WO2005013366A1 - Heatsinking electronic devices - Google Patents
Heatsinking electronic devices Download PDFInfo
- Publication number
- WO2005013366A1 WO2005013366A1 PCT/US2004/023438 US2004023438W WO2005013366A1 WO 2005013366 A1 WO2005013366 A1 WO 2005013366A1 US 2004023438 W US2004023438 W US 2004023438W WO 2005013366 A1 WO2005013366 A1 WO 2005013366A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wiring board
- heatsink
- leads
- assembly
- electrical
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Definitions
- the present invention generally relates to improved heatsmking of electronic devices, and more particularly to heatsmking of relatively high power dissipation electronic devices having surface mount package configurations or equivalent.
- FIG. 1A is a top view
- FIG. IB is a side view of high power light emitting diode (LED) 10 having surface mount package 12.
- LED 10 in package 12 has electrical leads or contacts 14-17 protruding laterally from sides 18-19 of LED package 12.
- Leads 14-15 of package 12 are formed downward and outward so that foot portions 20, 21 of leads 14, 15 are approximately parallel to base 22 of package 12.
- LED 10 conveniently emits light through lens 24 opposite to package base 22, but this is not essential.
- device 10 is identified herein as an LED, this is merely for convenience of description and not intended to be limiting.
- the problem described herein and the present invention apply to any type of electronic device having a generally surface mount lead configuration and substantially planar lower surface for contacting a heat sink.
- FIGS. 2A-B are partial cross-sectional views illustrating prior art arrangements for providing thermal contact to base 22 of package 12.
- device 10 is surface mounted on wiring board 26 by, for example, soldering leads 14, 15 to electrical contact regions (not shown) on upper surface 25 of wiring board 26.
- Wiring board 26 is often referred to as a "printed circuit board” (PCB) or “printed wiring board” (PWB).
- PCB printed circuit board
- PWB printed wiring board
- PWBs generally have a core of insulating material (e.g., plastic impregnated fiberglass) on which copper (or other highly conductive metal) foil "wires" have been formed, including the contact regions on surface 25 to which leads 14, 15 of device 10 are to be soldered.
- PWBs are well known in the art.
- the conductive metal leads and contact regions present on PWB 26 have been omitted in FIGS. 2A- B.
- PWB 26 in FIGS.2A-B and PWB 42 in FIGS. 3A-B, 4) have such conductive leads and contacts in locations appropriate to the circuit being implemented and the location of the devices being placed thereon.
- the insulating core of the PWB is generally a poor thermal conductor. For this reason, even though lower surface 27 of PWB 26 is in contact with upper surface 32 of heatsink 30, PWB 26 does not contribute greatly to heat disipation from device 10. Accordingly, it has been common in the prior art to provide metal insert regions 28 that act as thermal vias, underlying base 22 of package 12. These metal inserts or thermal vias (the terms are used interchangeably herein) reduce the thermal impedance between package base 22 and heatsink 30. It is common in the prior art to use a thermally conductive grease or adhesive between base 22 and thermal vias 28 and also between thermal vias 28 and heatsink 32.
- An adhesive provides the best heat conduction but prevents or greatly hinders replacement of defective LEDs and adds to the manufacturing cost of the assembly of FIG. 2A.
- Metal insert regions 28 are often formed by plating but other methods can also be used. A further disadvantage of the arrangement of FIG. 2A is that forming metal insert regions 28 is costly.
- FIG. 2B is a cross-sectional view similar to FIG. 2A but showing a different arrangement used in the prior art for providing heat sinking of device 10.
- heatsink 30' is provided with pillar 33 which makes direct contact at surface 32' with base 22 of device 10. While this arrangement generally provides good thermal contact to device 10, heatsink 30' must be machine to have pillar(s) 33 in the correct location(s) to match hole(s) 29 in the location(s) of device(s) 10. This can be very costly since, in general, standard heatsinks cannot be used and must be custom machined for each PWB configuration. This is a significant disadvantage, especially where the PWB contains a large number of high power dissipation devices.
- An apparatus for thermally coupling one or more electronic devices to a heatsink.
- the apparatus comprises: an electronic device having a top, a bottom and electrical leads; a heatsink; and a wiring board with a through-hole for receiving the device such that its bottom is in thermal contact with the heatsink and its top protrudes through the PWB and its leads are captured between at least a portion of the wiring board and the heatsink.
- a method for thermally coupling one or more electronic devices to a heatsink comprises placing the device in the through-hole in the PWB with its base surface protruding from the underside of the PWB, attaching its electical leads to contacts on the PWB and pressing the PWB toward the heatsink with the device electrical leads captured there between.
- An electrically insulating thermally conducting layer is desirably placed between the wiring board and the heatsink.
- FIG. 1A is a top view and FIG. IB is a side view of a present day, high power dissipation electronic device intended for surface mounting on a wiring board or the like;
- FIGS. 2A-B are partial cross-sectional views showing the device of FIGS 1A-B mounted on a wiring board and associated heatsink, according to the prior art;
- FIG. 3A-B are partial cross-sectional views of the device of FIGS. 1A-B mounted on a wiring board and associated heatsink according to the present invention, wherein FIG. 3 A shows a partially assembled view and FIG. 3B shows a fully assembled view;
- FIG. 4 is a top view of an array of electronic devices mounted on a PWB and heatsink, according to the present invention.
- FIGS. 5A-B are partial cross-sectional views similar to FIG. 3B but according to still further embodiments of the present invention.
- FIG. 3A-B are partial cross-sectional views of arrangement 40 for mounting device 10 of FIGS. 1A-B on wiring board 42 and associated heatsink 46, according to the present invention, wherein FIG. 3 A shows a partially assembled view (exploded in the direction of arrow 39) and FIG. 3B shows a fully assembled view.
- Arrangement 40 has device 10 of FIGS. 1A-B with leads 14-15, lens 24, package body 12 and lower heat dissipating surface 22. Leads 14-15 are attached (e.g., by soldering) to appropriate contact regions (not shown) on lower surface or underside 43 of PWB 42.
- PWB 42 has through-hole 44 for receiving body 12 of device 10.
- Lens 24 faces away from upper surface 41 of PWB 42 and from heatsink 46.
- Leads 14-15 are desirably formed such that when device body 12 is installed in through-hole 44 and leads 14-15 are attached to electrical contacts (not shown) provided on lower surface 43 of PWB 42, and that base 22 of package body 12 extends slightly below lower surface 43 of PWB 42.
- Thermally conducting layer 48 is preferably but not essentially provided between PWB 42 and lower surface 22 of package 12, and upper surface 45 of heatsink 46. This is to avoid air bubles or other interface anomalies that might increase the interfacial thermal impedance between lower surface 22 of package 12 and upper surface 45 of heatsink 46.
- Thermally conductive layer 48 should be resilient (e.g., thermally conductive rubber) and as thin as possible consistent with any requirement that it also be electrically insulating. When layer 48 is omitted, any exposed leads on lower surface 43 of PWB 42 need to be covered with an electrical insulating layer or. alternatively, upper surface 45 of heatsink 46 should have an insulating layer thereon.
- thermally conductive but electrically insulating layers For aluminum heatsinks, an aluminum oxide layer or oxide containing paints are examples of useful thermally conductive but electrically insulating layers.
- Heatsink 46 is conveniently of extruded aluminum but other thermally conductive materials may also be used. Because upper surface 45 need not have any special machining or other features, low cost standard heatsinks may be used. This is a significant advantage.
- Gap Pad A3000 manufactured by the Berquist Company, Chanhassen, MN is an example of a suitable material for thermally conductive layer 48. In a preferred embodiment of the present invention, layer 48 of this material having a thickness of 0.020 inches (0.5 mm) was suitable, but thicker or thinner layers can also be used depending upon the choice of electronic device(s) and the heatsink.
- leads 14-15 and lower surface 22 of device body surface 12 are firmly pressed against layer 48 and underlying heatsink 46.
- leads 14-15 are clamped between PWB 42 and layer 48 and underlying heatsink 46. This is a significant advantage because: (1) it produces a much more rugged structure, and (2) it improves the thermal coupling of device 20 to heatsink 46.
- leads 14-15 are important thermal pathways through which heat may be removed from device 10 and that the present arrangement provides much better thermal coupling of leads 14-15 to heatsink 46 than the prior art arrangement of FIGS. 2A-B.
- FIG. 4 is a top view of array 50 of electronic devices 10 mounted on PWB 42, according to the present invention.
- Array 50 is constructed as illustrated in cross-section in FIS. 3A-B.
- Screws 54 extend through PWB 42 and layer 48 into heatsink 46. When tightened, screws 54 firmly couple PWB 42 to heatsink 46, trapping leads 14-15 therebetween and forcing lower package surface 22 against thermal layer 48 in contact with heatsink surface 45 (see FTFS 3A-B).
- FTFS 3A-B heatsink surface 45
- Array 50 illustrates the advantages of the present invention when a dense array of high power, high dissipation devices must be arranged in close physical proximity, while still providing efficient heat removal therefrom.
- a further advantage of the present invention is that devices 10 are easily replaceable.
- devices 10 are easily replaceable.
- the glue makes disassembly difficult or impossible. With the present, arrangement such glue is not needed and the array may be easily disassembled to unsolder and replace any or all of devices 10. This is a significant advantage.
- FIGS. 5A-B are partial cross-sectional views similar to FIG. 3B but according to still further embodiments of the present invention. Like reference numbers are used for like elements.
- assembly 60 has the same structure as assembly 40 of FIG. 3B but with overlay member 62 added above PWB 42.
- Overlay member 62 has hole 64 therein through which the upper portion, e.g., lens 24, of device 10 protrudes or is exposed. Hole 64 is smaller than hole 44 and of a size to permit lens 24 (or other portion of device 10) to be exposed in the direction of arrow 23, but too small for all of package body 12 to pass through.
- Overlay member 62 has shoulder region 66 which contacts package 12 of device 10 so that, when overlay member 62 is clamped against heatsink 46 or thermal layer 48 (e. g, using screws 54 of FIG. 4 or equivalent), it presses down on package body 12 thereby forcing base 22 into intimate contact with heatsink 46 or thermal layer 48. Leads 14-15 need not be used to apply this compressive force to device 10.
- Overlay member 62 can be made of any convenient material and need only have hole(s) 64 wherever device(s) 10 are to be located and some means for being clamped with respect to heatsink 46, as for example, using screws equivalent to screws 54 or some other means.
- Overlay member 64 is shown here as being a separate layer from PWB 42 but that is merely for purposes of explanation and not intended to be limiting. PWB 42 and overlay member 62 can be combined.
- FIG. 5B is similar to FIG. 5A except that with assembly 60' leads 14, 15 of device 10 are modified to attach to contact pads (not shown) on upper surface 41 ' of PWB 42', or, equivalently, on lower surface 63 of overlay member 62. Either arrangement is useful. Shims 68 can optionally be included to more evenly distribute the clamping force being applied to overlay member 62 in the direction of arrows 70. It will be noted that in FIGS.
- 5A-B package body 12 is in compression with respect to heatsink 46 and leads 14-15 need not be stressed, but are still compressed against the contact areas to which they attach, that is, captured between PWB 42 or overlay member 62 and heatsink 46. This is desirable because it provides a more rugged overall structure with improved thermal properties.
- wiring board are intended to include either PWB 42, 42' alone or the combination of PWB 42, 42' and overlay member 62, and equivalent structures.
- device 10 has been illustrated as being a surface mount type LED this is merely for convenience of explanation and not intended to be limiting.
- Device 10 can be any type of electronic component that dissipates significant amounts of thermal energy and must be closely coupled to a heat sink and which has leads suitable for surface mounting.
- the above description illustrates the present invention for a surface mount device whose upper surface (e.g., the lens) must face away from the PWB, this is not intended to be limiting.
- the present invention has the following advantages: (A) devices 10 are easily replaceable; (B) compressive forces are applied to the tips of leads 14-15 thereby reducing the stress on the (e.g., solder) joints between leads 14-15 and the corresponding contact regions on the PWB; (C) leads 14-15 are in better thermal contact with heatsink 46 thereby improving the overall heat dissipation (e.g., providing lower thermal impedance between device 10 and heatsink 46); (D) the heatsink design and fabrication is simplified thereby lowering its cost; and (E) the number of thermal interfaces between device 10 and heatsink 46 is reduced, thereby improving the thermal coupling and reducing the thermal impedance between device 10 and heatsink 46.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006521906A JP2007500448A (en) | 2003-07-28 | 2004-07-21 | Endothermic electronic device |
EP04778791A EP1649515A1 (en) | 2003-07-28 | 2004-07-21 | Heatsinking electronic devices |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/629,374 | 2003-07-28 | ||
US10/629,374 US6999318B2 (en) | 2003-07-28 | 2003-07-28 | Heatsinking electronic devices |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005013366A1 true WO2005013366A1 (en) | 2005-02-10 |
Family
ID=34103606
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/023438 WO2005013366A1 (en) | 2003-07-28 | 2004-07-21 | Heatsinking electronic devices |
Country Status (7)
Country | Link |
---|---|
US (1) | US6999318B2 (en) |
EP (1) | EP1649515A1 (en) |
JP (1) | JP2007500448A (en) |
KR (1) | KR20060040727A (en) |
CN (1) | CN100521199C (en) |
TW (1) | TW200509420A (en) |
WO (1) | WO2005013366A1 (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100653645B1 (en) | 2005-12-27 | 2006-12-05 | 삼성전자주식회사 | Packcage of light emitting device and method of manufacturing the package |
JP2007234886A (en) * | 2006-03-01 | 2007-09-13 | Compal Communications Inc | Electronic element assembly with thermal dissipation constitution |
DE102006020600A1 (en) * | 2006-04-05 | 2007-10-18 | Trapp, Christian, Dr. | High power light emitting diode positioning method for illumination system, involves providing printed circuit board with continuous recess that corresponds with bulb housing bottoms of light emitting diodes |
EP1848924A2 (en) * | 2005-02-17 | 2007-10-31 | Federal-Mogul Corporation | Led light module assembly |
JP2007311760A (en) * | 2006-04-20 | 2007-11-29 | Kokubu Denki Co Ltd | Led module |
WO2008108574A1 (en) * | 2007-03-06 | 2008-09-12 | Gwang Sung Lighting Industry Co., Ltd. | Lamp with light emitting diodes using alternating current |
JP2009200187A (en) * | 2008-02-21 | 2009-09-03 | Kamakura Denshi Kogyo Kk | Led mounting method of lighting system, and led lighting system |
US7942563B2 (en) | 2008-02-29 | 2011-05-17 | Tyco Electronics Corporation | LED with light pipe assembly |
US9323139B2 (en) | 2011-08-09 | 2016-04-26 | Seiko Epson Corporation | Light source device and projector |
Families Citing this family (232)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6936855B1 (en) * | 2002-01-16 | 2005-08-30 | Shane Harrah | Bendable high flux LED array |
JP4305896B2 (en) * | 2002-11-15 | 2009-07-29 | シチズン電子株式会社 | High brightness light emitting device and manufacturing method thereof |
TWI224661B (en) * | 2003-06-13 | 2004-12-01 | Yuan Lin | Multi-channel light source based longitudinal lighting device |
US7607801B2 (en) * | 2003-10-31 | 2009-10-27 | Toyoda Gosei Co., Ltd. | Light emitting apparatus |
US7196459B2 (en) * | 2003-12-05 | 2007-03-27 | International Resistive Co. Of Texas, L.P. | Light emitting assembly with heat dissipating support |
US20050146884A1 (en) * | 2004-01-07 | 2005-07-07 | Goodrich Hella Aerospace Lighting Systems Gmbh | Light, particularly a warning light, for a vehicle |
JP4343720B2 (en) * | 2004-01-23 | 2009-10-14 | 株式会社小糸製作所 | Lamp |
CN1316608C (en) * | 2004-02-13 | 2007-05-16 | 上海三思科技发展有限公司 | A heat radiation needle arrangement for improving LED temperature rise |
US20050199899A1 (en) * | 2004-03-11 | 2005-09-15 | Ming-Der Lin | Package array and package unit of flip chip LED |
EP1754259B1 (en) | 2004-03-18 | 2019-07-17 | Phoseon Technology, Inc. | Direct and indirect cooling of leds |
US7210957B2 (en) * | 2004-04-06 | 2007-05-01 | Lumination Llc | Flexible high-power LED lighting system |
US7210817B2 (en) * | 2004-04-27 | 2007-05-01 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Method, system and device for delivering phototherapy to a patient |
EP1766287B1 (en) * | 2004-06-15 | 2012-04-11 | Data Cloak LLC | High power led electro-optic assembly |
TWI302038B (en) * | 2004-07-07 | 2008-10-11 | Epistar Corp | Light emitting diode having an adhesive layer and heat paths |
US7236366B2 (en) * | 2004-07-23 | 2007-06-26 | Excel Cell Electronic Co., Ltd. | High brightness LED apparatus with an integrated heat sink |
US7241030B2 (en) * | 2004-07-30 | 2007-07-10 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Illumination apparatus and method |
KR20060021707A (en) * | 2004-09-03 | 2006-03-08 | 엘지전자 주식회사 | Heat sink assembly of tcp for plasma display panel |
TWI255377B (en) * | 2004-11-05 | 2006-05-21 | Au Optronics Corp | Backlight module |
KR101115800B1 (en) * | 2004-12-27 | 2012-03-08 | 엘지디스플레이 주식회사 | Light-emitting device package, method for fabricating the same and backlight unit |
TWI352437B (en) | 2007-08-27 | 2011-11-11 | Epistar Corp | Optoelectronic semiconductor device |
JP4241658B2 (en) * | 2005-04-14 | 2009-03-18 | シチズン電子株式会社 | Light emitting diode light source unit and light emitting diode light source formed using the same |
US20060250270A1 (en) * | 2005-05-05 | 2006-11-09 | Kyrre Tangen | System and method for mounting a light emitting diode to a printed circuit board |
EP1891671B1 (en) | 2005-05-20 | 2020-08-19 | Signify Holding B.V. | Light-emitting module |
US8272757B1 (en) * | 2005-06-03 | 2012-09-25 | Ac Led Lighting, L.L.C. | Light emitting diode lamp capable of high AC/DC voltage operation |
EP1890343A4 (en) * | 2005-06-07 | 2014-04-23 | Fujikura Ltd | Substrate for light-emitting device mounting, light-emitting device module, illuminating device, display and traffic signal device |
CN100388516C (en) * | 2005-06-07 | 2008-05-14 | 友达光电股份有限公司 | Light source module |
US20060289887A1 (en) * | 2005-06-24 | 2006-12-28 | Jabil Circuit, Inc. | Surface mount light emitting diode (LED) assembly with improved power dissipation |
EP1897146A2 (en) * | 2005-06-27 | 2008-03-12 | Lamina Lighting, Inc. | Light emitting diode package and method for making same |
KR20070006458A (en) * | 2005-07-08 | 2007-01-11 | 삼성전자주식회사 | Light emitting diode module and a backlight assembly provided with the same and a display device provided with the same |
US20070041195A1 (en) * | 2005-08-16 | 2007-02-22 | Excel Cell Electronic Co., Ltd. | Light emitting assembly |
WO2007036958A1 (en) | 2005-09-27 | 2007-04-05 | Immobiliare Eder S.R.L. | Power led type lighting or light signaling device |
US20070081342A1 (en) * | 2005-10-07 | 2007-04-12 | Oliver Szeto | System and method for mounting a light emitting diode to a printed circuit board |
US20070081340A1 (en) * | 2005-10-07 | 2007-04-12 | Chung Huai-Ku | LED light source module with high efficiency heat dissipation |
WO2007061815A1 (en) * | 2005-11-18 | 2007-05-31 | Cree, Inc. | Solid state lighting device |
KR100764380B1 (en) * | 2005-12-16 | 2007-10-08 | 삼성전기주식회사 | Slim type back light unit |
WO2007072919A1 (en) * | 2005-12-22 | 2007-06-28 | Matsushita Electric Works, Ltd. | Illumination instrument using led |
DE102006001188A1 (en) * | 2006-01-10 | 2007-07-12 | Robert Bosch Gmbh | Arrangement for cooling power components on printed circuit boards and method for producing the same |
KR100736891B1 (en) * | 2006-01-13 | 2007-07-10 | 서울반도체 주식회사 | Led lamp |
KR100752009B1 (en) * | 2006-03-06 | 2007-08-28 | 삼성전기주식회사 | Backlight unit provided with light emitting diodes thereon |
JP4573128B2 (en) * | 2006-03-14 | 2010-11-04 | ミネベア株式会社 | Surface lighting device |
KR100738933B1 (en) * | 2006-03-17 | 2007-07-12 | (주)대신엘이디 | Led module for illumination |
US7806574B2 (en) * | 2006-04-16 | 2010-10-05 | Albeo Technologies, Inc. | Thermal management of LED-based lighting systems |
US8425085B2 (en) * | 2006-04-16 | 2013-04-23 | Albeo Technologies, Inc. | Thermal management of LED-based lighting systems |
WO2007122761A1 (en) * | 2006-04-19 | 2007-11-01 | Sharp Kabushiki Kaisha | Illuminating device and liquid crystal display comprising same |
US7648257B2 (en) * | 2006-04-21 | 2010-01-19 | Cree, Inc. | Light emitting diode packages |
US20090116252A1 (en) * | 2006-05-08 | 2009-05-07 | Koninklijke Philips Electronics N V | Thermal surface mounting of multiple leds onto a heatsink |
US20090279300A1 (en) * | 2006-05-31 | 2009-11-12 | Denki Kagaku Kogyo Kabushiki Kaisha | Led light source unit |
EP2035745B1 (en) | 2006-05-31 | 2020-04-29 | IDEAL Industries Lighting LLC | Lighting device with color control, and method of lighting |
US7736020B2 (en) * | 2006-06-16 | 2010-06-15 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Illumination device and method of making the device |
US7708427B2 (en) * | 2006-06-16 | 2010-05-04 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Light source device and method of making the device |
EP1876389A1 (en) * | 2006-07-05 | 2008-01-09 | LiteCorp Europe B.V. | Lighting system for a display apparatus |
JP2008016362A (en) * | 2006-07-07 | 2008-01-24 | Koito Mfg Co Ltd | Light-emitting module and vehicular lighting fixture |
KR20080007961A (en) * | 2006-07-19 | 2008-01-23 | 알티전자 주식회사 | Cooling device of led module and manufacturing method thereof |
US7545461B2 (en) * | 2006-07-25 | 2009-06-09 | Kyocera Corporation | Liquid crystal display device |
TWI340010B (en) * | 2006-08-04 | 2011-04-01 | Everlight Electronics Co Ltd | Circuit board with cooling functionality |
TWI286721B (en) * | 2006-08-07 | 2007-09-11 | Sunonwealth Electr Mach Ind Co | Heat-dissipating apparatus for a back light module of a liquid crystal display |
US20080068807A1 (en) * | 2006-09-20 | 2008-03-20 | Sunonwealth Electric Machine Industry Co., Ltd. | Heat-dissipating device for back light source for flat panel display |
US7686469B2 (en) | 2006-09-30 | 2010-03-30 | Ruud Lighting, Inc. | LED lighting fixture |
US20090086491A1 (en) | 2007-09-28 | 2009-04-02 | Ruud Lighting, Inc. | Aerodynamic LED Floodlight Fixture |
US9028087B2 (en) | 2006-09-30 | 2015-05-12 | Cree, Inc. | LED light fixture |
US9243794B2 (en) | 2006-09-30 | 2016-01-26 | Cree, Inc. | LED light fixture with fluid flow to and from the heat sink |
US7952262B2 (en) * | 2006-09-30 | 2011-05-31 | Ruud Lighting, Inc. | Modular LED unit incorporating interconnected heat sinks configured to mount and hold adjacent LED modules |
DE102006048230B4 (en) * | 2006-10-11 | 2012-11-08 | Osram Ag | Light-emitting diode system, method for producing such and backlighting device |
US20080151506A1 (en) * | 2006-12-20 | 2008-06-26 | Cheng Home Electronics Co., Ltd. | Printed circuit board having vertical heat dissipating element |
TWM313759U (en) * | 2007-01-12 | 2007-06-11 | Tai Sol Electronics Co Ltd | Combined assembly of LED and heat dissipation fins |
WO2008092271A1 (en) * | 2007-02-01 | 2008-08-07 | Aimrail Corp. | Multiple axes adjustable lighting system with movable thermally conductive carriage |
TWI323384B (en) * | 2007-04-09 | 2010-04-11 | Coretronic Corp | Light valve device |
US7898811B2 (en) * | 2007-04-10 | 2011-03-01 | Raled, Inc. | Thermal management of LEDs on a printed circuit board and associated methods |
US7976194B2 (en) * | 2007-05-04 | 2011-07-12 | Ruud Lighting, Inc. | Sealing and thermal accommodation arrangement in LED package/secondary lens structure |
US7938558B2 (en) * | 2007-05-04 | 2011-05-10 | Ruud Lighting, Inc. | Safety accommodation arrangement in LED package/lens structure |
EP1998101B2 (en) * | 2007-05-30 | 2019-09-25 | OSRAM GmbH | Lighting device |
WO2008152561A1 (en) * | 2007-06-14 | 2008-12-18 | Koninklijke Philips Electronics N.V. | Led-based luminaire with adjustable beam shape |
TW200904316A (en) * | 2007-07-13 | 2009-01-16 | Kai-Yu Lin | Heat-dissipation structure of luminous device |
JP2010538473A (en) * | 2007-08-31 | 2010-12-09 | リアクティブ ナノテクノロジーズ,インク. | Low temperature bonding method for electronic components |
CN101162816B (en) * | 2007-09-13 | 2010-09-01 | 番禺得意精密电子工业有限公司 | Electric connector |
JP4570106B2 (en) * | 2007-09-18 | 2010-10-27 | 日本航空電子工業株式会社 | connector |
CN101400210B (en) * | 2007-09-27 | 2010-06-02 | 北京京东方光电科技有限公司 | Printed circuit board equipped with LED |
CN100546058C (en) * | 2007-10-15 | 2009-09-30 | 佛山市国星光电股份有限公司 | Power luminous diode packaging structure |
US20090095971A1 (en) * | 2007-10-16 | 2009-04-16 | Andrew Glovatsky | Wire bond led lighting unit |
TWI343233B (en) * | 2007-10-19 | 2011-06-01 | Au Optronics Corp | Circuit board assembly and backlight module comprising the same |
TW200921207A (en) * | 2007-11-06 | 2009-05-16 | Ind Tech Res Inst | Light-emitting module |
US20090129024A1 (en) * | 2007-11-15 | 2009-05-21 | Dennis Mahoney | Inverted through circuit board mounting with heat sink |
US8866410B2 (en) | 2007-11-28 | 2014-10-21 | Cree, Inc. | Solid state lighting devices and methods of manufacturing the same |
KR101491138B1 (en) * | 2007-12-12 | 2015-02-09 | 엘지이노텍 주식회사 | Multi-layer board and light emitting diode module having thereof |
US8118447B2 (en) | 2007-12-20 | 2012-02-21 | Altair Engineering, Inc. | LED lighting apparatus with swivel connection |
TW200928203A (en) * | 2007-12-24 | 2009-07-01 | Guei-Fang Chen | LED illuminating device capable of quickly dissipating heat and its manufacturing method |
CN101198216A (en) * | 2008-01-07 | 2008-06-11 | 史杰 | Flexible circuit board of LED illumination array |
CN101521253B (en) * | 2008-02-29 | 2011-02-16 | 富士迈半导体精密工业(上海)有限公司 | Solid luminous element and light source module |
TWI419357B (en) * | 2008-03-12 | 2013-12-11 | Bright Led Electronics Corp | Manufacturing method of light emitting module |
US8207553B2 (en) * | 2008-03-25 | 2012-06-26 | Bridge Semiconductor Corporation | Semiconductor chip assembly with base heat spreader and cavity in base |
US8324723B2 (en) * | 2008-03-25 | 2012-12-04 | Bridge Semiconductor Corporation | Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump |
US20110163348A1 (en) * | 2008-03-25 | 2011-07-07 | Bridge Semiconductor Corporation | Semiconductor chip assembly with bump/base heat spreader and inverted cavity in bump |
US8148747B2 (en) * | 2008-03-25 | 2012-04-03 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base/cap heat spreader |
US8193556B2 (en) * | 2008-03-25 | 2012-06-05 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader and cavity in post |
US8525214B2 (en) | 2008-03-25 | 2013-09-03 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader with thermal via |
US8378372B2 (en) * | 2008-03-25 | 2013-02-19 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader and horizontal signal routing |
US8314438B2 (en) * | 2008-03-25 | 2012-11-20 | Bridge Semiconductor Corporation | Semiconductor chip assembly with bump/base heat spreader and cavity in bump |
US8212279B2 (en) * | 2008-03-25 | 2012-07-03 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader, signal post and cavity |
US8531024B2 (en) * | 2008-03-25 | 2013-09-10 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace |
US8354688B2 (en) | 2008-03-25 | 2013-01-15 | Bridge Semiconductor Corporation | Semiconductor chip assembly with bump/base/ledge heat spreader, dual adhesives and cavity in bump |
US8129742B2 (en) * | 2008-03-25 | 2012-03-06 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader and plated through-hole |
US8329510B2 (en) * | 2008-03-25 | 2012-12-11 | Bridge Semiconductor Corporation | Method of making a semiconductor chip assembly with a post/base heat spreader with an ESD protection layer |
US20110156090A1 (en) * | 2008-03-25 | 2011-06-30 | Lin Charles W C | Semiconductor chip assembly with post/base/post heat spreader and asymmetric posts |
US20100072511A1 (en) * | 2008-03-25 | 2010-03-25 | Lin Charles W C | Semiconductor chip assembly with copper/aluminum post/base heat spreader |
US8310043B2 (en) * | 2008-03-25 | 2012-11-13 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader with ESD protection layer |
US8415703B2 (en) * | 2008-03-25 | 2013-04-09 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange |
US20110278638A1 (en) | 2008-03-25 | 2011-11-17 | Lin Charles W C | Semiconductor chip assembly with post/dielectric/post heat spreader |
US8269336B2 (en) * | 2008-03-25 | 2012-09-18 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader and signal post |
US8232576B1 (en) | 2008-03-25 | 2012-07-31 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader and ceramic block in post |
US8067784B2 (en) | 2008-03-25 | 2011-11-29 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader and substrate |
US20100181594A1 (en) * | 2008-03-25 | 2010-07-22 | Lin Charles W C | Semiconductor chip assembly with post/base heat spreader and cavity over post |
US8288792B2 (en) * | 2008-03-25 | 2012-10-16 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base/post heat spreader |
US8203167B2 (en) * | 2008-03-25 | 2012-06-19 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader and adhesive between base and terminal |
US20090284932A1 (en) * | 2008-03-25 | 2009-11-19 | Bridge Semiconductor Corporation | Thermally Enhanced Package with Embedded Metal Slug and Patterned Circuitry |
US8360599B2 (en) | 2008-05-23 | 2013-01-29 | Ilumisys, Inc. | Electric shock resistant L.E.D. based light |
CA2726881C (en) * | 2008-06-05 | 2016-01-12 | Peter A. Hochstein | Light emitting assembly with independent elongated sections |
EP2133625A1 (en) * | 2008-06-09 | 2009-12-16 | Hon-Wen Chen | Light emitting diode lamp high heat-dissipation capacity |
US8631855B2 (en) * | 2008-08-15 | 2014-01-21 | Lighting Science Group Corporation | System for dissipating heat energy |
US8058659B2 (en) | 2008-08-26 | 2011-11-15 | Albeo Technologies, Inc. | LED chip-based lighting products and methods of building |
US8981629B2 (en) | 2008-08-26 | 2015-03-17 | Albeo Technologies, Inc. | Methods of integrating LED chips with heat sinks, and LED-based lighting assemblies made thereby |
US9076951B2 (en) | 2008-08-26 | 2015-07-07 | Albeo Technologies, Inc. | Methods of integrating LED chips with heat sinks, and LED-based lighting assemblies made thereby |
US7952114B2 (en) | 2008-09-23 | 2011-05-31 | Tyco Electronics Corporation | LED interconnect assembly |
US8901823B2 (en) | 2008-10-24 | 2014-12-02 | Ilumisys, Inc. | Light and light sensor |
US8653984B2 (en) | 2008-10-24 | 2014-02-18 | Ilumisys, Inc. | Integration of LED lighting control with emergency notification systems |
US7938562B2 (en) | 2008-10-24 | 2011-05-10 | Altair Engineering, Inc. | Lighting including integral communication apparatus |
US8214084B2 (en) | 2008-10-24 | 2012-07-03 | Ilumisys, Inc. | Integration of LED lighting with building controls |
US8324817B2 (en) | 2008-10-24 | 2012-12-04 | Ilumisys, Inc. | Light and light sensor |
US20100110684A1 (en) * | 2008-10-28 | 2010-05-06 | Abl Ip Holding Llc | Light emitting diode luminaires and applications thereof |
TW201020460A (en) * | 2008-11-26 | 2010-06-01 | Ling Chyuan Fa Ing Yonq Ltd | Heat-dissipation structure of LED |
DE102008059468A1 (en) * | 2008-11-28 | 2010-06-24 | Osram Opto Semiconductors Gmbh | Optoelectronic lamp |
US8651704B1 (en) | 2008-12-05 | 2014-02-18 | Musco Corporation | Solid state light fixture with cooling system with heat rejection management |
TWI423421B (en) * | 2009-01-17 | 2014-01-11 | Bright Led Electronics Corp | A light emitting device and a manufacturing method thereof |
TW201029230A (en) | 2009-01-23 | 2010-08-01 | Everlight Electronics Co Ltd | Light emitting diode package |
US8152322B1 (en) | 2009-01-29 | 2012-04-10 | Mcginty Patrick | Heat dissipating helmet and light |
US8651711B2 (en) | 2009-02-02 | 2014-02-18 | Apex Technologies, Inc. | Modular lighting system and method employing loosely constrained magnetic structures |
CN101807632B (en) * | 2009-02-17 | 2012-07-11 | 亿光电子工业股份有限公司 | Light emitting diode package |
TW201035513A (en) * | 2009-03-25 | 2010-10-01 | Wah Hong Ind Corp | Method for manufacturing heat dissipation interface device and product thereof |
US8955580B2 (en) * | 2009-08-14 | 2015-02-17 | Wah Hong Industrial Corp. | Use of a graphite heat-dissipation device including a plating metal layer |
CN101848626B (en) * | 2009-03-27 | 2013-08-07 | 富准精密工业(深圳)有限公司 | Radiator and manufacturing method thereof |
KR100948401B1 (en) * | 2009-04-17 | 2010-03-22 | 석주한 | Light emitting diode device reversely attached to printed circuit board |
JP5487704B2 (en) * | 2009-04-27 | 2014-05-07 | セイコーエプソン株式会社 | Electro-optical device and electronic apparatus |
FR2944853B1 (en) * | 2009-04-27 | 2012-10-12 | Hmi Innovation | LED LIGHTING DEVICE INCORPORATING A SUPPORT FOR THERMAL DISSIPATION. |
US20110249406A1 (en) * | 2009-06-20 | 2011-10-13 | LEDAdventures LLC | Heat dissipation system for electrical components |
US8476812B2 (en) * | 2009-07-07 | 2013-07-02 | Cree, Inc. | Solid state lighting device with improved heatsink |
JP5431818B2 (en) * | 2009-07-21 | 2014-03-05 | シチズン電子株式会社 | Light emitting diode light source device |
KR20110014867A (en) * | 2009-08-06 | 2011-02-14 | 삼성전기주식회사 | Power device package and fabricating method of the same |
US8324653B1 (en) | 2009-08-06 | 2012-12-04 | Bridge Semiconductor Corporation | Semiconductor chip assembly with ceramic/metal substrate |
KR101105454B1 (en) * | 2009-08-10 | 2012-01-17 | 심현섭 | Print circuit board of LED illumination device |
US20110065218A1 (en) * | 2009-09-14 | 2011-03-17 | Bridgelux Inc. | Pre-thermal greased led array |
EP2302985A1 (en) * | 2009-09-28 | 2011-03-30 | Huan-Chang Huang | LED assembly |
US8602593B2 (en) * | 2009-10-15 | 2013-12-10 | Cree, Inc. | Lamp assemblies and methods of making the same |
US8476645B2 (en) | 2009-11-13 | 2013-07-02 | Uni-Light Llc | LED thermal management |
US8241044B2 (en) * | 2009-12-09 | 2012-08-14 | Tyco Electronics Corporation | LED socket assembly |
US8235549B2 (en) * | 2009-12-09 | 2012-08-07 | Tyco Electronics Corporation | Solid state lighting assembly |
US8210715B2 (en) * | 2009-12-09 | 2012-07-03 | Tyco Electronics Corporation | Socket assembly with a thermal management structure |
US8845130B2 (en) * | 2009-12-09 | 2014-09-30 | Tyco Electronics Corporation | LED socket assembly |
US8878454B2 (en) * | 2009-12-09 | 2014-11-04 | Tyco Electronics Corporation | Solid state lighting system |
EP2346100B1 (en) * | 2010-01-15 | 2019-05-22 | LG Innotek Co., Ltd. | Light emitting apparatus and lighting system |
US8564947B2 (en) * | 2010-02-12 | 2013-10-22 | Electronics And Telecommunications Research Institute | Heat exhaustion structure for heat dissipating device |
US20110220338A1 (en) * | 2010-03-11 | 2011-09-15 | Kun-Jung Chang | Led heat sink and method of manufacturing same |
DE202010017532U1 (en) * | 2010-03-16 | 2012-01-19 | Eppsteinfoils Gmbh & Co.Kg | Foil system for LED applications |
US8540401B2 (en) | 2010-03-26 | 2013-09-24 | Ilumisys, Inc. | LED bulb with internal heat dissipating structures |
WO2011119921A2 (en) | 2010-03-26 | 2011-09-29 | Altair Engineering, Inc. | Led light with thermoelectric generator |
JP2011238367A (en) * | 2010-05-06 | 2011-11-24 | Funai Electric Co Ltd | Light source mounting structure of plane light-emitting device |
US20110279981A1 (en) * | 2010-05-17 | 2011-11-17 | Alex Horng | Heat Dissipating Assembly |
JP5052647B2 (en) * | 2010-05-31 | 2012-10-17 | シャープ株式会社 | Lighting device |
US8391009B2 (en) * | 2010-06-18 | 2013-03-05 | Sunonwealth Electric Machine Industry Co., Ltd. | Heat dissipating assembly |
US8550650B1 (en) | 2010-08-10 | 2013-10-08 | Patrick McGinty | Lighted helmet with heat pipe assembly |
TWI417478B (en) * | 2010-08-19 | 2013-12-01 | Delta Electronics Inc | Lamp module |
CN103154607A (en) * | 2010-09-13 | 2013-06-12 | Bk科技株式会社 | LED light source structure with high illuminating power and improved heat dissipating characteristics |
US8651689B2 (en) * | 2010-09-20 | 2014-02-18 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Light emitting diode light bar structure having heat dissipation function |
US10024510B2 (en) * | 2010-10-26 | 2018-07-17 | Steven G. Hammond | Flexible light emitting diode lighting process and assembly |
EP2633227B1 (en) | 2010-10-29 | 2018-08-29 | iLumisys, Inc. | Mechanisms for reducing risk of shock during installation of light tube |
CN102003685A (en) * | 2010-11-01 | 2011-04-06 | 深圳市华星光电技术有限公司 | Radiating structure for light-emitting source |
US8899774B2 (en) | 2010-11-17 | 2014-12-02 | Integra Lifesciences Corporation | Wearable headlight devices and related methods |
KR20120079325A (en) | 2011-01-04 | 2012-07-12 | 페어차일드코리아반도체 주식회사 | Semiconductor package and methods of fabricating the same |
US8652860B2 (en) | 2011-01-09 | 2014-02-18 | Bridgelux, Inc. | Packaging photon building blocks having only top side connections in a molded interconnect structure |
US8354684B2 (en) * | 2011-01-09 | 2013-01-15 | Bridgelux, Inc. | Packaging photon building blocks having only top side connections in an interconnect structure |
JP2012156233A (en) * | 2011-01-25 | 2012-08-16 | Seiko Epson Corp | Light source device and projector |
IT1403805B1 (en) * | 2011-02-01 | 2013-10-31 | Gs Plastics S A S Di Giovanni Gervasio & C | LED LAMP |
TWI457387B (en) * | 2011-03-09 | 2014-10-21 | Ind Tech Res Inst | Electrically insulating and thermally conductive composition and electronic device |
KR101804892B1 (en) | 2011-04-14 | 2017-12-06 | 엘지디스플레이 주식회사 | Light emitting diode assembly and liquid crystal display device having the same |
US9103540B2 (en) | 2011-04-21 | 2015-08-11 | Optalite Technologies, Inc. | High efficiency LED lighting system with thermal diffusion |
CN102128419A (en) * | 2011-04-22 | 2011-07-20 | 浙江生辉照明有限公司 | Breakdown protection method of LED (Light-Emitting Diode) light source and LED lamp |
US20120287634A1 (en) * | 2011-05-13 | 2012-11-15 | Schneider Electric USA, Inc. | Weather proof high efficient led light engine |
CN102798103B (en) * | 2011-05-24 | 2016-06-01 | 奥斯兰姆有限公司 | Module radiator for LED |
US8430521B2 (en) * | 2011-07-02 | 2013-04-30 | Jet Motor Limited | Pool lighting assembly |
WO2013028965A2 (en) | 2011-08-24 | 2013-02-28 | Ilumisys, Inc. | Circuit board mount for led light |
WO2013042193A1 (en) * | 2011-09-20 | 2013-03-28 | Necディスプレイソリューションズ株式会社 | Light source device and projection-type display device |
US9429309B2 (en) | 2011-09-26 | 2016-08-30 | Ideal Industries, Inc. | Device for securing a source of LED light to a heat sink surface |
US9423119B2 (en) | 2011-09-26 | 2016-08-23 | Ideal Industries, Inc. | Device for securing a source of LED light to a heat sink surface |
US9249955B2 (en) | 2011-09-26 | 2016-02-02 | Ideal Industries, Inc. | Device for securing a source of LED light to a heat sink surface |
FR2984679B1 (en) * | 2011-12-15 | 2015-03-06 | Valeo Sys Controle Moteur Sas | THERMALLY CONDUCTIVE AND ELECTRICALLY INSULATING CONNECTION BETWEEN AT LEAST ONE ELECTRONIC COMPONENT AND A RADIATOR IN ALL OR METALLIC PORTION |
US8568001B2 (en) | 2012-02-03 | 2013-10-29 | Tyco Electronics Corporation | LED socket assembly |
JP5772657B2 (en) * | 2012-02-27 | 2015-09-02 | 豊田合成株式会社 | Light emitting module |
US9024514B2 (en) | 2012-02-27 | 2015-05-05 | Toyoda Gosei Co., Ltd. | Light-emitting module having connection member to press for direct electrical contact |
WO2013131002A1 (en) | 2012-03-02 | 2013-09-06 | Ilumisys, Inc. | Electrical connector header for an led-based light |
CN102818216B (en) * | 2012-06-05 | 2014-08-06 | 佛山市国星光电股份有限公司 | Large-angle lens and large-angle light-emergent LED (Light Emitting Diode) light source module |
WO2014008463A1 (en) | 2012-07-06 | 2014-01-09 | Ilumisys, Inc. | Power supply assembly for led-based light tube |
US9271367B2 (en) | 2012-07-09 | 2016-02-23 | Ilumisys, Inc. | System and method for controlling operation of an LED-based light |
EP2878876A4 (en) * | 2012-07-24 | 2016-01-06 | Shanghai Yaming Lighting Co | Integrated led module |
JP6157022B2 (en) * | 2012-08-07 | 2017-07-05 | フィリップス ライティング ホールディング ビー ヴィ | Lighting device having heat sink structure |
CN102829399A (en) * | 2012-09-04 | 2012-12-19 | 京东方科技集团股份有限公司 | Backplate, backlight module and display device |
US9704774B2 (en) | 2012-12-11 | 2017-07-11 | Sensor Electronic Technology, Inc. | Thermal management structure with integrated heat sink |
FI20135113L (en) * | 2013-02-05 | 2014-08-06 | Tellabs Oy | Circuit board system with cooling arrangement |
WO2014160470A2 (en) * | 2013-03-13 | 2014-10-02 | Albeo Technologies, Inc. | Methods of integrating led chips with heat sinks, and led-based lighting assemblies made thereby |
US9285084B2 (en) | 2013-03-14 | 2016-03-15 | Ilumisys, Inc. | Diffusers for LED-based lights |
JP6171634B2 (en) * | 2013-07-03 | 2017-08-02 | 豊田合成株式会社 | lighting equipment |
US9267650B2 (en) | 2013-10-09 | 2016-02-23 | Ilumisys, Inc. | Lens for an LED-based light |
WO2015112437A1 (en) | 2014-01-22 | 2015-07-30 | Ilumisys, Inc. | Led-based light with addressed leds |
US9510400B2 (en) | 2014-05-13 | 2016-11-29 | Ilumisys, Inc. | User input systems for an LED-based light |
CN107079578A (en) * | 2014-09-24 | 2017-08-18 | Hiq太阳能股份有限公司 | Transistor heat management and EMI rwan management solution RWANs for fast edge rates environment |
US10718474B1 (en) | 2014-11-20 | 2020-07-21 | The Light Source, Inc. | Lighting fixture with closely-packed LED components |
US10775028B2 (en) * | 2014-12-11 | 2020-09-15 | Datalogic Ip Tech S.R.L. | Printed circuit board aperture based illumination system for pattern projection |
DE102015200548A1 (en) * | 2015-01-15 | 2016-07-21 | Zf Friedrichshafen Ag | Arrangement for the dissipation of at least one electronic component |
JP2016171147A (en) * | 2015-03-11 | 2016-09-23 | パナソニックIpマネジメント株式会社 | Light emission device and luminaire |
US10161568B2 (en) | 2015-06-01 | 2018-12-25 | Ilumisys, Inc. | LED-based light with canted outer walls |
JP6601055B2 (en) * | 2015-08-20 | 2019-11-06 | 富士通株式会社 | Printed wiring board, electronic device and mounting method |
CN106488686B (en) * | 2015-08-31 | 2020-09-29 | 上海伯乐电子有限公司 | Lighting device, electrical assembly, flexible circuit and heat transfer method |
WO2017107176A1 (en) * | 2015-12-25 | 2017-06-29 | Intel Corporation | Conductive wire through-mold connection apparatus and method |
FR3054640B1 (en) * | 2016-07-28 | 2020-06-12 | Linxens Holding | LIGHT EMITTING DEVICE |
US10504813B2 (en) * | 2016-09-30 | 2019-12-10 | Astec International Limited | Heat sink assemblies for surface mounted devices |
EP3358917A1 (en) * | 2017-02-07 | 2018-08-08 | Siemens Aktiengesellschaft | Printed circuit board with a cooling function |
CN108571695A (en) * | 2017-09-28 | 2018-09-25 | 常州星宇车灯股份有限公司 | A kind of car light projection lamp module |
JP2019087570A (en) * | 2017-11-02 | 2019-06-06 | シチズン電子株式会社 | Light-emitting device and led package |
USD884236S1 (en) | 2018-10-04 | 2020-05-12 | Integra Lifesciences Corporation | Wearable headgear device |
JP7288050B2 (en) | 2018-10-04 | 2023-06-06 | インテグラ・ライフサイエンシーズ・コーポレイション | HEAD WEARABLE DEVICE AND METHOD |
USD901737S1 (en) | 2018-10-04 | 2020-11-10 | Integra Lifesciences Corporation | Wearable headgear device |
CN112366269A (en) * | 2020-12-11 | 2021-02-12 | 江西众能光电科技有限公司 | High heat abstractor of LED |
TWI790671B (en) * | 2021-07-04 | 2023-01-21 | 郭明騰 | Light source module |
CN114071877B (en) * | 2022-01-17 | 2022-04-05 | 诚联电源股份有限公司 | Power module, manufacturing process and packaging mold |
US20240074031A1 (en) * | 2022-08-29 | 2024-02-29 | Creeled, Inc. | Textured metal core printed circuit boards for improved thermal dissipation |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996041507A1 (en) * | 1995-06-07 | 1996-12-19 | The Panda Project | Low profile semiconductor die carrier |
EP1139019A1 (en) * | 2000-03-31 | 2001-10-04 | Relume Corporation | L.E.D. thermal management |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0378247A (en) * | 1989-08-22 | 1991-04-03 | Oki Electric Ind Co Ltd | Semiconductor chip heat radiation mounting structure |
US5698866A (en) * | 1994-09-19 | 1997-12-16 | Pdt Systems, Inc. | Uniform illuminator for phototherapy |
US6045240A (en) * | 1996-06-27 | 2000-04-04 | Relume Corporation | LED lamp assembly with means to conduct heat away from the LEDS |
US5857767A (en) * | 1996-09-23 | 1999-01-12 | Relume Corporation | Thermal management system for L.E.D. arrays |
DE19931689A1 (en) * | 1999-07-08 | 2001-01-11 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Planar LED assembly on thermally-conductive board, increases cooling, component packing density and life, whilst permitting active device integration to form display- or illumination panel in or on e.g. vehicle |
US6517218B2 (en) * | 2000-03-31 | 2003-02-11 | Relume Corporation | LED integrated heat sink |
US6582100B1 (en) * | 2000-08-09 | 2003-06-24 | Relume Corporation | LED mounting system |
US6614103B1 (en) * | 2000-09-01 | 2003-09-02 | General Electric Company | Plastic packaging of LED arrays |
US6864513B2 (en) * | 2003-05-07 | 2005-03-08 | Kaylu Industrial Corporation | Light emitting diode bulb having high heat dissipating efficiency |
-
2003
- 2003-07-28 US US10/629,374 patent/US6999318B2/en not_active Expired - Fee Related
-
2004
- 2004-07-21 CN CNB2004800218487A patent/CN100521199C/en not_active Expired - Fee Related
- 2004-07-21 WO PCT/US2004/023438 patent/WO2005013366A1/en active Application Filing
- 2004-07-21 JP JP2006521906A patent/JP2007500448A/en not_active Withdrawn
- 2004-07-21 EP EP04778791A patent/EP1649515A1/en not_active Withdrawn
- 2004-07-21 KR KR1020067002025A patent/KR20060040727A/en not_active Application Discontinuation
- 2004-07-27 TW TW093122425A patent/TW200509420A/en unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996041507A1 (en) * | 1995-06-07 | 1996-12-19 | The Panda Project | Low profile semiconductor die carrier |
EP1139019A1 (en) * | 2000-03-31 | 2001-10-04 | Relume Corporation | L.E.D. thermal management |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1848924A4 (en) * | 2005-02-17 | 2009-05-06 | Federal Mogul Corp | Led light module assembly |
EP1848924A2 (en) * | 2005-02-17 | 2007-10-31 | Federal-Mogul Corporation | Led light module assembly |
KR100653645B1 (en) | 2005-12-27 | 2006-12-05 | 삼성전자주식회사 | Packcage of light emitting device and method of manufacturing the package |
JP2007234886A (en) * | 2006-03-01 | 2007-09-13 | Compal Communications Inc | Electronic element assembly with thermal dissipation constitution |
DE102006020600A1 (en) * | 2006-04-05 | 2007-10-18 | Trapp, Christian, Dr. | High power light emitting diode positioning method for illumination system, involves providing printed circuit board with continuous recess that corresponds with bulb housing bottoms of light emitting diodes |
JP2007311760A (en) * | 2006-04-20 | 2007-11-29 | Kokubu Denki Co Ltd | Led module |
WO2008108574A1 (en) * | 2007-03-06 | 2008-09-12 | Gwang Sung Lighting Industry Co., Ltd. | Lamp with light emitting diodes using alternating current |
EP2122233A1 (en) * | 2007-03-06 | 2009-11-25 | Gwang Sung Lighting Industry Co., Ltd. | Lamp with light emitting diodes using alternating current |
EP2122233A4 (en) * | 2007-03-06 | 2011-04-06 | Gwang Sung Lighting Industry Co Ltd | Lamp with light emitting diodes using alternating current |
US8029170B2 (en) | 2007-03-06 | 2011-10-04 | Gwangsung Electric Industry Co., Ltd. | Lamp with light emitting diodes using alternating current |
JP2009200187A (en) * | 2008-02-21 | 2009-09-03 | Kamakura Denshi Kogyo Kk | Led mounting method of lighting system, and led lighting system |
US7942563B2 (en) | 2008-02-29 | 2011-05-17 | Tyco Electronics Corporation | LED with light pipe assembly |
US9323139B2 (en) | 2011-08-09 | 2016-04-26 | Seiko Epson Corporation | Light source device and projector |
Also Published As
Publication number | Publication date |
---|---|
CN100521199C (en) | 2009-07-29 |
JP2007500448A (en) | 2007-01-11 |
TW200509420A (en) | 2005-03-01 |
EP1649515A1 (en) | 2006-04-26 |
CN1830085A (en) | 2006-09-06 |
US6999318B2 (en) | 2006-02-14 |
US20050024834A1 (en) | 2005-02-03 |
KR20060040727A (en) | 2006-05-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6999318B2 (en) | Heatsinking electronic devices | |
US6740903B2 (en) | Substrate for light emitting diodes | |
KR101219566B1 (en) | Led with integral thermal via | |
US8405288B2 (en) | LED illumination apparatus | |
US10269681B2 (en) | Semiconductor device and manufacturing method of semiconductor device | |
US20060061969A1 (en) | Circuit arrangement for cooling of surface mounted semi-conductors | |
US8157415B2 (en) | Light emitting diode lighting module and method for making the same | |
US9516748B2 (en) | Circuit board, electronic module and illuminating device having the circuit board, and method for manufacturing the circuit board | |
US20040184272A1 (en) | Substrate for light-emitting diode (LED) mounting including heat dissipation structures, and lighting assembly including same | |
US20080296599A1 (en) | LED Package with Stepped Aperture | |
CN110431664B (en) | Mounting LED elements on a flat carrier | |
KR20100133491A (en) | Thermally conductive mounting element for attachment of printed circuit board to heat sink | |
KR20080101729A (en) | Lighting device | |
US6657866B2 (en) | Electronics assembly with improved heatsink configuration | |
JP7016054B2 (en) | Power supplies, headlights, and mobiles | |
GB2480428A (en) | PCB with metal core having extended heatsink bosses for mounting LEDs | |
US6215663B1 (en) | Printed circuit board assembly with improved thermal performance | |
KR102553052B1 (en) | PCB of heat dissipation type, and method of the same | |
KR101944756B1 (en) | Substrate for electronic component | |
KR101801195B1 (en) | Method for manufacturing led lighting module and led lighting module manufactured by the same | |
KR101220940B1 (en) | Printed circuit board for heat dissipation and method for manufacturing the same | |
JP6403741B2 (en) | Surface mount semiconductor package equipment | |
JP2022076456A (en) | Thermal conduction management architecture for electronic devices | |
CN111050464A (en) | Circuit board with sandwich metal heat sink | |
JP2007234886A (en) | Electronic element assembly with thermal dissipation constitution |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200480021848.7 Country of ref document: CN |
|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2004778791 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020067002025 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2006521906 Country of ref document: JP |
|
WWP | Wipo information: published in national office |
Ref document number: 2004778791 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1020067002025 Country of ref document: KR |