装置 |
JPH1160759A (ja) * | 1997-08-25 | 1999-03-05 | Sekisui Chem Co Ltd | コロナ放電処理方法 |
JPH11512651A (ja) * | 1995-12-28 | 1999-11-02 | セオンド エレクトリック カンパニー リミテッド | 高電圧電場を用いる排出ガス浄化と騒音低減の方法及びその装置 |
JP2002158219A (ja) * | 2000-09-06 | 2002-05-31 | Sekisui Chem Co Ltd | 放電プラズマ処理装置及びそれを用いた処理方法 |
JP2002305070A (ja) * | 2001-04-06 | 2002-10-18 | Toto Ltd | コロナ放電装置 |
JP2002332572A (ja) * | 2002-01-28 | 2002-11-22 | Semiconductor Energy Lab Co Ltd | 被膜形成装置 |
JP2003086393A (ja) * | 2001-09-12 | 2003-03-20 | Keyence Corp | 除電装置 |
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---|---|---|---|---|
KR880000215A (ko) * | 1986-06-10 | 1988-03-24 | 나까므라 히사오 | 시이트(sheet)상 물체의 플라즈마 처리장치 |
WO1997013266A2 (en) * | 1995-06-19 | 1997-04-10 | The University Of Tennessee Research Corporation | Discharge methods and electrodes for generating plasmas at one atmosphere of pressure, and materials treated therewith |
JP2001297896A (ja) * | 2000-04-14 | 2001-10-26 | Keyence Corp | プラズマ処理方法及びその装置 |
KR100661197B1 (ko) * | 2002-09-13 | 2006-12-22 | 펄 고교 가부시키가이샤 | 플라즈마표면처리방법 및 그 장치 |
JP2005093273A (ja) * | 2003-09-18 | 2005-04-07 | Pearl Kogyo Co Ltd | プラズマ処理方法及びその装置 |
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2004
- 2004-02-17 JP JP2004040272A patent/JP2005235448A/ja active Pending
- 2004-08-30 EP EP04772427A patent/EP1725086A1/en not_active Withdrawn
- 2004-08-30 WO PCT/JP2004/012471 patent/WO2005107341A1/ja active Application Filing
- 2004-08-30 CN CNA2004800418214A patent/CN1918950A/zh active Pending
- 2004-08-30 AU AU2004319231A patent/AU2004319231A1/en not_active Abandoned
- 2004-08-30 US US10/589,732 patent/US20070175747A1/en not_active Abandoned
- 2004-08-30 CA CA002554976A patent/CA2554976A1/en not_active Abandoned
- 2004-08-30 KR KR1020067015897A patent/KR20060111684A/ko not_active Application Discontinuation
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0559198A (ja) * | 1991-02-02 | 1993-03-09 | Softal Elektron Gmbh | 種々な形状及び厚さをもつた導電性及び非導電性材料の間接的コロナ処理装置 |
JPH07226395A (ja) * | 1994-02-15 | 1995-08-22 | Matsushita Electric Ind Co Ltd | 真空プラズマ処理装置 |
JPH11512651A (ja) * | 1995-12-28 | 1999-11-02 | セオンド エレクトリック カンパニー リミテッド | 高電圧電場を用いる排出ガス浄化と騒音低減の方法及びその装置 |
JPH1160759A (ja) * | 1997-08-25 | 1999-03-05 | Sekisui Chem Co Ltd | コロナ放電処理方法 |
JP2002158219A (ja) * | 2000-09-06 | 2002-05-31 | Sekisui Chem Co Ltd | 放電プラズマ処理装置及びそれを用いた処理方法 |
JP2002305070A (ja) * | 2001-04-06 | 2002-10-18 | Toto Ltd | コロナ放電装置 |
JP2003086393A (ja) * | 2001-09-12 | 2003-03-20 | Keyence Corp | 除電装置 |
JP2002332572A (ja) * | 2002-01-28 | 2002-11-22 | Semiconductor Energy Lab Co Ltd | 被膜形成装置 |
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EP1725086A1 (en) | 2006-11-22 |
JP2005235448A (ja) | 2005-09-02 |
US20070175747A1 (en) | 2007-08-02 |
KR20060111684A (ko) | 2006-10-27 |
AU2004319231A1 (en) | 2005-11-10 |
CA2554976A1 (en) | 2005-11-10 |
CN1918950A (zh) | 2007-02-21 |
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