WO2005056269A3 - Verfahren zur herstellung lichtemittierender halbleiterdioden auf einer platine und leuchteinheiten mit integrierter platine - Google Patents
Verfahren zur herstellung lichtemittierender halbleiterdioden auf einer platine und leuchteinheiten mit integrierter platine Download PDFInfo
- Publication number
- WO2005056269A3 WO2005056269A3 PCT/DE2004/002652 DE2004002652W WO2005056269A3 WO 2005056269 A3 WO2005056269 A3 WO 2005056269A3 DE 2004002652 W DE2004002652 W DE 2004002652W WO 2005056269 A3 WO2005056269 A3 WO 2005056269A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light
- circuit board
- printed circuit
- printed
- emitting semiconductor
- Prior art date
Links
- 238000005286 illumination Methods 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 238000002347 injection Methods 0.000 abstract 2
- 239000007924 injection Substances 0.000 abstract 2
- 239000012815 thermoplastic material Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0046—Details relating to the filling pattern or flow paths or flow characteristics of moulding material in the mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
- B29C2045/14327—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles anchoring by forcing the material to pass through a hole in the article
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14836—Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/582,311 US20070117248A1 (en) | 2003-12-09 | 2004-12-03 | Method for the production of light-emitting semiconductor diodes |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10357818A DE10357818B4 (de) | 2003-12-09 | 2003-12-09 | Verfahren zur Herstellung lichtemittierender Halbleiterdioden auf einer Platine |
DE10357818.8 | 2003-12-09 | ||
DE102004033533.8 | 2004-07-09 | ||
DE200410033533 DE102004033533B4 (de) | 2004-07-09 | 2004-07-09 | Leuchteinheit mit integrierter Platine |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005056269A2 WO2005056269A2 (de) | 2005-06-23 |
WO2005056269A3 true WO2005056269A3 (de) | 2005-11-10 |
Family
ID=34680022
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2004/002652 WO2005056269A2 (de) | 2003-12-09 | 2004-12-03 | Verfahren zur herstellung lichtemittierender halbleiterdioden auf einer platine und leuchteinheiten mit integrierter platine |
Country Status (3)
Country | Link |
---|---|
US (1) | US20070117248A1 (de) |
TW (1) | TW200525786A (de) |
WO (1) | WO2005056269A2 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100789951B1 (ko) | 2006-06-09 | 2008-01-03 | 엘지전자 주식회사 | 발광 유닛 제작 장치 및 방법 |
US7909482B2 (en) | 2006-08-21 | 2011-03-22 | Innotec Corporation | Electrical device having boardless electrical component mounting arrangement |
US8408773B2 (en) * | 2007-03-19 | 2013-04-02 | Innotec Corporation | Light for vehicles |
WO2009076579A2 (en) | 2007-12-12 | 2009-06-18 | Innotec Corporation | Overmolded circuit board and method |
EP2480817B1 (de) * | 2009-12-04 | 2017-04-19 | OSRAM GmbH | Led-beleuchtungsmodul mit angeformten metallkontakten |
CN102412345A (zh) * | 2010-09-23 | 2012-04-11 | 展晶科技(深圳)有限公司 | 发光二极管封装结构及其制造方法 |
US9022631B2 (en) | 2012-06-13 | 2015-05-05 | Innotec Corp. | Flexible light pipe |
FR3065276B1 (fr) * | 2017-04-12 | 2019-11-29 | Valeo Vision | Surmoulage d’un element optique sur un cadre thermoplastique |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS611067A (ja) * | 1984-06-13 | 1986-01-07 | Stanley Electric Co Ltd | プリント基板に装着されたledチツプのモ−ルド方法 |
JPH0249478A (ja) * | 1988-05-31 | 1990-02-19 | Iwasaki Electric Co Ltd | 光ファイバ用半導体発光装置 |
JPH0563239A (ja) * | 1991-08-29 | 1993-03-12 | Mitsubishi Cable Ind Ltd | Led表示装置 |
JPH05109788A (ja) * | 1991-06-04 | 1993-04-30 | Rohm Co Ltd | ダイボンデイング装置 |
JPH0653258A (ja) * | 1992-07-29 | 1994-02-25 | Mitsubishi Cable Ind Ltd | 表示装置の製造方法 |
JPH06334224A (ja) * | 1993-05-24 | 1994-12-02 | Mitsubishi Cable Ind Ltd | Led照明具の製造方法 |
EP0632511A2 (de) * | 1993-06-29 | 1995-01-04 | MITSUBISHI CABLE INDUSTRIES, Ltd. | Lichtemittierende Diodenanordnung und Herstellungsverfahren |
JPH0730152A (ja) * | 1993-07-09 | 1995-01-31 | Mitsubishi Cable Ind Ltd | 基板に実装された電子部品のモールド方法およびそのモールド用基板構造 |
JP2001168122A (ja) * | 1999-12-03 | 2001-06-22 | Matsushita Electronics Industry Corp | 電子部品実装モジュールの製造方法および電子部品実装モジュール |
JP2003008065A (ja) * | 2001-06-21 | 2003-01-10 | Citizen Electronics Co Ltd | Smd型光素子モジュールの製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4242842C2 (de) * | 1992-02-14 | 1999-11-04 | Sharp Kk | Lichtemittierendes Bauelement zur Oberflächenmontage und Verfahren zu dessen Herstellung |
DE19612388C2 (de) * | 1996-03-28 | 1999-11-04 | Siemens Ag | Integrierte Halbleiterschaltung insb. optoelektronisches Bauelement mit Überspannungsschutz |
DE19638667C2 (de) * | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
DE10243247A1 (de) * | 2002-09-17 | 2004-04-01 | Osram Opto Semiconductors Gmbh | Leadframe-basiertes Bauelement-Gehäuse, Leadframe-Band, oberflächenmontierbares elektronisches Bauelement und Verfahren zur Herstellung |
-
2004
- 2004-12-03 WO PCT/DE2004/002652 patent/WO2005056269A2/de active Application Filing
- 2004-12-03 US US10/582,311 patent/US20070117248A1/en not_active Abandoned
- 2004-12-09 TW TW093138197A patent/TW200525786A/zh unknown
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS611067A (ja) * | 1984-06-13 | 1986-01-07 | Stanley Electric Co Ltd | プリント基板に装着されたledチツプのモ−ルド方法 |
JPH0249478A (ja) * | 1988-05-31 | 1990-02-19 | Iwasaki Electric Co Ltd | 光ファイバ用半導体発光装置 |
JPH05109788A (ja) * | 1991-06-04 | 1993-04-30 | Rohm Co Ltd | ダイボンデイング装置 |
JPH0563239A (ja) * | 1991-08-29 | 1993-03-12 | Mitsubishi Cable Ind Ltd | Led表示装置 |
JPH0653258A (ja) * | 1992-07-29 | 1994-02-25 | Mitsubishi Cable Ind Ltd | 表示装置の製造方法 |
JPH06334224A (ja) * | 1993-05-24 | 1994-12-02 | Mitsubishi Cable Ind Ltd | Led照明具の製造方法 |
EP0632511A2 (de) * | 1993-06-29 | 1995-01-04 | MITSUBISHI CABLE INDUSTRIES, Ltd. | Lichtemittierende Diodenanordnung und Herstellungsverfahren |
JPH0730152A (ja) * | 1993-07-09 | 1995-01-31 | Mitsubishi Cable Ind Ltd | 基板に実装された電子部品のモールド方法およびそのモールド用基板構造 |
JP2001168122A (ja) * | 1999-12-03 | 2001-06-22 | Matsushita Electronics Industry Corp | 電子部品実装モジュールの製造方法および電子部品実装モジュール |
JP2003008065A (ja) * | 2001-06-21 | 2003-01-10 | Citizen Electronics Co Ltd | Smd型光素子モジュールの製造方法 |
Non-Patent Citations (9)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 010, no. 137 (E - 405) 21 May 1986 (1986-05-21) * |
PATENT ABSTRACTS OF JAPAN vol. 014, no. 213 (E - 0923) 7 May 1990 (1990-05-07) * |
PATENT ABSTRACTS OF JAPAN vol. 017, no. 378 (E - 1398) 15 July 1993 (1993-07-15) * |
PATENT ABSTRACTS OF JAPAN vol. 017, no. 463 (E - 1420) 24 August 1993 (1993-08-24) * |
PATENT ABSTRACTS OF JAPAN vol. 018, no. 277 (E - 1554) 26 May 1994 (1994-05-26) * |
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 03 28 April 1995 (1995-04-28) * |
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 04 31 May 1995 (1995-05-31) * |
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 23 10 February 2001 (2001-02-10) * |
PATENT ABSTRACTS OF JAPAN vol. 2003, no. 05 12 May 2003 (2003-05-12) * |
Also Published As
Publication number | Publication date |
---|---|
WO2005056269A2 (de) | 2005-06-23 |
TW200525786A (en) | 2005-08-01 |
US20070117248A1 (en) | 2007-05-24 |
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