WO2005083149A1 - 微粒子付着基板 - Google Patents
微粒子付着基板 Download PDFInfo
- Publication number
- WO2005083149A1 WO2005083149A1 PCT/JP2005/002316 JP2005002316W WO2005083149A1 WO 2005083149 A1 WO2005083149 A1 WO 2005083149A1 JP 2005002316 W JP2005002316 W JP 2005002316W WO 2005083149 A1 WO2005083149 A1 WO 2005083149A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin
- adhered
- fine particles
- substrate
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
Definitions
- the present invention relates to a fine particle-adhered substrate, and more particularly, to a multifunctional substrate having nanoparticles attached thereto.
- a fine particle-adhered substrate and more particularly, to a multifunctional substrate having nanoparticles attached thereto.
- solar cells crystalline soft magnetic materials, magnetic recording devices, biochips
- Photocatalysts hydrogen storage materials, nanocomposite magnets, transparent electrodes for next-generation flat panel displays (FPDs), phosphors, light barrier materials, catalyst materials for the production of nanocarbon structures, etc. It relates to a formed and adhered substrate.
- Patent Document 1 describes that a carbon nanotube is contained in a constituent layer of a front plate or a back plate that forms a discharge space of a plasma display using such a method.
- Nanoparticles applied to a substrate by coating or printing with a dispersion using a solvent such as a nano-solvent are not only impaired in performance due to such a dispersion medium serving as an impurity, but also deteriorate on the surface.
- the occurrence of defects increases due to loss or dropout due to insufficient adhesion of particles in the vicinity.
- Patent Document 1 Japanese Patent Application Laid-Open No. 2003-272530
- An object of the present invention is to provide a substrate having excellent adhesion of directly attached fine particles and a method for producing the same.
- a fine particle-adhered substrate characterized in that nano-order fine particles themselves are directly adhered to a substrate in the form of primary particles.
- the number of collisions between the molecules of the raw material is limited by employing the plasma sputtering method under the atmospheric pressure, and as a result, the growth rate of the particles can be suppressed, and the control of the particle diameter can be easily performed.
- FIG. 1 is a cross-sectional view showing an example of a gas introduction part, a sputter target, and an electrode part of a discharge processing apparatus used for an atmospheric pressure plasma sputtering method according to the present invention.
- the substance constituting the fine particles directly adhered to the substrate is not particularly limited, and may be C, a typical metal, a metalloid, or a transition metal, that is, Mg, Al, Si, Sc. , Ti, V, Cr, Mn, Fe, Co, Ni ⁇ Cu, Zn, Ga, Ge, As, Se, Y, Zr, Nb, Mo, Ru, Rh, Pd, Ag , Cd, In, Sn, Sb, Te, Hf, Ta, W, Re, Os, Ir, Pt, Au, Tl, Pb, Bi ⁇ La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy , Ho, Er, Tm, Yb, Lu.
- compound fine particles or nanocomposite fine particles may be used by using a compound or alloy target, but are preferably fine particles of a metal or an oxide thereof. Further, it is preferable that the fine particles have a particle size of several nm to 100 nm, preferably 10 nm to 100 nm, and adhere to the base material in the form of primary particles in terms of expression of various functions.
- Zinc oxide solar cells, FDP transparent electrodes, phosphor materials, etc.
- Magnetic materials such as Co, FePt, and iron oxide:
- Titanium silicate dielectric, piezoelectric, paint
- ITO Transparent conductive film, device drive electrode, solar cell transparent electrode
- the temperature is set at 40 ° C.
- the temperature can be suppressed to 0 ° C or lower, preferably 300 ° C or lower, and more preferably 200 ° C or lower. Like this By suppressing the rise in temperature, even a material having low heat resistance such as glass or plastic can be used as a substrate.
- the base material to be used for example, quartz, glass, ceramics, metal, silicon substrates, etc., which can be insulated, conductive, or semiconductive, can be used.
- the glass is preferably a soda glass having a high strain point and a low soda glass in which it is desirable to use a transparent glass substrate such as soda lime glass, low soda glass, lead alkali silicate glass, and borosilicate glass.
- Examples of the ceramic include alumina, zirconium, titanium, silicon nitride, and silicon carbide.
- various resins can be used as long as they have heat resistance to the temperature at the time of formation.
- Polyimide, fluorine resin, polyetheretherketone (PEEK), polyethersulfone (PES), and polyparabanic acid Resins, polyphenylene oxide, polyarylate resins, and even epoxy resins can be used.
- PEEK polyetheretherketone
- PES polyethersulfone
- polyparabanic acid Resins polyphenylene oxide
- polyarylate resins polyarylate resins
- epoxy resins can be used.
- polyimide can be preferably used.
- polyamide resin polyamideimide resin
- PTFE tetrafluoroethylene resin
- PFA tetrafluoroethylene perfluoroalkoxyethylene copolymer
- FEP tetrafluoroethylene hexafluoropropylene Copolymer
- high temperature nylon resin polyphenylene sulfide resin (PPS), trifluoride triethylene resin (CTFP), modified phenol resin, polyethylene terephthalate resin (PET), poly Add filler such as glass fiber, glass beads, graphite, carbon fiber, fluorine resin, molybdenum disulfide, titanium oxide, etc.
- PPS polyphenylene sulfide resin
- CTFP trifluoride triethylene resin
- PET polyethylene terephthalate resin
- Add filler such as glass fiber, glass beads, graphite, carbon fiber, fluorine resin, molybdenum disulfide, titanium oxide, etc.
- resin such as butylene terephthalate resin (PBT) and polyetherene ether ketone (PEEK)
- PBT butylene terephthalate resin
- PEEK polyetherene ether ketone
- a heat-resistant sliding resin that secures slidability and wear resistance as well as heat resistance is used.
- polyimide resin containing graphite nylon resin containing graphite, acetal resin containing PTFE, phenol resin containing PTFE, and the like.
- glass fibers, glass beads, graphite, carbon fibers, fluorine resins, molybdenum disulfide, molybdenum disulfide, and titanium oxide are added to base resins such as polyimide resin, polyamide resin, and polyamideimide resin.
- base resins such as polyimide resin, polyamide resin, and polyamideimide resin.
- a heat-resistant resin to which a filler such as is added is also possible, and the heat-resistant temperature is 250 ° C or more.
- the heat-resistant resin obtained by adding the above filler to the fluorine resin also has a continuous use temperature of 250 ° C. or higher.
- wet coating in which the surface of the fine particle-adhered substrate can be overcoated with a resin or an inorganic compound, or dry coating such as CVD, sputtering, or vapor deposition, is employed. it can.
- a curable resin When overcoating with a resin, a curable resin can be used.
- the resin cured layer has various functions other than the overcoat!
- Examples of the resin cured layer include a layer formed by polymerizing a component containing at least one monomer having an ethylenically unsaturated bond.
- a layer formed by curing an active ray-cured resin or a heat-cured resin is preferable, and an actinic ray is particularly preferable.
- the actinic ray-curable resin layer refers to a layer mainly composed of a resin which cures through a cross-linking reaction or the like by irradiation with actinic rays such as ultraviolet rays or electron beams.
- Typical examples of the actinic ray curable resin include an ultraviolet curable resin and an electron beam curable resin, but a resin curable by riding on an actinic ray other than an ultraviolet ray or an electron beam may be used.
- the ultraviolet-curable resin examples include an ultraviolet-curable acrylic urethane-based resin, an ultraviolet-curable polyester atalylate-based resin, an ultraviolet-curable epoxy atalylate-based resin, and an ultraviolet-curable polyol acrylate-based resin. Resins or UV-curable epoxy resins can be used.
- the UV-curable acrylic urethane-based resin generally includes a product obtained by reacting a polyester polyol with an isocyanate monomer or prepolymer, and further adding 2-hydroxyxyl acrylate, 2-hydroxydene.
- Examples thereof include those easily formed by reacting an acrylate monomer having a hydroxyl group such as tyl methacrylate or 2-hydroxypropyl acrylate, such as those described in JP-A-59-151110. is there.
- Examples of the ultraviolet curable polyester acrylate resin include those easily formed by reacting a polyester polyol with 2-hydroxyethyl acrylate or a 2-hydroxy acrylate polymer. For example, there is one described in JP-A-59-151110.
- epoxy acrylate resin is used as an oligomer.
- a reactive diluent and a photoreaction initiator to each other and reacting them, for example, those described in JP-A-1-105738.
- the photoreaction initiator include benzoin and derivatives thereof, acetophenone, benzophenone, hydroxybenzophenone, Michler's ketone, OC monoamine oxime ester, thioxanthone and derivatives thereof.
- Examples of the ultraviolet curable polyol acrylate resin include trimethylolpropane triatalylate, ditrimethylolpropane tetraatalylate, pentaerythritol triatalylate, pentaerythritol tetraatalylate, dipentaerythritol hexaacrylate, Examples include alkyl-modified dipentaerythritol pentaatalylate.
- actinic radiation-curable resin layers can be applied by a known method.
- a light source for curing the ultraviolet-curable resin a low-pressure mercury lamp, a medium-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a carbon arc lamp, a metal nitride lamp, a xenon lamp, and the like can be used.
- resins for overcoat include Shiridani Bull Z-Butyl acetate copolymer, Shiridani Vinyl Resin, vinyl acetate resin, a copolymer of vinyl acetate and vinyl alcohol, and partial hydrolysis of water.
- Senorelose Estenole resin maleic acid Z Acid copolymer, acrylate ester copolymer, Atari mouth-tolyl Z styrene copolymer, chlorinated polyethylene, acrylonitrile Z chlorinated polyethylene z styrene copolymer, methyl metharylate Z butadiene Z styrene copolymer, Ataril resin, polybutylacetal resin, polybutyral resin, polyesterester resin, polyether polyurethane resin, polycarbonate polyurethane resin, polyester resin, polyether resin, polyamide resin, amino Resin, styrene z butadiene resin, butadiene z acrylonitrile resin, etc., rubber resin, silicone resin, fluorine resin Examples include resin, polymethyl methacrylate, and a copolymer of polymethyl methacrylate and polymethyl atalylate. Cellulose resins such as cellulose diacetate and cellulose acetate propionate are preferred.
- the atmospheric pressure plasma sputtering method refers to a sputtering method in which a high-frequency voltage is applied between a sputtering target and an electrode facing the same at an atmospheric pressure or a pressure close to the atmospheric pressure, and discharge plasma is generated. Is the law.
- the atmospheric pressure or a pressure near the atmospheric pressure is about 20 kPa to 110 kPa, and preferably 93 kPa to 104 kPa.
- the high frequency refers to one having a frequency of at least 0.5 kHz. Preferably it is 5 kHz-100 MHz, more preferably 50 kHz-50 MHz. Further, as described in JP-A-2003-96569, different frequencies may be applied to each of the opposing sputter target and electrode.
- the discharge treatment apparatus used in the atmospheric pressure plasma sputtering method according to the present invention applies a high-frequency voltage between a sputter target and an electrode coated with a dielectric facing the sputter target, and discharges between the electrodes.
- the introduced discharge gas is converted into a plasma state, and is placed on a substrate that is left standing or transferred in the discharge space.
- discharge output of the voltage to be introduced into the discharge space 0. 1, more preferably 40WZcm it is preferably a 2 instrument is 3- 20WZcm 2.
- the above atmospheric pressure plasma sputter discharge processing apparatus includes a gas supply unit for supplying a discharge gas to the discharge space. Further, it is preferable to have a temperature control means for controlling the temperatures of the sputter target and the electrode.
- the discharge gas here is a gas that can generate a uniform discharge in the discharge space, and includes nitrogen, rare gas, hydrogen gas, and the like. It does not work even if used.
- the rare gas include helium, neon, argon, krypton, xenon, and radon, which are elements of Group 18 of the periodic table.
- An additive gas may be contained in order to obtain desired nanoparticles.
- the additive gas include hydrogen gas, water vapor, hydrogen peroxide gas, carbon monoxide gas, and gases such as carbon fluoride and fluorocarbon. Hydrocarbons and steam are preferred.
- FIG. 1 is a cross-sectional view showing an example of a gas introduction part, a sputter target, and an electrode part of a discharge processing apparatus used for the atmospheric pressure plasma sputtering method according to the present invention. It should be noted that the present invention is not limited to this.Although the following description may include certain expressions for terms and the like, they show preferable examples in the present invention, and It does not limit the meaning or technical scope of the terms of the invention.
- the moving stage 27 forms an electrode facing the sputter target, and the two sputter targets 21 a and 21 b attached to the holding member 29 and connected to the power supply 11 are parallel to the moving stage electrode 27, respectively. It is attached to it.
- the moving stage electrode 27 is covered on its target side with a dielectric 22, and a high frequency voltage is applied by the electrode 11 to a space 23 formed between the target 21 and the electrode 27.
- the holding member 29 on which the target 21 is mounted and the inside of the electrode 27 have a hollow structure 24.
- heat generated by the discharge is discharged by water, oil, or the like, and the temperature is kept stable. Heat can be exchanged for this purpose.
- the gas 1 containing the discharge gas flows through the flow path 4, and the gas 2 containing the additional gas necessary for promoting the reaction flows through the flow path 5, and is mixed and mixed into the mixing space 25 by a gas supply means (not shown).
- the mixed gas passes between the targets 21a and 21b and is supplied to the space 23.
- a plasma discharge is generated, so that the discharge gas is turned into plasma. Nanoparticles are formed and adhered by a phenomenon that is considered to be hit at high speed onto the base material 26 on the moving stage electrode 27, which is a raw material of fine particles beaten out of the target surface by the plasma-generated discharge gas.
- the gap between the target 21 and the substrate 26 is preferably 5 mm or less.
- the moving stage electrode 27 has a structure capable of reciprocal scanning or continuous scanning. If necessary, the moving stage electrode 27 has a structure capable of performing heat exchange as described above so that the temperature of the base material can be maintained. . In addition, a mechanism 28 for exhausting gas blown onto the base material shall be provided as necessary. You can also. As a result, unnecessary products generated in the space can be quickly removed from the discharge space and the substrate.
- the base material used is not limited to a plate-shaped flat base material, and a three-dimensional object or a film-shaped base material can be adopted by changing the structure of the moving stage.
- the moving stage electrode 27 is a dielectric-coated electrode in which a dielectric material 22 is coated on a metal base material.
- the metal base material include metals such as silver, platinum, stainless steel, aluminum, and iron. It is preferable to use stainless steel or titanium from the viewpoint of the working force.
- the dielectric is preferably an inorganic or organic compound having a relative dielectric constant of 6 to 45. Examples of such a dielectric include ceramics such as alumina and silicon nitride, silicate glass, and the like.
- Glass lining materials such as borate glass, polyisoprene, butadiene styrene copolymer, polybutadiene, isoprene isoprene copolymer, ethylene propylene copolymer, polyurethane, polysiloxane, propylene hexafluoride
- rubber materials such as bilidene copolymers.
- a dielectric provided by spraying alumina is preferable. Further, it is preferable to perform a sealing treatment as necessary.
- high-energy plasma can be generated using inexpensive gas.
- a constant gas atmosphere can be created in the apparatus by surrounding the whole of the sputter target and the stage electrode and preventing the outside air from entering, and the desired high-quality nano-particles can be obtained. Can be formed and adhered.
- many magnetic materials used in conventional magnetic recording materials do not have permeability, but if they are directly attached to a base material by adjusting the particle size and density as nanoparticles, the magnetic function becomes poor. Can be imparted without impairing the permeability.
- a simple tester biochip for separating red blood cells, DNA, and proteins, etc., by controlling the adsorptivity by accumulating or patterning to control the adsorptivity).
- an electron emission source for a field emission display an electron beam source, and a micro vacuum tube are used.
- it is a suitable method.
- various metals having a catalytic action in the production of graphite and the vapor phase decomposition growth of carbon nanotubes can be used.
- iron group such as Ni, Fe, Co, platinum group such as Pd, Pt, Rh, rare earth metal such as La, Y, transition metal such as Mo, Mn, and metal compounds thereof Any one of them, or a mixture of two or more thereof can be used.
- Fine particles were adhered on the substrate with the apparatus configuration shown in FIG.
- targets 21a and 21b pure Fe targets in which a corner having a length of 20 x 20mm and a length of 120mm was machined into R3 were used.
- This target is mounted on a holding member 29 made of stainless steel, and the holding member 29 has a through hole so that the silicone oil for heat-retention and cooling flows.
- the moving stage electrode 27 a member made of a flat plate of 100x500x20mm titanium metal (JIS type 2) having holes for heat insulation penetrated through three places at a surface of 100x20mm was used.
- the surface of the electrode was spray-coated with alumina ceramic to a thickness of 0.8 mm, then a coating solution of an alkoxysilane monomer dissolved in an organic solvent was applied to the alumina ceramic coating, dried, and heated at 300 ° C.
- a dielectric 22 was formed by performing a sealing treatment.
- the two target members produced as described above were arranged so as to form a gap of 2 mm, and the gap was used as a discharge gas inlet.
- the distance D between the targets 21a and 21b and the moving stage electrode 27 was arranged to be 1. Omm. This was installed in a container equipped with an exhaust gas outlet as a manufacturing device.
- a glass plate having an area of 100 ⁇ 100 mm and a thickness of 0.5 mm was placed between the target and the electrode, and the moving stage electrode 27 was repeatedly moved at a transfer speed of 0.5 lmZsec.
- Ar gas was introduced between the target and the electrode while silicon oil was circulated through the electrode and the target and the heat retention temperature was maintained at 250 ° C, and air was purged for about 10 minutes to obtain 13.56 MHz, 80 OWZcm 2.
- a plasma discharge was caused between the electrode and the target for 60 seconds.
- Example 1 the target material was changed from pure Fe to TiO, and nitrogen gas was used as a discharge gas.
- a scan target - introducing between the electrodes, is purged for about 10 minutes air, the target 21 at 50 kHz 8kV, the electrode 27 is applied with 2 frequency LOWZcm 2 at 13. 56 MHz, between the electrodes and the target Plasma discharge was performed for 60 seconds.
- a fine particle-adhered substrate on which nano-order fine particles themselves are directly adhered with good adhesiveness without using a binder, a filler, or the like can be used for expensive vacuum equipment or the like. Can be obtained without using
- the atmospheric pressure plasma sputtering method can grow particles even at a low temperature of 200 ° C or less, it is possible to use an inexpensive glass substrate or plastic substrate with fine particles adhered to fine particles. it can.
- the fine particle-adhered substrate of the present invention obtained by controlling the particle diameter, the particle density, the notching, and the degree of integration can exhibit a new function.
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006510399A JP4905129B2 (ja) | 2004-02-26 | 2005-02-16 | ナノ粒子付着基板の製造方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004-051537 | 2004-02-26 | ||
| JP2004051537 | 2004-02-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2005083149A1 true WO2005083149A1 (ja) | 2005-09-09 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2005/002316 Ceased WO2005083149A1 (ja) | 2004-02-26 | 2005-02-16 | 微粒子付着基板 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4905129B2 (ja) |
| WO (1) | WO2005083149A1 (ja) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102084243A (zh) * | 2008-07-04 | 2011-06-01 | 罗伯特.博世有限公司 | 气体传感器和用于制造气体传感器的倒装芯片方法 |
| JP2012255197A (ja) * | 2011-06-10 | 2012-12-27 | Tohoku Univ | ナノ金属ガラス粒子集合体の製造方法 |
| WO2013074211A1 (en) * | 2011-11-01 | 2013-05-23 | The Boeing Company | Method and apparatus for deposition using an atmospheric pressure plasma |
| JP2013136233A (ja) * | 2011-11-29 | 2013-07-11 | Olympus Corp | フッ素樹脂製部品の製造方法およびフッ素樹脂製部品 |
| WO2015055717A1 (de) * | 2013-10-15 | 2015-04-23 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur vorbehandlung einer substratoberfläche, verfahren zur beschichtung der substratoberfläche und verfahren zum verbinden eines substrats mit einem element |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102013017109A1 (de) * | 2013-10-15 | 2015-04-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zur Herstellung von Partikeln in einem Atmosphärendruckplasma |
Citations (5)
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|---|---|---|---|---|
| JPH0318013A (ja) * | 1989-06-14 | 1991-01-25 | Res Dev Corp Of Japan | マイクロクラスターデバイス並びにその製造方法及び装置 |
| JP2001098372A (ja) * | 1999-09-27 | 2001-04-10 | Agency Of Ind Science & Technol | マイクロクラスターによるナノ構造およびその作製方法 |
| JP2004268030A (ja) * | 2003-02-18 | 2004-09-30 | National Institute Of Advanced Industrial & Technology | ナノクラスターを担持した窒素分子活性化材料及びその作製方法 |
| JP2004268031A (ja) * | 2003-02-18 | 2004-09-30 | National Institute Of Advanced Industrial & Technology | 窒素化合物を窒素分子から直接合成する方法 |
| JP2004277813A (ja) * | 2003-03-14 | 2004-10-07 | Japan Science & Technology Agency | 薄膜の作製方法、並びに微粒子の堆積方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2002263496A (ja) * | 2001-03-13 | 2002-09-17 | Honda Motor Co Ltd | 触媒組成物、その製造方法及びカーボンナノファイバーの製造方法 |
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2005
- 2005-02-16 JP JP2006510399A patent/JP4905129B2/ja not_active Expired - Fee Related
- 2005-02-16 WO PCT/JP2005/002316 patent/WO2005083149A1/ja not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0318013A (ja) * | 1989-06-14 | 1991-01-25 | Res Dev Corp Of Japan | マイクロクラスターデバイス並びにその製造方法及び装置 |
| JP2001098372A (ja) * | 1999-09-27 | 2001-04-10 | Agency Of Ind Science & Technol | マイクロクラスターによるナノ構造およびその作製方法 |
| JP2004268030A (ja) * | 2003-02-18 | 2004-09-30 | National Institute Of Advanced Industrial & Technology | ナノクラスターを担持した窒素分子活性化材料及びその作製方法 |
| JP2004268031A (ja) * | 2003-02-18 | 2004-09-30 | National Institute Of Advanced Industrial & Technology | 窒素化合物を窒素分子から直接合成する方法 |
| JP2004277813A (ja) * | 2003-03-14 | 2004-10-07 | Japan Science & Technology Agency | 薄膜の作製方法、並びに微粒子の堆積方法 |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102084243A (zh) * | 2008-07-04 | 2011-06-01 | 罗伯特.博世有限公司 | 气体传感器和用于制造气体传感器的倒装芯片方法 |
| US9012962B2 (en) * | 2008-07-04 | 2015-04-21 | Robert Bosch Gmbh | Gas sensor and flip-chip method for its manufacture |
| CN102084243B (zh) * | 2008-07-04 | 2016-09-21 | 罗伯特.博世有限公司 | 气体传感器和用于制造气体传感器的倒装芯片方法 |
| JP2012255197A (ja) * | 2011-06-10 | 2012-12-27 | Tohoku Univ | ナノ金属ガラス粒子集合体の製造方法 |
| WO2013074211A1 (en) * | 2011-11-01 | 2013-05-23 | The Boeing Company | Method and apparatus for deposition using an atmospheric pressure plasma |
| CN103906855A (zh) * | 2011-11-01 | 2014-07-02 | 波音公司 | 用于使用常压等离子体进行沉积的方法和装置 |
| US9145602B2 (en) | 2011-11-01 | 2015-09-29 | The Boeing Company | Open air plasma deposition system |
| US9758864B2 (en) | 2011-11-01 | 2017-09-12 | The Boeing Company | Open air plasma deposition method |
| JP2013136233A (ja) * | 2011-11-29 | 2013-07-11 | Olympus Corp | フッ素樹脂製部品の製造方法およびフッ素樹脂製部品 |
| WO2015055717A1 (de) * | 2013-10-15 | 2015-04-23 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur vorbehandlung einer substratoberfläche, verfahren zur beschichtung der substratoberfläche und verfahren zum verbinden eines substrats mit einem element |
| JP2016540886A (ja) * | 2013-10-15 | 2016-12-28 | フラウンホッファー−ゲゼルシャフト ツァ フェルダールング デァ アンゲヴァンテン フォアシュンク エー.ファオ | 基材表面を前処理する方法、基材表面をコーティングする方法および基材を部材に接合する方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4905129B2 (ja) | 2012-03-28 |
| JPWO2005083149A1 (ja) | 2007-11-22 |
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