Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
  • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
  • B32B37/0053—Constructional details of laminating machines comprising rollers; Constructional features of the rollers
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B15/00—Layered products comprising a layer of metal
  • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
  • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
  • H05K13/02—Feeding of components
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
  • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/01—Dielectrics
  • H05K2201/0137—Materials
  • H05K2201/0154—Polyimide
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/03—Conductive materials
  • H05K2201/0332—Structure of the conductor
  • H05K2201/0335—Layered conductors or foils
  • H05K2201/0358—Resin coated copper [RCC]
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/06—Lamination
  • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
  • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/15—Position of the PCB during processing
  • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/15—Position of the PCB during processing
  • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Definitions

• the present invention relates to a continuous production method of a double-sided conductor polyimide laminate suitable for a flexible printed circuit board or the like as a wiring material in response to a demand for miniaturization and light weight of electronic devices,
• the present invention relates to a continuous production method of a double-sided conductor polyimide laminate which can be stably produced as a roll-wound product without using a shim, and having a variable strength and quality.
• a flexible acid that is applied directly to a conductor such as copper foil by applying the uncured polyamic acid solution without using an adhesive, and then cured by heating.
• the linear expansion coefficient of the cured product 3. 0 X 10- 5 following Jiamin and the polyamic acid which is synthesized by the tetracarboxylic acid anhydride which is cured by heating is applied to the metal foil (e.g., Patent Document 1 ), A resin solution containing a polyamideimide precursor compound having a specific structural unit is applied onto a conductor and imidized (for example, see Patent Document 2), and diamines containing diaminobenzamide or a derivative thereof.
• These flexible printed wiring boards relate to a single-sided structure in which an insulating layer is adhered to only one side of a conductive metal foil by heat curing without using an adhesive.
• the present inventors first used a single-sided conductor laminate having at least three polyimide layers on one side of a conductive metal foil (M), Production of double-sided conductor polyimide laminate in which conductive metal foil (M) is laminated on the polyimide layer under heat and pressure
• Patent Document 1 JP-A-62-212140
• Patent Document 2 JP-A-63-84188
• Patent Document 3 JP-A-63-245988
• Patent Document 4 Japanese Patent Publication No. 6-49185
• Patent Document 5 JP-A-10-323935
• the inventors of the present invention have conducted intensive studies on the above problems, and as a result, have found that a pair of heated press rolls Press roll by using a surface temperature uniforming means and a heating control means for generating different thermal expansions in the central zone and both side zones, and causing a crown-shaped thermal expansion in the central zone.
• the purpose of the above is to automatically correct the unevenness of the pressing force due to the slight inclination when adjusting the gap, and to integrate the layers by heating and pressing, and to make the roll surface a specific roughened state. Have been achieved, and the present invention has been completed.
• a conductive metal foil is placed on the top layer of the insulator layer.
• (M) is laminated by heating and pressing to form a double-sided conductor polyimide laminate.
• the pair of press rolls are provided with a surface temperature uniforming means using a heat medium and a heating control means for an internal force for causing different thermal expansions in the central zone and the side zones.
• the heating control means heats the inner wall surface of the central zone to a temperature 5-20 ° C higher than the inner wall surfaces of the both side zones, so that the delicate adjustment of the press roll gap is achieved.
• the surface temperature uniforming means is a jacket or a heat pipe filled with a heat medium embedded near the surface of the press roll, and the means for controlling the internal force of the roll is a roll.
• the method is based on radiant heat from a dielectric heating coil or the like provided in at least three places inside the hollow, and controls the radiant heat to be applied by changing the ratio of the current flowing to the heating means at the three places. This is a method for continuously producing a double-sided conductor polyimide laminate of the above.
• the pair of press rolls are arranged vertically with the central axis being horizontal, and at least one of the press rolls is moved to a predetermined position by a pressing means to adjust the gap between the two.
• the thermal expansion is performed at least in the central zone by heating control means from the inside, and the roll surface temperature is 340-390 ° C, the linear pressure between the press rolls is 50KgZcm-500KgZcm (490NZcm-4900NZcm),
• the insulator layer has at least three layers: a base layer made of thermoplastic polyimide resin, an intermediate main layer made of low thermal expansion polyimide resin, and a top layer made of thermoplastic polyimide resin.
• a base layer made of thermoplastic polyimide resin
• an intermediate main layer made of low thermal expansion polyimide resin
• a top layer made of thermoplastic polyimide resin.
• the gap at the contact surface with the base material is reduced.
• the gap is absorbed by the thermal expansion of the central zone, and the ideal contact state is maintained. This prevents poor appearance such as vertical stripes on the surface of the laminate during thermocompression bonding.
• the degree of adhesion between the base material and the roll surface is reduced, and complicated wrapping (hereinafter referred to as “tralle”) or pits ( The generation of dents of several tens of microns on the product surface is also prevented.
• FIG. 1 is a schematic flow chart showing a method for producing a double-sided conductor polyimide laminate of the present invention.
• FIG. 2 (a) is an explanatory diagram showing an ideal contact state between a roll and a substrate
• FIG. 2 (b) is an explanatory diagram showing a poor contact state between the roll and the substrate when the roll is inclined.
• FIG. 3] (a)-(d) is an explanatory view showing the state of contact with the base material when the crown shape of the center zone of the roll and the pressure between the rolls are changed.
• FIG. 4 is a schematic longitudinal sectional view showing an example of a press roll.
• the conductive metal foil (M and M) used in the present invention has a thickness of 5 to 150 mm.
• Examples thereof include copper, aluminum, iron, silver, palladium, nickel, chromium, molybdenum, tungsten, zinc, and alloys thereof having a diameter of ⁇ m, and copper is preferable.
• rolled copper foil products which have been avoided because of their low rigidity and difficult to control the pressure by heating and pressing, can also be suitably used.
• the surface may be subjected to siding, plating, copper-zinc alloy plating, or chemical or mechanical surface treatment with aluminum alcoholate, aluminum chelate, silane coupling agent, etc. Good.
• Patent Document 1-14 a single-sided conductor laminate in which a polyimide resin is heat-cured and adhered as an insulating layer without adhesive to one surface of a conductive metal foil (M) that is strong is described in Patent Document 1-14.
• the publicly known ones disclosed in and 5 can be used.
• the polyimide resin used as the insulator layer is a general term for a resin having an imide ring structure, such as polyimide and polyamide. Imide, polyester imide and the like.
• Examples of the polyimide resin layer include, but are not particularly limited to, those having low thermal expansion as described in Patent Documents 14 to 14, and thermoplastic polyimides which melt or soften when heated.
• the insulating layer is composed of a base layer made of a thermoplastic polyimide resin obtained by heating and curing a polyimide precursor resin solution described in Patent Document 5, and a low thermal expansion polyimide resin.
• An intermediate main layer and a top layer made of a thermoplastic polyimide resin are preferably composed of at least three polyimide resin layers.
• the coefficient of linear expansion was determined using a sample that had completed the imidization reaction, heated to 250 ° C using a thermomechanical analyzer (TMA), cooled at a rate of 10 ° CZ, 240-100 The average linear expansion coefficient in the range of ° C was determined.
• TMA thermomechanical analyzer
• a polyimide resin having a unit structure represented by the following general formula (I) described in Patent Document 5 is desirable.
• R—R represents a lower alkyl group, a lower alkoxy group, a halogen group, or hydrogen.
• thermoplastic polyimide resin used for the base layer and the top layer may have any structure as long as its glass transition point temperature is 350 ° C. or lower. It is preferable that the adhesive strength at the interface is sufficient when pressed under heat and pressure.
• the thermoplastic polyimide resin as used herein includes those which can be adhered by pressure so that they do not necessarily show sufficient fluidity in a normal state above the glass transition point. Specific examples of the thermoplastic polyimide resin having such properties include those having a unit structure represented by the following general formula (II) or general formula (III) described in Patent Document 5 described above. [0024] [Formula 2]
• Ai ⁇ is a divalent aromatic group having 12 or more carbon atoms.
• Ar is a divalent aromatic group having 12 or more carbon atoms.
• divalent aromatic group Ar or Ar include, for example,
• a method for manufacturing a single-sided conductor laminate is described in Patent Documents 4 and 5 described above.
• a polyimide precursor solution or a polyimide solution is mixed with a known curing agent such as an acid anhydride-based amine-based curing agent, a silane coupling agent, a titanate coupling agent, an adhesion imparting agent such as an epoxy compound, and a flexible material such as rubber.
• a single-sided conductor laminate can be obtained by adding various additives such as a property imparting agent and a catalyst, applying the additive to a conductive metal foil (M), and then thermally curing by heat treatment.
• the conductive metal foil (M) has a thermoplastic polyimide resin layer as a base layer, an intermediate main layer a low thermal expansion polyimide resin layer, and a top layer (the outermost layer). It is preferable that a thermoplastic polyimide resin layer is laminated as ()).
• the intermediate main layer does not include the low thermal expansion polyimide resin layer
• the single-sided conductor laminate obtained in the heat curing step has a large warp or curl, and the workability in the subsequent steps is significantly reduced. I do.
• the top layer does not include a thermoplastic polyimide resin layer, the adhesive force by thermocompression bonding with the conductive metal foil in the thermocompression roll process is not sufficiently exhibited, which is not preferable. ! / ,.
• the ratio (t Zt) of the thickness t of the low thermal expansion polyimide resin layer to the thickness t of the thermoplastic polyimide resin layer is in the range of 2-100, preferably 5-20. Range is good.
• the adhesive force by the thermocompression bonding in the second step is not sufficiently exhibited.
• the application of the plurality of polyimide-based resins onto the conductive metal foil (M) can be performed in the form of the resin solution, and is preferably described in Patent Documents 4 and 5 described above.
• the heat conversion of the precursor to polyimide is performed simultaneously. It is preferred to do so. If another polyimide-based precursor solution is applied on the layer completely converted to polyimide and heat-treated to close the imide ring, the adhesion between the polyimide-based resin layers may not be fully exhibited. This causes the quality of the double-sided laminate of the product to deteriorate.
• a method for applying a polyimide resin solution or a precursor solution thereof (polyamic acid solution) on the conductive metal foil (M) for example, a knife coater, a die coater, a roll coater
• the coating can be carried out by a known method using a coater, a curtain coater or the like.
• a die coater or a knife coater is suitable.
• the polymer concentration of the polyimide-based precursor solution used for coating is usually 5 to 30% by weight, preferably 10 to 20% by weight, depending on the degree of polymerization of the polymer. If the polymer concentration is lower than 5% by weight, a single coating cannot provide a sufficient film thickness, and if the polymer concentration is higher than 30% by weight, the solution viscosity becomes too high and coating becomes difficult.
• the polyamic acid solution applied to the conductive metal foil to a uniform thickness is then subjected to a heat treatment to remove the solvent and further close the imide ring.
• a heat treatment to remove the solvent and further close the imide ring.
• the final heat treatment temperature is usually preferably 300 to 400 ° C. Above 400 ° C, thermal decomposition of polyimide starts to occur gradually, and below 300 ° C, the polyimide film becomes conductive metal. A single-sided conductor laminate having good flatness cannot be obtained because the film is not sufficiently oriented on the foil.
• the overall thickness of the polyimide resin layer as an insulator thus formed is usually 10 to 150 m.
• FIG. 1 shows a single-sided conductor laminate of the present invention and a conductive metal foil (M) introduced between a pair of press rolls, and laminated by heating and pressing.
• M conductive metal foil
• FIG. 2 (a) is an explanatory view showing a state in which the base material is in ideal contact with the press roll
• FIG. 2 (b) is an explanatory view showing a state in which the press roll is inclined and contact pressure is uneven due to poor contact
• FIGS. 3 (a) and 1 (d) are explanatory diagrams showing the state of contact with the base material when the pressure between the press rolls is changed by forming a crown shape in the central region of the press rolls.
• FIG. 4 is a schematic longitudinal sectional view showing an example of a press roll.
• FIG. 1 a single-sided conductor laminate 1 in which an insulating layer made of a polyimide resin is adhered to one surface of the above-described conductive metal foil (M) by heating and curing, and a conductive metal foil (M) 2 And together
• Roll winding state force After being continuously drawn out and preheated in a state where the flatness is enhanced through a plurality of guide rolls 3, 3 ', 4, 4', etc., a pair of heated press rolls 5, 6 And a conductive metal foil (M) is laminated on the top layer of the insulator layer by heating and pressing.
• M conductive metal foil
• the integrated double-sided conductor polyimide laminate 7 was formed by blowing an inert gas for cooling as appropriate. It is pre-cooled by the cooling means c, passes through a plurality of guide rolls 8, 8 ', and is further cooled in the outside air to form a roll wound product 9.
• a guide roll 3 '(4') immediately before the heating press roll 5.6 is a type having a heating means built-in type or a guide roll 3 '(4') is provided immediately before the heating press roll. Install a heating lamp or heater h, h, etc. that emits radiant energy.
• Heating may be performed, or both preheating means may be used in combination.
• a plurality of guide rolls 3, 3, 4, 4, etc., and a pair of heating press rolls 5, 6 are provided in a processing chamber 10 in a nitrogen gas atmosphere at atmospheric pressure or higher to prevent oxidation of the conductive metal foil. It is desirable to provide a nitrogen seal mechanism (labyrinth seal) 11 at the base material inlet and the laminate outlet.
• the pair of heating press rolls 5 and 6 hold at least one of the press rolls (not shown) with the center axis horizontal and arranged above and below at both sides of the shaft center, and are positioned at a predetermined position.
• the optimal pressing force is transmitted to the introduced base materials 1 and 2 mutually.
• one of the press roll and the base material when the gap adjustment was ideally performed when the gap between them was narrowed was idealized as shown in Fig. 2 (a). A contact state (however, the other press roll is omitted) is obtained.
• the roll to be moved is imbalanced by several microns due to the occurrence of deflection due to the holding of both ends and the limitation of machine accuracy, the height positions of both ends are kept unbalanced during the gap adjustment work, etc. Inevitably leaning toward.
• FIG. 3 (a)-(d) shows the pressure (press pressure) at the time of adjusting the gap between the press rolls on the vertical axis, and the state of contact of the substrate with the roll surface when the pressure changes.
• Fig. 3 (a) shows the initial stage of contact when the pressure is low and gaps are formed at both ends of the substrate due to the crown state due to thermal expansion.
• (b) and (c) show the stage where the pressure between the press rolls was appropriate and the crown was pressed against each other to maintain the flattened and optimal contact state, and (d) the pressure between the press rolls
• This is a case in which a gap is formed between the substrate and the base material in the center part of the press jar when the amount of excess is excessive. Therefore, it is clear that there is a preferable range of the pressing force applied to the base material for maintaining the optimum contact state between the press rolls.
• FIG. 4 shows an example of a suitable press roll for causing a crown state due to thermal expansion in a central zone portion of the press roll.
• the press roll 5 (6) has an outer peripheral portion of a cavity and a fixed central shaft 12 protruding at both ends of the press roll 5 (6) integrated through a rotation support member 13 such as a bearing disposed at both ends of the outer peripheral portion of the roll. It was done.
• the press roll 5 (6) is forcibly rotated around the central axis 12 by means of a rotary support member 13 such as a bearing through a transmission means such as a gear, which is not shown in the figure, and a rotational driving source force. It is.
• Heating control means 14, 15 and 16 using radiant heat are fixed to the center axis 12 at three positions at both ends and at the center.
• the radiant heat energy applied to the inner wall of the press roll is controlled by changing the ratio of the current flowing to the control means (a constant current value as a whole).
• the central zone portion greatly expands, and the press Non-uniformity of the pressing force due to subtle inclination when adjusting the roll gap can be automatically corrected. If this temperature difference is less than 5 ° C, the thermal expansion is too small, and if it is more than 20 ° C, it becomes difficult to make the roll surface temperature uniform, which is not preferable.
• a heat conductive element called a heat-pipe 17 or a jacket filled with an organic heat medium having good heat conductivity is embedded near the outer surface of the roll.
• the heating temperature of the roll outer surface temperature is desirably equal to or higher than the glass transition point of the thermoplastic polyimide resin, more preferably 350 to 390 ° C.
• the roll outer surface temperature is controlled by a temperature sensor embedded in the roll surface.
• the above-mentioned pair of heated press rolls were arranged above and below both under a nitrogen atmosphere by moving at least one of the pair of press rolls arranged vertically with the central axis being horizontal to a predetermined position.
• the linear pressure between the pair of press rolls at least one of the press rolls is moved to a predetermined position to narrow the gap between the two, and the pressing force is transmitted between the press rolls through the introduced base material.
• the linear pressure between the press rolls has a preferable range for the pressure applied to the base material for maintaining the optimum contact state between the press rolls as described in FIG.
• thermocompression bonding under the conditions of 500 kg / cm (490 N / cm—4900 N / cm), preferably 100—300 kg Zcm (980 NZcm—2940 N / cm), and a transit time of 2—5 seconds.
• a pair of heated press rolls to be used is used in a roughened state in which the surface roughness (Ra) of the press roll is 0.01 to 15 m, preferably 0.1 to 3 m. Is desirable. If the surface roughness (R a ) of the press roll is 0.01 ⁇ m or less, the double-sided conductor polyimide coming out from between the heating rolls causes a roll due to the close contact of the rolls, causing a seam during running. If it is 5 ⁇ m or more, the unevenness of the roll surface is transferred to the surface of the laminate, which is not preferable.
• the roughened surface of the roll within the above range can be adjusted by spraying a ceramic coating.
• the surface roughness (Ra) is determined by a stylus type surface roughness meter using a diamond needle.
• a double-sided conductor polyimide laminate 7 in which the conductive metal foil (M) 2 was laminated and integrated by heating and pressure bonding on the top layer of the single-sided conductor laminate 1 was formed by the heating press rolls 5 and 6.
• the temperature is preferably 200 ° C. or higher and not higher than the glass transition point of the thermoplastic polyimide resin as the top layer resin at 200 ° C. or higher, preferably 200 to 300 ° C.
• the double-sided conductor type polyimide laminate obtained in the present invention has a conductive metal layer as a conductor on both sides of a polyimide resin layer as an insulator, and has good appearance and no occurrence of shiny. Is a roll-wound product that does not vary in quality and is used as an electronic wiring material to be used with the advancement of miniaturization and light weight of mobile phones, digital cameras, navigators, and other various electronic devices that are becoming more sophisticated. It is suitable.
• the coefficient of linear expansion was measured by using a thermomechanical analyzer (TMA100) manufactured by Seiko Denshi Kogyo Co., Ltd., and then the temperature was raised to 250 ° C and then cooled at a rate of 10 ° CZ to 240 ° C-100 ° C. The average coefficient of linear expansion between C was calculated and found.
• TMA100 thermomechanical analyzer
• the polar radii of a copper-clad product having dimensions of 100 mm ⁇ 100 mm after imidization by heat treatment were measured.
• the adhesive strength of a single-sided copper-clad product was measured according to JIS C5016: 7.1, using a pattern with a conductor width of 3mm and peeling the copper foil in the 180 ° direction at a speed of 50mmZ. It was obtained as a value.
• MABA 2, -Methoxy-4,4, -Diaminobenzayulide.
• a polyimide precursor solution was prepared in the same manner as in Synthesis Example 1, except that 1 mol of DDE was used as the diamine component and 1 mol of BTDA was used as the acid anhydride component.
• the obtained polyimide precursor solution had a polymer concentration of 15% by weight and an apparent viscosity of 300 mPa ⁇ s at 25 ° C. by a B-type viscometer.
• the polyimide precursor solution 2 prepared in Synthesis Example 2 was uniformly applied to a roughened surface of a 35 ⁇ m roll-shaped electrolytic copper foil (manufactured by Nippon Gould Co., Ltd.) with a thickness of 12 m using a die coater. The solvent was removed by continuous treatment in a hot air drying oven at 120 ° C. Next, the polyimide precursor solution 1 prepared in Synthesis Example 1 was uniformly coated with a thickness of 200 m from above the polyimide precursor layer using a reverse roll coater, and was continuously applied in a hot air drying oven at 120 ° C.
• the polyimide precursor solution 2 prepared in Synthesis Example 2 was evenly applied to a thickness of 15 m, and then heated from 120 ° C to 360 ° C in a hot-air drying oven for 30 minutes.
• the single-sided conductor laminate (single-sided copper clad product) a having a polyimide resin layer having a thickness of 25 ⁇ m and having good flatness without warpage or curling was obtained by heating and heat-treating and imidizing.
• the 180 ° peel strength CFIS C-5016) between the copper foil layer of this single-sided conductor laminate a and the polyimide resin layer was 0.8 KgZcm, and the linear expansion coefficient of the film after etching was 0.8 kggcm. 23. was 5 X 10- 6 (lZ ° C ).
• both substrates can be heated and pressed under the condition that the linear pressure between the press rolls can be adjusted within the range of 150-170 kg / cm and the passage time within the range of 2-5 seconds.
• the outer diameter of the heating press roll is 300 mm
• the width is 800 mm
• a jacket type heat pipe filled with naphthalene is embedded near the surface as a uniform heating means
• the inner central axis is located at both ends and the center.
• Induction heating coil 400mm width at center
• the main coil and the sub-coil with a width of 200 mm are arranged on both sides of the main coil.
• Example 1 when the set temperature of the roll surface is 360 ° C, the linear pressure between the press rolls is 150 kgZcm, the passage time is 3 seconds, and there is no temperature difference between the inner wall surface of the central zone and the inner wall surfaces of both side zones. (0 ° C), and at 10 ° C and 20 ° C, the ceramic coating was sprayed to reduce the surface roughness (Ra) of the pre-press layer to 0.01 or less, 0.05, 0.20, and 10.
• Table 2 shows the results of an investigation of the surface condition of the double-sided copper-clad product obtained when it was changed during the period.
• Example 1 the set temperature of the roll surface was set to 360 ° C, the temperature difference between the central zone and the zones on both sides was set to 10 ° C, and the press roll surface roughness (Ra) was set to 0.
• the linear pressure between the press rolls was changed in the range of 10 to 500 kggcm under the conditions described above, the contact state of both substrates with the press rolls and the surface state of the obtained double-sided copper-clad product were investigated.
• the condition of contact with the press roll under a linear pressure of 50-300 KgZcm is optimal, and the surface of the obtained laminated integrated product is free of any shear and has no quality variation. It was confirmed that stable production was possible as a roll wound product.
• the method for producing a double-sided conductor polyimide laminate in which the conductive metal foil of the present invention is laminated and integrated by heating and pressing is a method of rolling a double-sided conductor polyimide-based laminate having a stable quality without appearance defects such as vertical wrinkles in a rolled state. It is a method of manufacturing continuously and is highly industrially applicable.

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• 2004
  • 2004-01-16 JP JP2004009530A patent/JP3675805B1/ja not_active Expired - Lifetime
  • 2004-12-27 KR KR1020067016381A patent/KR101056277B1/ko not_active Expired - Lifetime
  • 2004-12-27 WO PCT/JP2004/019522 patent/WO2005068182A1/ja active Application Filing
  • 2004-12-27 CN CN2004800405144A patent/CN1906028B/zh not_active Expired - Lifetime
• 2005
  • 2005-01-14 TW TW094101198A patent/TW200538277A/zh not_active IP Right Cessation

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