WO2005070643A1 - Encapsulation photopolymerique et/ou polymerique dans des circuits integres avec brasage direct, et processus associe permettant sa realisation - Google Patents
Encapsulation photopolymerique et/ou polymerique dans des circuits integres avec brasage direct, et processus associe permettant sa realisation Download PDFInfo
- Publication number
- WO2005070643A1 WO2005070643A1 PCT/BR2004/000183 BR2004000183W WO2005070643A1 WO 2005070643 A1 WO2005070643 A1 WO 2005070643A1 BR 2004000183 W BR2004000183 W BR 2004000183W WO 2005070643 A1 WO2005070643 A1 WO 2005070643A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- transponder
- encapsulation
- respective process
- electrical conductors
- solderi
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 28
- 230000008569 process Effects 0.000 title claims abstract description 24
- 238000005538 encapsulation Methods 0.000 title claims abstract description 23
- 238000005476 soldering Methods 0.000 title claims abstract description 5
- 239000004020 conductor Substances 0.000 claims abstract description 25
- 239000011347 resin Substances 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 229920000642 polymer Polymers 0.000 claims abstract description 12
- 238000007906 compression Methods 0.000 claims abstract description 10
- 230000006835 compression Effects 0.000 claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- 239000002985 plastic film Substances 0.000 claims abstract description 7
- 229920006255 plastic film Polymers 0.000 claims abstract description 7
- 230000005855 radiation Effects 0.000 claims abstract description 4
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 238000009991 scouring Methods 0.000 claims description 6
- 239000004922 lacquer Substances 0.000 claims description 5
- 238000007654 immersion Methods 0.000 claims description 4
- 230000009471 action Effects 0.000 claims description 3
- 238000006116 polymerization reaction Methods 0.000 description 6
- 238000001035 drying Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000000007 visual effect Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/70—Completely encapsulating inserts
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- PHOTOPOLYMERIC AND/OR POLYMERIC ENCAPSULATION IN INTEGRATED CI RCUITS WITH DIRECT SOLDERING AND THE RESPECTIVE PROCESS TO OBTAI N IT The present description refers to an invention patent application for an innovative process covering a photopolymeric system and/or, be it the need, a polymeric system which, in both procedures, has in a whole the purpose to promote the physical integrity and protection between an electrical conductor and an electronic component, pertaining to the electronics field, more precisely used for the protection and connection between an electrical conductor and a DI E, or an integrated circuit with no encapsulation, i . e.
- the integrated circuit or chip is a basic component for the development of circuits, since it is the most important component to memorize tasks, commands and information to be performed by the circuit, being said component able to process data, following a previously determined set of instructions, interpreting them and co-relating them so to activate response protocols, which control the activities to which it was designated.
- An example of these various applications of miniaturized chip is the manufacture of transponders, sender-receiver sets intelligently replying by radio frequency to an identification message originated by a signal sent by a given radio frequency sender source, being said technology called RFID.
- transponders Within the class of transponders, we can find systems fed by means of a coil, composed by a conductor geometrically located around a common center, so to become similar to a helical curve or a set of spirals, able to receive electromagnetic waves and convert them into electrical energy, enough to feed the chip connected to the coil.
- a coil composed by a conductor geometrically located around a common center, so to become similar to a helical curve or a set of spirals, able to receive electromagnetic waves and convert them into electrical energy, enough to feed the chip connected to the coil.
- thermal compression i. e. by means of point compression with the help of a punch applied against the electrical conductor, which is supported over the surface to be connected, thus causing interaction between metals to adhere the electrical conductor over the surface.
- the electrical conductor is filamentous and small-sized, it can suffer scourings or fatigue caused by the pressure of the filament over chip edges.
- practiced encapsulations are costly processes since they involve a series of chip preparation steps to receive immobilization, being many times hot processes, which drying time requires the exposure of the chip for long periods under high temperature and with no appropriate protection, compromising the operation of said chip, since they are sensible to quick thermal changes.
- the process at issue was developed, as immersion in photopolymerizable resin by ultraviolet radiation, resulting in a pellicle granting considerable protection to the connection point, with no prejudice to the flexibility of the system as a whole.
- the initial encapsulation may be practiced by using lacquer resin or similar, being drying made in an oven at a previously set up temperature in a polymerization system, thus considerably reducing costs over the photopolymerization system.
- Figure 1 upper view of the DI E connected to electrical conductors
- Figure 3 side view of the DIE connected to the electrical conductors, covered by the protecting polymer, in which the final covering , as already stated, presents the same visual and physical/functional conditions for both photopolymerization and polymerization systems.
- Figure 4 side view of the DI E during the thermal compression process after taking the excess of material .
- Figure 5 upper perspective view of the DI E connected to electrical conductors of the coil.
- Figure 6 upper perspective view of the transponder covered with resin and plastic pellicle, keeping the same visual and physical characteristics for both photopolymerization encapsulation and polymerization encapsulation .
- Figure 7 side cut view of the transponder detailing the contour of the DI E covered with polymer, keeping visual and physical characteristics for both photopolymerization encapsulation and polymerization encapsulation.
- Figure 8 schematic upper perspective view of the transporting mat of the coil connected to the DIE for the covering step by the photopolymerizable resin.
- Figure 9 schematic side view of the transporting mat of the coil connected to the DI E to be covered with photopolymerizable resin, showing the impregnation and photopolymerization steps.
- FIG 10 - schematic side view of the coil connected to the DI E to be covered with resin, e. g . lacquer, showing the impregnation and photopolymeriation steps in a heated oven, resulting in a DI E covered with polymer.
- resin e. g . lacquer
- the PHOTOPOLYMERIC AND/OR POLYMERIC ENCAPSULATION IN I NTEGRATED CI RCU ITS WITH DIRECT SOLDERI NG AND THE RESPECTIVE PROCESS TO OBTAI N IT object of the present invention patent application is constituted of different steps, in which the DIE (1 ) of the transponder (2) receives solder from the electrical conductors (3) of the feeding coil (4) over it, being said solder imposed by the action of point compression with the help of a punch (5), being said integrated circuit (1 ) subsequently immersed in an appropriate photopolymerizable resin (6).
- the DI E (1 ) is passed to an ultraviolet light exposure step (7) to form an involving polymer layer (8), which will protect the connection from electrical conductors (3) as properly said, avoiding disruptions by pressure, fatigue or scouring around the edge of said DI E (1 ), being the set passed to the encapsulation step between two plastic films (9) to form the transponder (2).
- the process counts on a corresponding procedure, in which said DI E (1 ), after receiving solder from electrical conductors (3) of the feeding coil (4) over it, as a consequence of the point compression with the help of the punch (5), is immersed in a polymerizable resin (6), preferably lacquer, to recover electrical connectors (3), being the DI E (1 ) subsequently passed to the drying step in a heating oven (10) to form an involving polymer layer (8).
- a polymerizable resin (6) preferably lacquer
- Said layer (8) will equally protect the connection of electrical conductors (3) over the DI E (1 ), thus avoiding disruption of the wires due to pressure, fatigue or scouring around the edge formed after the encapsulation of the transponder (2) formed between both plastic films (9).
- the time for which the DI E (1 ) is submitted to said heating oven (10) is lower than one minute, preferably 15 seconds, for the applied resin to become a polymer (8), being the temperature in the oven (10) preferably lower than 150 °C.
- Said polymerization encapsulation then arises as an option linking (just like the initial photopolymerization system) extremely efficient technical conditions resulting from a study disclosing the possibility of quick drying at a considerably reduced cost, bringing in a very good cost/benefit ratio.
- the present process enables to handle the transponder (2) with no worries about the disruption of the connection of electrical conductors (3), caused by their scouring by compression over DI E (1 ) edges. Therefore, the transponder (2) can be inserted within objects with no worries about the disruption of their components, since the polymer (8) inserted around the DIE (1 ) efficiently absorbs the mechanical efforts to which it is submitted, especially under aggressive environments, besides not interfering in its data emission-reception system via radio frequency.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/BR2004/000183 WO2005070643A1 (fr) | 2004-01-27 | 2004-09-23 | Encapsulation photopolymerique et/ou polymerique dans des circuits integres avec brasage direct, et processus associe permettant sa realisation |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BRC10202961-8 | 2004-01-27 | ||
PCT/BR2004/000183 WO2005070643A1 (fr) | 2004-01-27 | 2004-09-23 | Encapsulation photopolymerique et/ou polymerique dans des circuits integres avec brasage direct, et processus associe permettant sa realisation |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005070643A1 true WO2005070643A1 (fr) | 2005-08-04 |
Family
ID=34800293
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/BR2004/000183 WO2005070643A1 (fr) | 2004-01-27 | 2004-09-23 | Encapsulation photopolymerique et/ou polymerique dans des circuits integres avec brasage direct, et processus associe permettant sa realisation |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2005070643A1 (fr) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2963747A (en) * | 1957-05-15 | 1960-12-13 | Western Electric Co | Method of plastic encapsulation using irradiation |
US4073835A (en) * | 1976-01-30 | 1978-02-14 | Toyo Ink Manufacturing Co., Ltd. | Method of resin encapsulating electrical parts with UV curing of fire retardant resin |
US5420757A (en) * | 1993-02-11 | 1995-05-30 | Indala Corporation | Method of producing a radio frequency transponder with a molded environmentally sealed package |
US5786626A (en) * | 1996-03-25 | 1998-07-28 | Ibm Corporation | Thin radio frequency transponder with leadframe antenna structure |
US5826328A (en) * | 1996-03-25 | 1998-10-27 | International Business Machines | Method of making a thin radio frequency transponder |
US6666379B2 (en) * | 1997-10-17 | 2003-12-23 | Micron Technology, Inc. | Method of fabricating a wireless radio frequency identification device |
-
2004
- 2004-09-23 WO PCT/BR2004/000183 patent/WO2005070643A1/fr active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2963747A (en) * | 1957-05-15 | 1960-12-13 | Western Electric Co | Method of plastic encapsulation using irradiation |
US4073835A (en) * | 1976-01-30 | 1978-02-14 | Toyo Ink Manufacturing Co., Ltd. | Method of resin encapsulating electrical parts with UV curing of fire retardant resin |
US5420757A (en) * | 1993-02-11 | 1995-05-30 | Indala Corporation | Method of producing a radio frequency transponder with a molded environmentally sealed package |
US5786626A (en) * | 1996-03-25 | 1998-07-28 | Ibm Corporation | Thin radio frequency transponder with leadframe antenna structure |
US5826328A (en) * | 1996-03-25 | 1998-10-27 | International Business Machines | Method of making a thin radio frequency transponder |
US6666379B2 (en) * | 1997-10-17 | 2003-12-23 | Micron Technology, Inc. | Method of fabricating a wireless radio frequency identification device |
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