WO2005097408A1 - Anneau de maintien pour maintenir des tranches de semi-conducteur dans un dispositif de polissage chimico-mecanique - Google Patents

Anneau de maintien pour maintenir des tranches de semi-conducteur dans un dispositif de polissage chimico-mecanique Download PDF

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Publication number
WO2005097408A1
WO2005097408A1 PCT/EP2005/002944 EP2005002944W WO2005097408A1 WO 2005097408 A1 WO2005097408 A1 WO 2005097408A1 EP 2005002944 W EP2005002944 W EP 2005002944W WO 2005097408 A1 WO2005097408 A1 WO 2005097408A1
Authority
WO
WIPO (PCT)
Prior art keywords
retaining ring
metal
plastic material
ring according
coating
Prior art date
Application number
PCT/EP2005/002944
Other languages
German (de)
English (en)
Inventor
Wilfried Ensinger
Lawrence G. Resavage
Original Assignee
Ensinger Kunststofftechnologie Gbr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ensinger Kunststofftechnologie Gbr filed Critical Ensinger Kunststofftechnologie Gbr
Publication of WO2005097408A1 publication Critical patent/WO2005097408A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings

Definitions

  • the invention relates to a retaining ring for holding semiconductor wafers in a chemical mechanical polishing device, as described, for example, in US Pat. No. 6,251,215.
  • integrated circuits are typically produced on semiconductor substrates, in particular silicon wafers, with conductive, semiconducting and insulating layers being deposited on the wafer in succession. After each layer is deposited, etching is carried out to implement the circuit functions. After a series of layers have been sequentially stored and etched, the top surface of the semiconductor substrate, i.e. the outer surface of the substrate, more and more uneven. This uneven surface causes problems in photolithographic steps in the manufacturing process of the integrated circuits. Therefore, there is always a need to make the surface of the semiconductor substrate flat.
  • CMP chemical mechanical polishing
  • a recurrent problem in the CMP process is the so-called edge effect, i.e. the tendency to polish the edge of the substrate to be polished at a different speed than the center of the substrate. This typically results in too much edge polishing, i.e. too much material is removed from the edge here, especially in the outermost 5 to 10 mm of a wafer with a diameter of 200 mm.
  • Too much polishing reduces the flatness of the substrate as a whole and makes the edge of the substrate unsuitable for the production of integrated circuits and thus reduces the process yield.
  • US Pat. No. 6,251,215 proposes to design the retaining ring in two parts, one part being made from a rigid material, namely a metal part, and a second part made from a plastic material which has a lower rigidity, so that on the one hand it is abrasive and on the other hand in contact with the semiconductor wafer it cannot damage it.
  • US Pat. No. 6,251,215 proposes to connect the plastic part of the retaining ring and the metal ring to one another with an epoxy adhesive. Alternatively, it is proposed to press-fit the two parts together.
  • both solutions prove to be insufficient.
  • the refurbishment of the retaining ring causes problems after the plastic part has been abraded to a certain extent.
  • the complete retaining rings have to be sent to the manufacturer, where the plastic part is mechanically removed and the adhesive residues from the metal part are subsequently thermally decomposed by heating to approx. 200 ° C. Then the metal part has to be sandblasted to remove the last residues of the adhesive, and only then can a new plastic ring be stuck on again.
  • the retaining rings as such become very expensive.
  • the metallic holding elements which are more expensive than the plastic elements in terms of production costs, only survive a small number of cycles, in particular because of the temperature treatment during thermal degradation of the adhesive and the sandblasting treatment subsequently required.
  • the object of the present invention is to propose a retaining ring which avoids the aforementioned problems.
  • the retaining ring comprises a metal ring, which is arranged concentrically therein, and is otherwise made of plastic material, the retaining ring on a first end face a support surface for supporting the retaining ring on a polishing surface of the polishing device and on the in the axial direction to the first face opposite side comprises mounting elements, by means of which the retaining ring can be mounted in the polishing device.
  • the construction of the retaining ring according to the invention permits cost-effective production, so that the retaining ring as a whole can be thrown away after excessive wear.
  • the metal ring is embedded in the plastic material and the plastic material is selected according to its mechanical properties ,
  • the plastic material can comprise, for example, a thermoplastic, a thermoset, an elastomer and / or a plastic mixture.
  • plastic material is used in reinforced, at least in some areas, in particular in fiber-reinforced form.
  • the plastic material adjacent to its first face, i.e. the side which forms the support surface for supporting the retaining ring on a polishing surface of the polishing device, without reinforcing materials or with a lower content of reinforcing materials than on its side comprising the mounting elements.
  • the retaining ring In this way, in the area that is held on the polishing device, a partial area is obtained that has increased mechanical stability and that stabilizes the overall shape of the retaining ring. On the side on which the abrasive wear takes place, the retaining ring then has lower strengths and is in particular less hard, so that contact between the semiconductor wafers to be processed and the plastic material for the wafers is gentler.
  • friction and / or wear-reducing additives for example PTFE, polyimide, molybdenum disulfide, graphite, boron nitride, nanoparticles or the like, can be mixed into the plastic material.
  • the reinforcing materials are limited to a core area of the retaining ring, in particular the area in which the assembly elements are then also arranged. This gives the holding ring additional rigidity and geometric integrity even under one-sided loads, while contact of the holding ring with the wafer cannot damage the wafer, since the wafer only comes into contact with the softer plastic materials.
  • the metal ring already provides the necessary rigidity and geometric integrity of the retaining ring, while the surrounding plastic material again has the function that the semiconductor wafer to be processed is not exposed to mechanical damage.
  • the mounting elements are preferably held on the metal ring, so that these, which are used for mounting the retaining ring on the polishing device, ensure an exact contact of the holding ring with the polishing device and thus additionally secure the geometric structure of the retaining ring.
  • the metal ring which is surrounded by the plastic material can remain uncovered, in particular on the upper side, ie on the side of the holding ring which faces the polishing device, since there is no contact with the wafer material here is concerned.
  • This side of the retaining ring is also exposed to the chemical agents of the chemical mechanical polishing process only slightly or not at all.
  • the simplest form for the metal ring to reinforce the retaining ring is a sheet metal ring. This can in particular be perforated or generally provided with openings, so that a positive connection between the plastic material and the metal ring takes place through the through-going plastic material.
  • a sheet metal ring which has an essentially cylindrical shape, i.e. used in the form of a cylinder wall.
  • metal washers can also be used, in which case a greater thickness of the sheet metal material may be required.
  • the surface of the metal ring which is in contact with the plastic material, is preferably provided with a surface roughness, at least in some areas, so that a more permanent connection between the rental material and plastic is possible.
  • the surface roughness of the partial areas can be formed by depressions, undercuts, cavities or the like. Is particularly preferred the surface roughness is formed by microscopic metal spheres applied to the surface of the metal ring.
  • Rings made of steel are frequently used as metal rings, it being possible for metal spheres to be applied with other metallic materials, for example copper or copper alloys.
  • the metal spheres used to form the surface roughness preferably have an average diameter of 300 to 600 ⁇ m.
  • the metal balls more preferably have an average diameter of 400 to 500 ⁇ m. These sizes of the metal spheres ensure that the pores of the coating formed in this way are large enough so that plastic material can flow in without any problems when the ring is encapsulated and thus leads to a mechanical connection between metal and plastic.
  • the beads are sufficiently small to allow regular coating, i.e. also to enable an essentially flat coating of the metal ring, so that its geometry remains essentially unchanged.
  • the metal spheres can be applied as a single-layer coating, as a so-called monolayer, on the surface of the metal ring, or else as a multi-layer coating, in particular 3 or more layers.
  • the thickness of the coating will preferably be 600 ⁇ m or more, with a thickness of the coating of 1 mm often already being sufficient in the case of multilayer coatings. However, larger layer thicknesses are not disadvantageous.
  • the partial areas of the surface of the metal ring are preferably delimited from one edge with respect to other surface areas.
  • the Edge then has essentially the height that corresponds to the thickness of the coating with metal balls.
  • the part of the retaining ring which is made of plastic material is constructed in two layers, with a wear layer and a carrier layer holding the wear layer.
  • the wear layer and the carrier layer are preferably in contact with one another with a flat contact surface, so that they can be glued to one another very easily, for example. Since the bonding often brings problems, especially in the environment in which the retaining rings are used, the wear layer and the support layer are further preferably welded to one another, so that there is no adhesive layer to be provided here, which is often a weak point in the combination of wear and tear. and carrier layer.
  • wear layer and the carrier layer are created together as a one-piece component.
  • the invention further relates to a method for producing a retaining ring, as has already been described in detail above.
  • a prefabricated metal ring is encapsulated with plastic material, so that at least one Surface area of the metal ring is in contact with the plastic material, at least part of the surface area being pretreated to create a surface roughness.
  • the surface roughness of the surface area of the metal ring is preferably generated by means of chemical etching, plasma etching, sandblasting or metal spraying.
  • Metal spraying, with which micro-metal spheres can be applied to the surface area of the metal ring, is particularly preferred.
  • An open-pore coating is preferably produced on the part of the surface area which is to have the surface roughness by means of metal spraying, in contrast to the conventional coating methods which work with metal spraying, the procedure is different.
  • the latter generally attempts to create a covering metal layer to protect the underlying materials.
  • an open-pore coating by means of metal spraying is sought in the sense of the present invention, so that plastic material flows into the open pores of the coating when the metal ring is encapsulated with plastic material and an adequate mechanical connection is thus achieved between the metal of the metal ring and the plastic of the rest of the retaining ring ,
  • the thickness of the coating is preferably at least 600 ⁇ m or more preferably 1 mm or more, and as explained in advance, very much greater layer thicknesses than 1 mm bring no greater advantages.
  • the metal spraying process is carried out in such a way that the microscopic spheres preferably have an average diameter of 300 to 600 ⁇ m, more preferably an average diameter of 400 to 500 ⁇ m.
  • the plastic material can flow into the microscopic depressions, undercuts and / or cavities or into the open pores of the coating. If the intention is to replace the plastic material with the metal ring, then it is preferably ensured that the open pores, or cavities and undercuts are not completely filled with the plastic material, so that the plastic part can be more easily detached from the metal ring and replaced can be realized.
  • Figures 1A-1D a first embodiment of a retaining ring of the present invention
  • FIGS. 2A-2D a further embodiment of the retaining ring according to the invention.
  • FIG. 3 an enlarged detail in a sectional representation of a variant of the embodiment of FIG. 2;
  • FIGS. 4A and 4B show a further embodiment of the retaining ring according to the invention.
  • Figures 5A and 5B another embodiment of the retaining ring according to the invention.
  • FIGS. 1A to 1D show a retaining ring 10 according to the invention, which is made of a fiber-reinforced plastic material and which essentially has a rectangular cross section.
  • the retaining ring LO has a cylindrical metal ring 11 which is arranged concentrically in the plastic material.
  • the retaining ring 10 Adjacent to the outer circumference 12, the retaining ring 10 has an axially projecting circumferential collar 14, in which threaded bushings 16 are arranged at regular intervals.
  • the threaded bushings IS are used to fasten the retaining ring in the chemical-mechanical polishing device and preferably form part of the metal ring 11.
  • the opposite side of the collar 14 of the retaining ring 10 forms a support surface 18 with which the retaining ring 10 rests on a polishing surface of the same during operation of the polishing device.
  • FIG. 1B shows the retaining ring 10 according to the invention along the section line A-A in FIG. 1A.
  • Figure IC shows an enlarged detail from the sectional view of Figure IB.
  • FIG. 1D shows the retaining ring 10 according to the invention again in a perspective view.
  • the circumferential collar 14 has a recess 20 on its surface facing the polishing device, in which a complementary projection engages in the assembled state on the part of the polishing device in order to facilitate the correct angular orientation of the retaining ring 10 with respect to the polishing device, so that the threaded bushings 16 automatically match them Breakthroughs on the side of the polishing device, through which the bolts protrude, can be achieved.
  • FIGS. 2A to 2D A further embodiment is shown in FIGS. 2A to 2D in the form of a retaining ring 30.
  • the structure of the retaining ring 30 differs from the structure of the retaining ring 10 in particular in that an annular disk-shaped metal ring 32 is embedded therein as a reinforcing element for the plastic material.
  • the metal ring is arranged concentrically with the retaining ring 30 and is preferably made from a perforated sheet material.
  • the plastic material will pass through the perforations in the perforated material and thus lead to a form-fitting anchoring of the metal ring 32 in the retaining ring 30.
  • the retaining ring 30 also has on its side facing the polishing device a collar 34 which projects in the axial direction and which is arranged adjacent to the outer circumferential surface 36 of the retaining ring 30. In the region of the collar 34, threaded bushings 40 are arranged at regular angular intervals, by means of which the retaining ring 30 can be mounted in the polishing device.
  • the collar 34 has a recess 42 into which a projection engages on the part of the polishing device and thus ensures that the retaining ring 30 is mounted at the correct angle.
  • the plastic material can be selected from a large spectrum and in particular can be optimized to the requirements of abrasion or abrasion resistance with respect to the polishing surface of the polishing device.
  • the rigidity of the retaining ring 30 is essentially ensured here by the strength and geometric integrity of the metal ring 32 (ring disk).
  • the metal ring 32 can serve to support the threaded bushings 40, so that the metal ring 32 can be prefabricated with the threaded bushings 40, inserted into an injection mold and then overmolded with plastic - due to the fact that the metal ring 32 is essentially completely made of the plastic material of the retaining ring 30, the metallic material from which the metal ring 32 is made can also be selected from a wide range of materials, since this barely or not at all with the chemical agents used for the chemical mechanical polishing of the semiconductor wafers become in contact. Corrosion problems are therefore not to be expected.
  • FIG. 3 shows an enlarged detail in a sectional view of a variant of the retaining ring of FIG. 2, the metal ring 32 remaining uncovered by the plastic material on its side facing the device.
  • FIGS. 4A and 4B show a further variant of the retaining ring according to the invention, in which the retaining ring 50, in addition to a metal ring carrying the threaded bushings 56 (otherwise not shown in detail), consists of a first ring part 52 made of plastic material and a second ring part 54 made of a further plastic material is made.
  • the first ring part 52 and the second ring part 54 are connected to one another via the contact layer 58, the surfaces of the first and second ring parts 52 and 54 being essentially identical in the radial direction.
  • the contact layer 58 is formed when the first and second ring portions 52 and 54 are friction welded together to form an integral structure.
  • the contact layer 58 can be formed if the first and the second ring part are produced simultaneously in a two-component injection molding process and the plastic materials of the first and second ring part come into contact with one another. While the plastic material for the first ring part is selected in such a way that it offers the highest possible stability for the retaining ring, and in so far as it supports the stabilizing function of the metal ring, the second plastic material is selected in order to optimize the abrasion and tribological properties of the retaining ring.
  • the first plastic material is preferably a reinforced plastic material, while the second plastic material preferably contains no or only a small proportion of reinforcing components.
  • the second plastic material from which the second ring part is formed contains parts of components which reduce the abrasion, since this ring part is designed to make contact with the polishing surface of the polishing device.
  • the plastic resins used for the first and second plastic materials to form the first and second ring part can be the same or different and form a matrix in which the reinforcement or abrasion-reducing material is embedded.
  • the plastic resin that forms the matrix for the first and second plastic material of the first and second ring parts will be the same. This has advantages in particular in friction welding, but also in two-component spraying processes.
  • FIGS. 5A and 5B show a further embodiment of the present invention with a retaining ring 60 which contains a metal ring 62 which is embedded in plastic material 64.
  • the metal ring 62 is preferably made of steel and has a coating 66 made of metal balls, preferably balls made of copper or a copper alloy, on a surface which is in contact with the plastic material 64. These metal spheres are on the surface in an open-pore structure with microscopic spaces. Men deposited, which allow the plastic material flows into the cavities or gaps between the individual balls of the coating 66 when the metal ring 62 is encapsulated and thereby creates a mechanical connection between the plastic material 64 and the metal of the metal ring 62.
  • the surface area of the metal ring 62 which carries the coating 66 is preferably delimited by an edge 68, the height of which is, for example, 1 mm.
  • a multilayer coating 66 made of metal spheres with an average diameter of 400 to 500 ⁇ m is then built up within this edge, so that there is a sufficiently deep layer of the coating into which plastic material can flow.
  • the coating could also be implemented as a so-called monolayer.
  • the plastic part 64 of the retaining ring 60 is made up of two layers, similar to what is shown in connection with FIGS. 4A and 4B, ie it becomes a carrier layer and a wear layer made of plastic materials, the plastic materials can then be selected depending on their function, as described above.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

L'invention a pour objet la conception d'un anneau de maintien (10) économique et de longévité élevée, qui sert à maintenir des tranches de semi-conducteur dans un dispositif de polissage chimico-mécanique. A cet effet, on se sert d'un anneau de maintien (10) qui comprend un anneau métallique (11) qui est disposé de façon concentrique dans l'anneau de maintien, et est réalisé en matière plastique, l'anneau de maintien (10) formant sur un premier côté facial, une surface d'appui (18) permettant à l'anneau de maintien de prendre appui sur une surface de polissage du dispositif de polissage, et comprenant sur le côté axialement opposé au premier côté facial, des éléments de montage qui servent à monter l'anneau de maintien dans le dispositif de polissage.
PCT/EP2005/002944 2004-04-02 2005-03-19 Anneau de maintien pour maintenir des tranches de semi-conducteur dans un dispositif de polissage chimico-mecanique WO2005097408A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004017789.9 2004-04-02
DE200410017789 DE102004017789A1 (de) 2004-04-02 2004-04-02 Haltering zum Halten von Halbleiterwafern in einer chemisch-mechanischen Poliervorrichtung

Publications (1)

Publication Number Publication Date
WO2005097408A1 true WO2005097408A1 (fr) 2005-10-20

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PCT/EP2005/002944 WO2005097408A1 (fr) 2004-04-02 2005-03-19 Anneau de maintien pour maintenir des tranches de semi-conducteur dans un dispositif de polissage chimico-mecanique

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DE (1) DE102004017789A1 (fr)
TW (1) TW200539373A (fr)
WO (1) WO2005097408A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001023135A2 (fr) * 1999-09-29 2001-04-05 Semiconductor Equipment Technology, Inc. Ensemble a bague de retenue recyclable pour dispositif de polissage chimique et mecanique
US20040040656A1 (en) * 2002-08-28 2004-03-04 Hengel Raymond J. Method and apparatus for CMP retaining ring
WO2004033153A2 (fr) * 2002-10-02 2004-04-22 Ensinger Kunststofftechnologie Gbr Anneau de fixation de plaquettes en semiconducteurs dans un dispositif de polissage par voie chimique-mecanique
US20040259485A1 (en) * 2002-10-02 2004-12-23 Ensinger Kunstsofftechnoligie Gbr Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6390908B1 (en) * 1999-07-01 2002-05-21 Applied Materials, Inc. Determining when to replace a retaining ring used in substrate polishing operations
US6264540B1 (en) * 2000-03-30 2001-07-24 Speedfam-Ipec Corporation Method and apparatus for disposable bladder carrier assembly
TWM255104U (en) * 2003-02-05 2005-01-11 Applied Materials Inc Retaining ring with flange for chemical mechanical polishing

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001023135A2 (fr) * 1999-09-29 2001-04-05 Semiconductor Equipment Technology, Inc. Ensemble a bague de retenue recyclable pour dispositif de polissage chimique et mecanique
US20040040656A1 (en) * 2002-08-28 2004-03-04 Hengel Raymond J. Method and apparatus for CMP retaining ring
WO2004033153A2 (fr) * 2002-10-02 2004-04-22 Ensinger Kunststofftechnologie Gbr Anneau de fixation de plaquettes en semiconducteurs dans un dispositif de polissage par voie chimique-mecanique
US20040259485A1 (en) * 2002-10-02 2004-12-23 Ensinger Kunstsofftechnoligie Gbr Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus

Also Published As

Publication number Publication date
TW200539373A (en) 2005-12-01
DE102004017789A1 (de) 2005-10-20

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