WO2005074337A1 - Elektronisches bauelement auf einem trägerelement - Google Patents
Elektronisches bauelement auf einem trägerelement Download PDFInfo
- Publication number
- WO2005074337A1 WO2005074337A1 PCT/DE2004/002682 DE2004002682W WO2005074337A1 WO 2005074337 A1 WO2005074337 A1 WO 2005074337A1 DE 2004002682 W DE2004002682 W DE 2004002682W WO 2005074337 A1 WO2005074337 A1 WO 2005074337A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electronic component
- region
- carrier element
- pressure
- areas
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1147—Sealing or impregnating, e.g. of pores
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the invention is based on a device or a method for producing a device according to the preamble of the independent claims.
- soldering paste in a thermal process, e.g. soldered onto a circuit board.
- a solder joint disruption due to temperature changes can be observed over the lifetime of the component manufactured in this way. This creates fine cracks due to the thermal load in the soldering material or in the soldering paste, which can lead to the solder joint breaking.
- solder joint breaks regularly represent a limitation of the life of such an electronic component.
- the present invention describes a device with an electronic component and a carrier element, in particular a printed circuit board, or a method for producing such a device. It is provided that the electronic component and the carrier element have an electrical contact, this electrical contact being made via at least a first material. In addition, at least a first region made of a second material is provided between the electronic component and the carrier element, it being provided in particular that this second region functions as a spacer.
- the essence of the invention is that the first and the second material have comparable mechanical behavior.
- the use of a first area between the electronic component and the carrier element advantageously extends the life of the device consisting of the two aforementioned elements.
- the use of materials which are at least comparable in mechanical properties for the electrical contacting and for the first area during production is advantageous, since this enables simple simultaneous processing during production. It is therefore possible to generate the first area without increasing the process time.
- the first and / or the second material have temperature-dependent deformations.
- the electronic component has at least partially mechanical contact with the carrier element, regardless of the electrical contact.
- This mechanical contact advantageously takes place via the first region, it being provided in particular that the first region has at least one support point for the electronic component. Bending of the electronic component is prevented by such a support point, which can act as a spacer, for example.
- a further electrical contact is made through the support point independently of the electrical contact between the electronic component and the carrier element.
- the first region or the support point advantageously enables mechanical relief of the electrical contact.
- a sealing ring is applied to the electronic component, which connects the electronic component to a housing, for example. It can be provided that this sealing ring is pressed onto the electronic component by means of a compressive force.
- the configuration of the first region as a function of the pressure conditions which arise due to the pressing on of the sealing ring is particularly advantageous, since this transmits forces to the electrical one Contacting can be prevented or reduced. Such a reduction in the forces on a soldering point that produces the electrical contact reduces the risk or the susceptibility to a soldered joint disruption.
- the configuration of the first area depending on the pressure conditions can take place differently. It is thus conceivable to adapt the number of first areas between the electronic component and the carrier element to the pressure conditions. Alternatively, however, the geometric configuration of each individual first area or the position of the at least one area below the electronic component can be varied in order to enable the best possible compensation of the compressive force and thus the mechanical contact to be relieved as far as possible.
- the aging process of the electrical contact, in particular a solder joint can be significantly prevented or delayed by a suitable number and a suitable size of the first areas.
- the size of the pressure force, the starting point of the pressure force on the electronic component and the direction of the pressure force can play a role.
- the configuration of the first region as a soldering support point, as a support ball and / or as a soldering support bump is particularly advantageous, it also being possible for a plurality of first regions to be arranged below the electronic component.
- the electronic component has a sensor element which, in particular, provides a measurement variable that is critical with respect to positional shifts. For this reason, provision can be made for the first region to reduce the positional displacement of the electronic component to a minimum due to external pressurization.
- a sensor element can be provided which detects a pressure variable, an air mass variable, an oil state variable and / or a temperature variable.
- solder connection which characterizes the first region, is applied to the carrier material before the electronic component is assembled, in particular together with the solder connections for the electrical contacting.
- FIG. 1 a shows a structure of a device consisting of an electronic component and a carrier element.
- Figures l b and c contain detailed representations that show a solder disruption on an electrical contact.
- Figure 2 shows the mechanical relief of the electrical contacts according to the invention.
- FIG. 3 shows an example of the use of support points on a pressure sensor.
- the illustration in FIG. 4 shows an example of a possible configuration of a carrier element before the electronic component is assembled.
- FIG. 1 A device consisting of an electronic component 110 (SMD; Surface Mount Devices) and a carrier element 100, as is known from the prior art, is shown in FIG.
- the electronic component 110 has electrically conductive connections 120 which make electrical contact with the carrier element 100 by means of a solder joint 130.
- the connections 120 are advantageously designed such that they enable positioning on the carrier element 100. This is typically accomplished through connectors 120 that are longer than the body of the electronic component 110. On the one hand, this enables the electronic component 1 10 to be positioned on the carrier element 100 via the connection feet and, on the other hand, prevents the bottom of the electronic component 1 10 from sitting on the carrier element 100. The result is an (air) gap 190 between electronic component 110 and carrier element 100.
- solder joints 130 are exposed to frequent temperature changes in the course of time, coarsening or fine cracks may occur within the solder. In extreme cases, these cracks can even break the loosening point. Such a solder joint disruption frequently occurs at the end of the life of the device equipped with such a solder joint. If the electronic component 1 10 or the solder joint is additionally exposed to a mechanical load, the result is premature Disruption and thus a premature aging process of the solder joint 130. A corresponding mechanical load can be generated, for example, by a compressive force 150 which acts continuously or sporadically on the electronic component 110.
- FIGS. 1b and 1c a solder joint disruption due to an external force 150 on the electronic component 110 is shown corresponding to the region 140. Since the component 110 can yield to the pressure force 150 through the gap 190, there is a mechanical load on the solder joint 130, which is shown in the form of a force decomposition in FIG. 1b. In addition to the vertical force component 160, the resulting force 180 on the connection 120 or on the solder joint 130 results in a horizontal force component 170, which connects the connection 120 to the outside, i.e. pushes away from the electronic component.
- one or more support points 200 are therefore applied to the carrier element below the electronic component 110.
- Such support points 200 allow the body of the electronic component 110 to follow the external force 150 only to a very limited extent. This results in a reduced resulting force 180, which acts on the connection 120 or the solder joint 130.
- the horizontal force component 170 is also reduced or even prevented entirely by a suitable choice of the position of the support points 200.
- the support points can be varied depending on the pressure or force ratios that act on the electronic component 110. Both the number, the position and the geometry of the individual support points can be varied.
- a plurality of support points 200 are introduced between the electronic component 110 and the carrier element 100.
- the force 150 can thus be divided into a plurality of partial forces 155.
- FIG. 3 shows a special exemplary embodiment in which the electronic component 110 has an in particular micromechanical sensor element for pressure detection.
- the electronic component 110 is suitable for detecting an air mass variable, an oil state variable and / or a temperature variable.
- an opening 320 can be provided in a housing 3 10 through which the medium can come into contact with the sensor element in the electronic component 1 10.
- a sealing ring 300 is applied to the electronic component 110, which is pressed by the housing 310 with a constant force 330 onto the electronic component 110.
- the support points 200 can be attached under the electronic component 110 such that a horizontal force component of a resulting force is avoided.
- the support points are implemented as solder points, solder bumps or solder balls.
- This has the advantage that the support points 200 can be produced simultaneously with the solder points 130 in the manufacturing process. An increase in the process time through an additional, possibly complex process step is therefore not necessary.
- solder as the material for the support points, there are only very low additional costs, which are mainly due to a low additional consumption of solder.
- the support point or support ball and the solder points are made of the same material, they also have the same mechanical properties, which, for example, prevents unwanted distortion of the electronic component on the carrier element during the manufacture or operation of the device.
- the support points extend the lifespan of the solder joints many times over, since the effects that would accelerate the aging process of the solder joints are switched off or delayed.
- various contacting surfaces are prepared before the electronic component is mounted on the carrier element, to which the connections of the electronic component are later soldered.
- a carrier element 400 is shown by way of example in FIG. 4.
- Various contact surfaces 410, 420 and 430 can be seen, with the aid of which the electronic component on the surface of the Carrier element can be aligned.
- the support points 440 are also applied simultaneously with the contacting areas before the electronic component is applied to the carrier element.
- FIG. 4 shows only one possible configuration of the positioning of the support points. A triangular, pentagonal or other symmetrical or asymmetrical arrangement of the support points is also conceivable.
- the support points are mounted directly on the rear side before mounting on the support element, i.e. the bottom of the electronic component can be applied.
- the production of the support points from epoxy adhesive is also conceivable.
- the configuration of the housing of the electronic component with standoff is also possible. However, the latter would lead to a new type of component that can only be realized in packaging production with a new production line.
- standoffs it must also be taken into account that a suitable design must be selected so that the standoffs are not crushed by the temperature changes.
- the electronic component in FIG. 2 does not rest on the support points from the outset.
- the electronic component when a force is applied, the electronic component first has to overcome a small gap until it makes mechanical contact with the support point.
- a gap must be overcome at least at one support point, whereas mechanical contact occurs at at least one other support point even without the application of force.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04802890A EP1714534A1 (de) | 2004-01-30 | 2004-12-07 | Elektronisches bauelement auf einem trägerelement |
JP2006500507A JP2006523013A (ja) | 2004-01-30 | 2004-12-07 | 基板素子における電子構成素子 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004005030A DE102004005030A1 (de) | 2004-01-30 | 2004-01-30 | Elektronisches Bauelement auf einem Trägerelement |
DE102004005030.9 | 2004-01-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005074337A1 true WO2005074337A1 (de) | 2005-08-11 |
Family
ID=34801411
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2004/002682 WO2005074337A1 (de) | 2004-01-30 | 2004-12-07 | Elektronisches bauelement auf einem trägerelement |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1714534A1 (de) |
JP (1) | JP2006523013A (de) |
KR (1) | KR20070028309A (de) |
DE (1) | DE102004005030A1 (de) |
WO (1) | WO2005074337A1 (de) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007127202A1 (en) * | 2006-04-28 | 2007-11-08 | Sandisk Corporation | Molded sip package with reinforced solder columns |
US7435624B2 (en) | 2006-04-28 | 2008-10-14 | Sandisk Corporation | Method of reducing mechanical stress on a semiconductor die during fabrication |
US8878346B2 (en) | 2006-04-28 | 2014-11-04 | Sandisk Technologies Inc. | Molded SiP package with reinforced solder columns |
US10099318B2 (en) | 2012-06-19 | 2018-10-16 | Endress+Hauser Se+Co.Kg | Method for connecting a component to a support via soldering and component connectable with a support |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120168208A1 (en) * | 2010-12-30 | 2012-07-05 | Delphi Technologies, Inc. | System and method of forming a mechanical support for an electronic component attached to a circuit board |
JP6184388B2 (ja) * | 2014-10-07 | 2017-08-23 | 三菱電機株式会社 | 電動機、空気調和機、および電動機の製造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4774634A (en) * | 1986-01-21 | 1988-09-27 | Key Tronic Corporation | Printed circuit board assembly |
US4814944A (en) * | 1985-08-14 | 1989-03-21 | Omron Tateisi Electronics Co. | Mounting structure for surface mounted type component with projection extending down from lower surface thereof and method of mounting a surface mounted type component on a printed circuit board |
US5641995A (en) * | 1995-03-22 | 1997-06-24 | Hewlett-Packard Company | Attachment of ceramic chip carriers to printed circuit boards |
US5648615A (en) * | 1993-10-07 | 1997-07-15 | Robert Bosch Gmbh | Pressure sensor providing improved connection to a circuit board |
US5805427A (en) * | 1996-02-14 | 1998-09-08 | Olin Corporation | Ball grid array electronic package standoff design |
US5952719A (en) * | 1995-07-14 | 1999-09-14 | Advanced Interconnect Technologies, Inc. | Metal ball grid electronic package having improved solder joint |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3409109B2 (ja) * | 1996-11-05 | 2003-05-26 | オムロン株式会社 | 圧力センサ |
JP2000332473A (ja) * | 1999-05-17 | 2000-11-30 | Toshiba Corp | 電子機器 |
-
2004
- 2004-01-30 DE DE102004005030A patent/DE102004005030A1/de not_active Withdrawn
- 2004-12-07 KR KR1020067015261A patent/KR20070028309A/ko not_active Application Discontinuation
- 2004-12-07 EP EP04802890A patent/EP1714534A1/de not_active Withdrawn
- 2004-12-07 WO PCT/DE2004/002682 patent/WO2005074337A1/de active Application Filing
- 2004-12-07 JP JP2006500507A patent/JP2006523013A/ja active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4814944A (en) * | 1985-08-14 | 1989-03-21 | Omron Tateisi Electronics Co. | Mounting structure for surface mounted type component with projection extending down from lower surface thereof and method of mounting a surface mounted type component on a printed circuit board |
US4774634A (en) * | 1986-01-21 | 1988-09-27 | Key Tronic Corporation | Printed circuit board assembly |
US5648615A (en) * | 1993-10-07 | 1997-07-15 | Robert Bosch Gmbh | Pressure sensor providing improved connection to a circuit board |
US5641995A (en) * | 1995-03-22 | 1997-06-24 | Hewlett-Packard Company | Attachment of ceramic chip carriers to printed circuit boards |
US5952719A (en) * | 1995-07-14 | 1999-09-14 | Advanced Interconnect Technologies, Inc. | Metal ball grid electronic package having improved solder joint |
US5805427A (en) * | 1996-02-14 | 1998-09-08 | Olin Corporation | Ball grid array electronic package standoff design |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007127202A1 (en) * | 2006-04-28 | 2007-11-08 | Sandisk Corporation | Molded sip package with reinforced solder columns |
US7435624B2 (en) | 2006-04-28 | 2008-10-14 | Sandisk Corporation | Method of reducing mechanical stress on a semiconductor die during fabrication |
TWI404174B (zh) * | 2006-04-28 | 2013-08-01 | Sandisk Technologies Inc | 具有強化焊料柱之模化系統級封裝及減低半導體晶粒上於製造中之機械應力的方法 |
US8878346B2 (en) | 2006-04-28 | 2014-11-04 | Sandisk Technologies Inc. | Molded SiP package with reinforced solder columns |
US10099318B2 (en) | 2012-06-19 | 2018-10-16 | Endress+Hauser Se+Co.Kg | Method for connecting a component to a support via soldering and component connectable with a support |
Also Published As
Publication number | Publication date |
---|---|
EP1714534A1 (de) | 2006-10-25 |
JP2006523013A (ja) | 2006-10-05 |
KR20070028309A (ko) | 2007-03-12 |
DE102004005030A1 (de) | 2005-08-18 |
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