CN100388516C - Light source module - Google Patents

Abstract

A light source module, a light emitting diode assembly and the combining method and the structure of the carrier substrate, a light emitting diode assembly composed of a light emitting diode and a carrier composition, the carrier and the bottom of this a fixing portion extending abutment surface is formed; the carrier substrate slightly larger than the outer diameter is formed on the light emitting diode and smaller than the outer diameter of the outer edge portion of the perforated fixed, this way, when the light emitting diode component is pasted on a heat sink, the carrier substrate so that pressure can be administered to a light emitting diode assembly between the heat sink and a tighter integration and increased effectiveness of heat dissipation.

Description

The light source module

FIELD

The present invention relates to a light source module, and more particularly to a combination structure between the modules in a light emitting diode assembly with the carrier substrate.

Background technique

In the known light source module, a combination of a light emitting diode assembly side between the carrier substrate and

The method and compositions completed structure is pasted on a heat sink steps 1A to FIG 1C. First, 12 and 11 mainly composed of the substrate 12 for carrying a plurality of light emitting diode elements consisting of light emitting diode modules Referring to FIG sectional view, the light source module shown in FIG. 1A. Ii a first substrate having opposite surfaces LLL (bottom surface) 112 and a second surface (top surface), and formed with a plurality of perforations 11 through the substrate 113, and 111 on the first surface of the substrate 11 is formed with a patterned conductive line 114.

With continued reference to Figure 1A, each LED assembly 12 is composed of a carrier 121 and a light emitting diode 122, and the pins 124 121 are electrically connected to the plurality of light emitting diode is exposed from the carrier sidewall 122.

1B, the LED assembly 12 when moved from the first surface 111 and inserted into a corresponding perforation 113, the light emitting diode 121 is disposed through the substrate 11 and protrudes from the second surface 112, and exposed against the pin 124 through holes 113 on the patterned conductive traces around 114: at this time, the pin 13 welded 124 to the patterned conductive line 114 is completed and the light emitting diode 12 is electrically connected to the composite structure 11 to a substrate using liquid solder.

Referring back to Figure 1C, in order to effectively discharge heat energy generated by the operation of the light emitting diode 12, the light emitting diode can be welded to the substrate 12 in combination to complete the inverted 11 to make a 180 degrees, the bottom surface of the light emitting diode 12 of the carrier 122 against in the thermally conductive pad 14, while the thermal pad 14

Contacted with a surface of the heat dissipation member 15; however, when administered to a downward pressure of the substrate 11 in the arrow direction so that the light emitting diode and wish to have a closer contact between the heat sink 12 and the heat dissipation member 115 to increase the effectiveness of the light emitting diode 12 Since the pins 124 directly receives the substrate 11 administered pressure, easily lead to the occurrence of bending deformation of the pin 124, and may even damage the patterned conductive line 114 from occurring.

SUMMARY

Background of the Invention In view of the above problems, the combined structure of the LED assembly and the carrier substrate of the light source module can not be in close contact with the heat sink, this method provides a combination of a light emitting diode assembly between the carrier substrate and a light module and this composite structure, which allows the light emitting diode assembly object in close contact to cover the heat sink member while the light emitting diode assembly itself is not deformed or damaged occurs.

According to the above-described object, an aspect of the present invention are as follows:

A light source module comprising:

A substrate having thereon a first perforation; and

A light emitting diode assembly comprising a light emitting diode and a carrier, characterized in that, a bottom support forming the outer edge of the first fixing portion is larger than a outer diameter of the perforations, the carrier and the fixing portion of the projection extending from the bottom of the carrier side walls, wherein the light emitting diode through the first through hole, and the fixing portion of the bottom surface abuts against the substrate.

The present invention further provides a further aspect: a light source module characterized in that, comprising:

A substrate having a through slot and the opposite substrate having a first surface and a second surface;

A plurality of light emitting diode modules, to be arranged through slot, wherein each of the light emitting diode assembly composed of a light emitting diode and a carrier composed of a fixed portion and an outer edge is formed larger than the width of the through slot in the bottom of the carrier, the when the fixing portion extends from the bottom of the carrier and projecting from the side walls of the carrier, such that a plurality of light emitting diode modules from the first surface of the substrate is inserted into the through slot, the plurality of light emitting diodes can be simultaneously protrudes through the through slot in the

A second surface, which abuts against the fixing portion on the first surface adjacent to the periphery of the through groove.

Technical effects of the invention are: a combination method and structure of the light source module of the LED assembly and the carrier substrate, the light emitting diode in the bottom of the light emitting diode assembly for carrying out a fixed carrier extending abutment portion is formed, and fitted slightly larger than the outer diameter of the carrier is formed on a substrate and an outer diameter smaller than the perforations diode fixing portion of the outer periphery, a result, when the light emitting diode component is pasted on a heat sink, the substrate can be administered to a pressure and heat so that the light emitting diode assembly between pieces of a tighter integration and increased effectiveness of heat dissipation.

BRIEF DESCRIPTION

1A to 1C are known techniques, the light emitting diode assembly fitted onto a carrier substrate and on the heat dissipation member against the step of the process;

2A to 2C according to a preferred embodiment of the present invention to provide a light emitting diode component and fitted onto the carrier substrate against the process step of fins;

FIG. 2D accordance with a preferred embodiment of the present invention, the light source module is provided in combination complete a schematic perspective view;

FIG. 2E accordance with another preferred embodiment of the present invention is provided in a perspective schematic view of the combined substrate through the groove and having a light emitting diode assembly;

FIG. 2F and FIG. 2G according to a particular preferred embodiment of the present invention in a schematic cross-sectional view of the embodiment of the light source module is formed a reflective sheet provided;

FIG. 2H accordance with another preferred embodiment of the present invention are provided in a cross-sectional schematic view of the heat dissipating fin is formed in the shape of fins in the light source module;

FIG. 2I 2J shape change to a light emitting diode assembly fixed portion of the present invention.

DESCRIPTION OF REFERENCE NUMERALS:

11 substrate

The first surface 111

The second surface 112

113 perforation

The patterned conductive trace 114

12 light emitting diode assembly

121 light emitting diodes

122 carrier

124 Pin

Liquid solder 13

14 thermal pad

The heat sink 15

21 substrate

The first surface 211

The second surface 212

213 first perforation

The patterned conductive trace 214

215 through slots

22 light emitting diode assembly

221 light emitting diodes

222 carrier

The fixed portion 223

2231 abutment surface

224 Pin

Liquid solder 23

24 thermal pad

The heat sink 25

The reflective sheet 26

261 second perforation

27 cooling fins

detailed description

Next is a detailed description of the present invention, is described in the following description of the light source module and a light emitting diode assembly itself does not include a detailed construction and operating principle of the composition, followed by the prior art to the present invention, the focus here only for the formula reference to help illustrate the present invention. In the drawings and the following context also not related to the light source module based on actual scale, its role

Expressed only in the features of the present invention. Secondly, when each component or structure of an embodiment of the present invention in the drawings in the description of description and should not have defined as cognition, i.e. the following description when no constraints on the number of special emphasis, and spirit of the invention applications can be pushed, and the plurality of structural components or structures coexist.

The combination method and structure provides a light emitting diode package module with a carrier substrate according to the preferred embodiment of the present invention, and this close contact structures overlying the composition

A heat sink member. First, the main assembly of a plurality of light emitting diodes 22 and a substrate for carrying a light emitting diode assembly consisting Referring to FIG 21 a schematic cross-sectional view, the light source module shown in FIG. 2A. In the present embodiment, the substrate 21 may be a printed circuit board or other multilayer sheet having a first opposing surface 211 (bottom surface) 212 and a second surface (top surface), and forming a plurality of through the substrate 21 and the corresponding LED assembly 22 and the first position of the number of perforations 213; in addition, the first surface 211 is exposed on the substrate 21 patterned conductive line 214 made of copper foil or other conductive layer is formed.

With continued reference to Figure 2A, a light emitting diode assembly according to the present embodiment 22 is provided by a light emitting diode 221 and a carrier 222, where the outer diameter of the light emitting diode 221 is slightly smaller than the outer diameter of the first through hole 213, but the bottom support 222 a fixing portion 223 formed by extending the outer edge is larger than the outer diameter of the first through hole 213, a plurality of pins 224 and 221 are electrically connected to the light emitting diode 223 is also exposed out from the upper side wall portion is fixed.

2B, the first perforated section when the fixing assembly 22 and moving the light emitting diode 211 is inserted from the first surface 213 corresponding to the light emitting diodes 221 and 213 can be perforated by a first projection 21 on the second surface of the substrate 212, and 223 the abutment portion 213 adjacent the periphery of the first perforations can not be disposed through the first surface 211; thus, the substrate 22 can use the liquid solder 23 on a pin 224 welded to the patterned conductive line 214 is completed light emitting diode assembly 21 is electrically connected to the composite structure.

Referring to Figure 2C, in order to effectively discharge heat emitting diode 221 generated by the operation of the present embodiment, the light emitting diode assembly 22 will make a 180 degree turn in combination with the structure of the substrate 21,

After transfection directly by the plurality of thermally conductive surface contact carrier 24 and the bottom surface 222 and a heat sink pad 25; and as the carrier according to the present embodiment has a fixing portion 222 provided in an outer edge 213 is greater than the outer diameter of the first perforations 223, thus administering the direction of arrow 21 of the substrate - the pressure let-down light emitting diode assembly has a tighter bond between the heat sink 2522 and the cooling effect is increased, and the light emitting diode assembly known carriers of the pin because the voltage at the substrate deformed even with the patterned conductive trace from the problem can be avoided.

While the combination of a light source module which completed a perspective schematic diagram Referring to Figure 2D, this figure shows the light emitting diode 221 each have a first perforation through the corresponding projection 213 and the second surface 212 of the substrate 21. In accordance with other specific embodiments of the invention embodiment, the substrate may be directly formed with a corresponding plurality of through slots the light emitting diode elements, for example, see FIG. 2E, a through slot 215 formed on the substrate 21, and this through 215 width mediated groove between the outer diameter of the light emitting diode 221 and a fixed portion outer edge 213, this way, a plurality of light emitting diodes 221 can be simultaneously through this projecting through slots 215 and 212 on the second surface of the substrate 21, and each of the light emitting diode assembly a fixing portion 223 formed around the abutment surface 2231 can be adjacent to this groove through the first surface against the substrate 21 (not shown) on the 215.

Further, referring to FIG. 2F, the present invention also optionally features or components of the light emitting diode light source module 22 is a reflecting member increases, for example, when the light emitting diode of the present embodiment is used in a light emitting diode 221 side emission type (sideemitting) 22 when the second substrate can be 21 212 pasted on its surface 26 (or forming a reflective surface) a reflective sheet, and a second plurality of perforations 213 corresponding to the first position of the perforations 261 is formed on the reflective sheet 26, and this Alternatively diameter of the second perforation 261 as shown in the second figure F, is greater than the outer diameter of the light emitting diode, light emitting diode 221 and so directly through this second perforation 261 and protrudes outside the reflection sheet 26; or, in accordance with the present invention in other embodiments, the reflective sheet is formed on a second perforated outer diameter less than or equal to the light emitting diode, shown in Figure 2G, and allows a tighter fit results between the reflective sheet and the light emitting diode and to avoid the occurrence of light leakage the phenomenon, it can reach more light output efficiency.

Further, in accordance with other embodiments of the present invention, in addition to the heat dissipation member selected from a heat

An outer sheet, also shown in FIG. 2H selected from a heat-dissipating fins 27 (heat sink) is increased cooling effect; and the thermal conductivity between the heat dissipating fins 27 222 disposed on the bottom surface of each support pad 24 may also be as in the structure shown in FIG whole slice 2H.

Referring to FIG. 2 I and J in FIG. 2J second, a light emitting diode assembly according to the present embodiment is provided which has a perspective schematic view of a different shape 22 changes, wherein each of the base fixing portion 223 are extending support 222, the purpose of the forming a difference is generated off abutment surface 2231, such that the light emitting diode 221 is inserted from above the first perforated so that the light emitting diode substrate 221 and the fixed portion when the carrier portion 222, the outer edge of the aperture 223 can be larger than the perforations whereby abutment surface 2231 is against the first perforated outer, which can smoothly follow the pin 224 and the welding step of patterning the conductive lines; in addition, when the light emitting diode assembly 22 in combination with the structure of the substrate by the thermal pad against the surface to the heat sink , the pressure of the light emitting diode substrate assembly 22 does not direct compression administering patterned conductive trace pins 224 are welded together. The exterior assembly of the present invention, the light emitting diode 22 is provided which may be fixed portion 223 as shown in FIG. 21 and FIG. 2J, is a cubic type or a cylindrical type, which can be formed larger than the perforation (or through slots) range 2231 against the surface to achieve the same effect against.

The above-described embodiments are illustrative only and characteristics of the technical idea of ​​the present invention, it is an object to make the person skilled in the art to understand the present invention and according to embodiments, when the scope of the patent is not limited to the present invention, i.e., Generally under this or alterations of the invention disclosed spirit modifications made, it should still fall within the scope of the present invention.

Claims (13)

1. 1. A light source module comprising: a substrate having thereon a first through hole; and a light emitting diode assembly comprising a light emitting diode and a carrier, characterized in that an outer edge forming a bottom portion of the carrier is greater than the first through hole an outer diameter of a fixing portion, the fixing portion extends from the bottom of the carrier and projecting from the side wall of the support, wherein the light emitting diode through the first through hole, and the fixing portion of the bottom surface abuts against the substrate.
2. 2. The light source module as claimed in claim l, characterized in that the bottom surface further comprising a heat sink member connected to the carrier.
3. The light source module according to claim 2, characterized in that the heat sink comprises a heat sink.
4. The light source module according to claim 2, characterized in that, further comprising a thermal pad disposed between the support and the heat sink.
5. The light source module as claimed in claim l, characterized in that, further comprising a reflective sheet, the reflective sheet disposed on the top surface of the substrate.
6. The light source module according to claim 5, characterized in that, having a second through hole corresponding to the first punching position on the reflective sheet, whereby the light emitting diode through the second through hole and protruding from the reflective sheet .
7. The light source module according to claim 6, characterized in that the second perforated outer diameter of the pore diameter equal to or smaller than the light emitting diode.
8. 8. - seed light source module, which is characterized by comprising - a substrate having a through slot and the opposite substrate having a first surface and a second surface; and a plurality of light emitting diode modules, the configuration of the grooves should wear, wherein each of the light emitting diode assembly composed of a light emitting diode and a carrier composition, and to the outer edge of the bottom support is formed with a fixing portion is greater than the width of the through slot, extending from the bottom of the fixing portion of the support and the projection when the carrier side wall, such that the plurality of light emitting diode elements from the first surface of the substrate is inserted into the through slot, the plurality of light emitting diodes can be simultaneously protrudes through the slot through to the second surface, and the fixing portion of the against the periphery of the through slot is proximate to the first surface.
9. The light source module as claimed in claim 8, characterized in that, further comprising a heat sink member connected to a bottom surface of the carrier.
10. 10. The light source module according to claim 9, characterized in that the heat sink comprises a heat sink.
11. 11. The light source module according to claim 9, characterized in that, further comprising a thermal pad disposed between the support and the heat sink.
12. 12. The light source module according to claim 8, characterized in that, further comprising a reflective sheet disposed on a second surface of the substrate.
13. 13. The light source module as claimed in claim 12, characterized in that, having a light emitting diode assembly to be perforated on the reflective sheet, whereby the light emitting diode through the through hole and protruding from the reflective sheet.