JPWO2005062100A1 - Optical element holding device, lens barrel, exposure apparatus, and device manufacturing method - Google Patents

Abstract

Provided is an optical element holding device capable of finely adjusting the attitude of an optical element and maintaining high internal airtightness. The optical element holding device includes a frame member (41) and a lens frame body that is provided inside the frame member and holds the optical element. The displacement module (82) provided on the frame member adjusts the position of the optical element via the lens frame. An O-ring (88, 90) is provided between the displacement module and the frame member.

Description

  The present invention relates to an optical element for holding an optical element of an exposure apparatus used in a lithography process in a manufacturing process of a device such as a semiconductor element, a liquid crystal display element, an imaging element, a thin film magnetic head, or a mask such as a reticle or a photomask. The present invention relates to a holding device. The present invention also relates to a lens barrel and an exposure apparatus provided with the optical element holding device. Furthermore, the present invention relates to a device manufacturing method using the exposure apparatus.

  For example, as shown in Patent Document 1, there is known an optical element holding device including a lens frame that holds an optical element and a frame that supports the lens frame via flexure members arranged at equal intervals. It has been. The flexure member includes a connection block connected to the lens frame, and a flexure fixing portion that supports the connection block and is fixed to the frame. The flexure member enables the optical element to move and rotate along each of the optical element in the radial direction, the circumferential direction, and the optical axis direction in a polar coordinate system with the approximate center of the optical element as the origin. That is, the optical element is held in a state where six degrees of freedom of movement are secured, that is, kinematically.

  By the way, with the recent high integration of semiconductor devices, wiring patterns are becoming increasingly finer. For this reason, particularly in an exposure apparatus for manufacturing a semiconductor device, a projection optical system with extremely small wavefront aberration and distortion is required, and the relative position of each optical element housed in the lens barrel is finely defined. Need to control.

  When exposure light having an extremely short wavelength of 200 nm or less is used, exposure light is greatly attenuated if a light-absorbing substance such as water or oxygen is present in the lens barrel through which the exposure light passes. In the exposure apparatus, for example, a covered wire is used for power supply to various electric devices and signal communication with a sensor. A very small amount of organic material is gradually volatilized from these covered wires, and this organic material can become a pollutant.

For this reason, it is necessary to replace the gas inside the lens barrel with an inert gas such as nitrogen or a rare gas. However, the lens barrel may have many openings for adjusting the position of the optical element. When a large number of frames holding one or a plurality of optical elements are stacked to form a lens barrel, the gas outside the lens barrel enters the lens barrel via the joint portion of each frame. There was a possibility of intrusion.
US Patent Application Publication No. 2002/0163441

  The present invention has been made paying attention to such problems existing in the prior art. An object of the invention is to provide an optical element holding device and a lens barrel that can keep the internal airtightness high while finely adjusting the posture of the optical element.

Another object of the present invention is to provide an exposure apparatus with improved exposure accuracy.
It is a further object of the present invention to provide a device manufacturing method capable of improving the yield of highly integrated devices.

  A first aspect of the present invention is an optical element holding device including a frame member and a holding member that is provided inside the frame member and holds the optical element. An optical element holding device including an adjusting member that is adjusted via the first sealing member and a first seal member that is provided between the adjusting member and the frame member.

  In the first aspect of the present invention, the frame member is laminated with another frame member and has a joint portion that is joined to the other frame member, and the frame member is between the other frame member and the joint portion. A second seal member may be provided. Furthermore, the second seal member may include an O-ring arranged along a circle centered on the optical axis of the optical element. Furthermore, the O-ring may have a hollow structure that is in close contact with the joint and is elastically deformable.

  In the first aspect of the present invention, the frame member has an opening, the adjustment member has a displacement mechanism for displacing the position of the optical element, and the displacement mechanism can be displaced in the opening of the frame member. It may be accommodated. Furthermore, the displacement mechanism has a first adjustment component and a second adjustment component arranged side by side in the opening, and when the first adjustment component is removed from the opening, the second adjustment component opens. It may be placed in the department. Furthermore, the first adjustment component is one of a plurality of different first adjustment components, and the displacement amount of the optical element may be adjusted by replacing the first adjustment component. Furthermore, the first seal member may be disposed between the second adjustment component and the inner peripheral surface of the opening. Furthermore, the first adjustment component may include a coarse adjustment component that coarsely adjusts the amount of displacement of the optical element and a fine adjustment component that finely adjusts the amount of displacement of the optical element.

In the first aspect of the present invention, the optical element holding device includes a cylindrical body that accommodates the adjustment member, and the first seal member includes a seal portion provided between the adjustment member and the cylindrical body. But you can.
In the first aspect of the present invention, the optical element holding device may include an urging member that returns the holding member to a predetermined position when at least a part of the displacement mechanism is removed.

  According to a second aspect of the present invention, there is provided a lens barrel that includes the optical element holding device according to the first aspect of the present invention that holds at least one of the optical elements in a lens barrel that houses at least one optical element. .

In the second aspect of the present invention, the optical element may be one of a plurality of optical elements constituting a projection optical system that projects an image of a predetermined pattern formed on the mask onto the substrate.
According to a third aspect of the present invention, in an exposure apparatus for transferring an image of a predetermined pattern formed on a mask onto a substrate, the second aspect of the present invention for transferring the image of the predetermined pattern onto the substrate. An exposure apparatus having a lens barrel is characterized.

  According to a fourth aspect of the present invention, there is provided a device manufacturing method including a lithography process for performing exposure using the exposure apparatus according to the third aspect of the present invention.

1 is a schematic block diagram showing an embodiment of an exposure apparatus of the present invention. The perspective view which shows the optical element holding | maintenance apparatus of FIG. The top view which shows the optical element holding | maintenance apparatus of FIG. Sectional drawing which follows the 4-4 line of FIG. FIG. 3 is an enlarged plan view centered on a pair of arms of the frame member of FIG. 2. The top view which expands and further shows a pair of arm of the frame member of FIG. Sectional drawing which follows the 7-7 line | wire of FIG. Sectional drawing in a plane orthogonal to the optical axis of the optical element in the frame member of FIG. Sectional drawing which shows the displacement module of the example of a change. The flowchart of the manufacture example of a device. 11 is a detailed flowchart regarding the substrate processing of FIG. 10 in the case of a semiconductor device.

  The exposure apparatus, lens barrel, and optical element holding apparatus of the present invention will be described below. An exposure apparatus for manufacturing a semiconductor element and a lens barrel that houses the projection optical system thereof, and an optical element that holds a part of the lenses of the projection optical system. An embodiment embodied in a holding device will be described with reference to FIGS.

  FIG. 1 shows a schematic configuration of the exposure apparatus 31 with the projection optical system 35 as the center. As shown in FIG. 1, an exposure apparatus 31 of this embodiment includes a light source 32, an illumination optical system 33, a reticle stage 34 that holds a reticle Rt as a mask, a projection optical system 35, and a wafer W as a substrate. And a wafer stage 36 for holding the wafer.

The light source 32 oscillates, for example, an ArF excimer laser with a wavelength of 193 nm or an F ₂ laser with a wavelength of 157 nm. The illumination optical system 33 includes an optical integrator (not shown) such as a fly-eye lens and a rod lens, various lens systems such as a relay lens and a condenser lens, and an aperture stop. The exposure light EL emitted from the light source 32 is adjusted so as to uniformly illuminate the pattern on the reticle Rt by passing through the illumination optical system 33.

  The reticle stage 34 is arranged between the illumination optical system 33 and a projection optical system 35 described later so that the mounting surface of the reticle Rt is substantially orthogonal to the optical axis direction of the projection optical system 35. The projection optical system 35 includes optical elements 37 such as a plurality of lenses arranged so that their optical axes coincide with each other. The projection optical system 35 is housed in a lens barrel 39 in a state where each optical element 37 is held almost horizontally (so-called horizontal type) by an optical element holding device 38. The lens barrel 39 has a divided lens barrel structure in which a plurality of lens barrel modules 39a are stacked.

  The wafer stage 36 is disposed on the image plane side of the projection optical system 35 (exposing side of the exposure light EL) so that the mounting surface of the wafer W intersects the optical axis direction of the projection optical system 35. The pattern image on the reticle Rt illuminated with the exposure light EL is reduced to a predetermined reduction magnification through the projection optical system 35 and transferred to the wafer W on the wafer stage 36.

Next, the detailed configuration of the optical element holding device 38 will be described.
2 is a perspective view showing the optical element holding device 38, FIG. 3 is a plan view of the optical element holding device 38, and FIG. 4 is a cross-sectional view taken along line 4-4 of FIG. The optical element 37 is made of a glass material having a predetermined or higher breaking strength such as synthetic quartz or fluorite, and a flange 37a is formed on the periphery of the optical element 37 as shown in FIG. As shown in FIG. 2, the optical element holding device 38 includes a frame member 41 having a fastening portion 40 having a role as a joint portion with another stacked lens barrel module 39 a, and an optical element via a support member 42. And a lens frame 43 having a role as a holding member for holding 37.

  As shown in FIGS. 2 and 3, the frame member 41 and the lens frame 43 are both formed in a substantially annular shape. As shown in FIG. 4, the lens frame 43 is attached to the inside of the frame member 41 (an inner ring 51 to be described later), and a plurality of bolts are attached to the stepped portion 44 formed on the inner peripheral surface of the frame member 41. 45 is fixed. As shown in FIG. 3, three support members 42 are provided on the lens frame 43 at equal angular intervals.

  The support member 42 includes a base member 46 (see FIG. 4) that holds the flange 37 a of the optical element 37, and a clamp member 47. The base member 46 is transmitted from the device outside the support member 42 to the support member 42, and causes factors that affect the state of the optical surface of the optical element 37 (for example, the main body of the exposure device 31, the fastening portion 40 of the frame member 41). A flexure structure for absorbing fine surface roughness such as surface waviness and the like. Therefore, in a state where the optical element 37 is held on the lens frame 43 via the support member 42, the optical surface of the optical element 37 remains even if the lens frame 43 is attached to an external device via the frame member 41. Keep in good condition.

  The frame member 41 is formed with an inner ring 51, an outer ring 52, arms 53 a 1, 53 a 2, 53 b 1, 53 b 2, 53 c 1, 53 c 2, a lever 54, and a support link 55. The arms 53 a 1, 53 a 2, 53 b 1, 53 b 2, 53 c 1, 53 c 2 and the lever 54 form a posture adjusting mechanism 50 that adjusts the posture of the optical element 37 by adjusting the posture of the inner ring 51. The inner ring 51, outer ring 52, arms 53 a 1, 53 a 2, 53 b 1, 53 b 2, 53 c 1, 53 c 2, lever 54 and support link 55 are formed on a frame member 41 made of one structure by wire cutting and electric discharge machining. . The inner ring 51 and the outer ring 52 are connected to each other through arms 53a1, 53a2, 53b1, 53b2, 53c1, 53c2, a lever 54, and a support link 55 so as to be relatively movable.

  FIG. 5 is an enlarged plan view showing the pair of arms 53a1 and 53a2 in the frame member 41 and the periphery thereof. 6 is an enlarged plan view showing the arm 53a1, and FIG. 7 is a cross-sectional view taken along the line 7-7 in FIG.

  As shown in FIG. 3, the frame member 41 is provided with six arms 53a1, 53a2, 53b1, 53b2, 53c1, and 53c2 so as to form three pairs. The arm 53a1 and the arm 53a2 constitute a first link mechanism 53a, the arm 53b1 and the arm 53b2 constitute a second link mechanism 53b, and the arm 53c1 and the arm 53c2 constitute a third link mechanism 53c. ing. These three link mechanisms 53a, 53b, 53c are arranged at equal angular intervals on the circumference of a circle centered on the optical axis AX of the optical element 37.

  Since the first to third link mechanisms 53a, 53b, and 53c have the same configuration, the first link mechanism 53a will be described below as an example. As shown in FIGS. 5 and 6, a pair of through holes 56 are formed in the first ends of the arms 53 a 1 and 53 a 2, and a pair of slits 57 extend from the through holes 56. The pair of through holes 56 and the pair of slits 57 form an element side pivot 58. The first ends of the arms 53a1 and 53a2 are rotatably connected to the inner ring 51 via the element side pivot 58. A pair of through holes 56 are formed at the second end of each arm 53a1, 53a2, and a frame-side pivot 59 is formed by the pair of through holes 56 and a pair of slits 57 communicating with the pair of through holes 56. Is done. The second ends of the arms 53a1 and 53a2 are rotatably connected to the lever 54 via the frame side pivot 59.

  As shown in FIG. 7, which is a cross-sectional view taken along line 7-7 of FIG. 5, the first surface 60 of the frame member 41 that is substantially orthogonal to the optical axis AX of the optical element 37 has an element-side pivot 58 and Correspondingly, a small opening recess 61a dug by electric discharge machining is formed. A large opening recess 62 a having an opening larger than the small opening recess 61 a is formed on the first surface 60 corresponding to the frame side pivot 59. In the frame member 41, the second surface 63 parallel to the first surface 60 and opposite to the first surface 60 corresponds to the element side pivot 58 and is similar to the large opening recess 62 a formed in the first surface 60. A large opening recess 62b of the size is formed. Further, a small opening recess 61 b having the same size as the small opening recess 61 a formed in the first surface 60 is formed on the second surface 63 corresponding to the frame side pivot 59.

  The small opening recesses 61a and 61b are dug shallowly from the first surface 60 or the second surface 63, while the large opening recesses 62a and 62b are dug deeply from the second surface 63 or the first surface 60. ing. Accordingly, the element-side pivot 58 is formed as a neck near the first surface 60, and the frame-side pivot 59 is formed as a neck near the second surface 63. For this reason, each arm 53a1 and 53a2 is equivalent to a rigid body arranged in a state inclined with respect to the optical axis AX of the optical element 37 within the range of the thickness of the frame member 41.

  The rigid bodies of the arms 53a1 and 53a2 are arranged in a tangential plane that includes a tangent of a circle centered on the optical axis AX of the optical element 37 and is substantially parallel to a plane parallel to the optical axis AX. Yes. Further, the rigid body of the arm 53a1 and the rigid body of the arm 53a2 are with respect to a radiation plane Pr (that is, a second plane extending in the radial direction of the optical element 37) that includes the optical axis AX of the optical element 37 and is orthogonal to the tangential plane Pt. Are arranged approximately symmetrically.

  As shown in FIG. 3, the lever 54 is disposed between the adjacent link mechanisms 53a, 53b, and 53c, and has a substantially rectangular parallelepiped shape. As shown in FIG. 5, a portion of the first end of the lever 54 adjacent to the inner periphery of the frame member 41 is rotatably connected to the second end of each arm 53a1, 53a2 via a frame side pivot 59. Has been. A portion of the first end portion of the lever 54 adjacent to the outer periphery of the frame member 41 is rotatably connected to the outer ring 52 via a fulcrum pivot 66. The fulcrum pivot 66 is formed by a pair of through holes 67 formed in the frame member 41 and a pair of slits 68 extending from each through hole 67. The fulcrum pivot 66 is arranged on a straight line orthogonal to a straight line connecting the frame side pivot 59 and the element side pivot 58 of each arm 53a1, 53a2.

  FIG. 8 is a cross-sectional view of the frame member 41 taken along a plane orthogonal to the optical axis AX of the optical element 37. As shown in FIG. 8, a support link 55 is connected in the vicinity of the second end of the lever 54. The support link 55 includes a first support link 69 and a second support link 70. The first and second support links 69 and 70 are formed by a plurality of pairs of through holes 71 formed in the frame member 41 and a plurality of slits 72 extending from the through holes 71.

  The first end portion of the first support link 69 is rotatable to the indented portion of the second end portion of the lever 54 via the front end side support pivot 73 formed by the pair of through holes 71 and the pair of slits 72. It is connected. The second end portion of the first support link 69 can rotate to the first end portion of the second support link 70 via an intermediate support pivot 74 formed by the pair of through holes 71 and the pair of slits 72. It is connected to. The second support link 70 is disposed so as to extend in a direction perpendicular to the first support link 69. The front end side support pivot 73, the intermediate support pivot 74, and the fulcrum pivot 66 are aligned on a straight line.

  A second end of the second support link 70 is rotatably connected to the frame member 41 via a base end side support pivot 75 formed by a pair of through holes 71 and a pair of slits 72. The proximal end side support pivot 75 is formed thicker than the distal end side support pivot 73 and the intermediate support pivot 74.

  As shown in FIG. 3, a spring accommodating recess 76 is provided in the vicinity of the second end of the lever 54 on the first surface 60 and the second surface 63 of the frame member 41. In the spring accommodating recess 76, a pair of urging springs 77 that urge the second end of the lever 54 toward the outer ring 52 are stretched between the lever 54 and the outer ring 52.

  As shown in FIG. 2, a pair of fastening portions 40 protrude from the outer peripheral edge of the outer ring 52 at a predetermined interval. A plurality of bolt holes 80 are formed in the fastening portion 40, and a plurality of lens barrel modules 39 a are fastened and stacked using bolts (not shown) using the bolt holes 80. An annular groove 81 is formed in the inner peripheral portion of the fastening portion 40 on the first surface 60 of the frame member 41. The annular groove 81 accommodates a hollow O-ring 81a as a second seal member for maintaining the airtightness inside the lens barrel 39 in a state where a plurality of lens barrel modules 39a are stacked. That is, the hollow O-ring 81a is disposed along a circle centered on the optical axis AX of the optical element 37.

  As shown in FIG. 2, a displacement module mounting hole 83 serving as an opening for accommodating a displacement module 82 constituting an adjustment member and a displacement mechanism is provided on a side surface of the outer ring 52 at a position corresponding to the biasing spring 77. (See FIG. 8) is provided. As shown in FIG. 8, the displacement module 82 includes a displacement rod 84 as a second adjustment component, an adjustment washer 85 having a role as a fine adjustment component, an adjustment button 86 having a role as a coarse adjustment component, And an adjustment base plate 87. The adjustment washer 85 and the adjustment button 86 form a first adjustment part.

  In the displacement module mounting hole 83, a displacement rod housing 89 (cylindrical body) in which an O-ring 88 as a pair of first seal members is mounted is fitted on the outer peripheral surface thereof. The displacement rod 84 is slidably inserted into the displacement rod housing 89 via the first seal member and an O-ring 90 as a seal portion. By these O-rings 88 and 90, the airtightness inside the frame member 41 is maintained. The displacement rod 84 is formed in a substantially cylindrical shape having both planar end faces. A spherical boss 92 is attached in the vicinity of the second end portion of the lever 54 via a stud bolt 91, and the distal end surface of the displacement rod 84 is in contact with the spherical boss 92.

  A support bolt 93 is screwed to the center of the adjustment base plate 87 so as to penetrate the adjustment base plate 87. The tip of the support bolt 93 is inserted into the adjustment washer 85 and the adjustment button 86. The tip of the adjustment button 86 is formed in a substantially spherical shape. The adjustment base plate 87 is attached to the frame member 41 by positioning pins 94, and the distal end of the adjustment button 86 is in contact with the proximal end surface of the displacement rod 84.

  A plurality of adjustment washers 85 having different thicknesses in units of 1 μm are prepared. Also, a plurality of adjustment buttons 86 having different heights in units of 0.1 mm are prepared. From the plurality of adjustment washers 85 and the plurality of adjustment buttons 86, those capable of setting a predetermined displacement amount to the displacement rod 84 are appropriately selected and fitted to the tip of the support bolt 93. Here, the displacement rod 84 is movable along the longitudinal direction of the displacement module mounting hole 83, and the displacement force applied to the lever 54 can be changed by the movement of the displacement rod 84. Here, the displacement force is generated when the displacement rod 84 is moved by replacing the adjustment washer 85 and the adjustment button 86 that are already mounted in the displacement module 82 with another adjustment washer 85 and the adjustment button 86. Hereinafter, it is referred to as “driving force F”. The adjustment button 86 roughly adjusts the driving force F, and the adjustment washer 85 plays a role of finely adjusting the driving force F.

  As shown in FIG. 8, a JU module mounting hole 98 for accommodating a jack-up module (hereinafter referred to as “JU module”) 97 is formed on the side surface of the outer ring 52 adjacent to the displacement module mounting hole 83. ing. The JU module 97 includes a jackup rod (hereinafter referred to as “JU rod”) 99, a jackup housing (hereinafter referred to as “JU housing”) 100, and a position adjusting screw 101.

  The JU rod 99 is slidably inserted into the JU module mounting hole 98 via a plurality of O-rings 102. The O-ring 102 maintains the airtightness inside the frame member 41. The tip of the JU rod 99 has a spherical shape, and when the JU rod 99 is moved toward the lever 54, the tip of the JU rod 99 abuts against the side surface of the lever 54. A screw hole 103 is formed in the JU rod 99 from the base end side along the axis. The base end portion of the JU rod 99 is formed with a detent portion 104 that engages with the inner peripheral surface of the JU module mounting hole 98 and prevents the rotation of the JU rod 99.

  The JU housing 100 includes a holding plate 105 that holds the position adjusting screw 101 and a stop plate 106 that prevents the position adjusting screw 101 from falling off. A stepped accommodation hole 107 is formed at the center of the holding plate 105. The position adjusting screw 101 is rotatably inserted into the holding plate 105 so that the head portion 101 a is accommodated in the step portion 108 of the accommodation hole 107. A wrench hole 101b into which a jig such as a hexagon wrench is engaged is recessed in the head 101a of the position adjusting screw 101. An opening 110 is formed through the central portion of the stopper plate 106. The retaining plate 106 and the holding plate 105 are joined and fixed to the frame member 41 by bolts 109. In this state, the jig can be inserted into the wrench hole 101b through the opening 110. The diameter of the opening 110 is smaller than the diameter of the head 101a of the position adjusting screw 101, and the position adjusting screw 101 is prevented from falling off by fixing the stopper plate 106 to the frame member 41 in a state of being joined to the holding plate 105. Is done.

Therefore, according to the present embodiment, the following effects can be obtained.
(1) In the optical element holding device 38, O-rings 88 and 90 are provided between the displacement module 82 that adjusts the position of the optical element 37 and the frame member 41. For this reason, when the position of the optical element 37 is adjusted, the airtightness inside the frame member 41 can be maintained. Thereby, in the exposure apparatus 31, exposure accuracy can be improved.

  (2) In this optical element holding device 38, the frame member 41 is provided with a fastening portion 40 used for joining with another adjacent frame member 41, and is interposed between the fastening portions 40 of the adjacent frame members 41. A hollow O-ring 81a is provided. For this reason, the airtightness between the laminated frame members 41 can be improved.

  (3) In the optical element holding device 38, the hollow O-ring 81 a is arranged along a circle centered on the optical axis AX of the optical element 37. For this reason, high airtightness can be maintained over the entire circumference of the frame member 41.

  (4) In the optical element holding device 38, the displacement module 82 that applies displacement to the optical element 37 is accommodated in the displacement module attachment hole 83 formed in the frame member 41, and extends along the longitudinal direction of the displacement module attachment hole 83. Can be moved. For this reason, the opening diameter of the displacement module mounting hole 83 can be reduced, and the airtightness of the frame member 41 can be ensured by the small O-ring 88.

  (5) In the optical element holding device 38, the displacement module 82 includes the displacement rod 84, the adjustment button 86, and the adjustment washer 85 that are arranged in the longitudinal direction of the displacement module attachment hole 83. When the adjustment button 86 and the adjustment washer 85 are removed from the displacement module attachment hole 83, the displacement rod 84 is left in the displacement module attachment hole 83. Thus, since the displacement rod 84 is detained in the displacement module mounting hole 83, gas does not flow inside and outside the frame member 41 through the displacement module mounting hole 83. For this reason, even if it removes in order to replace | exchange the adjustment button 86 and the adjustment washer 85, for example by position adjustment of the optical element 37, the airtightness inside the frame member 41 can be maintained.

  (6) In the optical element holding device 38, the O-rings 88 and 90 are disposed between the displacement rod 84 placed in the displacement module mounting hole 83 and the inner peripheral surface of the displacement module mounting hole 83. . For this reason, even if it removes in order to replace | exchange the adjustment button 86 and the adjustment washer 85, the airtightness inside the frame member 41 can be maintained reliably.

  (7) In the optical element holding device 38, the displacement module 82 includes an adjustment button 86 that roughly adjusts the displacement of the optical element 37 and an adjustment washer 85 that finely adjusts the displacement of the optical element 37. For this reason, the position of the optical element 37 in the frame member 41 can be finely adjusted using the adjustment button 86 and the adjustment washer 85.

  (8) In the optical element holding device 38, the displacement module 82 is accommodated inside the displacement rod housing 89 via the O-ring 90, and the displacement rod housing 89 is attached to the frame member 41 via the O-ring 88. I wear it. The presence of the O-ring 90 allows the displacement rod 84 to be displaced by exchanging the adjustment button 86 and the adjustment washer 85 while maintaining the airtightness inside the frame member 41. Further, even if the displacement rod 84 is displaced, the O-ring 88 is not slid, and the durability of the O-ring 88 can be improved.

  (9) In the optical element holding device 38, the hollow O-ring 81a has a hollow structure that is brought into close contact with the entire circumference of the fastening portion 40 and elastically deformed. For this reason, the adhesiveness of the hollow O-ring 81a with respect to the fastening part 40 of each frame member 41 can be improved. Moreover, the hollow O-ring 81a is easily crushed, and when the plurality of lens barrel modules 39a are stacked, the centering operation of each lens barrel module 39a can be easily performed.

  (10) The optical element holding device 38 is provided with a biasing spring 77 for returning the lever 54 for displacing the optical element 37 to a predetermined position when the adjustment button 86 and the adjustment washer 85 are removed. For this reason, in a state in which the adjustment button 86 and the adjustment washer 85 are removed, the lens frame 43 can be disposed at the reference position, and the optical element 37 is stably held.

(Modification)
The embodiment of the present invention may be modified as follows.
In the embodiment, in order to adjust the driving force F in the displacement module 82, the adjustment washer 85 and the adjustment button 86 are appropriately selected, the adjustment washer 85 and the adjustment button 86 are replaced, and the displacement rod 84 is displaced. On the other hand, for example, a micrometer may be provided in the displacement module 82, and the displacement rod 84 may be displaced by the advance and retreat of the micrometer. In this case, the adjustment of the driving force F can be easily performed, and fine adjustment can be easily performed.

  Further, as shown in FIG. 9, an actuator 122 such as a piezo element may be provided in a displacement module 121 that constitutes an adjustment member and a displacement mechanism, and the displacement rod 84 may be displaced by driving the actuator 122. In this case, it is convenient that the attitude control of the optical element 37 can be performed at a remote position by remotely operating the actuator 122. Further, for example, a predetermined control signal based on aberration information obtained during operation of the exposure apparatus 31, an irradiation history of the optical element 37, a change in environmental conditions in which the exposure apparatus 31 is arranged, a change in exposure conditions such as illumination conditions, and the like. With this input, the attitude of the optical element 37 can be controlled to finely correct the aberration. Thereby, the exposure accuracy in the exposure apparatus 31 can be improved and the throughput can be improved by reducing the downtime.

Note that a fluid pressure actuator or the like may be employed as the actuator.
In the embodiment, the optical element holding device 38 may be provided with a sensor that detects the attitude of the optical element 37. In this case, more accurate posture control of the optical element 37 can be performed.

  In particular, when it is necessary to ensure airtightness in the lens barrel 39, an optical window is provided on the outer peripheral surface of the frame member 41, and the scale is attached to the optical element 37 or the lens frame 43 through the optical window. Is preferably an optical encoder type sensor or a capacitance type sensor which can be read by a head arranged outside the lens barrel 39. With this configuration, it is not necessary to arrange the cord connected to the sensor and the sensor substrate in the lens barrel 39, and the inside of the lens barrel 39 can be kept clean.

  -In the said embodiment, the hollow O-ring 81a is provided so that it may press between the fastening parts 40 of the frame member 41 of the lens-barrel module 39a joined mutually. On the other hand, the hollow O-ring 81a may be omitted by processing and finishing the joint surface of the fastening portion 40 with high accuracy. Further, for example, a gasket may be interposed between the joint surfaces of the fastening portion 40, the joint portion of the fastening portion 40 may be covered with a cover, and an O-ring may be disposed between the cover and the outer peripheral surface of the fastening portion 40. .

Further, the O-ring interposed between the fastening portions 40 may have a solid structure.
In the above embodiment, the lens frame 43 may be omitted, and the first ends of the arms 53a1, 53a2, 53b1, 53b2, 53c1, and 53c2 may be directly connected to the support member 42 via the element side pivot 58. Good.

  In the embodiment, O-rings 90 and 88 are interposed between the outer peripheral surface of the displacement rod 84 and the displacement rod housing 89 and between the outer peripheral surface of the displacement rod housing 89 and the inner peripheral surface of the displacement module mounting hole 83. It is disguised. Instead of the O-rings 90 and 88, for example, a magnetic fluid seal may be used. In such a case, since the hysteresis element is eliminated, it is particularly effective in a configuration in which the posture of the optical element 37 is controlled during the operation of the exposure apparatus 31.

  In the above embodiment, the displacement rod 84 is accommodated in the displacement module mounting hole 83 of the frame member 41 in a state of being accommodated in the displacement rod housing 89, but the displacement rod housing 89 is omitted and the displacement rod 84 is directly displaced. You may mount in the module attachment hole 83. FIG.

  In the embodiment, the driving force F is applied to the lever 54 by the movement (translational movement) of the optical element 37 in the radial direction of the displacement rod 84. On the other hand, for example, the displacement rod 84 is rotated, moved in the optical axis direction or other directions, or rotated in the circumferential direction of the frame member 41 to give a driving force to the lever 54. Also good.

In the embodiment, a lens is exemplified as the optical element 37, but the optical element 37 may be another optical element such as a parallel plate, a mirror, or a half mirror.
The optical element holding device 38 according to the present invention is not limited to the holding configuration of the horizontal type optical element 37 in the projection optical system 35 of the exposure apparatus 31 of the above embodiment. For example, the present invention may be embodied in a holding configuration of an optical element in the illumination optical system 33 of the exposure apparatus 31 and a holding configuration of a vertically placed optical element 37. Furthermore, the present invention may be embodied in a configuration for holding an optical element in another optical machine, for example, an optical system such as a microscope or an interferometer.

  In addition, as an exposure apparatus, a contact exposure apparatus that transfers the mask pattern to the substrate by bringing the mask and the substrate into close contact with each other without using a projection optical system, and the mask pattern on the substrate by bringing the mask and the substrate close to each other. The present invention can also be applied to an optical system of a proximity exposure apparatus for transferring. Further, the projection optical system is not limited to the total refraction type, but may be a catadioptric type.

Furthermore, the exposure apparatus of the present invention is not limited to a reduction exposure type exposure apparatus, and may be, for example, an equal magnification exposure type or an enlargement exposure type exposure apparatus.
A glass substrate or silicon wafer from a mother reticle is used to manufacture a reticle or mask used in not only microdevices such as semiconductor elements but also light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, and electron beam exposure apparatuses. The present invention can also be applied to an exposure apparatus that transfers a circuit pattern. For example, in an exposure apparatus using DUV (deep ultraviolet) or VUV (vacuum ultraviolet) light, a transmission type reticle is generally used. As a reticle substrate, quartz glass, quartz glass doped with fluorine, fluorite, magnesium fluoride, Or crystal etc. are used. For example, in a proximity type X-ray exposure apparatus or electron beam exposure apparatus, a transmission mask (stencil mask, member lens mask) is used, and a silicon wafer is used as a mask substrate.

  The present invention can be applied not only to an exposure apparatus used for manufacturing a semiconductor element but also to an exposure apparatus used for manufacturing a display including a liquid crystal display element (LCD) to transfer a device pattern onto a glass plate. it can. The present invention can also be applied to an exposure apparatus that is used for manufacturing a thin film magnetic head and transfers a device pattern to a ceramic wafer, and an exposure apparatus that is used for manufacturing an imaging device such as a CCD.

  Furthermore, the present invention can be applied to a scanning stepper that transfers a mask pattern onto a substrate while the mask and the substrate are relatively moved, and sequentially moves the substrate stepwise. The present invention can also be applied to a step-and-repeat stepper in which the mask pattern is transferred to the substrate while the mask and the substrate are stationary, and the substrate is sequentially moved stepwise.

As a light source of the exposure apparatus, in addition to the ArF excimer laser (193 nm) and the F ₂ laser (157 nm) described in the above embodiment, for example, g line (436 nm), i line (365 nm), KrF excimer laser (248 nm), A Kr ₂ laser (146 nm) or an Ar ₂ laser (126 nm) may be used. Further, an infrared or visible single wavelength laser beam oscillated from a DFB semiconductor laser or a fiber laser is amplified by a fiber amplifier doped with, for example, erbium (or both erbium and ytterbium), and the laser is amplified. You may use as a light source the harmonic which wavelength-converted light into ultraviolet light using the nonlinear optical crystal.

In addition, the exposure apparatus 31 of the said embodiment is manufactured as follows, for example.
That is, first, at least a part of the optical elements 37 such as a plurality of lenses or mirrors constituting the illumination optical system 33 and the projection optical system 35 is held by the optical element holding device 38 of the embodiment or each of the modified examples. The illumination optical system 33 and the projection optical system 35 are incorporated in the main body of the exposure apparatus 31, and optical adjustment is performed. Next, a wafer stage 36 (including a reticle stage 34 in the case of a scan type exposure apparatus) made up of a large number of mechanical parts is attached to the main body of the exposure apparatus 31 to connect wiring. And after connecting the gas supply piping which supplies gas in the optical path of exposure light, further comprehensive adjustment (electric adjustment, operation check, etc.) is performed.

  Each component constituting the optical element holding device 38 is assembled after removing impurities such as processing oil and metal substances by ultrasonic cleaning. The exposure apparatus 31 is preferably manufactured in a clean room in which the temperature, humidity, and atmospheric pressure are controlled and the cleanness is adjusted.

  The example in which fluorite, quartz or the like is used as the glass material in the embodiment has been described, but lithium fluoride, magnesium fluoride, strontium fluoride, lithium-calcium-aluminum-fluoride, and lithium-strontium-aluminum-fluoride. Crystals such as zirconium-barium-lanthanum-aluminum, quartz glass doped with fluorine, quartz glass doped with hydrogen in addition to fluorine, quartz glass containing OH groups, OH in addition to fluorine Improved quartz such as quartz glass containing groups may be used.

Next, an embodiment of a device manufacturing method using the above-described exposure apparatus 31 in a lithography process will be described.
FIG. 10 is a flowchart showing a manufacturing example of a device (for example, a semiconductor element such as an IC or LSI, a liquid crystal display element, an imaging element (for example, CCD), a thin film magnetic head, a micromachine, etc.). As shown in FIG. 10, first, in step S201 (design step), the function and performance design (for example, circuit design of a semiconductor device) of a device (microdevice) is performed, and a pattern design for realizing the function is performed. Do. Subsequently, in step S202 (mask manufacturing step), a mask (such as a reticle Rt) having the designed circuit pattern is manufactured. In step S203 (substrate manufacturing step), a substrate (wafer W in the case of using a silicon material) is manufactured using a material such as silicon or a glass plate.

  Next, in step S204 (substrate processing step), using the mask and substrate prepared in steps S201 to S203, an actual circuit or the like is formed on the substrate by lithography or the like, as will be described later. Next, in step S205 (device assembly step), device assembly is performed using the substrate processed in step S204. This step S205 includes a plurality of processes such as a dicing process, a bonding process, and a packaging process (chip encapsulation or the like) as necessary.

  Finally, in step S206 (inspection step), inspections such as an operation confirmation test and a durability test of the device manufactured in step S205 are performed. After these steps, the device is completed and shipped.

  FIG. 11 is a flowchart showing in detail an example of step S204 of FIG. 10 in the case of a semiconductor device. In FIG. 11, in step S211 (oxidation step), the surface of the wafer W is oxidized. In step S212 (CVD step), an insulating film is formed on the wafer W surface. In step S213 (electrode formation step), an electrode is formed on the wafer W by vapor deposition. In step S214 (ion implantation step), ions are implanted into the wafer W. Each of the above steps S211 to S214 constitutes a pretreatment process at each stage of the wafer processing, and is selected and executed according to a necessary process at each stage.

  At each stage of the wafer process, when the above pre-process is completed, the post-process is executed as follows. In this post-processing process, first, a photosensitive agent is applied to the wafer W in step S215 (resist formation step). Subsequently, in step S216 (exposure step), the circuit pattern of the mask (reticle Rt) is transferred onto the wafer W by the lithography system (exposure apparatus 31) described above. Next, in step S217 (development step), the exposed wafer W is developed, and in step S218 (etching step), the portion of the wafer W other than the portion where the resist remains is removed by etching. In step S219 (resist removal step), the resist that has become unnecessary after the etching is removed.

Multiple circuit patterns are formed on the wafer W by repeatedly performing these pre-processing and post-processing steps.
If the device manufacturing method of this embodiment described above is used, the exposure apparatus 31 is used in the exposure step (step S216), the resolution can be improved by the exposure light EL in the vacuum ultraviolet region, and the exposure amount can be controlled. It can be performed with high accuracy. Therefore, as a result, a highly integrated device having a minimum line width of about 0.1 μm can be produced with a high yield.

Claims (15)

In an optical element holding device comprising a frame member and a holding member that is provided inside the frame member and holds the optical element,
An adjustment member provided on the frame member for adjusting the position of the optical element via the holding member; and a first seal member provided between the adjustment member and the frame member. An optical element holding device.   The frame member is laminated with another frame member and has a joint portion that joins to the other frame member, and the frame member is provided between the other frame member and the joint portion. The optical element holding device according to claim 1, further comprising a second seal member.   The optical element holding device according to claim 2, wherein the second seal member includes an O-ring arranged along a circle centered on the optical axis of the optical element.   The optical element holding device according to claim 3, wherein the O-ring has a hollow structure that is in close contact with the joint and is elastically deformable.   The frame member has an opening, the adjustment member has a displacement mechanism for displacing the position of the optical element, and the displacement mechanism is accommodated in the opening of the frame member in a displaceable manner. The optical element holding device according to any one of claims 1 to 4, wherein the optical element holding device is provided.   The displacement mechanism has a first adjustment component and a second adjustment component arranged side by side in the opening, and the second adjustment when the first adjustment component is removed from the opening. The optical element holding device according to claim 5, wherein a component is placed in the opening.   The first adjustment component is one of a plurality of different first adjustment components, and the displacement amount of the optical element is adjusted by exchanging the first adjustment component. 7. The optical element holding device according to 6.   The optical element holding device according to claim 7, wherein the first seal member is disposed between the second adjustment component and an inner peripheral surface of the opening.   9. The first adjustment component includes a coarse adjustment component that roughly adjusts a displacement amount of the optical element, and a fine adjustment component that finely adjusts the displacement amount of the optical element. Optical element holding device.   The cylindrical body which accommodates the said adjustment member is provided, A said 1st seal member contains the seal | sticker part provided between the said adjustment member and the said cylindrical body, The Claim 1 characterized by the above-mentioned. 9. The optical element holding device according to claim 9.   The optical element holding device according to claim 1, further comprising an urging member that returns the holding member to a predetermined position when at least a part of the displacement mechanism is removed. apparatus. In a lens barrel that houses at least one optical element,
A lens barrel comprising the optical element holding device according to claim 1, which holds at least one of the optical elements.   The lens barrel according to claim 12, wherein the optical element is one of a plurality of optical elements constituting a projection optical system that projects an image of a predetermined pattern formed on a mask onto a substrate. . In an exposure apparatus that transfers an image of a predetermined pattern formed on a mask onto a substrate,
An exposure apparatus comprising: the lens barrel according to claim 13 for transferring an image of the predetermined pattern onto the substrate. In the device manufacturing method,
A device manufacturing method comprising a lithography step of performing exposure using the exposure apparatus according to claim 14.

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