WO2005083803A2 - Leuchtdioden-anordnung für eine hochleistungs-leuchtdiode und verfahren zur herstellung einer leuchtdioden-anordnung - Google Patents
Leuchtdioden-anordnung für eine hochleistungs-leuchtdiode und verfahren zur herstellung einer leuchtdioden-anordnung Download PDFInfo
- Publication number
- WO2005083803A2 WO2005083803A2 PCT/DE2005/000170 DE2005000170W WO2005083803A2 WO 2005083803 A2 WO2005083803 A2 WO 2005083803A2 DE 2005000170 W DE2005000170 W DE 2005000170W WO 2005083803 A2 WO2005083803 A2 WO 2005083803A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light
- emitting diode
- arrangement according
- circuit board
- layer
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 230000001070 adhesive effect Effects 0.000 claims description 32
- 239000000853 adhesive Substances 0.000 claims description 31
- 239000004020 conductor Substances 0.000 claims description 18
- 230000001681 protective effect Effects 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002390 adhesive tape Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 3
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- -1 polyethylene naphthalate Polymers 0.000 claims description 3
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims 17
- 239000012790 adhesive layer Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 3
- 230000000717 retained effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Definitions
- the invention relates to a light-emitting diode arrangement for high-performance light-emitting diodes, which are mounted on a flexible printed circuit board.
- the invention further relates to a method for producing the light-emitting diode arrangement.
- the mounting bracket is provided by a flexible printed circuit board.
- the high-performance light-emitting diode is soldered onto the flexible printed circuit board. Through the soldering process, the light-emitting diode is both electrically contacted with the flexible printed circuit board and mechanically fixed on the printed circuit board.
- the flexible printed circuit board contains at least one flexible carrier layer.
- the flexible carrier layer preferably contains one of the following materials: polyimide, polyethylene naphthalate, polyester, FR4.
- Other materials can also be used in the flexible carrier layer of the circuit board be suitable if the flexibility of the printed circuit board is retained and good transmission of the heat generated by the high-performance light-emitting diode through the carrier layer is ensured.
- This thermal contact can be produced, for example, in that the thermal connection part of the high-performance light-emitting diode is soldered onto the heat-conducting layer.
- the heat initially spreads from the thermal connection part of the high-performance light-emitting diode in the heat-conducting layer.
- the heat is then released to the environment over a large area and absorbed, for example, by the flexible carrier layer.
- the flexible carrier layer dissipates the heat to the surroundings over a large area.
- the heat-conducting layer contains copper.
- the adhesive tape attached to the printed circuit board is preferably sealed to its free surface with a protective film.
- This protective film only has to be removed before the LED arrangement is applied at its destination.
- the light-emitting diode arrangement can be stuck onto its destination in the form of a decal.
- the protective film contains a plastic.
- a particularly heat-resistant adhesive-containing layer is preferably used for the light-emitting diode arrangement.
- the adhesive-containing layer can withstand temperatures up to 250 ° C for a short time without damage. If the adhesive-containing layer is briefly heated to this temperature value, the adhesive-containing layer does not lose its adhesive effect. Firm adherence of the light-emitting diode arrangement to its destination remains guaranteed even when the layer containing the adhesive is heated.
- a large number of high-line light-emitting diodes are applied to the flexible printed circuit board.
- the high-power LEDs are preferably connected in series.
- the light-emitting diode arrangement is preferably divided into sections, each section having a high-performance light-emitting diode and the associated pair of contact areas. These sections are advantageously arranged on the circuit board as repeating, regular structures.
- these sections are arranged in a row. With the arrangement described, it is possible to contact the entirety of the high-line light-emitting diodes on the flexible printed circuit board by connecting the two outermost contact surfaces — on the opposite side of the light-emitting diode arrangement — on the printed circuit board to a current source.
- the construction of the light-emitting diode arrangement described enables a particularly simple division of the light-emitting diode arrangement between the sections, so that partial light-emitting diode arrangements each have a smaller number of sections as the original light emitting diode arrangement. Even with these light-emitting diode arrangements, with a smaller number of high-performance light-emitting diodes, it is possible to contact the entirety of the light-emitting diodes on the arrangement in the manner described. A division of the light-emitting diode arrangement is possible so far that individual sections, each with a high-performance light-emitting diode and a pair of contact surfaces, are created.
- the size of the light-emitting diode arrangement and the number of light-emitting diodes can be adapted in this way to their intended purpose and the conditions of the destination. This means that the LED arrangement is adapted, for example, to the required luminosity or the available space.
- a lighting device in which the light-emitting diode arrangement is applied to a predetermined heat sink is specified.
- the light-emitting diode arrangement is preferably glued onto the heat sink with its adhesive-containing layer.
- gluing the light-emitting diode arrangement a mechanical fastening of the arrangement on the heat sink and also a thermal coupling of the arrangement to the heat sink is ensured at the same time.
- the heat emitted by the high-performance light-emitting diodes is initially dissipated to the heat-conducting layer. From there, the heat is dissipated over a large area to the flexible layer. The heat is then released to the heat sink through the thin layer containing adhesive.
- the heat sink preferably contains a metal.
- the heat sink is part of a Luminaire housing.
- the lamp housing is a housing for a car interior lighting, a car rear lighting, a brake light, a turn signal, or the like. The arrangement of the LEDs adapts to the shape of the respective lamp housing due to the flexible printed circuit board.
- FIG. 1 shows the surface of the flexible printed circuit board 10 of the light-emitting diode arrangement divided into six sections 11.
- FIG. 1 shows the upper side of the printed circuit board 10 to which the light-emitting diodes 34 can be applied.
- the surface of the flexible printed circuit board 10 is covered with an insulating layer 12. In the insulating layer 12 there are recesses through which a connection to the electrical connection points 13, the thermal contact surface 14 and the electrical contact surfaces 15 is possible.
- the high-performance light-emitting diode is electrically contacted via the electrical contact surfaces 15.
- the entirety of all light-emitting diodes of the light-emitting diode arrangement can be contacted by connecting the two outermost electrical contact surfaces 15a and 15b to a current source.
- FIG. 2 shows the plane of the circuit board 10 with the heat-conducting layer 21 and the electrical conductor tracks 22, 23 of the flexible circuit board 10.
- the high-performance light-emitting diode is coupled to the heat-conducting layer 21 via the thermal contact surface 14.
- the heat-conducting layer 21 has a particularly large area so that the heat emitted by the high-performance light-emitting diode can be emitted to the surroundings over a large area.
- the heat-conducting layer 21 is not in electrical contact with electrical conductor tracks 22, contact surfaces 15 or connection points 13.
- the heat-conducting layer 21 can have a substantially round shape.
- the Thermally conductive layer 21 at least 60 percent of the area of the plane of the circuit board 10 in which it is located. It preferably takes at least 70 percent, particularly preferably at least 80 percent.
- These high-performance light-emitting diodes can in turn be electrically connected by contacting the two outermost contact surfaces on a power source.
- the heat-conducting layer 21 and the electrical conductor tracks 22, 23 are applied to the carrier layer 33.
- the insulating layer 12 follows them.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05706737.3A EP1719189B1 (de) | 2004-02-26 | 2005-02-02 | Leuchtdioden-anordnung für eine hochleistungs-leuchtdiode und verfahren zur herstellung einer leuchtdioden-anordnung |
US10/590,744 US8975532B2 (en) | 2004-02-26 | 2005-02-02 | Light-emitting diode arrangement for a high-power light-emitting diode and method for producing a light-emitting diode arrangement |
CN200580006300XA CN1926685B (zh) | 2004-02-26 | 2005-02-02 | 发光二极管装置及制造发光二极管装置的方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004009284.2 | 2004-02-26 | ||
DE200410009284 DE102004009284A1 (de) | 2004-02-26 | 2004-02-26 | Leuchtdioden-Anordnung für eine Hochleistungs-Leuchtdiode und Verfahren zur Herstellung einer Leuchtdioden-Anordnung |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005083803A2 true WO2005083803A2 (de) | 2005-09-09 |
WO2005083803A3 WO2005083803A3 (de) | 2006-03-09 |
Family
ID=34853698
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2005/000170 WO2005083803A2 (de) | 2004-02-26 | 2005-02-02 | Leuchtdioden-anordnung für eine hochleistungs-leuchtdiode und verfahren zur herstellung einer leuchtdioden-anordnung |
Country Status (6)
Country | Link |
---|---|
US (1) | US8975532B2 (de) |
EP (1) | EP1719189B1 (de) |
CN (2) | CN102157671B (de) |
DE (1) | DE102004009284A1 (de) |
TW (1) | TWI265644B (de) |
WO (1) | WO2005083803A2 (de) |
Cited By (3)
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DE102006059127A1 (de) * | 2006-09-25 | 2008-03-27 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer Anordnung optoelektronischer Bauelemente und Anordnung optoelektronischer Bauelemente |
CN101491166B (zh) * | 2006-06-14 | 2011-09-28 | 巴斯夫欧洲公司 | 在载体上生产导电表面的方法 |
DE102010042193A1 (de) * | 2010-10-08 | 2012-04-12 | Zumtobel Lighting Gmbh | LED-Leuchte mit gebogenem Lichtabgebebereich |
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KR100592508B1 (ko) * | 2005-07-15 | 2006-06-26 | 한국광기술원 | 비콘 모양의 기판을 구비한 고출력 발광 다이오드 패키지 |
DE102005050254B4 (de) * | 2005-10-20 | 2010-02-11 | Dieter Leber | Verfahren zur Herstellung einer flexiblen Leuchteinrichtung als Mehrfachanordnung |
KR20080057881A (ko) * | 2006-12-21 | 2008-06-25 | 엘지전자 주식회사 | 인쇄회로기판, 이를 포함하는 발광 장치 및 그 제조 방법 |
DE102007043401A1 (de) * | 2007-09-12 | 2009-03-19 | Osram Gesellschaft mit beschränkter Haftung | Leuchtvorrichtung und Verfahren zur Herstellung derselben |
DE102008021618A1 (de) * | 2007-11-28 | 2009-06-04 | Osram Opto Semiconductors Gmbh | Chipanordnung, Anschlussanordnung, LED sowie Verfahren zur Herstellung einer Chipanordnung |
DE102008059552A1 (de) | 2008-11-28 | 2010-06-02 | Osram Opto Semiconductors Gmbh | Leuchtdiodenmodul und Leuchtdiodenbauteil |
DE202008016023U1 (de) * | 2008-12-04 | 2010-04-15 | Schweitzer, Rolf, Dipl.-Ing. | Tageslicht-LED-Cluster |
US8115393B2 (en) * | 2009-01-09 | 2012-02-14 | Neal Andrew T | LED tubular lighting fixture |
DE102009054840A1 (de) * | 2009-12-17 | 2011-06-22 | Poly-Tech Service GmbH, 67681 | Leuchtmittel mit einer Mehrzahl von Leuchtdioden |
DE102010011604A1 (de) * | 2010-03-16 | 2011-09-22 | Eppsteinfoils Gmbh & Co.Kg | Foliensystem für LED-Anwendungen |
DE102010049333B4 (de) * | 2010-10-22 | 2012-07-05 | Jürgen Hackert | Verfahren und Vorrichtung zur Herstellung einer bandförmigen Struktur zur Aufnahme von elektronischen Bauteilen |
KR20130141559A (ko) | 2010-11-03 | 2013-12-26 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 열 관리를 위한 가요성 led 디바이스 및 제조 방법 |
WO2012061184A1 (en) | 2010-11-03 | 2012-05-10 | 3M Innovative Properties Company | Flexible led device and method of making |
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CN103096615A (zh) * | 2012-11-14 | 2013-05-08 | 南京市江宁区丁卯电子科技中心 | 一种安装有发光二极管的柔性电路板 |
US20150014024A1 (en) * | 2013-07-12 | 2015-01-15 | Kevin Yang | Jumper Fin |
DE102014220188B3 (de) * | 2014-10-06 | 2016-02-11 | E.G.O. Elektro-Gerätebau GmbH | Anzeigevorrichtung |
DE102015107657A1 (de) | 2015-05-15 | 2016-12-01 | Alanod Gmbh & Co. Kg | Verfahren zur Herstellung eines Anschlussträgers, Anschlussträger sowie optoelektronisches Halbleiterbauteil mit einem Anschlussträger |
CN105263259B (zh) * | 2015-11-30 | 2019-03-01 | 靳丰泽 | 一种以网为基底的印刷电路板 |
EP3182471B1 (de) * | 2015-12-14 | 2019-06-05 | LG Electronics Inc. | Lichtquellenmodul |
EP3203146B1 (de) | 2016-02-08 | 2018-10-31 | OSRAM GmbH | Stützstruktur für lichtstrahlungsquellen, zugehörige vorrichtung und verfahren |
WO2017151686A1 (en) | 2016-02-29 | 2017-09-08 | Safely Brake, Inc. | Safety brake light module and method of engaging a safety brake light |
DE102016103819A1 (de) | 2016-03-03 | 2017-09-07 | Heraeus Deutschland GmbH & Co. KG | Anschlussträger, optoelektronisches Bauteil und Verfahren zur Herstellung eines Anschlussträgers oder eines optoelektronischen Bauteils |
CN108112166B (zh) * | 2017-12-07 | 2019-11-05 | 何莉莉 | 一种用于电子显示器led发光体的印刷电路板 |
US10281113B1 (en) | 2018-03-05 | 2019-05-07 | Ford Global Technologies, Llc | Vehicle grille |
BG112718A (bg) * | 2018-04-10 | 2019-10-31 | "Граф Он" ООД | Устройство за отопление на оловни акумулатори, експлоатирани при ниски температури и акумулатор с това устройство |
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JPH05290669A (ja) * | 1992-01-22 | 1993-11-05 | Fujikura Ltd | 照光スイッチ |
DE10051159C2 (de) * | 2000-10-16 | 2002-09-19 | Osram Opto Semiconductors Gmbh | LED-Modul, z.B. Weißlichtquelle |
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- 2005-02-02 CN CN2011100503721A patent/CN102157671B/zh active Active
- 2005-02-02 US US10/590,744 patent/US8975532B2/en active Active
- 2005-02-02 CN CN200580006300XA patent/CN1926685B/zh active Active
- 2005-02-02 EP EP05706737.3A patent/EP1719189B1/de active Active
- 2005-02-22 TW TW94105222A patent/TWI265644B/zh active
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CN101491166B (zh) * | 2006-06-14 | 2011-09-28 | 巴斯夫欧洲公司 | 在载体上生产导电表面的方法 |
DE102006059127A1 (de) * | 2006-09-25 | 2008-03-27 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer Anordnung optoelektronischer Bauelemente und Anordnung optoelektronischer Bauelemente |
WO2008040307A2 (de) | 2006-09-25 | 2008-04-10 | Osram Opto Semiconductors Gmbh | Verfahren zur herstellung einer anordnung optoelektronischer bauelemente und anordnung optoelektronischer bauelemente |
WO2008040307A3 (de) * | 2006-09-25 | 2008-06-19 | Osram Opto Semiconductors Gmbh | Verfahren zur herstellung einer anordnung optoelektronischer bauelemente und anordnung optoelektronischer bauelemente |
US8638565B2 (en) | 2006-09-25 | 2014-01-28 | Osram Opto Semiconductors Gmbh | Arrangement of optoelectronic components |
DE102010042193A1 (de) * | 2010-10-08 | 2012-04-12 | Zumtobel Lighting Gmbh | LED-Leuchte mit gebogenem Lichtabgebebereich |
Also Published As
Publication number | Publication date |
---|---|
TW200534509A (en) | 2005-10-16 |
WO2005083803A3 (de) | 2006-03-09 |
EP1719189A2 (de) | 2006-11-08 |
EP1719189B1 (de) | 2019-04-03 |
CN1926685A (zh) | 2007-03-07 |
CN102157671B (zh) | 2013-05-01 |
US8975532B2 (en) | 2015-03-10 |
DE102004009284A1 (de) | 2005-09-15 |
CN1926685B (zh) | 2011-04-27 |
US20070291503A1 (en) | 2007-12-20 |
CN102157671A (zh) | 2011-08-17 |
TWI265644B (en) | 2006-11-01 |
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