WO2005055693A2 - Procede et appareil de formation continue d'une feuille uniforme a utiliser en tant que tampon de polissage semi-conducteur - Google Patents

Procede et appareil de formation continue d'une feuille uniforme a utiliser en tant que tampon de polissage semi-conducteur Download PDF

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Publication number
WO2005055693A2
WO2005055693A2 PCT/US2004/039322 US2004039322W WO2005055693A2 WO 2005055693 A2 WO2005055693 A2 WO 2005055693A2 US 2004039322 W US2004039322 W US 2004039322W WO 2005055693 A2 WO2005055693 A2 WO 2005055693A2
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WO
WIPO (PCT)
Prior art keywords
belts
sheet
precursor
temperature
thickness
Prior art date
Application number
PCT/US2004/039322
Other languages
English (en)
Other versions
WO2005055693A3 (fr
Inventor
Joseph Schneider
Oscar Hsu
Volker Wilheim
Greg Watka
Lothar Hackler
Original Assignee
Freudenberg Nonwovens, L.P.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Freudenberg Nonwovens, L.P. filed Critical Freudenberg Nonwovens, L.P.
Priority to JP2006542628A priority Critical patent/JP2007512984A/ja
Priority to EP04816977A priority patent/EP1689574A2/fr
Priority to CA002548083A priority patent/CA2548083A1/fr
Publication of WO2005055693A2 publication Critical patent/WO2005055693A2/fr
Publication of WO2005055693A3 publication Critical patent/WO2005055693A3/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B7/00—Mixing; Kneading
    • B29B7/30—Mixing; Kneading continuous, with mechanical mixing or kneading devices
    • B29B7/32—Mixing; Kneading continuous, with mechanical mixing or kneading devices with non-movable mixing or kneading devices
    • B29B7/325—Static mixers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B7/00—Mixing; Kneading
    • B29B7/30—Mixing; Kneading continuous, with mechanical mixing or kneading devices
    • B29B7/34—Mixing; Kneading continuous, with mechanical mixing or kneading devices with movable mixing or kneading devices
    • B29B7/38—Mixing; Kneading continuous, with mechanical mixing or kneading devices with movable mixing or kneading devices rotary
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/22—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of indefinite length
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
    • B29C67/24—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
    • B29C67/246—Moulding high reactive monomers or prepolymers, e.g. by reaction injection moulding [RIM], liquid injection moulding [LIM]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2075/00—Use of PU, i.e. polyureas or polyurethanes or derivatives thereof, as moulding material

Definitions

  • the present invention relates to the field of making polishing pads used in polishing and planarization, and especially in chemical-mechanical planarization (CMP) of electronic devices such as integrated circuits, semiconductors, hard disks, magnetic recording heads and silicon wafers, etc., and more specifically to a continuous process for producing a highly efficient polishing pad of uniform thickness.
  • CMP chemical-mechanical planarization
  • a conformal layer of silicon dioxide may cover a metal interconnect such that the upper surface of the layer is characterized by a series of non-planar steps corresponding in height and width to the underlying metal interconnects.
  • CMP chemical mechanical planarization
  • VLSI very large scale integration
  • ULSI ultra large scale integration
  • etching techniques are used to planarize conductive (metals) and insulator surfaces.
  • the various metal interconnects are formed through lithographic or damascene processes. For example, in a lithographic process, a first blanket metal layer is deposited on a first insulating layer, following which electrical lines are formed by subtractive etching through a first mask. A second layer is placed over the first metalized layer, and holes are patterned into the second insulating layer using a second mask.
  • Metal columns or plugs are formed by filling the holes with metal.
  • a second blanket metal layer is formed over the second insulating layer, the plugs electrically connecting the first and second metal layers.
  • the second metal layer is masked and etched to form a second set of electrical lines. This process is repeated as required to generate the desired device.
  • the damascene technique is described in Untied Stated Patent No. 4,789,648, to Chow, et al.
  • VLSI uses aluminum for the wiring and tungsten for the plugs because of their susceptibility to etching.
  • the resistively of copper is superior to either aluminum or tungsten, making its use desirable, however copper does not have desirable properties with respect to etching.
  • Variations in the height of the upper surface of the intermetal dielectric layer have several undesirable characteristics.
  • the depth of focus of subsequent photolithographic processing steps may be degraded by non-planar dielectric surfaces. Loss of the depth of focus lowers the resolution at which lines may be printed.
  • the coverage of a second layer over the dielectric layer may be incomplete, leading to open circuits.
  • methods have been evolved to planarize the upper surface of the metal and dielectric layers.
  • One such technique is chemical-mechanical planarization or polishing (CMP) using an abrasive polishing agent worked by a rotating pad.
  • CMP chemical-mechanical planarization or polishing
  • a chemical-mechanical polishing method is described in United States Patent No. 4,944,836, to Beyer, et al.
  • polishing pads are made of a relatively soft and flexible material, such as non-woven fibers interconnected together by a relatively small amount of polyurethane adhesive binder, or may comprise laminated layers with variations of physical properties throughout the thickness of the pad.
  • Multilayer pads generally have a flexible top polishing layer backed by a layer of stiffer material.
  • Polishing pads may also be made of a uniform material such as a polyurethane composition which is typically formed by placing reactive precursors in a closed mold and allowing the precursors to react and cure to form the pad material. Subsequently, the pad material may be die-cut to size and shape and the top surface conditioned to form the polishing pad.
  • the reactive precursors may be placed in a cylindrical container to form a log or loaf from which slices may be cut that may be subsequently used as a polishing pad.
  • the formed polishing pads may also be further modified by annealing, pressing, embossing, casting, sintering or photolithographic processes.
  • the aforementioned processes are typically batch processes where one pad or sheet of material is produced in step function followed by another pad. This method usually results in pad to pad or sheet to sheet variability of both physico-chemical and/or morphological properties and dimensions. Variability in these properties and/or dimensions of the polishing pads leads to non-uniformity and defects in polishing, and CMP of electronic devices in particular.
  • thermoplastic sintering method as one "that applies minimal or no pressure beyond atmospheric pressure to achieve the desired pore size, porosity and density and thickness of the substrate".
  • the present invention relates to a continuous process for making polishing pads, which are particularly useful for chemical-mechanical planarization (CMP).
  • CMP chemical-mechanical planarization
  • the process of this invention comprises a two step approach which utilizes a series of networked process control and feedback loops to ensure uniformity in sheet surface and thickness resulting in efficient, continuous production of a highly uniform polishing pad in both properties and dimensions.
  • a first step one or more high viscosity liquid precursor polymers are mixed with one or more fillers under vacuum and controlled temperature, to yield a liquid mixture having a controlled viscosity and consistency.
  • the liquid polymers contain functional groups which are chemically active.
  • Such chemically active polymers encompass the realm of monomers, oligomers, pre-polymers and high molecular weight polymers of organic and inorganic origin.
  • various modifiers such as thickening or thinning agents, colorants, UV and heat stabilizers, surface tension modifiers (surfactants) etc. may be added into the mix.
  • a hardening or curing agent is dispersed uniformity into the polymer mix to chemically react with the liquid polymers.
  • the amount of the hardening or curing agent is precisely controlled at a specified ratio to the polymer mix to achieve the desired product properties.
  • the temperature and viscosity of the reactant mixture as well as the ambient pressure and atmosphere are precisely controlled to a pre-determined specification.
  • a high vacuum no less than 28 in. of water may be applied during the entire mixing process, and nitrogen gas may be used to 'blanket' the mix if it has to be stored for an extended period of time.
  • the reactive mix may then be dispensed into a preset gap space formed between a vertically stacked pair of endless steel belts with heaters on the back of one or both belts, accompanied by feedback control of such parameters as conveyor speed, belt pressure, temperature and belt gap to form a uniform sheet. Subsequently, the sheet may be cut to length, post cured in an oven and die cut to form the polishing pads of the present invention.
  • FIG. 1 is a block diagram of the general features of the continuous process of the present invention.
  • FIG. 2 is a simplified schematic view of the apparatus for continuous manufacture of a polishing pad of the present invention.
  • Description of Preferred Embodiments The present invention is directed at a high volume essentially continuous manufacturing process for forming polishing pads to be used for chemical-mechanical polishing.
  • One key to the process are numerous networked process controls which are used to monitor and feed back information in real time as the product is being produced.
  • the manufacturing process of the present invention comprises two basic steps: Step A, the compounding of the preferable high viscosity liquid polymer precursor and Step B, the continuous dispensing and sheet formation of the liquid polymer precursor mixed with a hardening agent. Subsequently, the sheet material may be cut to length, postcured to establish optimal properties and cut to shape to form polishing pads.
  • step A the compounding step, a highly viscous mixture of liquid polymer, preferably polyurethane is first equilibrated under vacuum and elevated temperature for several hours.
  • Examples of such sources of polymers are the Adiprene Polyurethane Pre-polymer offered by the Crompton Corporation, and the Airthane Polyurethane Pre-polymer from Air Products, respectively. Any required additives such as antifoaming agent, UV and heat stabilizers, surface tension modifiers, etc. are also blended uniformity into the polymer mix. Any required organic or inorganic filler materials, soluble or insoluble, and in various particulate configurations and sizes are then added preferably under vacuum or a blanket of nitrogen gas and dispersed uniformity within the mix. Again the temperature, viscosity of the entire mixture, the vacuum or ambient nitrogen (in the headspace of the mixing vessel) are kept precisely controlled throughout the mixing, storing and subsequent operations.
  • a filler component may also optionally be included, preferably the hollow Expancel® microspheres from Expancel, Inc. having diameters from 20 to 90 microns, at a level of about 1-5 wt. percent, and preferably at 3 wt. percent of the formulation.
  • the dry filler component preferably has a specific weight of from about 0.03 to about 0.12 grams per cubic centimeter.
  • One purpose of the dry filler component is to provide a porous surface on the polishing pad after it is conditioned for use.
  • the conditioning of the surface of the pad by abrading its top surface removes a thin layer of reacted polymer and breaks the microspheres at the surface providing a controlled level of porosity.
  • other materials may be used as the filler component to provide specific abrasive or porous properties of the polishing pad, and include, but are not limited to, water soluble fibers and soluble products such as salts that may be washed out after surface buffing to create a porous surface, particulate or powder polymers, etc.
  • the homogenous liquid precursor compounded in Step A preferably has a specific weight from about 0.50 to about 1.2 grams per cubic centimeter and is stored for use in the continuous process phase (Step B) at 25 - 40 degrees C.
  • Step B is shown in simplified schematic representation in FIG. 2.
  • the liquid polymer precursor comprising, preferably, a blend of polyurethane pre-polymers with an additive(s) and filler components dispersed therein, can be pumped or gravity fed to a continuously replenished feed tank 10 which is preferably maintained under vacuum conditions or inert gas (e.g. nitrogen) and preferably at about 20 - 40 degrees C.
  • a hardening or curing agent for example (MOCA or Ethacure), can be stored in an ambient or nitrogen blanketed tank 20.
  • the curing agent and the liquid polymer precursor are precisely metered by Coriolis mass flow regulations 12, 22 and pumped into, preferably, a continuous static or a dynamic mixer 30.
  • the stoichiometric ratio of the curing agent to the polyurethane precursor is preferably between 0.85 to 1.05. This ratio and set of processing conditions preferably provides a viscosity of the mixture in the range of 20,000 - 400,000 Pascal seconds.
  • Dynamic or mechanical mixers may be used providing that minimal air is introduced.
  • the reacting composition 32 is uniformly fed into the feed end 42 of a double steel belt press 40.
  • the feed end of the double belt press as well as the double belt press itself is preferably kept under an atmospherically controlled chamber 60 at uniform temperature and pressure prior to the compressed heated zones and to ensure a more efficient polymerization during heating.
  • the double belt press 40 will generally comprise two endless steel belts driven over rollers revolving in opposing directions, with mutually facing outer sides thereof pressed against material passed there between. Heating can be accomplished by means of one or more temperature controlled press plates, pressure chambers or IR heaters at the back sides of the compressed areas.
  • the steel belts which form the top and bottom surface of the continuously molded urethane sheet can be heated and maintained preferably at 80-110 degrees C to provide polymerization of the urethane into a solid compound under isobaric conditions.
  • the pressing zone 44 is formed between mutually opposing outer sides of the pressing belts.
  • the endless belts are preferably of stainless steel and can be maintained at a precisely controlled pressure level preferably about 4 MPa (550 - 600 psi) although in the broad context of the present invention, the pressure may range from 1-10 MPa (145 psi - 1450 psi).
  • the pressure may be generated by the weight of the upper unit plates of the endless belt and/or by mechanical or hydraulic means.
  • the sheet As the molded sheet moves between the opposing steel belts, the sheet is compressed, over a distance of preferably about 4.5 meters at 44, to its final thickness and solidified by the heat provided from the heated belts.
  • the curing process can be initiated by the exothermic heat of reaction of the urethane and amine components and by the heat from the endless belts.
  • the process to form a continuous uniform sheet may be fully PLC controlled with interactive information exchange between mechanical components, each having built-in tools for process control, data trending and process enhancements. All liquid as well as solid raw material components are monitored as to precise temperature and viscosity, and dosed for compounding and mixing.
  • the system preferably uses a fast communication protocol -PROFIBUS- to monitor and control all system components.
  • the system is set up for easy operator control and interface, via touch screens, to monitor and adjust process parameters.
  • An in-line, real-time testing and inspection metrology equipment for monitoring material properties such as thickness, density, hardness, compressibility and surface roughness, as well as inspection with an imaging system for contaminants, can be fully integrated.
  • the system also incorporates online continuous data storage, statistical analysis, trending and CRT display as well as operator alert on process excursions.
  • the belt press 40 can produce a continuous urethane sheet 32A having a uniform density of preferably less than 1.0 g/cc due to the process controls in use. Density variation measured on a square yard is less than 2.0 percent. Thickness of the sheet is controlled by micrometer adjustment at 50 to +/- 0.05mm.
  • the nominal thickness of the sheet 32A formed as described above, may preferably be between 1mm to 3mm or higher.
  • the resulting urethane sheet 32A is discharged from the belt press 40 at the takeoff end and is cut to length using preferably a roller blade cutter at 62. Other types of cutters may also be used.
  • the cut to length sheets 32B are next stacked at 70 and transferred to an oven 80 for post curing for preferably 16-24 hours at a temperature specified for a given type of urethane and curing agent, said temperature typically varies from 150 to 450 degree F.
  • the cured urethane sheets can be subsequently cooled to ambient temperature under controlled cooling rates, tested and inspected again, and buffed or napped to remove any surface polymeric 'skin' to expose the bulk structure of the sheet.
  • the buffing or napping is also designed and controlled to impart a pre-determined micro texture to the urethane sheet surface which reduces the 'break-in' time in end-use polishing applications.
  • the preferred material composition to continuously produce polishing pads of the present invention is a blend of liquids with filler(s)
  • other material precursor compositions may also be processed through the apparatus of the present invention, including, but not limited to, dry polymers, powders and other solid compounds and fillers, both soluble and insoluble. The incorporation of these materials may require corresponding change in processing temperature and other parameter. Table I lists some properties of the polishing pads contemplated and targeted for manufacture by the continuous process of the present invention.
  • Thickness 10 - 130 mils; preferably 50 - 100 mils Density: 0.3 - 1.2 g/cc; preferably 0.5 - 0.9 g/cc Pore Size distribution: 20 - 100 micrometers; preferably 20 - 60 micrometers Pore or Void Volume: 15 - 60 % of total volume; preferably 20 - 40 % of total volume Hardness: 30 - 80 Durometer Shore D; preferably 45 - 75 Durometer Shore D Compressibility: 0 - 10 %; preferably 0 - 4 %
  • edge and bulk waviness are ⁇ 0.5" it corresponds to a 1 meter by 1 meter area of the pad that does not indicate, when laying flat, an upward deflection or wave in the pad that exceeds 0.5", and is preferably ⁇ 0.1". Due to the scale and nature of this continuous process, variations in the composition and properties of the finished product will be minimized.
  • the raw materials can be blended in large quantities to provide a recirculating feed system that continuously supplies the mixer. These materials can therefore be blended under precise process control of temperature, vacuum, ratio and viscosity.
  • the continuous nature of the sheet forming process enables precise control for producing a uniform sheet as process controls monitor and feed back data regarding feed temperature, belt temperature, pressure, feed rate, conveyor speed, sheet thickness and density.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

L'invention concerne un procédé et un appareil permettant de fabriquer en continu une feuille de polyuréthanne à utiliser en tant que tampons de polissage, notamment, de polissage chimico-mécanique. Ledit processus consiste à commander avec précision le traitement de paramètres de manière à engendrer un mélange polymère, le mélange avec un durcisseur, la dispersion du mélange dans l'extrémité d'amenée d'un filtre à bande presseuse double et la solidification du mélange afin de former une feuille polymère. Cette feuille peut être ensuite découpée à une certaine taille et la surface supérieure conditionnée pour former un tampon de polissage. Ce procédé est, notamment, approprié à la fabrication à grand débit d'un produit consistant, la consistance dudit produit possédant un effet direct sur l'efficacité du polissage.
PCT/US2004/039322 2003-12-05 2004-11-18 Procede et appareil de formation continue d'une feuille uniforme a utiliser en tant que tampon de polissage semi-conducteur WO2005055693A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006542628A JP2007512984A (ja) 2003-12-05 2004-11-18 半導体用研磨パッドとして用いられる均一なシートを連続的に形成する工程及び装置
EP04816977A EP1689574A2 (fr) 2003-12-05 2004-11-18 Procede et appareil de formation continue d'une feuille uniforme a utiliser en tant que tampon de polissage semi-conducteur
CA002548083A CA2548083A1 (fr) 2003-12-05 2004-11-18 Procede et appareil de formation continue d'une feuille uniforme a utiliser en tant que tampon de polissage semi-conducteur

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US52750703P 2003-12-05 2003-12-05
US60/527,507 2003-12-05

Publications (2)

Publication Number Publication Date
WO2005055693A2 true WO2005055693A2 (fr) 2005-06-23
WO2005055693A3 WO2005055693A3 (fr) 2005-08-04

Family

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PCT/US2004/039322 WO2005055693A2 (fr) 2003-12-05 2004-11-18 Procede et appareil de formation continue d'une feuille uniforme a utiliser en tant que tampon de polissage semi-conducteur

Country Status (5)

Country Link
EP (1) EP1689574A2 (fr)
JP (1) JP2007512984A (fr)
CN (1) CN1946539A (fr)
CA (1) CA2548083A1 (fr)
WO (1) WO2005055693A2 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2383097A1 (fr) * 2010-04-30 2011-11-02 KraussMaffei Technologies GmbH Dispositif pour la fabrication d'un matériau composite
US8167690B2 (en) 2006-09-08 2012-05-01 Toyo Tire & Rubber Co., Ltd. Polishing pad
US8257153B2 (en) 2007-01-15 2012-09-04 Toyo Tire & Rubber Co., Ltd. Polishing pad and a method for manufacturing the same
US8318298B2 (en) 2005-07-15 2012-11-27 Toyo Tire & Rubber Co., Ltd. Layered sheets and processes for producing the same
US8476328B2 (en) 2008-03-12 2013-07-02 Toyo Tire & Rubber Co., Ltd Polishing pad

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4884726B2 (ja) 2005-08-30 2012-02-29 東洋ゴム工業株式会社 積層研磨パッドの製造方法
CN102211319B (zh) * 2010-04-08 2014-06-11 三芳化学工业股份有限公司 制造抛光垫的方法和抛光垫
CN102285189B (zh) * 2011-06-15 2014-09-17 上海大唐盛隆制冷科技有限公司 钢带式聚氨酯连续层压机
CN103831745B (zh) * 2014-03-10 2017-01-18 南京宏盛毛毡制品有限公司 一种玻璃抛光轮自动卷筒机
US20180147688A1 (en) * 2016-11-30 2018-05-31 Dow Global Technologies Llc Airless atomizing methods for making chemical mechanical planarization (cmp) polishing pads
WO2023145933A1 (fr) * 2022-01-31 2023-08-03 株式会社クラレ Procédé de fabrication d'une feuille de résine à l'aide d'une imprimante 3d, et tampon de polissage ayant une couche de polissage ainsi obtenue

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US4128369A (en) * 1975-12-10 1978-12-05 Hazelett Strip-Casting Corporation Continuous apparatus for forming products from thermoplastic polymeric material having three-dimensional patterns and surface textures
US6428586B1 (en) * 1999-12-14 2002-08-06 Rodel Holdings Inc. Method of manufacturing a polymer or polymer/composite polishing pad

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JPS52128958A (en) * 1976-04-22 1977-10-28 Kuraray Co Method of producing opposed belt continuous cast plate
JPS63161807A (ja) * 1986-12-24 1988-07-05 株式会社日本可鍛鋳鉄所 活線用引留クランプ
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JP3558273B2 (ja) * 1999-09-22 2004-08-25 東洋ゴム工業株式会社 ポリウレタン発泡体の製造方法及び研磨シート
JP3452265B1 (ja) * 2002-12-10 2003-09-29 東洋紡績株式会社 研磨シート用高分子材料、研磨シート、及び研磨パッド

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Publication number Priority date Publication date Assignee Title
US4128369A (en) * 1975-12-10 1978-12-05 Hazelett Strip-Casting Corporation Continuous apparatus for forming products from thermoplastic polymeric material having three-dimensional patterns and surface textures
US6428586B1 (en) * 1999-12-14 2002-08-06 Rodel Holdings Inc. Method of manufacturing a polymer or polymer/composite polishing pad

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8318298B2 (en) 2005-07-15 2012-11-27 Toyo Tire & Rubber Co., Ltd. Layered sheets and processes for producing the same
US8167690B2 (en) 2006-09-08 2012-05-01 Toyo Tire & Rubber Co., Ltd. Polishing pad
US8257153B2 (en) 2007-01-15 2012-09-04 Toyo Tire & Rubber Co., Ltd. Polishing pad and a method for manufacturing the same
US8476328B2 (en) 2008-03-12 2013-07-02 Toyo Tire & Rubber Co., Ltd Polishing pad
EP2383097A1 (fr) * 2010-04-30 2011-11-02 KraussMaffei Technologies GmbH Dispositif pour la fabrication d'un matériau composite

Also Published As

Publication number Publication date
CN1946539A (zh) 2007-04-11
EP1689574A2 (fr) 2006-08-16
WO2005055693A3 (fr) 2005-08-04
CA2548083A1 (fr) 2005-06-23
JP2007512984A (ja) 2007-05-24

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