CN100388516C - Light source module - Google Patents

Light source module Download PDF

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Publication number
CN100388516C
CN100388516C CNB2005100759925A CN200510075992A CN100388516C CN 100388516 C CN100388516 C CN 100388516C CN B2005100759925 A CNB2005100759925 A CN B2005100759925A CN 200510075992 A CN200510075992 A CN 200510075992A CN 100388516 C CN100388516 C CN 100388516C
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emitting diode
carrier
source module
light source
light
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CN1697207A (en
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周信宏
刘邦炫
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AUO Corp
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AU Optronics Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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Abstract

A method for combining a light emitting diode assembly and a bearing substrate in a light source module and a structure thereof are provided, wherein the light emitting diode assembly consists of a light emitting diode and a carrier, and a fixing part extends out of the bottom of the carrier to form a leaning surface; the bearing substrate is provided with a through hole with the outer diameter slightly larger than that of the light-emitting diode and smaller than the outer edge of the fixing part, so that when the light-emitting diode component is attached to a heat dissipation part, the bearing substrate can apply pressure to enable the light-emitting diode component and the heat dissipation part to be tightly combined, and the heat dissipation effect is improved.

Description

光源模块 Light source module

技术领域 technical field

本发明涉及一种光源模块,特别是涉及一种光源模块内发光二极管组件与承载基板间的组合方式及其结构。The invention relates to a light source module, in particular to a combination method and structure of a light emitting diode assembly and a carrier substrate in the light source module.

背景技术 Background technique

在已知的光源模块中,发光二极管组件与承载基板之间的组合方法以及将组合完成的结构贴覆于一散热件上的步骤可参照图1A至图1C。首先参照图1A所示的剖面示意图,光源模块主要由复数个发光二极管组件12以及用来承载发光二极管组件12的基板11所组成。基板11具有相对的第一表面111(底面)与第二表面112(顶面),并形成有复数个贯穿基板11的穿孔113,而在基板11的第一表面111上则形成有图案化导电线路114。In the known light source module, the assembly method between the LED assembly and the carrier substrate and the steps of pasting the assembled structure on a heat sink can refer to FIGS. 1A to 1C . Referring first to the schematic cross-sectional view shown in FIG. 1A , the light source module is mainly composed of a plurality of LED assemblies 12 and a substrate 11 for carrying the LED assemblies 12 . The substrate 11 has an opposing first surface 111 (bottom surface) and a second surface 112 (top surface), and is formed with a plurality of through holes 113 penetrating through the substrate 11, and a patterned conductive pattern is formed on the first surface 111 of the substrate 11. Line 114.

继续参照图1A,每一发光二极管组件12由一发光二极管121以及一载体122所组成,而复数个与发光二极管121电性连接的引脚124则自载体122侧壁外露。Continuing to refer to FIG. 1A , each LED assembly 12 is composed of a LED 121 and a carrier 122 , and a plurality of pins 124 electrically connected to the LED 121 are exposed from the sidewall of the carrier 122 .

参照图1B,当移动发光二极管组件12并自第一表面111插入对应的穿孔113时,发光二极管121穿设基板11并突出于第二表面112,而外露的引脚124则抵靠在穿孔113周围的图案化导电线路114上;此时,即可利用焊液13将引脚124焊接于图案化导电线路114上而完成发光二极管12与基板11间的电性连接与组合结构。Referring to FIG. 1B , when the light emitting diode assembly 12 is moved and inserted into the corresponding through hole 113 from the first surface 111 , the light emitting diode 121 penetrates the substrate 11 and protrudes from the second surface 112 , while the exposed pin 124 abuts against the through hole 113 on the surrounding patterned conductive circuit 114; at this time, the pin 124 can be welded on the patterned conductive circuit 114 by using the solder liquid 13 to complete the electrical connection and combination structure between the LED 12 and the substrate 11.

参照图1C,为了将发光二极管12运作时所产生的热能有效排出,即可将焊接组合完成的发光二极管12与基板11做一180度的翻转后,将发光二极管12的载体122的底面抵靠于导热垫14上,而导热垫14再与一散热件15表面接触;但是,当沿箭头方向施予基板11一向下的压力而欲让发光二极管12与散热件115之间有一更紧密的接触而增加散热功效时,发光二极管12上的引脚124由于直接承受基板11所施予的压力,因此容易导致引脚124发生变形弯曲的情况,甚至可能与图案化导电线路114发生脱离而损坏。Referring to FIG. 1C , in order to effectively discharge the heat energy generated during the operation of the LED 12 , the soldered LED 12 and the substrate 11 can be flipped 180 degrees, and then the bottom surface of the carrier 122 of the LED 12 is placed against the bottom surface of the substrate 11. On the heat conduction pad 14, and the heat conduction pad 14 contacts with the surface of a heat sink 15 again; When increasing the heat dissipation effect, the pins 124 on the LED 12 are directly subjected to the pressure exerted by the substrate 11 , so the pins 124 are easily deformed and bent, and may even be detached from the patterned conductive circuit 114 to be damaged.

发明内容 Contents of the invention

有鉴于上述发明背景中,光源模块内的发光二极管组件与承载基板的组合结构无法紧密与散热件接触的问题,于此提供一种光源模块内发光二极管组件与承载基板之间的组合方法及此组合结构,其目的在让发光二极管组件紧密贴覆至散热件上的同时,发光二极管组件本身也不会发生变形或是损坏的情况。In view of the above-mentioned background of the invention, the combined structure of the light emitting diode assembly and the carrier substrate in the light source module cannot be in close contact with the heat sink, hereby provides a combination method between the light emitting diode assembly and the carrier substrate in the light source module and its The purpose of the composite structure is to allow the LED assembly to be closely adhered to the heat sink, and at the same time, the LED assembly itself will not be deformed or damaged.

根据上述的目的,本发明提供的一技术方案如下:According to above-mentioned purpose, a technical scheme that the present invention provides is as follows:

一种光源模块,包括:A light source module, comprising:

一基板,其上具有一第一穿孔;以及a substrate having a first through hole; and

一发光二极管组件,包括有一发光二极管及一载体,其特征是,该载体底部形成一外缘大于该第一穿孔外径的一固定部,该固定部由该载体的底部延伸而凸出该载体的侧壁,其中该发光二极管贯穿该第一穿孔,而该固定部则抵接于该基板的底面。A light-emitting diode assembly, including a light-emitting diode and a carrier, is characterized in that the bottom of the carrier forms a fixing portion whose outer edge is larger than the outer diameter of the first through hole, and the fixing portion extends from the bottom of the carrier to protrude from the carrier wherein the light emitting diode penetrates through the first through hole, and the fixing part abuts against the bottom surface of the substrate.

本发明还提供另一技术方案:The present invention also provides another technical solution:

一种光源模块,其特征是,包括:A light source module, characterized by comprising:

一基板,具有一穿槽,且该基板具有相对的一第一表面与一第二表面;以及A base plate has a through groove, and the base plate has a first surface and a second surface opposite to each other; and

复数个发光二极管组件,对应该穿槽配置,其中,每一该发光二极管组件由一发光二极管以及一载体所组成,并于该载体底部形成有外缘大于该穿槽宽度的一固定部,该固定部由该载体的底部延伸而凸出该载体的侧壁,使得复数个发光二极管组件自该基板的该第一表面插入该穿槽时,该复数个发光二极管能够同时通过该穿槽而突出于该第二表面,而该固定部则抵靠于该第一表面上邻近该穿槽的周围。A plurality of light-emitting diode components are arranged corresponding to the groove, wherein each light-emitting diode component is composed of a light-emitting diode and a carrier, and a fixing part whose outer edge is larger than the width of the groove is formed on the bottom of the carrier, the The fixing part extends from the bottom of the carrier and protrudes from the side wall of the carrier, so that when a plurality of light emitting diode assemblies are inserted into the through groove from the first surface of the substrate, the plurality of light emitting diodes can protrude through the through groove at the same time on the second surface, and the fixing part abuts against the periphery of the first surface adjacent to the through groove.

本发明的技术效果为:光源模块中发光二极管组件与承载基板的组合方法及其结构,在发光二极管组件内用来承载发光二极管的载体底部延伸出一固定部而形成抵靠面,并配合在承载基板上形成外径略大于二极管外径并小于固定部外缘的穿孔,如此一来,当发光二极管组件贴覆于一散热件上时,基板便可施予一压力让发光二极管组件与散热件之间有一更紧密的结合而增加散热的功效。The technical effect of the present invention is: the combination method and structure of the light-emitting diode component and the carrier substrate in the light source module, a fixing part extends from the bottom of the carrier used to carry the light-emitting diode in the light-emitting diode component to form an abutment surface, and fits on the A perforation with an outer diameter slightly larger than the outer diameter of the diode and smaller than the outer edge of the fixing part is formed on the carrier substrate. In this way, when the LED assembly is attached to a heat sink, the substrate can apply a pressure to allow the LED assembly to dissipate heat. There is a tighter bond between the components to increase the efficiency of heat dissipation.

附图说明 Description of drawings

图1A至图1C为已知技术,将发光二极管组件装配至承载基板上并抵靠于散热件上的步骤流程;Figures 1A to 1C are the steps of assembling the light-emitting diode assembly on the carrier substrate and leaning against the heat sink in the known technology;

图2A至图2C依据本发明的一较佳具体实施例所提供将发光二极管组件装配至承载基板上并抵靠于散热件上的步骤流程;2A to 2C provide a flow of steps for assembling the light-emitting diode assembly on the carrier substrate and leaning against the heat sink according to a preferred embodiment of the present invention;

图2D依据本发明的一较佳具体实施例所提供组合完成的光源模块立体示意图;FIG. 2D is a schematic perspective view of a light source module assembled according to a preferred embodiment of the present invention;

图2E依据本发明的其它较佳具体实施例所提供具有穿槽的基板与发光二极管组件组合在一起时的立体示意图;FIG. 2E is a three-dimensional schematic diagram of a combination of a substrate with through grooves and a light-emitting diode assembly according to other preferred embodiments of the present invention;

图2F与图2G依据本发明的一较佳具体实施例所提供形成一反射片于光源模块上的剖面示意图;FIG. 2F and FIG. 2G are schematic cross-sectional views of forming a reflective sheet on the light source module according to a preferred embodiment of the present invention;

图2H依据本发明的其它较佳具体实施例所提供在光源模块中形成一散热鳍片外型的散热件时的剖面示意图;FIG. 2H is a schematic cross-sectional view when a heat sink in the form of a heat sink is formed in the light source module according to other preferred embodiments of the present invention;

图2I至图2J为本发明发光二极管组件其固定部的外形变化。FIG. 2I to FIG. 2J are the appearance changes of the fixing part of the light emitting diode assembly of the present invention.

图中符号说明:Explanation of symbols in the figure:

11     基板11 Substrate

111    第一表面111 first surface

112    第二表面112 second surface

113    穿孔113 piercing

114    图案化导电线路114 patterned conductive lines

12     发光二极管组件12 LED components

121    发光二极管121 LEDs

122    载体122 carrier

124    引脚124 pins

13     焊液13 soldering fluid

14     导热垫14 thermal pad

15     散热件15 heat sink

21     基板21 Substrate

211    第一表面211 first surface

212    第二表面212 second surface

213    第一穿孔213 first piercing

214    图案化导电线路214 patterned conductive lines

215    穿槽215 Grooving

22     发光二极管组件22 LED components

221    发光二极管221 LEDs

222    载体222 carrier

223    固定部223 Fixed part

2231   抵靠面2231 abutment surface

224    引脚224 pins

23     焊液23 soldering fluid

24     导热垫24 thermal pad

25     散热件25 heat sink

26     反射片26 reflector

261    第二穿孔261 second piercing

27     散热鳍片27 cooling fins

具体实施方式 Detailed ways

接下来是本发明的详细说明,下述说明中对光源模块以及发光二极管组件本身的描述并不包括详细的构造组成以及运作原理,本发明所沿用的现有技艺,在此仅作重点式的引用,以助本发明的阐述。而且下述内文中有关光源模块的附图亦并未依据实际比例绘制,其作用仅在表达出本发明的特征。其次,当本发明的实施例图式中的各组件或结构在描述说明时,不应以此作为有限定的认知,即如下的说明未特别强调数目上的限制时,本发明的精神与应用范围可推及多数个组件或结构并存的结构上。The following is a detailed description of the present invention. The description of the light source module and the light emitting diode assembly itself in the following description does not include detailed structural components and operating principles. The prior art used by the present invention is only emphasized here. Cited to help explain the present invention. Moreover, the drawings related to the light source module in the following texts are not drawn according to the actual scale, and their function is only to express the characteristics of the present invention. Secondly, when each component or structure in the drawings of the embodiments of the present invention is described, it should not be regarded as a limited cognition, that is, when the following description does not particularly emphasize the limitation on the number, the spirit of the present invention and The scope of application can be extended to structures where multiple components or structures coexist.

依据本发明的一较佳具体实施例提供一种光源模块内发光二极管组件与承载基板的组合方法及其结构,并可将此组合结构紧密贴覆于一散热件上。首先参照图2A所示的剖面示意图,光源模块主要由复数个发光二极管组件22以及用来承载发光二极管组件的基板21所组成。在本实施例中,基板21可以是一印刷电路板或其它多层板,其具有相对的第一表面211(底面)与第二表面212(顶面),并形成复数个贯穿基板21且对应发光二极管组件22位置以及数量的第一穿孔213;此外,在基板21的第一表面211上暴露出由铜箔或其它导电层所形成的图案化导电线路214。According to a preferred embodiment of the present invention, there is provided a combination method and structure of a light emitting diode component in a light source module and a carrier substrate, and the combined structure can be closely attached to a heat sink. Referring first to the schematic cross-sectional view shown in FIG. 2A , the light source module is mainly composed of a plurality of LED assemblies 22 and a substrate 21 for carrying the LED assemblies. In this embodiment, the substrate 21 can be a printed circuit board or other multi-layer board, which has a first surface 211 (bottom surface) and a second surface 212 (top surface) opposite, and forms a plurality of through the substrate 21 and corresponding The position and number of the first through holes 213 of the LED assembly 22 ; in addition, the patterned conductive circuit 214 formed by copper foil or other conductive layers is exposed on the first surface 211 of the substrate 21 .

继续参照图2A,本实施例所提供的发光二极管组件22由一发光二极管221以及一载体222所组成,其中,发光二极管221的外径略小于第一穿孔213的外径,但载体222底部则延伸形成一外缘大于第一穿孔213外径的固定部223,并且复数个与发光二极管221电性连接的引脚224也自固定部223侧壁上外露出来。Continuing to refer to FIG. 2A, the light emitting diode assembly 22 provided in this embodiment is composed of a light emitting diode 221 and a carrier 222, wherein the outer diameter of the light emitting diode 221 is slightly smaller than the outer diameter of the first through hole 213, but the bottom of the carrier 222 is A fixing portion 223 is formed with an outer edge larger than the outer diameter of the first through hole 213 , and a plurality of pins 224 electrically connected to the LEDs 221 are also exposed from the sidewall of the fixing portion 223 .

参照图2B,当移动发光二极管组件22并自第一表面211插入对应的第一穿孔213时,发光二极管221就可通过第一穿孔213并突出于基板21的第二表面212,而固定部223则抵靠于第一表面211上邻近第一穿孔213周围的部分而无法穿设;如此,就可利用焊液23将引脚224焊接于图案化导电线路214上而完成发光二极管组件22与基板21间的电性连接与组合结构。Referring to FIG. 2B, when the light emitting diode assembly 22 is moved and inserted into the corresponding first through hole 213 from the first surface 211, the light emitting diode 221 can pass through the first through hole 213 and protrude from the second surface 212 of the substrate 21, and the fixing portion 223 Then it is against the part of the first surface 211 adjacent to the first through hole 213 and cannot be penetrated; in this way, the pin 224 can be soldered to the patterned conductive circuit 214 by using the solder liquid 23 to complete the light emitting diode assembly 22 and the substrate. 21 electrical connections and combination structures.

参照图2C,为了将发光二极管221运作时所产生的热能有效排出,本实施例将发光二极管组件22与基板21的组合结构做一180度的翻转后直接藉复数个导热垫24而将载体222底面与一散热件25的表面接触;而由于本实施例所提供的载体222具有外缘大于第一穿孔213外径的固定部223,因此可沿箭头方向施予基板21一向下的压力而让发光二极管组件22与散热件25之间有一更紧密的结合而增加散热的功效,而已知的发光二极管组件的载体其引脚因为基板下压而产生变形甚至与图案化导电线路脱离的问题就可以避免。Referring to FIG. 2C , in order to effectively discharge the heat energy generated when the LED 221 is in operation, in this embodiment, the combined structure of the LED assembly 22 and the substrate 21 is flipped 180 degrees, and then the carrier 222 is directly borrowed from a plurality of thermal pads 24 . The bottom surface is in contact with the surface of a heat sink 25; and since the carrier 222 provided by this embodiment has a fixed portion 223 whose outer edge is larger than the outer diameter of the first through hole 213, a downward pressure can be applied to the substrate 21 in the direction of the arrow to allow There is a tighter combination between the light-emitting diode assembly 22 and the heat sink 25 to increase the heat dissipation effect, and the problem that the pins of the carrier of the known light-emitting diode assembly are deformed or even separated from the patterned conductive circuit due to the pressing down of the substrate can be eliminated. avoid.

而组合完成的光源模块其立体示意图可参照图2D,此图显示每一发光二极管221已通过对应的第一穿孔213并突出于基板21的第二表面212。而在依据本发明的其它具体实施例中,基板也可直接形成有对应复数个发光二极管组件的穿槽,例如参照图2E,在基板21上形成有一穿槽215,并且此穿槽215宽度介于发光二极管221外径以及固定部213外缘之间,如此一来,复数个发光二极管221就可同时通过此穿槽215并且突出于基板21的第二表面212,而每一发光二极管组件的固定部223所形成的抵靠面2231均可抵靠于基板21的第一表面(图中未示)上邻近此穿槽215的周围。The perspective view of the assembled light source module can be referred to FIG. 2D , which shows that each light emitting diode 221 has passed through the corresponding first through hole 213 and protrudes from the second surface 212 of the substrate 21 . In other specific embodiments according to the present invention, the substrate can also be directly formed with through grooves corresponding to a plurality of LED components. For example, referring to FIG. 2E, a through groove 215 is formed on the substrate 21, and the width of the through groove 215 is between between the outer diameter of the light emitting diode 221 and the outer edge of the fixing part 213, so that a plurality of light emitting diodes 221 can simultaneously pass through the slot 215 and protrude from the second surface 212 of the substrate 21, and each light emitting diode assembly The abutting surface 2231 formed by the fixing portion 223 can abut against the periphery of the through groove 215 on the first surface (not shown in the figure) of the substrate 21 .

另外,参照图2F,本发明也可视发光二极管组件22的特性或光源模块的需要而增加一反射件,例如当本实施例所采用的发光二极管221为一边射型(side emitting)的发光二极管22时,就可在基板21的第二表面212上贴覆一反射片26(或形成一反射表面),而在反射片26上形成复数个对应第一穿孔213位置的第二穿孔261,并且此第二穿孔261的外径可选择如第二F图中所示,大于发光二极管外径,而让发光二极管221直接通过此第二穿孔261并突出于反射片26外;或者在依据本发明的其它具体实施例中,在反射片上形成一外径等于或小于发光二极管的第二穿孔,如图2G所示,而能让反射片与发光二极管之间有一更紧密的贴合效果而避免发生漏光的现象,故可以达到更有效能的光输出。In addition, referring to FIG. 2F, the present invention may also add a reflector according to the characteristics of the light emitting diode assembly 22 or the needs of the light source module. For example, when the light emitting diode 221 used in this embodiment is a side emitting light emitting diode 22, a reflective sheet 26 (or form a reflective surface) can be pasted on the second surface 212 of the substrate 21, and a plurality of second perforations 261 corresponding to the positions of the first perforations 213 are formed on the reflective sheet 26, and The outer diameter of this second perforation 261 can be selected as shown in the second F figure, which is larger than the outer diameter of the light-emitting diode, so that the light-emitting diode 221 directly passes through the second perforation 261 and protrudes outside the reflector 26; or in accordance with the present invention In other specific embodiments, a second perforation with an outer diameter equal to or smaller than the light-emitting diode is formed on the reflector, as shown in FIG. The phenomenon of light leakage can achieve more efficient light output.

另外,在依据本发明的其它实施例中,散热件除了可选自一散热片外,也可如图2H中所示选自一散热鳍片27(heat sink)而增加散热的效果;而设置于每一载体222底面与散热鳍片27之间的导热垫24也可如图2H中所示为一整片的结构。In addition, in other embodiments according to the present invention, in addition to being selected from a heat sink, the heat sink can also be selected from a heat sink 27 (heat sink) as shown in Figure 2H to increase the effect of heat dissipation; and set The heat conduction pad 24 between the bottom surface of each carrier 222 and the heat dissipation fins 27 can also be a whole structure as shown in FIG. 2H .

参照图2I与第二J图2J,其本实施例所提供的发光二极管组件22具有不同外型变化的立体示意图,其中,每一种固定部223均为载体222底部的延伸,其目的在产生断差而形成一抵靠面2231,使得发光二极管221自基板上方插入第一穿孔而让发光二极管221以及部分载体222通过时,外缘大于穿孔孔径的固定部223就能藉此抵靠面2231而被抵靠在第一穿孔外,因而能顺利进行后续引脚224与图案化导电线路的焊接步骤;此外,当发光二极管组件22与基板的组合结构藉导热垫而抵靠至散热件表面时,基板所施予发光二极管组件22的压力就不会直接压迫与图案化导电线路焊接在一起的引脚224。而本发明所提供的发光二极管组件22其固定部223的外型可如图2I以及图2J中所示,为一立方体型或是圆柱型,其均可形成大于穿孔(或穿槽)范围的抵靠面2231而达到相同的抵靠效果。Referring to FIG. 2I and the second J to FIG. 2J, the light-emitting diode assembly 22 provided in this embodiment has a three-dimensional schematic diagram of different appearance changes, wherein each fixing part 223 is an extension of the bottom of the carrier 222, and its purpose is to produce An abutment surface 2231 is formed by a gap, so that when the light-emitting diode 221 is inserted into the first through hole from above the substrate to allow the light-emitting diode 221 and part of the carrier 222 to pass through, the fixing part 223 whose outer edge is larger than the aperture of the through hole can use this abutment surface 2231 and be against the outside of the first through hole, so that the subsequent welding steps of the pin 224 and the patterned conductive circuit can be carried out smoothly; in addition, when the combined structure of the light emitting diode assembly 22 and the substrate is leaned against the surface of the heat sink by means of the thermal pad Therefore, the pressure exerted by the substrate on the LED assembly 22 will not directly press the pins 224 welded together with the patterned conductive lines. The appearance of the fixing part 223 of the light emitting diode assembly 22 provided by the present invention can be as shown in Figure 2I and Figure 2J, which is a cube or a cylinder, which can form a hole larger than the scope of the perforation (or groove). The same abutting effect can be achieved by abutting against the surface 2231 .

以上所述的实施例仅为说明本发明的技术思想及特点,其目的在使熟习此项技艺的人士能够了解本发明的内容并据以实施,当不能以的限定本发明的专利范围,即大凡依本发明所揭示的精神所作的均等变化或修饰,仍应涵盖在本发明的专利范围内。The above-described embodiments are only to illustrate the technical ideas and characteristics of the present invention, and its purpose is to enable those who are familiar with this art to understand the content of the present invention and implement it accordingly, and should not limit the patent scope of the present invention, that is, All equivalent changes or modifications made according to the spirit disclosed in the present invention should still fall within the patent scope of the present invention.

Claims (13)

1.一种光源模块,包括:1. A light source module, comprising: 一基板,其上具有一第一穿孔;以及a substrate having a first through hole; and 一发光二极管组件,包括有一发光二极管及一载体,其特征是,该载体底部形成一外缘大于该第一穿孔外径的一固定部,该固定部由该载体的底部延伸而凸出该载体的侧壁,其中该发光二极管贯穿该第一穿孔,而该固定部则抵接于该基板的底面。A light-emitting diode assembly, including a light-emitting diode and a carrier, is characterized in that the bottom of the carrier forms a fixing portion whose outer edge is larger than the outer diameter of the first through hole, and the fixing portion extends from the bottom of the carrier to protrude from the carrier wherein the light emitting diode penetrates through the first through hole, and the fixing part abuts against the bottom surface of the substrate. 2.如权利要求1所述的光源模块,其特征是,还包括一散热件连接该载体的底面。2. The light source module according to claim 1, further comprising a heat sink connected to the bottom surface of the carrier. 3.如权利要求2所述的光源模块,其特征是,该散热件包括一散热片。3. The light source module as claimed in claim 2, wherein the heat sink comprises a heat sink. 4.如权利要求2所述的光源模块,其特征是,还包括一导热垫设置于该载体与该散热件之间。4. The light source module as claimed in claim 2, further comprising a thermal pad disposed between the carrier and the heat sink. 5.如权利要求1所述的光源模块,其特征是,还包括一反射片,该反射片配置于该基板的顶面上。5. The light source module according to claim 1, further comprising a reflective sheet disposed on the top surface of the substrate. 6.如权利要求5所述的光源模块,其特征是,该反射片上具有对应于该第一穿孔位置的一第二穿孔,藉以使该发光二极管能够通过该第二穿孔并突出于该反射片。6. The light source module according to claim 5, wherein the reflector has a second through hole corresponding to the position of the first through hole, so that the LED can pass through the second through hole and protrude from the reflector . 7.如权利要求6所述的光源模块,其特征是,该第二穿孔的孔径相当于或小于该发光二极管的外径。7. The light source module according to claim 6, wherein the diameter of the second through hole is equal to or smaller than the outer diameter of the LED. 8.一种光源模块,其特征是,包括:8. A light source module, characterized by comprising: 一基板,具有一穿槽,且该基板具有相对的一第一表面与一第二表面;以及A base plate has a through groove, and the base plate has a first surface and a second surface opposite to each other; and 复数个发光二极管组件,对应该穿槽配置,其中,每一该发光二极管组件由一发光二极管以及一载体所组成,并于该载体底部形成有外缘大于该穿槽宽度的一固定部,该固定部由该载体的底部延伸而凸出该载体的侧壁,使得该复数个发光二极管组件自该基板的该第一表面插入该穿槽时,该复数个发光二极管能够同时通过该穿槽而突出于该第二表面,而该固定部则抵靠于该第一表面上邻近该穿槽的周围。A plurality of light-emitting diode components are arranged corresponding to the groove, wherein each light-emitting diode component is composed of a light-emitting diode and a carrier, and a fixing part whose outer edge is larger than the width of the groove is formed on the bottom of the carrier, the The fixing part extends from the bottom of the carrier and protrudes from the side wall of the carrier, so that when the plurality of light emitting diode assemblies are inserted into the through groove from the first surface of the substrate, the plurality of light emitting diodes can pass through the through groove at the same time. protrudes from the second surface, and the fixing part abuts against the periphery of the first surface adjacent to the through groove. 9.如权利要求8所述的光源模块,其特征是,还包括一散热件连接该载体的底面。9. The light source module according to claim 8, further comprising a heat sink connected to the bottom surface of the carrier. 10.如权利要求9所述的光源模块,其特征是,该散热件包括一散热片。10. The light source module as claimed in claim 9, wherein the heat dissipation member comprises a heat sink. 11.如权利要求9所述的光源模块,其特征是,还包括一导热垫设置于该载体与该散热件之间。11. The light source module as claimed in claim 9, further comprising a heat conduction pad disposed between the carrier and the heat sink. 12.如权利要求8所述的光源模块,其特征是,还包括一反射片配置于该基板的第二表面上。12. The light source module according to claim 8, further comprising a reflective sheet disposed on the second surface of the substrate. 13.如权利要求12所述的光源模块,其特征是,该反射片上具有对应该发光二极管组件的一穿孔,藉以使该发光二极管能够通过该穿孔并突出于该反射片。13 . The light source module according to claim 12 , wherein the reflective sheet has a through hole corresponding to the LED assembly, so that the light emitting diode can pass through the through hole and protrude from the reflective sheet.
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KR101524005B1 (en) * 2007-05-07 2015-05-29 코닌클리케 필립스 엔.브이. Led-based lighting fixtures for surface illumination with improved heat dissipation and manufacturability
US8115369B2 (en) * 2009-11-09 2012-02-14 Lg Innotek Co., Ltd. Lighting device
CN101975376B (en) * 2010-10-08 2012-07-11 深圳市华星光电技术有限公司 Luminous source heat-dissipation structure of backlight module
CN102679210B (en) * 2012-04-01 2014-08-13 深圳市超频三科技有限公司 LED (light-emitting diode) lamp and LED light source component

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