WO2005062100A1

WO2005062100A1 - Optical element holding apparatus, barrel, exposure apparatus, and device producing method

Info

Publication number: WO2005062100A1
Application number: PCT/JP2004/019264
Authority: WO
Inventors: Yuichi Shibazaki
Original assignee: Nikon Corporation
Priority date: 2003-12-24
Filing date: 2004-12-22
Publication date: 2005-07-07
Also published as: JP4586731B2; JPWO2005062100A1

Abstract

An optical element holding apparatus capable of finely adjusting the attitude of an optical element and where the inside air-tightness can be maintained high. The optical element holding device has a frame member (41) and a lens frame body provided inside the frame member and holding an optical element. A displacement module (82) provided on the frame member adjusts the position of the optical element through the lens frame body. O-rings (88, 90) are arranged between the displacement module and the frame member.

Description

Specification

Optical element holding device, lens barrel, exposure device, and device manufacturing method

The present invention relates to an optical device of an exposure apparatus used in a lithography step in a process of manufacturing a device such as a semiconductor device, a liquid crystal display device, an imaging device, a thin film magnetic head, or a mask such as a reticle or a photomask. The present invention relates to an optical element holding device for holding. Further, the present invention relates to a lens barrel and an exposure apparatus provided with the optical element holding device. Further, the present invention relates to a device manufacturing method using the exposure apparatus.

Background art

[0002] For example, as shown in Patent Document 1, an optical element holding device including a lens frame holding an optical element and a frame supporting the lens frame via flexure members arranged at equal intervals. Devices are known. The flexure member includes a connection block connected to the lens frame, and a flexure fixing portion that supports the connection block and is fixed to the frame. The flexure member enables the optical element to move and rotate along the radial, circumferential, and optical axis directions of the optical element in a polar coordinate system having the origin substantially at the center of the optical element. That is, the optical element is held in a state where six degrees of freedom of movement are secured, that is, kinematically.

[0003] By the way, with the recent remarkable high integration of semiconductor elements, the wiring pattern power S has been increasingly miniaturized. For this reason, especially in an exposure apparatus for manufacturing a semiconductor device, a projection optical system with extremely low wavefront aberration and distortion has been required, and the relative position of each optical element housed inside the lens barrel has been narrowed. It is necessary to control the force.

[0004] In the case of using exposure light having an extremely short wavelength of 200 nm or less, if a light-absorbing substance such as water or oxygen is present in a lens barrel through which the exposure light passes, the exposure light is greatly attenuated. Is done. In the exposure apparatus, for example, a covered wire is used for power supply to various electric devices and signal communication with a sensor. Trace amounts of organic substances are gradually volatilized from these coated wires, and these organic substances can be pollutants. [0005] For this reason, it is necessary to replace the gas inside the lens barrel with an inert gas such as nitrogen or a rare gas. While applying force, the lens barrel may have many openings for adjusting the position of the optical element and the like. In addition, when a large number of frames holding one or more optical elements are stacked to form a lens barrel, gas outside the lens barrel enters the lens barrel via a joint portion of each frame. There was a possibility of intrusion.

Patent Document 1: US Patent Application Publication No. 2002Z0163741

Disclosure of the invention

[0006] The present invention has been made by focusing on the problems existing in such conventional techniques. An object of the present invention is to provide an optical element holding device and a lens barrel that can maintain a high airtightness while finely adjusting the attitude of the optical element.

Another object of the present invention is to provide an exposure apparatus with improved exposure accuracy.

A further object of the present invention is to provide a device manufacturing method capable of improving the yield of highly integrated devices.

[0008] A first aspect of the present invention is directed to an optical element holding device including a frame member and a holding member provided inside the frame member and holding the optical element. An optical element holding device including an adjustment member for adjusting a position via a holding member, and a first seal member provided between the adjustment member and the frame member is characterized.

[0009] In the first aspect of the present invention, the frame member has a joint portion laminated with another frame member and joined to the other frame member, and the frame member has a joint portion with the other frame member. And a second seal member provided between them. Further, the second seal member may include an O-ring disposed along a circle centered on the optical axis of the optical element. Further, the o-ring may have a hollow structure that is closely adhered to the joint and is elastically deformable.

[0010] In the first aspect of the present invention, the frame member has an opening, the adjustment member has a displacement mechanism for displacing the position of the optical element, and the displacement mechanism is provided in the opening of the frame member. It may be accommodated so as to be displaceable. Further, the displacement mechanism has a first adjustment component and a second adjustment component arranged side by side in the opening, and when the first adjustment component is removed from the opening, the second adjustment component opens. It may be left in the department. In addition, the first adjustment component is It is one of the first adjustment components, and the displacement of the optical element may be adjusted by replacing the first adjustment component. Further, the first seal member may be arranged between the second adjustment component and the inner peripheral surface of the opening. Furthermore, the first adjustment component may include a coarse adjustment component for roughly adjusting the displacement of the optical element and a fine adjustment component for finely adjusting the displacement of the optical element.

[0011] In the first aspect of the present invention, the optical element holding device includes a tubular body that accommodates the adjusting member, and the first seal member is a seal provided between the adjusting member and the tubular body. May be included.

In the first aspect of the present invention, the optical element holding device may include an urging member that returns the holding member to a predetermined position when at least a part of the displacement mechanism is removed.

[0012] A second aspect of the present invention is a lens barrel that accommodates at least one optical element and includes the optical element holding device according to the first aspect of the present invention that holds at least one of the optical elements. Features.

In the second aspect of the present invention, the optical element may be one of a plurality of optical elements constituting a projection optical system that projects an image of a predetermined pattern formed on a mask onto a substrate. Good.

According to a third aspect of the present invention, there is provided an exposure apparatus for transferring an image of a predetermined pattern formed on a mask onto a substrate to transfer the image of the predetermined pattern onto the substrate. An exposure apparatus including the lens barrel according to the second aspect of the present invention is characterized.

[0014] A fourth aspect of the present invention is characterized by a method for manufacturing a device having a lithographic process for performing exposure using the exposure apparatus of the third aspect of the present invention.

Brief Description of Drawings

FIG. 1 is a schematic configuration diagram showing one embodiment of an exposure apparatus of the present invention.

FIG. 2 is a perspective view showing the optical element holding device of FIG. 1.

FIG. 3 is a plan view showing the optical element holding device of FIG. 1.

FIG. 4 is a cross-sectional view taken along line 4-4 in FIG.

FIG. 5 is an enlarged plan view mainly showing a pair of arms of the frame member of FIG. 2.

FIG. 6 is a plan view showing a further enlarged pair of arms of the frame member of FIG. 2. FIG. 7 is a sectional view taken along line 7_7 of FIG.

FIG. 8 is a cross-sectional view of the frame member of FIG. 2 on a plane orthogonal to the optical axis of the optical element.

FIG. 9 is a cross-sectional view showing a displacement module according to a modification.

FIG. 10 is a flowchart of a device manufacturing example.

[FIG. 11] A detailed flowchart regarding the substrate processing of FIG. 10 in the case of a semiconductor device.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, an exposure apparatus, a lens barrel, and an optical element holding device according to the present invention are described as an exposure apparatus for manufacturing a semiconductor element, a lens barrel that houses the projection optical system thereof, and a lens of a part of the projection optical system. One embodiment embodied in the optical element holding device for holding will be described with reference to FIGS.

FIG. 1 shows a schematic configuration of the exposure apparatus 31 with its projection optical system 35 at the center.

As shown in FIG. 1, an exposure apparatus 31 of this embodiment includes a light source 32, an illumination optical system 33, a reticle stage 34 for holding a reticle Rt as a mask, a projection optical system 35, and a substrate as a substrate. And a wafer stage 36 for holding the wafer W.

The light source 32 is, for example, an ArF excimer laser having a wavelength of 193 nm, or an F excimer laser having a wavelength of 157 nm.

2 Start the laser. The illumination optical system 33 includes optical integrators (not shown) such as a fly-eye lens and a rod lens, various lens systems such as a relay lens and a condenser lens, and an aperture stop. The exposure light EL emitted from the light source 32 passes through the illumination optical system 33, and is adjusted so as to uniformly illuminate the pattern on the reticle Rt.

The reticle stage 34 is arranged between the illumination optical system 33 and a projection optical system 35 described later such that the mounting surface of the reticle Rt is substantially orthogonal to the optical axis direction of the projection optical system 35. ing. The projection optical system 35 includes an optical element 37 such as a plurality of lenses arranged so that their optical axes coincide with each other. The projection optical system 35 is housed in a lens barrel 39 with each optical element 37 held substantially horizontally (so-called horizontal type) by an optical element holding device 38. The lens barrel 39 has a divided lens barrel structure in which a plurality of lens barrel modules 39a are stacked.

The wafer stage 36 is located on the image plane side of the projection optical system 35 (the exit side of the exposure light EL). The mounting surface of the wafer W is disposed so as to intersect with the optical axis direction of the projection optical system 35. The image of the pattern on the reticle Rt illuminated with the exposure light EL is reduced to a predetermined reduction magnification through the projection optical system 35 and transferred to the wafer W on the wafer stage 36.

Next, a detailed configuration of the optical element holding device 38 will be described.

FIG. 2 is a perspective view showing the optical element holding device 38, FIG. 3 is a plan view of the optical element holding device 38, and FIG. 4 is a sectional view taken along line 4-14 in FIG. The optical element 37 is made of a glass material such as synthetic quartz or fluorite having a breaking strength of a predetermined level or more, and a flange 37a is formed on the periphery of the optical element 37 as shown in FIG. As shown in FIG. 2, the optical element holding device 38 is provided via a frame member 41 having a fastening portion 40 serving as a joint portion with another lens barrel module 39a to be laminated, and a support member 42. A lens frame 43 serving as a holding member for holding the optical element 37;

As shown in FIGS. 2 and 3, the frame member 41 and the lens frame 43 are both formed in a substantially annular shape. As shown in FIG. 4, the lens frame 43 is attached to the inside of a frame member 41 (an inner ring 51 to be described later), and a plurality of step portions 44 formed on the inner peripheral surface of the frame member 41 are provided. It is fixed by bolt 45. As shown in FIG. 3, on the lens frame 43, three support members 42 are provided at equal angular intervals.

The support member 42 includes a base member 46 (see FIG. 4) for holding the flange 37a of the optical element 37, and a clamp member 47. The base member 46 is transmitted to the support member 42 from a device outside the support member 42 and is a factor that affects the state of the optical surface of the optical element 37 (for example, the main body of the exposure device 31, Etc.), which has a fretting structure to absorb minute surface roughness and surface undulations. For this reason, in a state where the optical element 37 is held on the lens frame 43 via the support member 42, even if the lens frame 43 is mounted on an external device via the frame member 41, the optical element 37 The surface is kept in good condition.

[0024] Frame B material 41 has inner ring 51, outer ring 52, arms 53al, 53a2, 53bl,

53b2, 53cl, 53c2, Reno 54, and the support link 55 are formed by force. The arms 53al, 53a2, 53bl, 53b2, 53cl, 53c2 and the reno 54 form a posture adjusting mechanism 50 that adjusts the posture of the optical element 37 by adjusting the posture of the inner ring 51. These inner rings 51, outer rings 52, arms 53al, 53a2, 53bl, 53b2, 53cl, 53 The c2, the lever 54, and the support link 55 are formed on the frame member 41 made of one structure by wire cutting and electric discharge machining. The inner ring 51 and the outer ring 52 are connected to each other via arms 53a1, 53a2, 53bl, 53b2, 53cl, 53c2, a reno 54, and a support link 55 so as to be able to move in a pair.

FIG. 5 is an enlarged plan view showing a pair of arms 53al and 53a2 of the frame member 41 and the periphery thereof. FIG. 6 is a plan view showing the arm 53al further enlarged, and FIG. 7 is a sectional view taken along line 7-7 in FIG.

[0026] As shown in FIG. 3, the frame, the frame member 41, and the six arms 53al, 53a2, 53bl, 53b2, 53c1, 53c2 are provided so as to form three pairs. The arm 53al and the arm 53a2 form a first link mechanism 53a, the arm 53bl and the arm 53b2 form a second link mechanism 53b, and the arm 53cl and the arm 53c2 form a third link mechanism 53c. ing. These three link mechanisms 53a, 53b, 53c are arranged at equal angular intervals on the circumference of a circle centered on the optical axis AX of the optical element 37.

Since the first to third link mechanisms 53a, 53b, 53c have the same configuration, the first link mechanism 53a will be described below as an example. As shown in FIGS. 5 and 6, a pair of through holes 56 are formed at the first end of each of the arms 53al and 53a2, and a pair of slits 57 extend from the through holes 56. The pair of through holes 56 and the pair of slits 57 form an element-side pivot 58. The first ends of the arms 53al and 53a2 are rotatably connected to the inner ring 51 via element-side pivots 58. At the second end of each arm 53al, 53a2, a pair of through-holes 56 is formed, and the pair of through-holes 56 and a pair of slits 57 communicating with the pair of through-holes 56 form a frame joint J pivot 59. Force S formed. The second ends of the arms 53al and 53a2 are rotatably connected to the lever 54 via a frame-side pivot 59.

As shown in FIG. 7, which is a cross-sectional view taken along line 7-7 in FIG. 5, a first surface 60 of the frame member 41, which is substantially orthogonal to the optical axis AX of the optical element 37, has an element side Corresponding to the pivot 58, a small opening recessed portion 61a dug by a power discharger is formed. The first surface 60 is formed with a large opening recess 62a having an opening larger than the small opening recess 61a, corresponding to the frame-side pivot 59. In the frame member 41, the second surface 63 parallel to the first surface 60 and opposite to the first surface 60 has a large opening recess 6 formed in the first surface 60 corresponding to the element-side pivot 58. A large opening recess 62b having the same size as 2a is formed. In addition, a small opening recess 6 lb having the same size as the small opening recess 61 a formed in the first surface 60 is formed on the second surface 63 in correspondence with the frame-side pivot 59.

[0029] The small opening recesses 61a and 61b are dug shallowly from the first surface 60 or the second surface 63, whereas the large opening recesses 62a and 62b are deeper from the second surface 63 or the first surface 60. It is dug. Therefore, the element-side pivot 58 is formed as a neck near the first surface 60, and the frame-side pivot 59 is formed as a neck near the second surface 63. For this reason, each of the arms 53al and 53a2 is equivalent to a rigid body that is arranged in a state of being inclined with respect to the optical axis AX of the optical element 37 within the range of the thickness of the frame member 41.

[0030] The rigid force of each of the arms 53al and 53a2 is arranged in a tangential plane that includes a tangent of a circle centered on the optical axis AX of the optical element 37 and that is substantially parallel to a plane parallel to the optical axis AX. It has been. The rigid body of the arm 53al and the rigid body of the arm 53a2 are defined by a radiation plane Pr (that is, a second plane extending in the radial direction of the optical element 37) that includes the optical axis AX of the optical element 37 and is orthogonal to the tangent plane Pt. On the other hand, they are arranged substantially symmetrically.

As shown in FIG. 3, the lever 54 is disposed between the adjacent link mechanisms 53a, 53b, 53c, and has a substantially rectangular parallelepiped shape. As shown in FIG. 5, the portion near the inner periphery of the frame member 41 at the first end of the lever 54 is rotated to the second end of each arm 53al, 53a2 via the frame-side pivot 59. It is connected as possible. A portion of the lever 54 near the outer periphery of the frame member 41 at the first end is rotatably connected to the outer ring 52 via a fulcrum pivot 66. The fulcrum pivot 66 is formed by a pair of through holes 67 formed in the frame member 41 and a pair of slits 68 extending from each through hole 67. This fulcrum, pivot 66, is arranged on a straight line that is orthogonal to the straight line that connects the frame Tsukuda J pivot 59 of each arm 53al, 53a2 and the element rule pivot 58.

FIG. 8 is a cross-sectional view of the frame member 41 taken along a plane perpendicular to the optical axis AX of the optical element 37. As shown in FIG. 8, a support link 55 is connected near the second end of the lever 54. The support link 55 includes a first support link 69 and a second support link 70. The first and second support links 69, 70 are formed by a plurality of pairs of through holes 71 formed in the frame member 41 and a plurality of slits 72 extending from the through holes 71. [0033] The first end of the first support link 69 is connected to a recessed portion of the second end of the lever 54 via a distal end support pivot 73 formed by a pair of through holes 71 and a pair of slits 72. It is rotatably connected. The second end of the first support link 69 is rotatable to the first end of the second support link 70 via an intermediate support pivot 74 formed by a pair of through holes 71 and a pair of slits 72. It is connected to. The second support link 70 is disposed so as to extend in a direction perpendicular to the first support link 69. Note that the distal-end-side support pivot 73, the intermediate support pivot 74, and the fulcrum pivot 66 are aligned.

[0034] A second end of the second support link 70 is rotatably connected to the frame member 41 via a base end support pivot 75 formed by a pair of through holes 71 and a pair of slits 72. I have. The base support pivot 75 is formed to be thicker than the distal support pivot 73 and the intermediate support pivot 74.

As shown in FIG. 3, a spring receiving recess 76 is provided on the first surface 60 and the second surface 63 of the frame member 41 near the second end of the lever 54. In the spring accommodating recess 76, a pair of biasing springs 77 for biasing the second end of the lever 54 toward the outer ring 52 are stretched between the lever 54 and the outer ring 52.

As shown in FIG. 2, a pair of fastening portions 40 project from the outer peripheral edge of the outer ring 52 at predetermined intervals. A plurality of bolt holes 80 are formed in the fastening portion 40, and a plurality of lens barrel modules 39a are fastened by bolts (not shown) using the bonnet holes 80, and are stacked. An annular groove 81 is formed in an inner peripheral portion of the fastening portion 40 on the first surface 60 of the frame member 41. The annular groove 81 accommodates a hollow ring 81a as a second seal member for maintaining airtightness inside the lens barrel 39 in a state where a plurality of lens barrel modules 39a are stacked. That is, the hollow ring 81a is arranged along a circle centered on the optical axis AX of the optical element 37.

As shown in FIG. 2, a displacement module as an opening for accommodating a displacement module 82 constituting an adjustment member and a displacement mechanism is provided on a side surface of the outer ring 52 at a position corresponding to the biasing spring 77. A mounting hole 83 (see FIG. 8) is provided. As shown in FIG. 8, the displacement module 82 includes a displacement rod 84 as a second adjustment component, an adjustment pusher 85 having a role as a fine adjustment component, and an adjustment button 86 having a role as a coarse adjustment component. , Adjust Base plate 87. The adjustment pusher 85 and the adjustment button 86 form a first adjustment component.

In the displacement module mounting hole 83, a displacement rod housing 89 (tubular body) having a pair of first O-rings 88 mounted thereon is fitted on the outer peripheral surface thereof. The displacement rod 84 is slidably inserted into the displacement rod housing 89 via a first seal member and a ring 90 as a seal portion. By these o-rings 88 and 90, airtightness inside the frame member 41 is maintained. The displacement rod 84 is formed in a substantially cylindrical shape having both ends in a planar shape. Near the second end of the lever 54, a spherical boss 92 is mounted via a stud bolt 91, and the distal end surface of the displacement rod 84 is in contact with the spherical boss 92.

At the center of the adjustment base plate 87, a support bolt 93 is screwed so as to penetrate the adjustment base plate 87. The tip of the support bolt 93 is inserted into the adjustment pusher 85 and the adjustment button 86. The tip of the adjustment button 86 is formed in a substantially spherical shape. The adjustment base plate 87 is attached to the frame member 41 by positioning pins 94, and the tip of the adjustment button 86 is in contact with the base end surface of the displacement rod 84.

[0040] A plurality of adjustment washers 85 having different thicknesses in units of 1 µm are prepared. A plurality of adjustment buttons 86 having different heights in units of 0.1 lm are provided. From the plurality of adjustment pushers 85 and the plurality of adjustment buttons 86, those capable of setting a predetermined displacement amount on the displacement rod 84 are appropriately selected and fitted to the tip of the support bolt 93. Here, the displacement rod 84 is movable along the longitudinal direction of the displacement module mounting hole 83, and the displacement force applied to the lever 54 can be changed by the movement of the displacement rod 84. Here, the displacement force is generated when the displacement rod 84 is moved by replacing the already installed adjustment pusher 85 and adjustment button 86 with another adjustment pusher 85 and adjustment button 86 in the displacement module 82. The driving force is hereinafter referred to as “driving force F”. The adjustment button 86 coarsely adjusts the driving force F, and the adjustment pusher 85 plays a role of finely adjusting the driving force F.

As shown in FIG. 8, a JU module mounting hole 98 for accommodating a jack-up module (hereinafter referred to as “JU module”) 97 is provided on the side surface of the outer ring 52 adjacent to the displacement module mounting hole 83. Is formed. The JU module 97 consists of a jack-up rod (hereinafter referred to as “JU rod”) 99 and a jack-up housing (hereinafter referred to as “JU housing”) 1 00 and a position adjusting screw 101.

The JU rod 99 is slidably inserted into the JU module mounting hole 98 via a plurality of rings 102. By the o-ring 102, the airtightness inside the frame member 41 is maintained. The tip of the JU rod 99 has a spherical shape, and when the JU rod 99 is moved toward the lever 54, the tip of the JU rod 99 contacts the side surface of the lever 54. The JU rod 99 is provided with a screw hole 103 from the proximal end side along the axis thereof. At the base end of the JU rod 99, there is formed a rotation stopping portion 104 which is engaged with the inner peripheral surface of the JU module mounting hole 98 to prevent the rotation of the JU rod 99.

The JU housing 100 includes a holding plate 105 for holding the position adjusting screw 101 and a stop plate 106 for preventing the position adjusting screw 101 from dropping off. At the center of the holding plate 105, a stepped accommodation hole 107 is formed. The position adjusting screw 101 is rotatably inserted into the holding plate 105 such that the head portion 101a is housed in the step portion 108 of the housing hole 107. A wrench hole 101b into which a jig such as a hexagon wrench is engaged is recessed in the head 101a of the position adjusting screw 101. An opening 110 is provided through the center of the stopper plate 106. The stopper plate 106 and the holding plate 105 are joined and fixed to the frame member 41 by bolts 109. In this state, the jig can be inserted into the wrench hole 101b through the opening 110. The diameter of the opening 110 is smaller than the diameter of the head 101a of the position adjusting screw 101, and the stopper plate 106 is fixed to the frame member 41 in a state of being joined to the holding plate 105, so that the position adjusting screw 101 is not dropped. Will be blocked.

Therefore, according to the present embodiment, the following effects can be obtained.

(1) In the optical element holding device 38, 88 and 90 O-rings are provided between the displacement module 82 for adjusting the position of the optical element 37 and the frame member 41. Therefore, when the position of the optical element 37 is adjusted, the airtightness inside the frame member 41 can be maintained. Thereby, in the exposure apparatus 31, the exposure accuracy can be improved.

(2) In this optical element holding device 38, the frame member 41 is provided with a fastening portion 40 used for joining with another frame member 41 that is in P-contact, and the fastening portion 40 of the adjacent frame member 41 is provided. A hollow O-ring 81a interposed therebetween is provided. Therefore, the airtightness between the laminated frame members 41 can be improved. (3) In the optical element holding device 38, the hollow ring 81a is arranged along a circle centered on the optical axis AX of the optical element 37. Therefore, high airtightness can be maintained over the entire circumference of the frame member 41.

(4) In the optical element holding device 38, the displacement module 82 for applying a displacement to the optical element 37 is accommodated in the displacement module mounting hole 83 formed in the frame member 41, and the displacement module mounting hole 83 It is movable along the longitudinal direction. Therefore, the opening diameter of the displacement module mounting hole 83 can be reduced, and the airtightness of the frame member 41 can be ensured by the small O-ring 88.

(5) In this optical element holding device 38, the displacement module 82 has a displacement rod 84, an adjustment button 86, and an adjustment pusher 85 that are arranged side by side in the longitudinal direction of the displacement module mounting hole 83. You. When the adjustment button 86 and the adjustment pusher 85 are removed from the displacement module mounting hole 83, the displacement rod 84 is retained in the displacement module mounting hole 83. Thus, since the displacement rod 84 is placed in the displacement module mounting hole 83, gas does not flow inside and outside the frame member 41 through the displacement module mounting hole 83. Therefore, for example, even when the adjustment button 86 and the adjustment pusher 85 are removed for replacement in the position adjustment of the optical element 37, the airtightness inside the frame member 41 can be maintained.

(6) In the optical element holding device 38, the O-ring 88, 90 force is disposed between the displacement rod 84 retained in the displacement module mounting hole 83 and the inner peripheral surface of the displacement module mounting hole 83. Have been. For this reason, even if the adjustment button 86 and the adjustment washer 85 are removed for replacement, the airtightness inside the frame member 41 can be reliably maintained.

(7) In the optical element holding device 38, the displacement module 82 has the adjustment button 86 for roughly adjusting the displacement of the optical element 37 and the adjustment pusher 85 for finely adjusting the displacement of the optical element 37. I have. Therefore, the position of the optical element 37 in the frame member 41 can be finely adjusted using the adjustment button 86 and the adjustment pusher 85.

(8) In the optical element holding device 38, the displacement module 82 is housed inside the displacement rod housing 89 via the O-ring 90, and the displacement rod housing 89 is framed via the O-ring 88. It is attached to member 41.存在 Due to the presence of the ring 90, the displacement button 84 is displaced by replacing the adjustment button 86 and the adjustment pusher 85 while maintaining the airtightness of the inside of the frame member 41. Can be done. Further, even if the displacement rod 84 is displaced, the O-ring 88 does not slide, so that the durability of the ring 88 can be improved.

(9) In the optical element holding device 38, the hollow ring 81a has a hollow structure that is closely adhered over the entire periphery of the fastening portion 40 and is elastically deformed. Therefore, the adhesion of the hollow ring 81a to the fastening portion 40 of each frame member 41 can be improved. Also, the hollow ring 81a is easily crushed. When stacking a plurality of lens barrel modules 39a, the centering operation of each lens barrel module 39a can be easily performed.

(10) The optical element holding device 38 is provided with a biasing spring 77 for returning the lever 54 for displacing the optical element 37 to a predetermined position when the adjustment button 86 and the adjustment pusher 85 are removed. ing. Therefore, when the adjustment button 86 and the adjustment pusher 85 are removed, the lens frame 43 can be disposed at the reference position, and the optical element 37 is stably held.

(Modification)

Note that the embodiment of the present invention may be modified as follows.

In the embodiment, in order to adjust the driving force F in the displacement module 82, the adjustment pusher 85 and the adjustment button 86 are appropriately selected, the adjustment pusher 85 and the adjustment button 86 are exchanged, and the displacement rod 84 is displaced. . On the other hand, for example, a micrometer may be provided in the displacement module 82, and the displacement rod 84 may be displaced by moving the micrometer forward and backward. In this case, the driving force F can be easily adjusted, and the fine adjustment can be easily performed.

As shown in FIG. 9, an actuator 122 such as a piezo element is provided in a displacement module 121 serving as an adjusting member and a displacement mechanism, and the displacement rod 84 is displaced by driving the actuator 122. Yeah. In this case, by remotely operating the actuator 122, the attitude of the optical element 37 can be controlled at a remote position, which is convenient. Also, for example, predetermined control based on aberration information obtained during the operation of the exposure apparatus 31, irradiation history of the optical element 37, changes in environmental conditions in which the exposure apparatus 31 is arranged, changes in exposure conditions such as illumination conditions, and the like. By inputting the signal, the attitude of the optical element 37 can be controlled, and the aberration can be corrected more finely. As a result, the exposure accuracy of the exposure apparatus 31 is improved, and Thus, the throughput can be improved by shortening the run time.

[0056] Note that a fluid pressure actuator or the like may be employed as the actuator.

In the above embodiment, a sensor for detecting the attitude of the optical element 37 may be provided in the optical element holding device 38. In this case, more accurate attitude control of the optical element 37 can be performed.

In particular, when it is necessary to ensure airtightness in the lens barrel 39, an optical window is provided on the outer peripheral surface of the frame member 41, and the optical element 37 or the lens frame 43 is attached through the optical window. It is preferable to use a sensor of an optical encoder type, a capacitance type, or the like that reads the attached scale with a head disposed outside the lens barrel 39. With this configuration, it is not necessary to dispose the cord connected to the sensor and the substrate of the sensor in the lens barrel 39, and the inside of the lens barrel 39 can be kept clean.

In the above embodiment, the hollow ring 81a is provided so as to be pressed between the fastening portions 40 of the frame member 41 of the lens barrel module 39a to be joined to each other. On the other hand, the hollow ring 81a may be omitted by processing and finishing the joining surface of the fastening portion 40 with high precision. Alternatively, for example, a gasket may be interposed between the joint surfaces of the joints 40, the joint of the joints 40 may be covered with a cover, and an O-ring may be arranged between the cover and the outer peripheral surface of the joint 40. Good.

[0059] Further, the o-ring interposed between the fastening portions 40 may have a solid structure.

In the above embodiment, the lens frame 43 is omitted, and the first ends of the arms 53al, 53a2, 53bl, 53b2, 53cl, 53c2 are directly connected to the support member 42 via the element-side pivot 58. They may be connected.

In the above embodiment, the O-ring 90 is provided between the outer peripheral surface of the displacement rod 84 and the displacement rod housing 89 and between the outer peripheral surface of the displacement rod housing 89 and the inner peripheral surface of the displacement module mounting hole 83. , 88 are interposed. Instead of the o-rings 90 and 88, for example, a magnetic fluid seal may be used. In this case, since the hysteresis element is eliminated, it is particularly effective in a configuration in which the attitude of the optical element 37 is controlled during the operation of the exposure apparatus 31.

In the embodiment, the displacement rod 84 is accommodated in the displacement rod housing 89. The force accommodated in the displacement module mounting hole 83 of the frame member 41 may be omitted, and the displacement rod 84 may be directly mounted in the displacement module mounting hole 83 without the displacement rod housing 89.

In the above embodiment, the driving force F is applied to the lever 54 by the movement (translational movement) of the displacement rod 84 in the radial direction of the optical element 37. On the other hand, a driving force is applied to the lever 54 by, for example, rotating the displacement rod 84, moving the displacement rod 84 in the optical axis direction or another direction, or rotating the displacement rod 84 in the circumferential direction of the frame member 41. You may.

In the above embodiment, a lens is exemplified as the optical element 37, but the optical element 37 may be another optical element such as a parallel plate, a mirror, a half mirror, or the like.

The optical element holding device 38 of the present invention is not limited to the holding structure of the horizontal type optical element 37 in the projection optical system 35 of the exposure apparatus 31 of the above embodiment. For example, the present invention may be embodied in a configuration for holding the optical element in the illumination optical system 33 of the exposure apparatus 31 and a configuration for holding the optical element 37 of the vertical type. Further, the present invention may be embodied in a configuration for holding an optical element in another optical machine, for example, an optical system such as a microscope or an interferometer.

· A contact exposure apparatus for transferring a mask pattern to a substrate by bringing a mask and a substrate into close contact without using a projection optical system as an exposure apparatus, and a mask pattern for bringing a mask and a substrate close to each other. The present invention can also be applied to an optical system of a proximity exposure apparatus that transfers the light onto a substrate. Further, the projection optical system is not limited to the total refraction type, but may be a reflection refraction type.

Further, the exposure apparatus of the present invention is not limited to a reduction exposure type exposure apparatus, and may be, for example, a 1 × exposure type or an enlargement type exposure apparatus.

From a mother reticle to a glass substrate or a silicon wafer to manufacture reticles or masks used in light exposure equipment, EUV exposure equipment, X-ray exposure equipment, and electron beam exposure equipment that can be used only with microdevices such as semiconductor devices. The present invention can be applied to an exposure apparatus for transferring a circuit pattern. For example, in an exposure apparatus using DUV (deep ultraviolet) or VUV (vacuum ultraviolet) light, a transmission reticle is generally used, and as a reticle substrate, quartz glass, fluorine-doped quartz glass, fluorite, magnesium fluoride, Or a crystal is used. For example, a proximity type X-ray exposure apparatus or electron beam exposure apparatus In this case, a transmission type mask (stencil mask, memrene mask) is used, and a silicon wafer is used as a mask substrate.

The present invention is also applied to an exposure apparatus used for manufacturing a display including a liquid crystal display element (LCD) and the like, which transfers a device pattern onto a glass plate, which is not limited to an exposure apparatus used for manufacturing a semiconductor element. can do. The present invention is also applicable to an exposure apparatus used for manufacturing a thin-film magnetic head and transferring a device pattern to a ceramic wafer, and an exposure apparatus used for manufacturing an imaging device such as a CCD. .

Further, the present invention can be applied to a scanning stepper that transfers a pattern of a mask to a substrate in a state where the mask and the substrate are relatively moved, and sequentially moves the substrate in steps. Further, the present invention can be applied to a step-and-repeat type stepper in which a pattern of a mask is transferred to a substrate while the mask and the substrate are stationary and the substrate is sequentially moved stepwise.

[0068] As the light source of the exposure apparatus, in addition to the ArF excimer laser (193 nm) and the F laser (157 nm) described in the above embodiment, for example, g-line (436 nm)

2. For i-line (365nm), KrF excimer laser (248nm), Kr laser (146nm) 126nm)

2. Ar laser (may be used.

2

A single-wavelength laser beam in the infrared or visible range oscillated from a DFB semiconductor laser or fiber laser is amplified by, for example, a fiber amplifier doped with erbium (or both erbium and ytterbium), and the amplified laser light is amplified. A harmonic converted to ultraviolet light using a nonlinear optical crystal may be used as a light source.

The exposure apparatus 31 of the embodiment is manufactured, for example, as follows.

That is, first, at least a part of the optical element 37 such as a plurality of lenses or mirrors constituting the illumination optical system 33 and the projection optical system 35 is held by the optical element holding device 38 of the embodiment or each of the modified examples. The illumination optical system 33 and the projection optical system 35 are incorporated in the main body of the exposure device 31 to perform optical adjustment. Next, a wafer stage 36 (including a reticle stage 34 in the case of a scan type exposure apparatus) composed of a number of mechanical parts is attached to the main body of the exposure apparatus 31, and wiring is connected. Then, after connecting a gas supply pipe that supplies gas into the optical path of exposure light, comprehensive adjustment (electrical adjustment, operation confirmation, etc.) is performed.

[0070] Each component constituting the optical element holding device 38 is processed by ultrasonic cleaning with processing oil and metal. It is assembled after removing impurities such as substances. It is desirable that the manufacture of the exposure apparatus 31 be performed in a clean room in which the temperature, humidity and pressure are controlled and the cleanliness is adjusted.

[0071] Although examples in which fluorite, quartz, or the like is used as the glass material in the above embodiment have been described, lithium fluoride, magnesium fluoride, strontium fluoride, lithium-calcium-aluminum-fluoride, and lithium-strontium are used. —Aluminum-fluoride crystal, zirconium-barium-lanthanum-aluminum fluoride glass, fluorine-doped quartz glass, quartz glass doped with hydrogen in addition to fluorine, quartz containing OH groups Use improved quartz such as glass and quartz glass containing OH groups in addition to fluorine.

Next, an embodiment of a device manufacturing method using the above-described exposure apparatus 31 in a lithographic process will be described.

FIG. 10 is a flowchart illustrating an example of manufacturing a device (eg, a semiconductor element such as an IC or an LSI, a liquid crystal display element, an imaging element (eg, a CCD), a thin-film magnetic head, a micromachine, etc.). As shown in FIG. 10, first, in step S201 (design step), a function and performance design of a device (micro device) (for example, a circuit design of a semiconductor device) is performed, and a pattern design for realizing the function is performed. I do. Subsequently, in step S202 (mask manufacturing step), a mask (such as reticle Rt) having the designed circuit pattern is manufactured. In step S203 (substrate manufacturing step), a substrate (wafer W when a silicon material is used) is manufactured using a material such as silicon or a glass plate.

Next, in step S204 (substrate processing step), using the mask and the substrate prepared in steps S201 to S203, an actual circuit or the like is formed on the substrate by lithography or the like, as described later. . Next, in step S205 (device assembly step), device assembly is performed using the substrate processed in step S204. Step S205 includes a plurality of steps such as a dicing step, a bonding step, and a packaging step (such as chip encapsulation) as necessary.

Finally, in step S206 (inspection step), inspections such as an operation confirmation test and a durability test of the device manufactured in step S205 are performed. After these steps, Is completed and shipped.

FIG. 11 is a flowchart showing details of an example of step S204 in FIG. 10 in the case of a semiconductor device. In FIG. 11, in step S211 (oxidation step), the surface of wafer W is oxidized. In step S212 (CVD step), an insulating film is formed on the surface of the wafer W. In step S213 (electrode formation step), electrodes are formed on the wafer W by vapor deposition. In step S214 (ion implantation step), ions are implanted into the wafer W. Each of the above steps S211 to S214 constitutes a pre-processing step of each stage of wafer processing, and is selected and executed according to required processing in each stage.

At each stage of the wafer process, when the above-described pre-processing step is completed, the post-processing step is executed as follows. In this post-processing step, first, in step S215 (resist formation step), a photosensitive agent is applied to the wafer W. Subsequently, in step S216 (exposure step), the circuit pattern of the mask (reticle Rt) is transferred onto the wafer W by the lithography system (exposure apparatus 31) described above. Next, in step S217 (image step), the exposed wafer W is developed, and in step S218 (etching step), portions of the wafer W other than the portion where the resist remains are removed by etching. Then, in step S219 (resist removing step), unnecessary resist after etching is removed.

By repeatedly performing these pre-processing and post-processing steps, multiple circuit patterns are formed on wafer W.

By using the device manufacturing method of the present embodiment described above, the above-described exposure apparatus 31 is used in the exposure step (step S216), and the resolution can be improved by the exposure light EL in the vacuum ultraviolet region, and the exposure amount can be controlled. Can be performed with high accuracy. Therefore, as a result, highly integrated devices with a minimum line width of about 0.1 μm can be produced with good yield.

Claims

The scope of the claims

[1] An optical element holding device including: a frame member; and a holding member provided inside the frame member and holding the optical element.

An adjusting member provided on the frame member to adjust the position of the optical element via the holding member; and a first seal member provided between the adjusting member and the frame member. Optical element holding device.

[2] The frame member has a joining portion that is laminated with another frame member and joined to the other frame member, and the frame member is located between the other frame member and the joining portion. 2. The optical element holding device according to claim 1, further comprising a second seal member provided.

3. The optical element holding device according to claim 2, wherein the second seal member includes an O-ring arranged along a circle centered on an optical axis of the optical element.

[4] The optical element holding device according to claim 3, wherein the o-ring has a hollow structure which is in close contact with the joint portion and is elastically deformable.

[5] The frame member has an opening, the adjusting member has a displacement mechanism for displacing the position of the optical element, and the displacement mechanism is displaceable into the opening of the frame member. 5. The optical element holding device according to claim 1, wherein the optical element holding device is housed.

[6] The displacement mechanism has a first adjustment component and a second adjustment component arranged side by side in the opening, and when the first adjustment component is removed from the opening, the second adjustment component is removed. The optical element holding device according to claim 5, wherein the adjustment component of (2) is placed in the opening.

[7] The first adjustment component is one of a plurality of different first adjustment components, and the displacement amount of the optical element is adjusted by replacing the first adjustment component. The optical element holding device according to claim 6, wherein

[8] The optical element holding device according to claim 7, wherein the first seal member is arranged between the second adjustment component and an inner peripheral surface of the opening.

9. The first adjustment component includes a coarse adjustment component for coarsely adjusting the displacement of the optical element and a fine adjustment component for finely adjusting the displacement of the optical element. Written in Optical device holding device.

10. The apparatus according to claim 1, further comprising: a tubular body that houses the adjustment member, wherein the first seal member includes a seal portion provided between the adjustment member and the tubular body. The optical element holding device according to claim 9.

11. The device according to claim 11, further comprising an urging member for returning the holding member to a predetermined position when at least a part of the displacement mechanism is removed. Optical element holding device.

[12] In a lens barrel containing at least one optical element,

12. A lens barrel comprising the optical element holding device according to claim 11, which holds at least one of the optical elements.

13. The optical element according to claim 12, wherein the optical element is one of a plurality of optical elements constituting a projection optical system that projects an image of a predetermined pattern formed on a mask onto a substrate. Barrel.

14. The lens barrel according to claim 13, for transferring the image of the predetermined pattern onto the substrate by exposing the image of the predetermined pattern formed on the mask to an exposure apparatus that transfers the image of the predetermined pattern onto the substrate. An exposure apparatus comprising:

[15] In the device manufacturing method,

A method for manufacturing a device, comprising: a lithographic process for performing exposure using the exposure apparatus according to claim 14.