JP2008047622A - Exposure apparatus, device manufacturing method, and regulating method for regulating position of optical element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an exposure apparatus capable of positioning an optical element with a high accuracy upon assembling or dismantling and reassembling a mirror tube in the maintenance of the optical element, to provide a manufacturing method of a device which uses the exposure apparatus, and to provide a regulating method for regulating the position of the optical element. <P>SOLUTION: The exposure apparatus is equipped with an optical element driving unit 120 having a driving mechanism for driving the optical element 103 for projecting exposure light on a wafer 8 through the retaining mechanism 106 of an intermediate block 104, and a relative position measuring sensor 121 for measuring a relative position between the mirror tube 11 and the driving unit 120. The driving unit 120 is equipped with a position measuring sensor 108 for measuring the position of the optical element 103 with respect to a base plate, and is positioned by a positioning pin 123 in the mirror tube 11. The correct positioning to an original position of the optical element 103 upon re-assembling and the trimming of aberration are facilitated by the driving of the driving mechanism. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an exposure apparatus, and more particularly, to an exposure apparatus having a mechanism for holding an optical element used for projecting exposure light onto a substrate, a device manufacturing method using the exposure apparatus, and adjusting the position of the optical element. It relates to the adjustment method.

A semiconductor exposure apparatus used in a lithography process in the manufacture of semiconductor elements and microdevices is an apparatus for transferring an original (reticle) having many different types of patterns onto a substrate (silicon wafer).
The degree of integration of semiconductor elements is increasing year by year, and in order to create highly integrated circuit patterns, it is essential to reduce aberrations and distortion of the projection optical system.
Overlay errors in a semiconductor exposure apparatus are classified into alignment errors, image distortions, and magnification errors. The alignment error can be reduced by adjusting the relative position between the original and the substrate.
On the other hand, image distortion and magnification error can be adjusted by moving the optical axis of some optical elements of the optical system.

When moving the optical element in the direction of the optical axis, it is necessary to prevent components other than the moving direction of the optical element, in particular, parallel eccentricity and tilt eccentricity error components from becoming large.
In the case of a conventional projection optical system, each optical element and a lens barrel unit in which the optical element is accommodated are positioned and then assembled with other lens barrel units that are similarly assembled.
Therefore, Japanese Patent Laid-Open No. 2002-203765 (Patent Document 1) has proposed a technique for facilitating maintenance.
However, in the case of the above assembly method, when performing maintenance such as replacement or readjustment when the actuator or sensor of the optical element adjustment mechanism arranged in the projection optical system has failed or shifted due to an accident, etc. It was necessary to separate the group tube.

In addition, it is necessary to separate the lens barrels when correcting the shape of the optical element surface from the result of wavefront aberration measurement performed after the projection optical system is assembled.
Thus, when the group barrel is separated and then reassembled, there is a problem in that it cannot be accurately returned to the original position, and the optical performance is different from the state before the barrel is separated.
Even in the technique of facilitating the maintenance described in Japanese Patent Application Laid-Open No. 2002-203765 (Patent Document 1), it is necessary to perform high-accuracy positioning in the reassembly after the maintenance.
JP 2002-203765 A

  Accordingly, the present invention provides an exposure apparatus capable of positioning an optical element with high accuracy when assembling or disassembling and reassembling a lens barrel in maintenance of the optical element, a device manufacturing method using the exposure apparatus, and an optical element An object of the present invention is to provide an adjustment method for adjusting the position.

The device manufacturing method of the present invention for solving the above-described problems includes a step of exposing a wafer using the exposure apparatus of the present invention and a step of developing the wafer.
Furthermore, the adjustment method for adjusting the position of the optical element according to the present invention includes an optical element after an optical element driving unit including an optical element in an exposure apparatus and an actuator for driving the optical element is attached to a lens barrel. An adjustment method for adjusting the position of the optical element, the method comprising: measuring a relative position between the lens barrel and the optical element driving unit; and adjusting the position of the optical element based on the measurement result. Features.

According to the exposure apparatus of the present invention, an optical element driving unit including an actuator for driving an optical element, a lens barrel holding the optical element driving unit, and between the lens barrel and the optical element driving unit. And a relative position measuring sensor for measuring the relative position.
For this reason, when the optical element driving unit is reassembled, the optical element can be accurately returned to the original position, and the optical performance of the optical element is different from the state before the lens barrel is separated. Can solve the problem.
In addition, for example, it is extremely easy to precisely position the optical element to the original position and finely adjust the aberration when the lens barrel is reassembled after maintenance. Reliability can be easily maintained.
Furthermore, according to the device manufacturing method of the present invention, since the exposure apparatus is used, a highly accurate and highly reliable exposure process can always be used, and a highly reliable device can always be manufactured.
Furthermore, according to the adjustment method for adjusting the position of the optical element of the present invention, since the optical element driving unit and the relative position measurement sensor are used, the reassembled optical element is accurately reproduced in the original position and the original posture. It is easy to do, and the reliability can be reliably increased.

  Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows an example of a schematic configuration of an exposure apparatus according to the first embodiment of the present invention.
The exposure apparatus of this example uses EUV light (for example, wavelength 13.4 nm) as illumination light for exposure, and a circuit formed on the reticle 5 by, for example, a step-and-scan method or a step-and-repeat method. This is a projection exposure apparatus that exposes a pattern onto a wafer 8.
Hereinafter, an example in which the optical element driving unit (driving mechanism) of the present invention is applied to an exposure apparatus using EUV light will be described. However the light source e.g. KrF, ArF, may be used other light sources such as F _2, the exposure apparatus may be applied to the drive mechanism.
Such an exposure apparatus is suitable for a lithography process of sub-micron or quarter-micron or less, and in this example, a step-and-scan type exposure apparatus (also referred to as “scanner”) will be described as an example.

Here, the “step-and-scan method” means that the wafer 8 is continuously scanned (scanned) with respect to the reticle 5 to expose the mask pattern onto the wafer 8 and the wafer 8 is exposed after one shot of exposure is completed. This is an exposure method that moves stepwise and moves to the next exposure region.
The “step-and-repeat method” is an exposure method in which the wafer 8 is moved stepwise to the exposure area of the next shot for every batch exposure of the wafer 8.
As shown in FIG. 1, the exposure apparatus of this example includes an illumination device (not shown), a reticle stage (not shown) on which a reticle 5 is placed, a wafer stage 9 on which a wafer 8 is placed, and the reticle 5 described above. And a projection optical system 1 for forming the above image on a substrate (wafer 8).
Further, the exposure apparatus of this example includes an alignment detection mechanism (not shown) and a focus position detection mechanism (not shown).

On the other hand, since EUV light has a low transmittance with respect to the atmosphere, at least the optical path through which the EUV light passes (that is, the entire optical system) is a vacuum atmosphere.
The reticle 5 is, for example, a reflection type, and a circuit pattern (or image) to be transferred is formed thereon. The reticle 5 is supported and fixed on a reticle stage using an electrostatic chuck or the like, and is driven integrally with the reticle stage.
Since the diffracted light emitted from the reticle 5 is reflected by the projection optical system 1 and projected onto the wafer 8, the reticle 5 and the wafer 8 are arranged in an optically conjugate relationship.
Since the exposure apparatus of this example is a step-and-scan type exposure apparatus, the pattern of the reticle 5 is reduced and projected onto the wafer 8 by scanning the reticle 5 and the wafer 8.

The projection optical system 1 uses a plurality of multilayer mirrors to reduce and project a pattern on the surface of the reticle 5 onto a substrate (wafer 8) that is an image plane.
The number of mirrors is preferably about 4 to 6. FIG. 1 shows an example of six mirror systems, which are shown as M1 to M6, respectively.
In order to realize a wide exposure area with a small number of mirrors of 4 to 8 mirrors (preferably an even number such as 4, 6, 8, etc.), a certain distance from the optical axis. It is preferable to use a thin arc-shaped region (ring field) separated by a distance.
The exposure apparatus of this example scans the reticle 5 and the wafer 8 simultaneously, and transfers the pattern on the surface of the reticle 5 to a large area on the substrate (wafer 8). The numerical aperture (NA) of the projection optical system 1 is about 0.2 to 0.3.

The lens barrel 11 is provided with the lens barrel surface plate 2 of the lens barrel 11 so that the vibration of the floor on which the lens barrel is installed is not transmitted to the projection optical system 1 and further to each mirror (hereinafter, referred to as “optical element”). The base plate 3 is fastened through a plurality of vibration isolation mechanisms 4.
The lens barrel 11 holds an optical element drive unit (drive unit 120) described later of the present invention. The optical element control means 10 controls an optical element drive unit (drive unit 120) described later according to the present invention in accordance with a predetermined control flow.
Specifically, the optical element control means 10 is a predetermined optical element based on a result calculated to minimize an error amount such as a magnification error obtained from exposure aberration and alignment information, and a program stored in advance. By adjusting and driving, the optical performance of the projection optical system 1 is optimized.

(Outline of the present invention in Example 1)
FIG. 2 shows an outline of an optical element driving unit (hereinafter referred to as a driving unit) 120 mounted on a lens barrel (see FIG. 1) 11 applied to the first embodiment of the present invention.
The drive unit 120 includes, for example, six drive means (actuators) 115 provided on the base plate 105 via elastic hinges 107 that are displaceable in one axial direction.
Each driving means 115 is connected in an oblique posture as shown in the figure between six elastic hinges 107 on the base plate 105 and so-called three protrusions 104 a around the intermediate block 104.
As each drive means 115, for example, any type capable of linear movement, such as a piezo element or a cylinder, may be used.

Six uniaxially displaceable driving means 115 are provided for the intermediate block 104 to keep the intermediate block 104 and the optical element 103 on the intermediate block 104 in a completely horizontal posture, for example, by any arbitrary drive. Posture adjustment is possible.
This configuration is a general configuration example of the parallel mechanism. By arbitrarily operating the six driving means 115, it is possible to operate a total of six axes including three orthogonal axes and three rotation axes around the axes. Yes.
As a result, the intermediate block 104 can be driven in six axes by the six driving means 115, and various postures can be changed. Each of the six driving means 115 can be arbitrarily driven by the activation of the optical element control means 10.
That is, the optical element control means 10 drives the drive means 115 based on the output of an optical element measurement sensor (each position measurement sensor 108) described later.
The driving means 115 drives the intermediate block 104 or a plurality of holding mechanisms 106 provided in the holding unit via the intermediate block 104.

On the other hand, the optical element 103 on the intermediate block 104 is mounted on the intermediate block 104 via a plurality of holding mechanisms 106 provided in the holding unit.
Each holding mechanism 106 uses the same system as the elastic hinge 107 as an example. However, the method of the holding mechanism 106 is not limited to this, and other methods such as those using a kinematic mount may be used (not shown).
That is, when positioning the drive unit 120, a kinematic mount composed of three balls and three V grooves on the base plate 105, or three balls and one V groove, one plane, A kinematic mount composed of a single cone may be used.
The holding mechanism 106 of the holding unit on the intermediate block 104 plays a role of reducing the adverse effect on the optical performance due to the minute deformation of the intermediate block 104 transmitted to the optical element 103 when the drive unit 120 is driven, and the mounting of the optical element 103. Realize the role of high reproducibility.

The base plate 105 has a so-called ring-shaped flat plate configuration.
On the surface of the main body of the base plate 105, a frame body 105a is provided that stands upright at three equally spaced positions.
A position measurement sensor 108 for measuring the position and orientation of the optical element 103 with respect to the base plate 105 is provided at the tip of each frame body 105a.
As the position measurement sensor 108, for example, a capacitance sensor, a differential transformer, an eddy current displacement sensor, a laser interferometer with an origin, or the like can be used.

FIG. 3 shows a partial outline when the drive unit 120 is mounted on the lens barrel 11. FIG. 3 shows only around M1 and M3 in FIG. However, the drive unit 120 of the present invention may be applied to M2, M4, M5, and M6 shown in FIG.
The lens barrel 11 includes, for example, a lens barrel 126 and a lens barrel 127 that can be divided into upper and lower parts, and each includes the drive unit 120.
However, the drive unit 120 in the lens barrel 126 is configured upward as in the case shown in FIG. On the other hand, the drive unit 120 in the lens barrel 127 is configured to face downward, contrary to the case shown in FIG.
The lens barrel 126 includes a relative position measurement sensor 121 for measuring the relative position between the lens barrel 126 and the drive unit 120 in the lens barrel 126, and a sensor gate 125 provided in the base plate 105.
When the relative position measuring sensor 121 in the lens barrel 126 detects the sensor gate 125, it is possible to detect the installation position and posture of the drive unit 120 in the lens barrel 126.

The lens barrel 127 also includes a relative position measurement sensor 121 for measuring the relative position between the lens barrel 127 and the drive unit 120 in the lens barrel 127, and a sensor gate 125 provided in the base plate 105.
When the relative position measuring sensor 121 in the lens barrel 127 detects the sensor gate 125, it is possible to detect the installation position and posture of the drive unit 120 in the lens barrel 127.
On the other hand, after assembling the projection optical system 1 by incorporating the optical element 103 into the lens barrel 11, the wavefront aberration is measured by the inspection apparatus.
If the measured wavefront aberration amount does not fall within the allowable value, the projection optical system 1 undergoes a correction work as necessary.
In the correction processing operation, the lens barrel 11 is separated, the optical element 103 is taken out, and the optical element 103 is subjected to correction processing such as additional processing or polishing, and the lens barrel is assembled again.
The high-performance projection optical system 1 can be reproduced by passing through a loop in which the amount of aberration is measured again by an inspection device (not shown).

On the other hand, regarding the drive unit 120, when a piezo actuator using a piezo element is used as the drive means 115 being used, it is easy to replace the drive means 115 due to damage to the piezo element.
At that time, the lens barrel 11 is separated and reassembled. Thus, in order to reproduce the high-performance projection optical system 1 as described above, it is considered that the projection optical system 1 is separated and reassembled a plurality of times. It is done.
When the lens barrel 11 is separated to correct the optical element 103 or perform maintenance of the driving means 115, the lens barrel 11 is separated like the lens barrel 126 and the lens barrel 127, and the optical element 103 is driven to the drive unit 120. Take out every time.
Further, by disassembling the drive unit 120 and taking out the optical element 103 and the drive means 115, the optical element 103 is corrected or the drive means 115 is maintained.

After completing the correction process and maintenance, the lens barrel 11 and the drive unit 120 are reassembled. When the lens barrel 11 and the drive unit 120 are reassembled, the lens barrel 11 is assembled by abutting against positioning pins 123 as fixing means provided in advance.
Further, the relative position between the drive unit 120 and the lens barrel 11 is measured by a position measurement sensor 121 provided in the lens barrel 11 in advance, and the lens barrel 11 is assembled based on the relative position measured in advance before disassembly. .
Fine adjustment in the case where an error of several μm occurs as the reproducibility between the positioning pin (fixing means) 123 and the drive unit 120 is performed by the position measurement sensor 108 provided in the drive unit 120, the drive means 115, or a fine movement mechanism (not shown). This is performed while driving the optical element 103.

As described above, the exposure apparatus according to the first embodiment includes the drive unit 120 having the drive unit 115 for the intermediate block 104, the position measurement sensor 108, and the relative position measurement sensor 121, and is provided between the intermediate block 104 and the optical element 103. A holding mechanism 106 was provided.
Therefore, when the lens barrel 11 is separated and then reassembled, the optical element 103 can be accurately returned to the original position, and the optical performance of the optical element 103 is different from the state before the lens barrel 11 is separated. It is possible to solve the problem of end.
Moreover, for example, it is very easy to position the optical element 103 at the original position and finely adjust the aberration when reassembling the mirror 11 or the like after maintenance. Reliability can be easily maintained.

Next, a second embodiment of the present invention will be described.
FIG. 4 is a partially cutaway explanatory view for explaining the structure of the lens barrel of Embodiment 2 of the present invention, and shows the structure of portions M1 and M3 shown in FIG.
In FIG. 4, the same parts as those described in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
In the first embodiment, positioning is performed by abutting the drive unit 120 against the positioning pin 123. However, in the second embodiment, the positioning is performed by the kinematic mount 122 provided on the lower surface of the base plate 105 of the drive unit 120 as shown in FIG. It was set as the structure which performs.
As a result, it is possible to realize higher positioning reproduction compared to the method using the positioning pins 123, and it can be used for a projection optical system that requires higher optical performance.

FIG. 5 shows two configuration examples of the kinematic mount 122.
As shown in FIG. 5A, one kinematic mount 122 has a contact relationship between one ball 122a and one V groove 122b, and a contact relationship between one ball 122a and one cone 122c. It consists of a contact relationship between one ball 122a and one plane 122d.
Further, as shown in FIG. 5B, one kinematic mount 122 is configured by a one-to-one contact relationship between each of the three balls 122a and the three V grooves 122b. Which structure in FIGS. 5A and 5B is used for the kinematic mount 122 is arbitrary.
Further, the position of the drive unit 120 is measured by a relative position measurement sensor 121 such as a capacitance sensor, a differential transformer, an eddy current displacement sensor, or a linear encoder attached in the lens barrel 11.

The difference in installation position of the optical element 103 before and after maintenance can be adjusted by the driving means 115 of the driving unit 120 or a fine movement mechanism (not shown) and can be finally adjusted. Thereby, the position of the high optical element 103 can be reproduced.
When the drive unit 120 is measured from the relative position measurement sensor 121 of the lens barrel 11, the position on the base plate 105 can be considered as the position where the sensor target 125 is attached as shown in FIG.
However, the attachment position of the sensor target 125 may be selected from the intermediate block 104, the holding mechanism 106, or the optical element 103 itself.
4 shows only one relative position measurement sensor 121 provided in the lens barrel 11 and one sensor target 125 provided in the drive unit 120, but six-axis direction measurement can be performed according to the required accuracy. It is preferable to provide 6 pieces each as possible.

As described above, the exposure apparatus according to the second embodiment exemplifies the case where the sensor target 125 of the relative position measurement sensor 121 is provided in the base plate 105, the intermediate block 104, the holding mechanism 106, or the optical element 103.
Also in this configuration, when the lens barrel 11 is separated and then reassembled, the optical element 103 can be accurately returned to the original position, and the optical performance of the optical element 103 is in a state before the lens barrel 11 is separated. The problem of being different can be solved.
Moreover, for example, it is very easy to position the optical element 103 at the original position and finely adjust the aberration when reassembling the mirror 11 or the like after maintenance. Reliability can be easily maintained.

Next, a third embodiment of the present invention will be described.
FIG. 6 is a partially cutaway explanatory view illustrating the configuration of the lens barrel according to the third embodiment of the present invention. FIG. 6 also illustrates the configuration of the portions M1 and M3 shown in FIG.
In FIG. 6, the same parts as those described in the first or second embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
In the third embodiment, the side surface of the lens barrel 11 has openable and closable openings 11 a and 11 b for taking out and housing the drive unit 120.
In addition, the lens barrel 11 is provided with a linear motion rail 131 for pulling out the drive unit 120 and a guide 130 such as a rolling guide when performing maintenance of the optical element 103 and the drive means 115.
However, when the drive unit 120 is installed, the linear rail 131 or the rolling guide as the guide 130 is provided with a straight plate-like flange portion or the like, and the drive unit 120 is prevented from dropping or dropping at the flange portion or the like. It is preferable to have.

The openings 11a and 11b for taking out and housing the drive unit 120 are sealed with a cover (not shown) in order to separate the pressure inside and outside the lens barrel 11 and the gas environment.
When the drive unit 120 is assembled into the lens barrel 11 after the maintenance is completed, the moving mechanism 140 provided in the drive unit 120 is moved along the guide 130 and abuts against the positioning pin 123 provided on the lens barrel 11. Fix it.
The position of the drive unit 120 is measured by a relative position measurement sensor 121 such as a capacitance sensor, a differential transformer, an eddy current displacement sensor, or a linear encoder attached to the lens barrel 11.
The difference in the measured value of the position of the drive unit 120 before and after the maintenance is finally adjusted by the drive means 115 of the drive unit 120 or a fine movement mechanism (not shown).
As a result, as in the above-described embodiment, the drive unit 120 can be easily removed without separating the lens barrel 11 like the lens barrel 126 and the lens barrel 127 and taking out the drive unit 120 during maintenance. It can be positioned with high accuracy during removal and storage.

As described above, the exposure apparatus of the third embodiment is provided with the openings 11a and 11b for taking out and housing the drive unit 120, and the linear motion rail 131 and the rolling guide for guiding the movement of the drive unit 120 in the lens barrel 11. A guide 130 was provided.
In this configuration, the drive unit 120 can be taken out and recollected without separating the lens barrel 11, and the guide 130 improves workability and stability when the drive unit 120 is reassembled.
Further, the guide 130 improves the functionality for assisting in solving the problem that the optical performance of the optical element 103 is different from the state before reassembly.
In other words, the guide 130 facilitates, for example, high-precision positioning and aberration fine adjustment to the original position of the optical element 103 after reassembly after maintenance, and high accuracy and high reliability during the exposure process. It also becomes a factor that helps to maintain easily.

(Example of device manufacturing method)
Next, an embodiment of a device manufacturing method using the above-described exposure apparatus will be described with reference to FIGS.
FIG. 7 is a flowchart for explaining how to fabricate devices (ie, semiconductor chips such as IC and LSI, LCDs, CCDs, etc.). Here, a semiconductor chip manufacturing method will be described as an example.
In step S1 (circuit design), a semiconductor device circuit is designed. In step S2 (mask production), a mask is produced based on the designed circuit pattern. In step S3 (wafer manufacture), a wafer is manufactured using a material such as silicon.

Step S4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by using the mask and the wafer by the above-described exposure apparatus using the lithography technique.
Step S5 (assembly) is called a post-process, and is a process for forming a semiconductor chip using the wafer manufactured in step S4. The assembly process includes an assembly process (dicing, bonding), a packaging process (chip encapsulation), and the like. including.
In step S6 (inspection), inspections such as an operation check test and a durability test of the semiconductor device manufactured in step S5 are performed. Through these steps, the semiconductor device is completed and shipped (step S7).

FIG. 8 is a detailed flowchart of the wafer process in Step 4. In step S11 (oxidation), the surface of the wafer is oxidized. In step S12 (CVD), an insulating film is formed on the surface of the wafer. In step S13 (electrode formation), an electrode is formed on the wafer. In step S14 (ion implantation), ions are implanted into the wafer.
In step S15 (resist process), a photosensitive agent is applied to the wafer. In step S16 (exposure), the circuit pattern of the mask is exposed on the wafer by the exposure apparatus. In step S17 (development), the exposed wafer is developed.
In step S18 (etching), portions other than the developed resist image are removed. In step S19 (resist stripping), the resist that has become unnecessary after the etching is removed. By repeatedly performing these steps, multiple circuit patterns are formed on the wafer.
Since the device manufacturing method according to the embodiment of the present invention uses the exposure apparatus according to the above-described embodiment of the present invention, for example, even when the exposure apparatus needs to be maintained, the accurate original system of the optical system (optical element) is used. The reproducibility to the normal position is good, and therefore a highly reliable exposure process can always be used.
For this reason, the device manufacturing method of the Example of this invention can always manufacture a highly reliable device.

(Example of an adjustment method for adjusting the position of an optical element)
An adjustment method for adjusting the position of an optical element according to an embodiment of the present invention includes: an optical element driving unit including an optical element in an exposure apparatus and an actuator for driving the optical element; This is an adjustment method for adjusting the position of.
The adjustment method for adjusting the position of the optical element of the present example first includes a measurement step of measuring a relative position between the lens barrel 11 and the optical element driving unit (driving unit) 120. The measurement process can be programmed.
In the measurement process, after the drive unit 120 is reinstalled, the sensor target 125 provided on the base plate 105 of the drive unit 120 is determined in advance by the relative position measurement sensor 121 of the lens barrel 11 shown in FIG. 3 (or FIGS. 5 and 6). It is detected whether it is in the correct position.
In the measurement process, when the detection of the sensor target 125 detects that the drive unit 120 is not in the correct position, for example, the wavefront aberration of the optical element (see FIG. 2) 103 is measured by an inspection device (not shown), for example. .

When the measured wavefront aberration amount is not within the allowable value, for example, the optical element (see FIG. 2) 103 is subjected to correction work as necessary.
In the correction processing operation, the optical element 103 is taken out from the lens barrel 11 together with the drive unit 120, and correction processing such as additional processing or polishing of the optical element 103 is performed, and the lens barrel 11 is assembled again.
The high-performance projection optical system 1 can be reproduced by passing through a loop in which the amount of aberration is measured again by an inspection device (not shown).
On the other hand, when the lens barrel 11 and the drive unit 120 are reassembled, the drive unit 120 is abutted against a positioning pin 123 as a fixing means provided in the lens barrel 11 in advance.

At the time of reassembly, the relative position between the drive unit 120 and the lens barrel 11 is measured by a relative position measurement sensor 121 provided in the lens barrel 11 in advance, and the relative position measured in advance before disassembly is used as a reference. The lens barrel 11 is assembled.
The adjustment method for adjusting the position of the optical element of this example includes an adjustment process for adjusting the position of the optical element 103 based on the measurement result. The adjustment process can be automatically performed following the measurement process, and can be similarly programmed.
In the adjustment process, after reassembling the lens barrel 11 and the drive unit 120, if an error of several μm is recognized as the abutment reproducibility between the positioning pin (fixing means) 123 and the drive unit 120, the drive unit is finely adjusted. Each position measurement sensor 108 provided in 120 is activated.

Based on the measurement value of each position measurement sensor 108, for example, each driving means 115 is driven by the optical element control means 10 and the optical element 103 is driven, and the accurate alignment of the optical element 103 is adjusted.
While driving the optical element 103, for example, there is a mode in which accurate alignment of the irradiation position of transmitted light that passes through the optical element 103 is involved.
That is, for example, the driving means 115 is appropriately driven by, for example, the optical element control means 10 so that the irradiation position of the transmitted light that passes through the optical element 103 coincides with a predetermined accurate position.
Since the adjustment method for adjusting the position of the optical element of this example uses, for example, the drive unit 120 shown in the first embodiment, the optical element 103 after reassembly can be accurately reproduced in the original position and original posture. In addition, the reliability can be reliably increased.

It is explanatory drawing explaining an example of schematic structure of the exposure apparatus of Example 1 of this invention. FIG. 3 is a perspective view illustrating an outline of an optical element driving unit (driving unit) mounted on a lens barrel applied to the first embodiment. It is explanatory drawing explaining the partial outline | summary at the time of the drive unit of Example 1 being mounted in the lens barrel. It is a partially notched explanatory drawing explaining the structure of the lens barrel of Example 2 of this invention. FIG. 5A is a perspective view illustrating an example of a kinematic mount according to the second embodiment. FIG. 5B is a perspective view showing another example of the kinematic mount of the second embodiment. FIG. 6 is a partially cutaway explanatory view illustrating a configuration of a lens barrel according to a third embodiment of the present invention. It is a flowchart for demonstrating the device manufacturing method using the exposure apparatus of this invention. It is a detailed flowchart of the wafer process of step 4 of the flowchart shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Projection optical system 2 Lens barrel surface plate 3 Base plate 4 Vibration isolation mechanism 5 Reticle 8 Wafer 9 Wafer stage 10 Optical element control means 11, 126, 127 Lens barrel 11a, 11b Opening 103 Optical element 104 Intermediate block 104a Projection 105 Base plate 105a Frame body 106 Holding mechanism 107 Elastic hinge 108 Position measurement sensor 115 Drive means 120 Drive unit 121 Relative position measurement sensor 122 Kinematic mount 122a Ball 122b V groove 122c Cone 122d Plane 123 Positioning pin 125 Sensor target 130 Guide 131 Linear motion rail 140 Movement mechanism

Claims (9)

An optical element drive unit including an optical element used for projecting exposure light onto a substrate and an actuator for driving the optical element;
A lens barrel for holding the optical element driving unit;
An exposure apparatus comprising: a relative position measuring sensor for measuring a relative position between the lens barrel and the optical element driving unit.   The exposure apparatus according to claim 1, wherein the optical element driving unit includes a base plate and an optical element measurement sensor for measuring a position of the optical element with respect to the base plate. The optical element driving unit includes a holding unit including a holding mechanism for holding the optical element,
The exposure apparatus according to claim 2, wherein the actuator is supported by the base plate and drives the holding unit.   4. The exposure apparatus according to claim 1, wherein the optical element driving unit is fixed to the lens barrel via a fixing unit.   The exposure apparatus according to claim 1, wherein a plurality of the optical element driving units are arranged in the lens barrel.   6. The exposure apparatus according to claim 1, wherein the optical element driving unit is positioned on the lens barrel by a kinematic mount.   The exposure apparatus according to claim 2, wherein the actuator is driven based on an output of the optical element measurement sensor. A step of exposing a wafer using the exposure apparatus according to claim 1;
And a step of developing the wafer. An adjustment method for adjusting the position of an optical element after attaching an optical element driving unit comprising an optical element in an exposure apparatus and an actuator for driving the optical element to a lens barrel,
Measuring a relative position between the lens barrel and the optical element driving unit;
Adjusting the position of the optical element based on the measurement result, and an adjustment method for adjusting the position of the optical element.

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