WO2005094132A1 - 有機elパネルの製造方法 - Google Patents
有機elパネルの製造方法 Download PDFInfo
- Publication number
- WO2005094132A1 WO2005094132A1 PCT/JP2005/004069 JP2005004069W WO2005094132A1 WO 2005094132 A1 WO2005094132 A1 WO 2005094132A1 JP 2005004069 W JP2005004069 W JP 2005004069W WO 2005094132 A1 WO2005094132 A1 WO 2005094132A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- organic
- panel
- film
- electrode
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 238000000034 method Methods 0.000 title abstract description 57
- 238000010438 heat treatment Methods 0.000 claims abstract description 70
- 230000006698 induction Effects 0.000 claims abstract description 22
- 230000018044 dehydration Effects 0.000 claims abstract description 13
- 238000006297 dehydration reaction Methods 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims description 90
- 230000001681 protective effect Effects 0.000 claims description 25
- 238000010030 laminating Methods 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 10
- 239000010408 film Substances 0.000 description 58
- 239000010410 layer Substances 0.000 description 21
- -1 polyethylene terephthalate Polymers 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 5
- 230000001678 irradiating effect Effects 0.000 description 5
- 238000010304 firing Methods 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920006289 polycarbonate film Polymers 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 239000013557 residual solvent Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates to a method for manufacturing an organic EL panel.
- FIG. 1 is a schematic cross-sectional view for explaining a configuration of an organic EL panel.
- the organic EL panel 10 has a configuration in which an anode 12, an organic EL layer 13, a cathode 14, and the like are sequentially stacked on a substrate 11.
- a polycarbonate film a polyethylene terephthalate (PET) film, a polyethersulfone film, a polyacrylate film, a polyethylene
- PET polyethylene terephthalate
- PES polyethersulfone
- a polyacrylate film a polyethylene
- a transparent electrode is usually used as the electrode.
- the organic EL layer 13 is extremely sensitive to moisture and oxygen and is degraded, when the film substrate is used as the substrate 11 as described above, the organic EL layer 13 exists in the film substrate. It is necessary to remove water in advance.
- the transparent electrode 12 is formed.
- the film substrate is directly placed on the heater (1) and the caloric heat is directly generated by the heat of the heater.
- the method it is generally difficult to uniformly heat the entire film substrate, depending on the nature of the heater used, and the film substrate may be deformed by heating, and the It is difficult to provide a stable film substrate from which has been removed.
- the present invention has been made in view of such a problem, and it is possible to uniformly heat a film substrate and perform the process in a shorter time without deforming the film substrate.
- Another object of the present invention is to provide a method for removing moisture in a film substrate used for an organic EL panel.
- the invention described in claim 1 for solving the above-mentioned problem is a method for manufacturing an organic EL panel in which a substrate, a first electrode, an organic EL layer, a second electrode, and a protective film are sequentially laminated. Then, for at least one of dehydration of the substrate, dehydration of the first electrode, baking of the organic EL layer, and dehydration of the protective film, at least one of dielectric heating, induction heating, and microwave heating is performed. And one process is performed.
- FIG. 1 is a schematic cross-sectional view illustrating a configuration of an organic EL panel.
- FIG. 2 is a schematic sectional view of an organic EL panel formed by the method of the present application.
- FIG. 3 is a schematic sectional view of an organic EL panel formed by the method of the present application.
- First electrode anode or cathode
- Second electrode (cathode or anode)
- 2 and 3 are schematic cross-sectional views showing the configuration of an organic EL panel manufactured by the method of the present invention.
- the method of the present application is a method for manufacturing an organic EL panel in which a substrate, a first electrode, an organic EL layer, a second electrode, and a protective film are sequentially laminated. Performing at least one of dielectric heating, induction heating, and microwave heating for at least one of baking of the organic EL layer and dehydration of the protective film.
- the following treatment (I)-(IV) is performed. It is characterized by applying
- the method of the present application is a method for manufacturing an organic EL panel 20 in which a substrate 21, a first electrode 22, an organic EL layer 23, a second electrode 24, and a protective film 25 are sequentially laminated.
- the method is characterized in that at least one of dielectric heat treatment, induction heat treatment, and microwave heat treatment is performed on the substrate 21 at a stage before the layer 22 is laminated thereon, for the purpose of dehydrating the substrate.
- One of the first electrode 22 and the second electrode 24 is an electrode that functions as an anode, and the other is an electrode that functions as a cathode. Either may be the anode or the cathode.
- the first electrode 22 will be described as an anode and the second electrode will be described as a cathode.
- the method of the present application is a method for manufacturing an organic EL panel in which a substrate, a first electrode, an organic EL layer, a second electrode, and a protective film are sequentially laminated. Performing at least one of dielectric heating, induction heating, and microwave heating for at least one of dehydration of the electrode, baking of the organic EL layer, and dehydration of the protective film.
- the material and shape of the substrate, the first electrode, the organic EL layer, the second electrode, and the protective film, and the configuration, shape, and manufacturing method of the organic EL panel depend on the purpose and application. Conventionally known various ones are used.
- the substrate 21 is not heated from the outside as in the case of using a heater as a heating means, but is heated by dielectric heating, induction heating, or microwave heating. Since the internal force can also be heated, the heating can be performed more uniformly than in the conventional method, and as a result, the deformation of the substrate 21 can be prevented. Further, as described above, the method of the present invention can heat the substrate 21 from the inside, so that the processing time can be shortened and the yield is improved as compared with the conventional method using radiant heat. To improve the storage life and drive life of the manufactured OLED panel. Can. Such a method of the present application is particularly suitable when a film substrate is used as the substrate 21.
- the moisture in the substrate 21 can be surely removed as compared with the processing described in (1)-(5) described in the background art, so that the organic EL A protective film 25 for blocking moisture from external forces can be formed on the panel. That is, in the conventional processing, moisture may remain in the substrate. In such a case, if the protective film 25 is formed, the moisture in the substrate is released after the protective film is formed. In the meantime, this water is confined between the substrate and the protective film, that is, trapped inside the organic EL panel, and the protective film 25 for shutting off moisture from the outside causes deterioration of the organic EL panel.
- the moisture inside the substrate can be completely removed, so that the protective film 25 can be formed with confidence.
- the protective film 25 shown in FIG. 2 has a single-layer protective film structure formed so as to be in close contact with the second electrode 24 and the organic EL layer 23.
- the method of the present invention can be applied to a multilayer structure as shown in FIG. 3, which is not limited thereto (reference numeral 26 in FIG. 3 denotes an intermediate adhesive layer).
- the process of the substrate 21 before the anode 22 is laminated which is a feature of the method of the present invention, includes three processes: (A) induction heating, (B) induction heating, and (C) microwave heating. They can be broadly classified.
- a substrate to be processed is placed between two electrodes, and a high-frequency voltage is applied to the two electrodes.
- the time for performing the dielectric heat treatment is not particularly limited in the method of the present invention, and may be arbitrarily set according to the type of the substrate, the amount of moisture in the substrate, the size of the substrate, and the like. Can be However, it is necessary to set the time so that the substrate itself is not damaged (for example, if a film substrate is used as a substrate, and if the TG of the film substrate exceeds the TG, melting occurs). There is. For example, when removing water from a film substrate made of polyethylene terephthalate resin, which is conventionally used in an organic EL panel, a time of about 15 to 30 minutes is sufficient. It should be noted that the conventional method using radiant heat usually requires 415 hours to remove water. Compared to this, the method of the present invention makes it possible to greatly reduce the processing time.
- the invention of the present application is not particularly limited to an apparatus for performing the dielectric heating treatment, and a conventionally known apparatus may be used.
- this method acts on water molecules present in the film substrate to heat the substrate, it can be applied to all types of substrates conventionally used as substrate films for organic EL panels.
- Specific examples include a polycarbonate film, a polyethylene terephthalate (PET) film, a polyether sulfone film, a polyarylate film, and a polyethylene sulfite (PES) finolem.
- This treatment is a method that is conventionally used as a method of heating metal, in which a substrate to be treated is placed at the center of a coil connected to an AC power supply, and a voltage is applied to the coil. .
- the substrate is heated, and the moisture inside the substrate is released as vapor. This treatment also prevents heat unevenness and does not cause distortion of the substrate.
- the induction heating treatment it is preferable to mainly apply a low frequency voltage (several kHz to several MHz). Specifically, 100 kHz to 600 kHz is preferable. In this induction heating process, the applied frequency and the amount of generated heat are in a proportional relationship.
- the method of the present invention is not particularly limited with respect to the time for performing the induction heating treatment, similarly to the case of the above-mentioned (A) dielectric heating treatment. It can be set arbitrarily according to the size of the film. When a film substrate made of polyethylene terephthalate resin is used as the substrate, a time of about 15 to 30 minutes is sufficient. Compared with the conventional method using radiant heat, which requires 415 hours to remove water, the method of the present invention can greatly reduce the processing time.
- the invention of the present application is not particularly limited, and a conventionally known apparatus may be used.
- This process is a process of irradiating a substrate as a processing target with microwaves.
- the molecules forming the substrate can be vibrated by the electric field of the microwave penetrating the inside of the substrate, and the adjacent molecules are rubbed by the vibration. Together, they generate frictional heat, which can quickly heat the substrate and remove moisture.
- the substrate can be heated from the inside by the same principle as in the above-mentioned (a) dielectric heating process, so that uneven heating is prevented and the substrate is not likely to be distorted.
- a voltage having a frequency of about several hundred MHz to several hundred GHz it is preferable to apply a voltage having a frequency of about several hundred MHz to several hundred GHz.
- a voltage having a frequency of 2.45 GHz or 28 GHz can be preferably used. .
- the method of the present invention can be arbitrarily set according to the type of the substrate, the amount of water in the substrate, the size of the substrate, and the like without any particular limitation.
- the apparatus for performing the microwave heating treatment the invention of the present application is not particularly limited, and a conventionally known apparatus may be used.
- the substrate (I) that is, the substrate constituting the organic EL panel.
- the force described for applying the method of the present application is not limited to the above (II)-(IV), that is, for the first electrode, the organic EL layer, and further the protective layer, the (A) — ( The treatment of C) may be performed.
- an epoxy resin or an acrylic resin may be used as an intermediate adhesive layer between the barrier thin films.
- the moisture inside the intermediate adhesive layer forming the protective film is also removed according to the second method of the present application. It is possible.
- the organic EL layer is not fired, the residual solvent may have an adverse effect on the characteristics of the organic EL element.
- the firing is performed according to the method (A)-(C ), The residual solvent can be removed.
- the present invention is not limited to the above embodiment.
- the above embodiment is merely an example, and any of those having substantially the same configuration as the technical idea described in the claims of the present invention and having the same effect can be obtained. Are also included in the technical scope of the present invention.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006511421A JPWO2005094132A1 (ja) | 2004-03-26 | 2005-03-09 | 有機elパネルの製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-091574 | 2004-03-26 | ||
JP2004091574 | 2004-03-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005094132A1 true WO2005094132A1 (ja) | 2005-10-06 |
Family
ID=35056585
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/004069 WO2005094132A1 (ja) | 2004-03-26 | 2005-03-09 | 有機elパネルの製造方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2005094132A1 (ja) |
TW (1) | TW200541392A (ja) |
WO (1) | WO2005094132A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014069151A1 (ja) * | 2012-10-29 | 2014-05-08 | 日東電工株式会社 | ロールツーロール方式を用いた有機エレクトロルミネッセンスパネルの製造方法 |
JP2015191880A (ja) * | 2014-03-31 | 2015-11-02 | 東京エレクトロン株式会社 | 処理装置及び処理方法 |
WO2018146950A1 (ja) * | 2017-02-09 | 2018-08-16 | 住友化学株式会社 | 有機電子デバイスの製造方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106324720A (zh) * | 2016-10-24 | 2017-01-11 | 昆山工研院新型平板显示技术中心有限公司 | 一种薄膜封装结构 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000150147A (ja) * | 1998-11-05 | 2000-05-30 | Toray Ind Inc | 有機電界発光素子の製造方法 |
WO2001058221A1 (fr) * | 2000-01-31 | 2001-08-09 | Idemitsu Kosan Co., Ltd. | Dispositif d'affichage par electroluminescence organique et procede de production du dispositif |
JP2001237065A (ja) * | 2000-02-25 | 2001-08-31 | Toppan Printing Co Ltd | 高分子el素子およびその製造方法 |
JP2002359072A (ja) * | 2001-05-31 | 2002-12-13 | Auto Network Gijutsu Kenkyusho:Kk | 薄膜形成装置及びこの薄膜形成装置により形成された有機el素子 |
JP2003332058A (ja) * | 2002-03-05 | 2003-11-21 | Sanyo Electric Co Ltd | エレクトロルミネッセンスパネルおよびその製造方法 |
-
2005
- 2005-03-09 JP JP2006511421A patent/JPWO2005094132A1/ja active Pending
- 2005-03-09 WO PCT/JP2005/004069 patent/WO2005094132A1/ja active Application Filing
- 2005-03-25 TW TW094109298A patent/TW200541392A/zh unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000150147A (ja) * | 1998-11-05 | 2000-05-30 | Toray Ind Inc | 有機電界発光素子の製造方法 |
WO2001058221A1 (fr) * | 2000-01-31 | 2001-08-09 | Idemitsu Kosan Co., Ltd. | Dispositif d'affichage par electroluminescence organique et procede de production du dispositif |
JP2001237065A (ja) * | 2000-02-25 | 2001-08-31 | Toppan Printing Co Ltd | 高分子el素子およびその製造方法 |
JP2002359072A (ja) * | 2001-05-31 | 2002-12-13 | Auto Network Gijutsu Kenkyusho:Kk | 薄膜形成装置及びこの薄膜形成装置により形成された有機el素子 |
JP2003332058A (ja) * | 2002-03-05 | 2003-11-21 | Sanyo Electric Co Ltd | エレクトロルミネッセンスパネルおよびその製造方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014069151A1 (ja) * | 2012-10-29 | 2014-05-08 | 日東電工株式会社 | ロールツーロール方式を用いた有機エレクトロルミネッセンスパネルの製造方法 |
JP2015191880A (ja) * | 2014-03-31 | 2015-11-02 | 東京エレクトロン株式会社 | 処理装置及び処理方法 |
WO2018146950A1 (ja) * | 2017-02-09 | 2018-08-16 | 住友化学株式会社 | 有機電子デバイスの製造方法 |
US10950825B2 (en) | 2017-02-09 | 2021-03-16 | Sumitomo Chemical Company, Limited | Method for manufacturing organic electronic device |
Also Published As
Publication number | Publication date |
---|---|
JPWO2005094132A1 (ja) | 2008-02-14 |
TW200541392A (en) | 2005-12-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI423723B (zh) | 自發光面板之製造方法 | |
US9923157B2 (en) | Method of manufacturing flexible display | |
JP2006044231A (ja) | ガスバリア性フィルム、並びにこれを用いたディスプレイ用基板及びディスプレイ | |
US7261795B2 (en) | Method for encapsulation of light emitting polymer devices | |
WO2005094132A1 (ja) | 有機elパネルの製造方法 | |
US9750091B2 (en) | Apparatus and method for heat treatment of coatings on substrates | |
JP2008021605A (ja) | 透明導電膜付きフィルム、およびこの透明導電膜付きフィルムからなるディスプレイ用基板、ディスプレイならびに有機el素子 | |
JP2014011256A (ja) | 熱処理方法および熱処理装置 | |
CA2984098A1 (en) | Method for manufacturing secondary cell | |
WO2015174064A1 (ja) | ポリイミドフィルムの製造方法、電子機器の製造方法および塗膜の剥離方法 | |
JP5616657B2 (ja) | 表面処理方法 | |
KR20040106579A (ko) | 폴리머 오엘이디의 제조방법 | |
JP2008166127A (ja) | 有機elディスプレイ用基板 | |
JP5748069B2 (ja) | ゲッター層を有する有機電界発光表示装置の製造方法 | |
KR20140044109A (ko) | 플렉시블 디스플레이 장치의 제조방법 | |
TWI628079B (zh) | 玻璃基板的製造方法 | |
US20150357572A1 (en) | Method for producing organic electroluminescence device | |
JP2007269957A (ja) | ガスバリア性フィルムとその製造方法、およびそれを用いた画像表示素子 | |
US9444073B2 (en) | Organic light emitting display device and manufacturing method thereof | |
KR102354027B1 (ko) | 플렉서블 컬러필터의 제조방법 | |
JP3413389B2 (ja) | 積層フィルムコンデンサおよびその製造方法、ならびに保護膜形成装置 | |
US20060121260A1 (en) | Laminated sheet and a method for manufacturing the laminated sheet | |
KR20070069237A (ko) | 액정 패널용 가요성 기판의 접착 방법 및 그 장비 | |
WO2018211978A1 (ja) | 電子デバイスの製造方法 | |
CN117063036A (zh) | 薄膜干燥装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2006511421 Country of ref document: JP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWW | Wipo information: withdrawn in national office |
Country of ref document: DE |
|
122 | Ep: pct application non-entry in european phase |