WO2005066996A1 - 画像表示装置およびその製造方法 - Google Patents
画像表示装置およびその製造方法 Download PDFInfo
- Publication number
- WO2005066996A1 WO2005066996A1 PCT/JP2004/019037 JP2004019037W WO2005066996A1 WO 2005066996 A1 WO2005066996 A1 WO 2005066996A1 JP 2004019037 W JP2004019037 W JP 2004019037W WO 2005066996 A1 WO2005066996 A1 WO 2005066996A1
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- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- spacers
- spacer
- image display
- substrates
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
- H01J29/02—Electrodes; Screens; Mounting, supporting, spacing or insulating thereof
- H01J29/028—Mounting or supporting arrangements for flat panel cathode ray tubes, e.g. spacers particularly relating to electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J31/00—Cathode ray tubes; Electron beam tubes
- H01J31/08—Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
- H01J31/10—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes
- H01J31/12—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes with luminescent screen
- H01J31/123—Flat display tubes
- H01J31/125—Flat display tubes provided with control means permitting the electron beam to reach selected parts of the screen, e.g. digital selection
- H01J31/127—Flat display tubes provided with control means permitting the electron beam to reach selected parts of the screen, e.g. digital selection using large area or array sources, i.e. essentially a source for each pixel group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
- H01J9/18—Assembling together the component parts of electrode systems
- H01J9/185—Assembling together the component parts of electrode systems of flat panel display devices, e.g. by using spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2329/00—Electron emission display panels, e.g. field emission display panels
- H01J2329/86—Vessels
- H01J2329/8625—Spacing members
- H01J2329/863—Spacing members characterised by the form or structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2329/00—Electron emission display panels, e.g. field emission display panels
- H01J2329/86—Vessels
- H01J2329/8625—Spacing members
- H01J2329/864—Spacing members characterised by the material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2329/00—Electron emission display panels, e.g. field emission display panels
- H01J2329/86—Vessels
- H01J2329/8625—Spacing members
- H01J2329/8645—Spacing members with coatings on the lateral surfaces thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2329/00—Electron emission display panels, e.g. field emission display panels
- H01J2329/86—Vessels
- H01J2329/8625—Spacing members
- H01J2329/865—Connection of the spacing members to the substrates or electrodes
- H01J2329/866—Adhesives
Definitions
- Image display device and method of manufacturing the same
- the present invention relates to an image display device including a substrate disposed in opposition and a plurality of spacers disposed between the substrates, and a method of manufacturing the same.
- CTRs cathode ray tubes
- SEDs surface conduction electron-emitting devices
- FED field emission device
- the SED includes a first substrate and a second substrate that are opposed to each other at a predetermined interval, and these substrates are joined to each other via rectangular side walls to form a vacuum envelope. Is composed. On the inner surface of the first substrate, phosphor layers of three colors are formed, and on the inner surface of the second substrate, a large number of electron-emitting devices corresponding to each pixel are arranged as electron sources for exciting the phosphor. .
- Each electron-emitting device includes an electron-emitting portion, a pair of electrodes for applying a voltage to the electron-emitting portion, and the like.
- an anode voltage is applied to the phosphor layer, and the electron beam emitted from the electron-emitting device is accelerated by the anode voltage and collided with the phosphor layer, so that the phosphor emits light. Display an image.
- a high voltage of 5 kV or more is applied between the front plate and the back plate.
- the electrons emitted from the electron-emitting devices arranged on the rear panel accelerate the speed of the emitted electrons to reach the phosphor on the front panel. Since the brightness of the displayed image depends on the acceleration voltage, a high voltage (high withstand voltage) is desirable.
- the gap between the first substrate and the second substrate is set to be as small as about 11 mm from the viewpoints of resolution, characteristics of the support member, and manufacturability.
- the present invention has been made in view of the above points, and an object of the present invention is to suppress an electric discharge generated between the first and second substrates, to improve an image display device with improved reliability and display quality, and to manufacture the same. It is to provide a method.
- an image display device is arranged such that a first substrate on which an image display surface is formed is opposed to the first substrate with a predetermined gap therebetween.
- a second substrate provided with a plurality of electron emission sources for exciting the image display surface, and a second substrate formed of an insulating material and provided between the first and second substrates.
- a plurality of spacers each having an end in contact with at least one of the first substrate and the second substrate and supporting an atmospheric pressure load acting on the first and second substrates, wherein each of the spacers is
- the first substrate and the second substrate are formed of at least two types of materials having different softening temperatures, and an end portion in contact with at least one of the first substrate and the second substrate is formed of a material having a high softening temperature.
- An image display device includes a first substrate on which an image display surface is formed, and a first substrate, which is opposed to the first substrate with a predetermined gap therebetween, and wherein the image display surface is A second substrate provided with a plurality of electron emission sources to be excited, and a plurality of electron beam passage holes respectively opposed to the electron emission source, and first and second substrates opposed to the first and second substrates.
- a plate-shaped support substrate provided between the two substrates, and an end formed of an insulating material and provided on the support substrate and in contact with at least one of the first substrate and the second substrate.
- a plurality of spacers for supporting an atmospheric load acting on the first and second substrates wherein each of the spacers is formed of at least two kinds of materials having different softening temperatures.
- a method of manufacturing an image display device is characterized in that the first substrate on which an image display surface is formed is opposed to the first substrate with a predetermined gap therebetween, and the image display is performed.
- a second substrate provided with a plurality of electron emission sources for exciting a surface, and a second substrate formed of an insulating material and provided between the first and second substrates;
- a method for manufacturing an image display device comprising: a plurality of spacers having an end portion in contact with at least one of them and supporting an atmospheric pressure load acting on the first and second substrates,
- a molding die having a plurality of bottomed spacer forming holes is prepared, and glass is contained at the bottom of each of the spacer forming holes of the molding die, and a first material having a high softening temperature and the first material is mixed with the above-mentioned spacer.
- Each of the spacer forming holes of the mold filled with the first material is filled with an amount of less than the volume of the spacer forming hole, and each of the spacer forming holes contains glass and has a lower temperature than the softening temperature of the first material.
- a method of manufacturing an image display device is characterized in that the first substrate on which the image display surface is formed is opposed to the first substrate with a predetermined gap therebetween, and A second substrate provided with a plurality of electron emission sources for exciting an image display surface, and a plurality of electron beam passage holes respectively facing the electron emission sources, facing the first and second substrates; And a plate-shaped support substrate provided between the first and second substrates, and abuts on at least one of the first and second substrates while being provided on the support substrate and formed of an insulating material. And a plurality of spacers having an end portion formed and supporting an atmospheric pressure load acting on the first and second substrates.
- a plate-shaped support substrate having a through hole and a mold having a plurality of bottomed spacer forming holes are prepared, and the bottom of each spacer forming hole of the mold contains glass.
- the first material having a high softening temperature is filled in an amount less than the volume of the spacer forming hole.
- Each spacer forming hole of the mold filled with the first forming material is filled with a second material containing glass and having a softening temperature lower than the softening temperature of the first material. After the filled first and second materials are cured, they are released from the molding die, placed on the support substrate with the second material side bonded to the support substrate, and placed on the support substrate.
- the first and second materials are fired to form a plurality of spacers, and the fired plurality of spacers are below the softening temperature of the first material and above the softening temperature of the second material.
- the plurality of spacers are pressed in the height direction by a pressing plate in contact with the tips of the plurality of spacers to be formed at a common height.
- FIG. 1 is a perspective view showing an SED according to a first embodiment of the present invention.
- FIG. 2 is a perspective view of the SED, taken along a line II II in FIG. 1.
- FIG. 3 is an enlarged sectional view showing the SED.
- FIG. 4 is an enlarged sectional view showing a part of a spacer structure in the SED.
- FIG. 5 is a cross-sectional view showing a grid and a mold used for manufacturing the spacer structure.
- FIG. 6A is a cross-sectional view showing the molding die in an enlarged manner.
- FIG. 6B is a cross-sectional view showing the molding die in an enlarged manner.
- FIG. 7 is a cross-sectional view showing a step of irradiating with UV light in a state where the mold is filled with a first material and a second material.
- FIG. 8 is a cross-sectional view showing an assembly in which the mold and the grid are brought into close contact with each other.
- FIG. 9 is a cross-sectional view showing a state where the mold is released.
- FIG. 10 is a cross-sectional view showing a step of pressing the spacer structure.
- FIG. 11 is an enlarged sectional view showing a part of an SED according to a second embodiment of the present invention.
- FIG. 12A is a cross-sectional view showing a state in which a second material is filled in the molding die in the second embodiment.
- FIG. 12B is a cross-sectional view showing a state in which the molding die is filled with a second material in the second embodiment.
- FIG. 13 is a cross-sectional view showing an assembly in which the molding die and the grid are brought into close contact with each other in the second embodiment.
- FIG. 14 is a cross-sectional view showing a step of spraying a first material on a grid and a second material in the second embodiment.
- FIG. 15 is a cross-sectional view showing a step of pressing a spacer structure in the second embodiment.
- FIG. 16 is an enlarged sectional view showing a part of an SED according to a third embodiment of the present invention.
- FIG. 17A is a cross-sectional view showing a state where the mold is filled with a spacer forming material in the third embodiment.
- FIG. 17B is a cross-sectional view showing a state where the mold is filled with a spacer forming material in the third embodiment.
- FIG. 18 is a cross-sectional view showing an assembly in which the molding die and the grid are brought into close contact with each other in the third embodiment.
- FIG. 19 is a cross-sectional view showing a step of pressing a spacer structure in the third embodiment.
- FIG. 20 is an enlarged sectional view showing a part of an SED according to a fourth embodiment of the present invention.
- the SED is a first substrate made of a rectangular glass plate. 10 and a second substrate 12, and these substrates are opposed to each other with a gap of about 1.0-2. Omm.
- the first substrate 10 and the second substrate 12 are joined to each other via a rectangular frame-shaped side wall 14 made of glass to form a flat vacuum envelope 15 whose inside is maintained in a vacuum. .
- a phosphor screen 16 functioning as an image display surface is formed.
- This phosphor screen 16 is configured by arranging phosphor layers R, G, and B that emit red, green, and blue light and a light-shielding layer 11, and these phosphor layers are formed in a stripe shape, a dot shape, or a rectangular shape. Is formed.
- a metal knock 17 and a getter film 19 which also have a force such as aluminum, are sequentially laminated.
- a large number of surface conduction electron-emitting devices 18 each emitting an electron beam are provided as electron emission sources for exciting the phosphor layers R, G, and B of the phosphor screen 16. Is provided. These electron-emitting devices 18 are arranged in a plurality of columns and a plurality of rows corresponding to each pixel. Each electron-emitting device 18 includes an electron-emitting portion (not shown), device electrodes for applying a voltage to the electron-emitting portion, and the like.
- a number of wirings 21 for supplying a potential to the electron-emitting devices 18 are provided in a matrix shape, and the ends of the wirings 21 are drawn out of the vacuum envelope 15.
- the side wall 14 functioning as a joining member is sealed to the peripheral portion of the first substrate 10 and the peripheral portion of the second substrate 12 by a sealing material 20 such as a low melting point glass or a low melting point metal. Substrates are joined together.
- a sealing material 20 such as a low melting point glass or a low melting point metal.
- the SED has a spacer structure 22 disposed between the first substrate 10 and the second substrate 12.
- the spacer structure 22 is integrally formed on both sides of the grid with a rectangular grid 24 provided between the first and second substrates 10 and 12, which also has a metal plate force. And a large number of columnar spacers.
- the grid 24 functioning as a support substrate has a first surface 24a facing the inner surface of the first substrate 10 and a second surface 24b facing the inner surface of the second substrate 12; It is arranged parallel to the substrate.
- a large number of electron beam passage holes 26 are formed in the grid 24 by etching or the like.
- the electron beam passage holes 26 are arranged to face the electron-emitting devices 18, respectively, and transmit the electron beams emitted from the electron-emitting devices.
- the grid 24 is formed of, for example, an iron-nickel-based metal plate with a thickness of 0.1 to 0.3 mm.
- an oxide film made of an element constituting the metal plate for example, Fe
- NiFe O oxide film is formed.
- each electron beam passage hole 26 is covered with a high resistance film having a discharge current limiting effect.
- This high-resistance film is formed of a high-resistance material containing glass as a main component.
- a plurality of first spacers 30a are erected on the first surface 24a of the grid 24, and are located between the adjacent electron beam passage holes 26, respectively.
- the tip of the first spacer 30a is in contact with the inner surface of the first substrate 10 via the getter film 19, the metal back 17, and the light shielding layer 11 of the phosphor screen 16.
- a plurality of second spacers 30 b are erected on the second surface 24 b of the grid 24, and are respectively located between the adjacent electron beam passage holes 26.
- the tip of the second spacer 30b is in contact with the inner surface of the second substrate 12.
- the tip of each second spacer 30b is located on the wiring 21 provided on the inner surface of the second substrate 12.
- the first and second spacers 30a and 30b are located in alignment with each other, and are formed integrally with the grid 24 with the grid 24 sandwiched from both sides.
- each of the first and second spacers 30a and 30b is formed in a tapered tapered shape whose diameter decreases toward the extending end from the grid 24 side.
- each of the first spacers 30a has a substantially elliptical cross-sectional shape, and the diameter of the base located on the grid 24 side is about 0.3 mm X 2 mm, and the diameter of the extension end is about 0.2 mm X
- the height hi is 2 mm, and the height hi along a direction perpendicular to the first and second substrates 10 and 12 is about 0.6 mm.
- Each of the second spacers 30b has a substantially elliptical cross-sectional shape, the base end located on the grid 24 side has a diameter of about 0.3 mm X 2 mm, and the extension end has a diameter of about 0.2 mm X 2 mm.
- a height h2 along a direction orthogonal to the first and second substrates 10 and 12 is formed to be about 0.8 mm.
- the overall height H of the spacer structure 22 including the grid 24 is 1.52 mm.
- the difference in height between adjacent first spacers 30a is formed within 5 ⁇ m, and the variation in height of all first spacers is formed within 0.1 mm.
- the height difference between the adjacent second spacers 30b is formed within 5 m, and the height variation of all the second spacers is formed within 0.1 mm. ing.
- each of the first and second spacers 30a and 30b is formed of at least two types of materials having different softening temperatures.
- each of the first spacers 30a has a tip portion 31a in contact with the first substrate 10 formed of a first material having a high softening temperature, and another portion, that is, a base portion 31b having a first material. It is formed of a second material having a lower softening temperature than the material.
- each of the second spacers 30b has a tip portion 31a in contact with the second substrate 12 formed of a first material having a higher softening temperature, and a base portion 31b having a softer temperature than the first material. It is formed of a second material having a low level.
- materials containing glass as an insulating material are used! /
- the spacer structure 22 configured as described above is disposed between the first substrate 10 and the second substrate 12.
- the first and second spacers 30a and 30b contact the inner surfaces of the first substrate 10 and the second substrate 12 to support an atmospheric pressure load acting on these substrates and to set a predetermined distance between the substrates. Maintain to
- the SED includes a voltage supply unit (not shown) for applying a voltage to the grid 24 and the metal back 17 of the first substrate 10.
- the voltage supply unit is connected to the grid 24 and the metal back 17, respectively, and applies, for example, a voltage of 12 kV to the grid 24 and a voltage of 10 kV to the metal back 17.
- an anode voltage is applied to the phosphor screen 16 and the metal back 17, and the electron beam emitted from the electron-emitting device 18 is accelerated by the anode voltage and collides with the phosphor screen 16. Let it. As a result, the phosphor layer of the phosphor screen 16 is excited to emit light, and an image is displayed.
- a grid 24 having a predetermined size and an upper die 36a and a lower die 36b having a rectangular plate shape having substantially the same dimensions as the grid are prepared.
- a 0.12 mm-thick metal plate made of Fe-50% Ni is degreased, washed, and dried, and then the electron beam passage hole 26 is formed by etching.
- an insulating film is formed on the grid surface including the inner surface of the electron beam passage hole 26.
- a coating liquid containing glass as a main component is applied on the insulating film, dried, and then fired to form a high-resistance film.
- a grid 24 is obtained.
- the upper mold 36a and the lower mold 36b as molding dies are formed in a flat plate shape using a transparent material that transmits ultraviolet light, for example, transparent silicon, transparent polyethylene terephthalate, or the like.
- the upper die 36a has a flat contact surface 41a that is in contact with the grid 24, and a number of bottomed spacer forming holes 40a for forming the first spacer 30a.
- the spacer forming holes 40a are respectively opened in the contact surface 41a of the upper die 36a, and are arranged at predetermined intervals.
- the lower die 36b has a flat contact surface 41b and a number of bottomed spacer forming holes 40b for forming the second spacer 30b.
- the spacer forming holes 40b are respectively opened on the contact surface 41b of the lower die 36b, and are arranged at predetermined intervals.
- a spacer forming material is filled into the spacer forming holes 40a of the upper mold 36a and the spacer forming holes 40b of the lower mold 26b.
- the spacer forming material two kinds of first material 46a and second material 46b having different softening temperatures are used.
- first material 46a a glass paste containing at least an ultraviolet-curable binder (organic component) and a glass filler, having a softening temperature of 585 ° C and a firing temperature of 580 ° C for 30 minutes is used.
- a glass paste containing at least a UV-curable binder (organic component) and a glass filler, having a softening temperature of 550 ° C and a firing temperature of 550 ° C for 30 minutes is used as the second material 46b.
- the specific gravity and viscosity of the glass paste are appropriately selected.
- the first material 46a is placed on the bottom of each spacer forming hole 40a of the upper die 36a in an amount of about 20% of the volume of the spacer forming hole 40a.
- the spacer forming hole 40a is filled with the second material 46b to fill the spacer forming hole 40a.
- the bottom of each spacer forming hole 40b of the lower die 36b is filled with the first material 46a in an amount of about 20% of the volume of the spacer forming hole 40b, and then the spacer forming hole 40b is filled. Is filled with the second material 46b to fill the spacer forming hole 40b.
- UV ultraviolet rays
- the upper mold 36a and the lower mold 36b are each formed of an ultraviolet transmitting material. Therefore, the ultraviolet light emitted from the ultraviolet lamp passes through the upper mold 36a and the lower mold 36b, and is applied directly and through the filled first and second materials 46a and 46b. This Then, the first and second materials 46a and 46b are cured by ultraviolet rays to form the first and second spacers 30a and 30b.
- the upper die 36a is positioned so that the cured first spacer 30a faces the region between the electron beam passage holes 26, and the contact surface 41a is moved to the first position of the grid 24. Adhere to surface 24a.
- the lower die 36b is positioned so that the second spacer 30b faces the region between the electron beam passage holes 26, and the contact surface 4lb is brought into close contact with the second surface 24b of the grid 24.
- an assembly 42 including the grid 24, the upper mold 36a and the lower mold 36b is formed.
- the spacer forming holes 40a of the upper die 36a and the spacer forming holes 40b of the lower die 36b are arranged to face each other with the grid 24 interposed therebetween.
- the assembly 42 is pressed from both sides, and the upper mold 36a and the lower mold 36b are brought into close contact with the grid 24. Thereby, the cured first and second spacers 36a, 36b are bonded to the first and second surfaces 24a, 24b of the grid 24, respectively.
- the upper mold 36a and the lower mold 36b are peeled off from the grid 24 so that the cured first and second spacers 30a, 30b are left on the grid 24.
- the grid 24 provided with the first and second spacers 30a and 30b is heat-treated in a heating furnace, and the internal force of the first and second materials 46a and 46b also blows off the binder. Main firing at 30 ° C for 30 minutes.
- two flat pressing plates 50a and 50b are prepared.
- the pressing plates 50a and 50b have a larger area than the grid 24 and are formed of a material having a coefficient of thermal expansion substantially equal to the coefficient of thermal expansion ⁇ of the grid 24.
- the first and second spacers 30a, 30b erected on the grid 24 are sandwiched between the two pressing plates 50a, 50b, and the tip of the first spacer 30a is pressed by the pressing plate.
- the distal end of the second spacer 30b is brought into contact with the pressing plate 50b.
- a plurality of gap regulating members 52 are arranged outside the grid 24 and between the peripheral portions of the pressing plates 50a and 50b.
- the thickness T of each gap regulating member 52 is formed with high accuracy at a target spacer height.
- the thickness T of the gap regulating member 52 is The height H, which is the sum of the heights of the first and second spacers 30a and 30b and the thickness of the grid 24, is also the height from which the compression margin is subtracted.
- the compression margin is 0.02 mm
- T is 1.5 mm
- the first and second spacers 30a and 30b are heated to a temperature lower than the softening temperature of the first material 46a and higher than the softening temperature of the second material 46b, for example, 550 ° C. Softens only material 46b.
- the pressing plates 50a, 50b are pressed in a direction approaching each other, pressed against the gap regulating member 52, and the first and second spacers 30a, 30b are compressed from both sides along the height direction. Plastically deform to a uniform height.
- the heights of the first and second spacers 30a and 30b after compression are controlled by the gap regulating member 52. Thereby, the plurality of first spacers 30a are formed at a common height, and at the same time, the plurality of second spacers 30b are formed at a common height.
- the pressing plates 50a and 50b are removed.
- the second material 46b is softened, and the first material 46a forming the tip portions of the first and second spacers abutting on the pressing plates 50a and 50b is I'm not soft. Therefore, the pressing plates 50a, 50b, which prevent the spacer tip from adhering to the pressing plates 50a, 50b, are separated easily without damaging the first and second spacers. be able to.
- the spacer structure 22 in which the first and second spacers 30a and 30b are formed on the grid 24 is obtained.
- the height difference between the adjacent first spacers 30a is formed within 5 ⁇ m, and the height variation of all the first spacers is formed within 0.1 mm.
- the height difference between the adjacent second spacers 30b is formed within 5 ⁇ m, and the height variation of all the second spacers is formed within 0.1 mm.
- the standard deviation of the height of the first and second spacers is 0.008 in the spacer structure in which the above-described pressing step is not performed, whereas the standard deviation is 0.001 in the present embodiment.
- the variation in spacer height has been greatly reduced.
- the second substrate 12 is prepared.
- the spacer structure 22 obtained as described above is positioned and arranged on the second substrate 12.
- the first substrate 1 The first substrate, the second substrate 12, and the spacer structure 22 are placed in a vacuum chamber, and the inside of the vacuum chamber is evacuated. Then, the first substrate is joined to the second substrate via the side wall. As a result, an SED including the spacer structure 22 is manufactured.
- SEDs were prepared by controlling the height variation of the SED and the spacer configured as described above, and a discharge test was performed for each of them.
- the number of discharges was about 10 when the acceleration voltage was kept at lOkV for 1 hour, and about 25 when the acceleration voltage was kept for 10 hours.
- no discharge was generated under the same conditions.
- the first spacer 30a and the second spacer 30b have no variation in height, and the first spacer and the first spacer 30a and the first spacer 30b have the same height.
- the gap between the substrate and the gap between the second spacer and the second substrate can be greatly reduced. Therefore, it is possible to suppress the occurrence of discharge due to the gap between the spacer and the substrate, and obtain an SED with high withstand voltage and improved reliability.
- the withstand voltage improves, a high acceleration voltage can be applied between the first and second substrates, and an SED with improved display quality can be obtained.
- each of the first and second spacers 30a and 30b erected on the grid 24 has at least two types having different softening temperatures. It is formed by the material of.
- each first spacer 30a is composed of a columnar base portion 31b erected on the first surface 24a of the grid 24, and a coating layer 31c covering the outer periphery and the tip of the base portion.
- the base portion 31b is formed of a second material having a lower softening temperature
- the coating layer 3lc is formed of a first material having a higher softening temperature than the second material.
- each second spacer 30b is composed of a columnar base portion 31b erected on the second surface 24b of the grid 24, and a coating layer 31c covering the outer periphery and the tip of the base portion. It has been.
- the base portion 31b is formed of a second material having a low softening temperature
- the coating layer 31c is formed of the second material. It is formed of a first material having a higher softening temperature.
- the first and second surfaces 24a and 24b of the grid 24 and the inner surface of the electron beam passage hole 26 are covered with a first material.
- a material containing glass as an insulating substance is used as the first and second materials.
- the grid 24 is formed by forming an electron beam passage hole 26 on a 0.12 mm thick metal plate made of Fe—50% Ni, oxidizing the entire metal plate, and forming a grid including the inner surface of the electron beam passage hole 26.
- An insulating film is formed on the surface.
- the upper mold 36a and the lower mold 36b are formed in a flat plate shape using a transparent material that transmits ultraviolet light, for example, transparent silicon, transparent polyethylene terephthalate, or the like.
- the upper die 36a has a flat contact surface 41a that is in contact with the grid 24, and a number of bottomed spacer forming holes 40a for forming the first spacer 30a. .
- the spacer forming holes 40a are respectively opened on the contact surface 41a of the upper die 36a, and are arranged at predetermined intervals.
- the lower die 36b has a flat contact surface 41b and a number of bottomed spacer forming holes 40b for forming the second spacer 30b.
- the spacer forming holes 40b are respectively opened on the contact surface 41b of the lower die 36b, and are arranged at predetermined intervals.
- a second material 46b is formed as a spacer forming material in each of the spacer forming holes 40a of the upper die 36a and the spacer forming holes 40b of the lower die 26b. Then, each spacer forming hole is filled with the second material.
- a glass paste containing at least a UV-curable binder (organic component) and a glass filler, having a softening temperature of 550 ° C and a firing temperature of 550 ° C for 30 minutes is used.
- both sides of the upper mold 36a and the lower mold 36b are irradiated with ultraviolet rays (UV) by an ultraviolet lamp to cure the second material 46b.
- the upper mold 36a and the lower mold 36b are each formed of an ultraviolet transmitting material. Therefore, the ultraviolet light irradiated by the ultraviolet lamp is transmitted through the upper mold 36a and the lower mold 36b, and directly enters the filled second material 46b. Irradiated through the mold. As a result, the second material 46b is ultraviolet-cured to form a base portion 3 lb of the spacer.
- the dispenser is placed on the base end face of the base 3 lb exposed on the contact surfaces 41a and 41b of the upper mold 36a and the lower mold 36b, respectively, and on the spacer standing position of the grid 24. Or apply the adhesive by printing.
- the upper die 36a is positioned so that the hardened base portions 31b respectively face the regions between the electron beam passage holes 26, and the contact surface 41a is placed on the first surface 24a of the grid 24. In close contact.
- the lower die 36b is positioned so that the base 3 lb faces the region between the electron beam passage holes 26, and the contact surface 41b is brought into close contact with the second surface 24b of the grid 24.
- an assembly 42 including the grid 24, the upper mold 36a, and the lower mold 36b is formed.
- the spacer forming holes 40a of the upper die 36a and the spacer forming holes 40b of the lower die 36b are arranged to face each other with the grid 24 interposed therebetween.
- This assembly 42 is also pressed against the both-side force to bring the upper mold 36a and the lower mold 36b into close contact with the grid 24. Thereby, the cured base portion 31b is bonded to the first and second surfaces 24a, 24b of the grid 24, respectively.
- a first material 46a having a higher softening temperature than the second material 46b is sprayed on the surface of the grid 24 and the outer surface of each base portion 31b, and the thickness of the first material 46 is also increased. 1.
- a 50 m covering layer 31c is formed.
- a glass paste containing at least a glass filler, having a softening temperature of 585 ° C and a firing temperature of 580 ° C for 30 minutes is used. The specific gravity and viscosity of the glass paste in the first and second materials 46a and 46b are appropriately selected.
- the grid 24 provided with the base portion 31b and the coating layer 31c is heat-treated in a heating furnace, and the internal force of the first and second materials 46a and 46b is also removed at 580 ° C. Bake for 30 minutes.
- the first spacer 30a and the second spacer 30b are formed on the first and second surfaces 24a and 24b of the grid 24 integrally.
- two flat pressing plates 5 Oa and 50 b similar to those in the first embodiment are prepared.
- the first and second spacers 30a erected on the grid 24 , 30b are sandwiched between the two pressing plates 50a, 50b, and the tip of the first spacer 30a is brought into contact with the pressing plate 50a, and the tip of the second spacer 30b is brought into contact with the pressing plate 50b.
- a plurality of gap regulating members 52 are arranged outside the grid 24 and between the peripheral portions of the pressing plates 50a and 50b. The thickness T of each gap regulating member 52 is formed with high accuracy at the target spacer height.
- the thickness T of the gap controlling member 52 is a height obtained by subtracting the compression margin from the total height of the heights of the first and second spacers 30a and 30b and the grid 24.
- the compression margin is 0.02 mm
- T is 1.5 mm.
- first and second spacers 30a and 30b are heated to a temperature lower than the softening temperature of the first material 46a and higher than the softening temperature of the second material 46b, for example, 550 ° C. Only 3 lb of base part made of material 46b is softened. In this state, the pressing plates 50a and 50b are pressed in the direction of approaching each other and pressed against the gap regulating member 52, and the first and second spacers 30a and 3 Ob are also compressed in both sides along the height direction. And plastically deform to a uniform height. The heights of the first and second spacers 30a and 30b after compression are controlled by the gap regulating member 52. Thereby, the plurality of first spacers 30a are formed at a common height, and at the same time, the plurality of second spacers 30b are formed at a common height.
- the pressing plates 50a and 50b are removed.
- the second material 46b is softened, and the coating layer 31c forming the tip portions of the first and second spacers abutting on the pressing plates 50a and 50b is softened.
- the pressing plates 50a and 50b which prevent the spacer tip from adhering to the pressing plate, can be separated easily and without damaging the first and second spacers.
- a spacer structure 22 in which the first and second spacers 30a and 30b are formed on the grid 24 is obtained.
- the height difference between the adjacent first spacers 30a is formed within 5 ⁇ m, and the height variation of all the first spacers is formed within 0.1 mm.
- the height difference between adjacent second spacers 30b is formed within 5 ⁇ m, and the variation in height of all second spacers is formed within 0.1 mm.
- the standard deviation of the heights of the first and second spacers is 0.008 in the spacer structure in which the above-described pressing step is not performed, whereas the standard deviation is 0.001 in the present embodiment.
- the variation in spacer height has been greatly reduced.
- an SED including the spacer structure 22 is manufactured by the same method as in the first embodiment.
- the SED according to the second embodiment configured as described above and the SED in which the height variation control of the spacer was not performed were prepared, and a discharge test was performed on each of them.
- the number of discharges was about 10 times when the acceleration voltage was held at lOkV for 1 hour, and about 25 times when the acceleration voltage was held for 10 hours.
- no power was generated under the same conditions.
- each of the first and second spacers 30a and 30b erected on the grid 24 is formed of one type of material.
- a material for forming the spacer a material containing glass as an insulating substance is used.
- the other configuration is the same as that of the above-described first embodiment, and the same portions are denoted by the same reference characters and detailed description thereof will not be repeated.
- a grid 24 having a predetermined dimension and a rectangular plate having substantially the same dimensions as the grid 24 are formed.
- the spacer forming material 46 is filled in the spacer forming hole 40a of the upper die 36a and the spacer forming hole 40b of the lower die 26b, respectively. Fill the formation hole.
- the spacer-forming material contains at least a UV-curable binder (organic component) and a glass filler, and uses a glass paste with a softening temperature of 50 ° C and a baking temperature of 550 ° C for 30 minutes.
- UV ultraviolet rays
- a dispenser or printing is performed on the base end surface of the spacer forming material 46 exposed on the contact surfaces 41a and 41b of the upper die 36a and the lower die 36b, and on the spacer standing position of the grid 24, respectively.
- the adhesive is applied to apply the adhesive.
- the upper die 36a is positioned so that the hardened spacer forming material 46 faces the region between the electron beam passage holes 26, and the contact surface 41a is fixed to the first of the grid 24. Adhere to surface 24a.
- the lower die 36b is positioned so that the base portion 31b faces the region between the electron beam passage holes 26, and the contact surface 41b is brought into close contact with the second surface 24b of the grid 24.
- an assembly 42 including the grid 24, the upper mold 36a and the lower mold 36b is formed.
- the assembly 42 is pressed from both sides to bring the upper mold 36a and the lower mold 36b into close contact with the grid 24.
- the cured spacer forming material 46 is bonded to the first and second surfaces 24a and 24b of the grid 24, respectively.
- the upper die 36a and the lower die 36b are released from the grid 24 so that the hardened spacer forming material 46 is left on the grid 24.
- the grid 24 on which the spacer forming material 46 is provided is heat-treated in a heating furnace, the internal force of the spacer forming material 46 is blown off, and then the main firing is performed at 550 ° C. for 30 minutes.
- the first spacer 30a and the second spacer 30b are formed on the first and second surfaces 24a and 24b of the grid 24 integrally.
- two flat pressing plates 5 Oa and 50 b similar to those of the first embodiment are prepared.
- a release agent having an insulating property for example, a solution of silicon oxide powder having a particle size of about 1 ⁇ m dissolved in water is applied to the surfaces of the press plates 50a and 50b by spraying.
- the first and second spacers 30a, 30b erected on the grid 24 are sandwiched between the two pressing plates 50a, 50b, and the distal end of the first spacer 30a is pressed on the pressing plate 50a. Then, the tip of the second spacer 30b is brought into contact with the pressing plate 50b.
- each gap regulating member 52 is arranged between the peripheral portions of the pressing plates 50a and 50b.
- the thickness T of each gap regulating member 52 is a height obtained by subtracting a compression margin from the total height of the heights of the first and second spacers 30a and 30b and the grid 24.
- the compression margin is 0.02 mm
- T is 1.5 mm
- first and second spacers 30a and 30b are heated to 550 ° C to soften the spacer forming material 46.
- the pressing plates 50a and 50b are pressed in a direction approaching each other, and pressed against the gap regulating member 52, and the first and second spacers 30a and 30b are both-sidely compressed along the height direction.
- the heights of the first and second spacers 30a and 30b after compression are controlled by the gap regulating member 52. This allows multiple The first spacers 30a are formed to have a common height, and at the same time, the plurality of second spacers 30b are formed to have a common height.
- the pressing plates 50a and 50b are removed.
- the pressing plates 50a and 50b can be easily attached to the first end of the spacer so that the tip of the spacer does not adhere to the pressing plate.
- the second spacer can be separated without damage.
- the release agent attached to the tips of the first and second spacers 30a and 30b is removed using a sandpaper or the like.
- the spacer structure 22 in which the first and second spacers 30a and 30b are formed on the grid 24 is obtained.
- the height difference between the adjacent first spacers 30a is formed within 5 ⁇ m, and the height variation of all the first spacers is formed within 0.1 mm.
- the height difference between adjacent second spacers 30b is formed within 5 ⁇ m, and the variation in height of all second spacers is formed within 0.1 mm.
- the standard deviation of the heights of the first and second spacers is 0.008 in the spacer structure in which the above-described pressing process is not performed, whereas the standard deviation is 0.002 in the present embodiment.
- the variation in spacer height has been greatly reduced.
- an SED including the spacer structure 22 is manufactured by the same method as in the first embodiment.
- the SED according to the third embodiment configured as described above and the SED in which the height variation control of the spacer was not performed were prepared, and a discharge test was performed on each of them.
- the number of discharges was about 10 times when the acceleration voltage was 10 kV and held for 1 hour, and about 25 times when it was held for 10 hours.
- the number of discharges was 0 and 3 under each condition, which was significantly improved.
- the height difference between the first spacer 30a and the second spacer 30b is eliminated, and the gap between the first spacer and the first substrate and the second spacer 30a are removed.
- the gap between the spacer and the second substrate can be greatly reduced. Therefore, it is possible to suppress the occurrence of discharge due to the gap between the spacer and the substrate, and to obtain an SED with high withstand voltage and improved reliability. it can.
- a release agent When a release agent is used, adverse effects due to dust can be considered, but the better effect of reducing the variation in spacer height is greater, and as a result, the withstand voltage can be improved.
- an insulating material as a release material, electric discharge due to the remaining release agent is less likely to occur.
- the spacer assembly 22 has a configuration in which the first and second spacers and the grid are integrally provided, but the second spacer 30b is formed on the second substrate 12 It is good also as a structure formed in. Further, the spacer structure may include only the grid and the second spacer, and the grid may directly contact the first substrate.
- the spacer structure 22 includes a support substrate 24 which also functions as a grid with a rectangular metal plate and a support substrate. And a plurality of columnar spacers 30 integrally provided only on one of the surfaces.
- the support substrate 24 has a first surface 24a facing the inner surface of the first substrate 10 and a second surface 24b facing the inner surface of the second substrate 12, and is arranged in parallel with these substrates.
- a large number of electron beam passage holes 26 are formed in the support substrate 24 by etching or the like. The electron beam passage holes 26 are arranged to face the electron-emitting devices 18, respectively, and transmit the electron beams emitted from the electron-emitting devices.
- the first and second surfaces 24a and 24b of the support substrate 24 and the inner wall surfaces of the respective electron beam passage holes 26 are used as an insulating layer as a high-resistance film mainly composed of glass, ceramic, or the like, which also has an insulating material. More coated.
- the support substrate 24 is provided with its first surface 24a in surface contact with the inner surface of the first substrate 10 via the getter film 19, the metal back 17, and the phosphor screen 16.
- the electron beam passage holes 26 provided in the support substrate 24 face the phosphor layers R, G, B of the phosphor screen 16. Thus, each electron-emitting device 18 faces the corresponding phosphor layer through the electron beam passage hole 26.
- each spacer 30 is formed in a tapered tapered shape whose diameter decreases toward the extended end from the grid 24 side.
- the spacer 30 is formed to have a height of about 1.4 mm. Sweep along a direction parallel to the grid surface
- the cross section of the sensor 30 is formed substantially elliptical.
- the height difference between the adjacent spacers 30 is formed within, and the height variation of all the spacers is formed within 0.1 mm. Further, the height difference between adjacent second spacers 30b is formed within 5 m, and the variation in height of all the second spacers is formed within 0.1 mm.
- each of the spacers 30 is formed of at least two types of materials having different softening temperatures.
- each spacer 30 has a tip 31a in contact with the second substrate 12 formed of a first material having a high softening temperature, and extends from the other portion, that is, from the support substrate 24 to the tip.
- the base portion 31b is formed of a second material having a lower softening temperature than the first material.
- a material containing glass as an insulating material is used!
- the grid 24 comes into surface contact with the first substrate 10, and the extended end of the spacer 30 comes into contact with the inner surface of the second substrate 12.
- the atmospheric load applied to these substrates is supported, and the distance between the substrates is maintained at a predetermined value.
- the other configuration is the same as that of the above-described first embodiment, and the same components are denoted by the same reference characters and will not be described in detail.
- the SED and its spacer structure according to the fourth embodiment can be manufactured by the same manufacturing method as the manufacturing method according to the above-described embodiment. In the fourth embodiment, the same operation and effect as in the first embodiment can be obtained.
- the present invention is not limited to the above-described embodiment as it is, and may be modified by modifying the components without departing from the scope of the invention at the stage of implementation. Further, various inventions can be formed by appropriately combining a plurality of components disclosed in the embodiments. For example, some components, such as all components shown in the embodiment, may be deleted. Furthermore, constituent elements over different embodiments may be appropriately combined.
- the diameter and height of the spacer, the dimensions and materials of the other components, and the like can be appropriately selected as necessary without being limited to the above-described embodiment.
- Various filling conditions of the spacer forming material can be selected as needed.
- the present invention is not limited to one using a surface conduction electron-emitting device as an electron source, but is also applicable to an image display device using another electron source such as a field emission type or a carbon nanotube.
- an image display device which eliminates a gap between a spacer and a substrate, suppresses a discharge generated between the first and second substrates, improves reliability and display quality, and a method of manufacturing the same. can do.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
- Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04807394A EP1705686A1 (en) | 2004-01-06 | 2004-12-20 | Image display device and its manufacturing method |
US11/480,849 US20060249734A1 (en) | 2004-01-06 | 2006-07-06 | Image display device and method of manufacturing the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004001050A JP2005197048A (ja) | 2004-01-06 | 2004-01-06 | 画像表示装置およびその製造方法 |
JP2004-001050 | 2004-01-06 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/480,849 Continuation US20060249734A1 (en) | 2004-01-06 | 2006-07-06 | Image display device and method of manufacturing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005066996A1 true WO2005066996A1 (ja) | 2005-07-21 |
Family
ID=34746968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/019037 WO2005066996A1 (ja) | 2004-01-06 | 2004-12-20 | 画像表示装置およびその製造方法 |
Country Status (7)
Country | Link |
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US (1) | US20060249734A1 (ja) |
EP (1) | EP1705686A1 (ja) |
JP (1) | JP2005197048A (ja) |
KR (1) | KR20070029658A (ja) |
CN (1) | CN1902727A (ja) |
TW (1) | TWI284340B (ja) |
WO (1) | WO2005066996A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US7838313B2 (en) * | 2007-07-31 | 2010-11-23 | Hewlett-Packard Development Company, L.P. | Pixel well electrode |
KR100963258B1 (ko) * | 2007-09-07 | 2010-06-11 | 한국전자통신연구원 | 전계 방출 장치 |
KR20090065266A (ko) * | 2007-12-17 | 2009-06-22 | 한국전자통신연구원 | 전계 방출형 백라이트 유닛 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0757664A (ja) * | 1993-08-06 | 1995-03-03 | Toshiba Corp | 陰極線管およびその製造方法 |
JP2003031125A (ja) * | 2001-07-17 | 2003-01-31 | Toshiba Corp | 平面表示装置に用いるスペーサアッセンブリの製造方法 |
JP2003217479A (ja) * | 2002-01-25 | 2003-07-31 | Canon Inc | 電子線装置 |
JP2003297265A (ja) * | 2002-04-03 | 2003-10-17 | Toshiba Corp | 画像表示装置およびその製造方法 |
JP2004047382A (ja) * | 2002-07-15 | 2004-02-12 | Toshiba Corp | 表示装置及びスペーサ部材 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5658832A (en) * | 1994-10-17 | 1997-08-19 | Regents Of The University Of California | Method of forming a spacer for field emission flat panel displays |
-
2004
- 2004-01-06 JP JP2004001050A patent/JP2005197048A/ja not_active Abandoned
- 2004-12-20 EP EP04807394A patent/EP1705686A1/en not_active Withdrawn
- 2004-12-20 WO PCT/JP2004/019037 patent/WO2005066996A1/ja not_active Application Discontinuation
- 2004-12-20 CN CNA2004800398757A patent/CN1902727A/zh active Pending
- 2004-12-20 KR KR1020067014584A patent/KR20070029658A/ko not_active Application Discontinuation
- 2004-12-27 TW TW093140827A patent/TWI284340B/zh not_active IP Right Cessation
-
2006
- 2006-07-06 US US11/480,849 patent/US20060249734A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0757664A (ja) * | 1993-08-06 | 1995-03-03 | Toshiba Corp | 陰極線管およびその製造方法 |
JP2003031125A (ja) * | 2001-07-17 | 2003-01-31 | Toshiba Corp | 平面表示装置に用いるスペーサアッセンブリの製造方法 |
JP2003217479A (ja) * | 2002-01-25 | 2003-07-31 | Canon Inc | 電子線装置 |
JP2003297265A (ja) * | 2002-04-03 | 2003-10-17 | Toshiba Corp | 画像表示装置およびその製造方法 |
JP2004047382A (ja) * | 2002-07-15 | 2004-02-12 | Toshiba Corp | 表示装置及びスペーサ部材 |
Also Published As
Publication number | Publication date |
---|---|
EP1705686A1 (en) | 2006-09-27 |
JP2005197048A (ja) | 2005-07-21 |
KR20070029658A (ko) | 2007-03-14 |
TWI284340B (en) | 2007-07-21 |
US20060249734A1 (en) | 2006-11-09 |
CN1902727A (zh) | 2007-01-24 |
TW200537540A (en) | 2005-11-16 |
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