CN100388516C - Light source module - Google Patents
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- CN100388516C CN100388516C CNB2005100759925A CN200510075992A CN100388516C CN 100388516 C CN100388516 C CN 100388516C CN B2005100759925 A CNB2005100759925 A CN B2005100759925A CN 200510075992 A CN200510075992 A CN 200510075992A CN 100388516 C CN100388516 C CN 100388516C
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- 239000000758 substrate Substances 0.000 claims abstract description 51
- 230000017525 heat dissipation Effects 0.000 claims abstract description 9
- 230000000712 assembly Effects 0.000 claims description 6
- 238000000429 assembly Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000019771 cognition Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
Description
技术领域 technical field
本发明涉及一种光源模块,特别是涉及一种光源模块内发光二极管组件与承载基板间的组合方式及其结构。The invention relates to a light source module, in particular to a combination method and structure of a light emitting diode assembly and a carrier substrate in the light source module.
背景技术 Background technique
在已知的光源模块中,发光二极管组件与承载基板之间的组合方法以及将组合完成的结构贴覆于一散热件上的步骤可参照图1A至图1C。首先参照图1A所示的剖面示意图,光源模块主要由复数个发光二极管组件12以及用来承载发光二极管组件12的基板11所组成。基板11具有相对的第一表面111(底面)与第二表面112(顶面),并形成有复数个贯穿基板11的穿孔113,而在基板11的第一表面111上则形成有图案化导电线路114。In the known light source module, the assembly method between the LED assembly and the carrier substrate and the steps of pasting the assembled structure on a heat sink can refer to FIGS. 1A to 1C . Referring first to the schematic cross-sectional view shown in FIG. 1A , the light source module is mainly composed of a plurality of LED assemblies 12 and a
继续参照图1A,每一发光二极管组件12由一发光二极管121以及一载体122所组成,而复数个与发光二极管121电性连接的引脚124则自载体122侧壁外露。Continuing to refer to FIG. 1A , each LED assembly 12 is composed of a LED 121 and a carrier 122 , and a plurality of
参照图1B,当移动发光二极管组件12并自第一表面111插入对应的穿孔113时,发光二极管121穿设基板11并突出于第二表面112,而外露的引脚124则抵靠在穿孔113周围的图案化导电线路114上;此时,即可利用焊液13将引脚124焊接于图案化导电线路114上而完成发光二极管12与基板11间的电性连接与组合结构。Referring to FIG. 1B , when the light emitting diode assembly 12 is moved and inserted into the corresponding through hole 113 from the
参照图1C,为了将发光二极管12运作时所产生的热能有效排出,即可将焊接组合完成的发光二极管12与基板11做一180度的翻转后,将发光二极管12的载体122的底面抵靠于导热垫14上,而导热垫14再与一散热件15表面接触;但是,当沿箭头方向施予基板11一向下的压力而欲让发光二极管12与散热件115之间有一更紧密的接触而增加散热功效时,发光二极管12上的引脚124由于直接承受基板11所施予的压力,因此容易导致引脚124发生变形弯曲的情况,甚至可能与图案化导电线路114发生脱离而损坏。Referring to FIG. 1C , in order to effectively discharge the heat energy generated during the operation of the LED 12 , the soldered LED 12 and the
发明内容 Contents of the invention
有鉴于上述发明背景中,光源模块内的发光二极管组件与承载基板的组合结构无法紧密与散热件接触的问题,于此提供一种光源模块内发光二极管组件与承载基板之间的组合方法及此组合结构,其目的在让发光二极管组件紧密贴覆至散热件上的同时,发光二极管组件本身也不会发生变形或是损坏的情况。In view of the above-mentioned background of the invention, the combined structure of the light emitting diode assembly and the carrier substrate in the light source module cannot be in close contact with the heat sink, hereby provides a combination method between the light emitting diode assembly and the carrier substrate in the light source module and its The purpose of the composite structure is to allow the LED assembly to be closely adhered to the heat sink, and at the same time, the LED assembly itself will not be deformed or damaged.
根据上述的目的,本发明提供的一技术方案如下:According to above-mentioned purpose, a technical scheme that the present invention provides is as follows:
一种光源模块,包括:A light source module, comprising:
一基板,其上具有一第一穿孔;以及a substrate having a first through hole; and
一发光二极管组件,包括有一发光二极管及一载体,其特征是,该载体底部形成一外缘大于该第一穿孔外径的一固定部,该固定部由该载体的底部延伸而凸出该载体的侧壁,其中该发光二极管贯穿该第一穿孔,而该固定部则抵接于该基板的底面。A light-emitting diode assembly, including a light-emitting diode and a carrier, is characterized in that the bottom of the carrier forms a fixing portion whose outer edge is larger than the outer diameter of the first through hole, and the fixing portion extends from the bottom of the carrier to protrude from the carrier wherein the light emitting diode penetrates through the first through hole, and the fixing part abuts against the bottom surface of the substrate.
本发明还提供另一技术方案:The present invention also provides another technical solution:
一种光源模块,其特征是,包括:A light source module, characterized by comprising:
一基板,具有一穿槽,且该基板具有相对的一第一表面与一第二表面;以及A base plate has a through groove, and the base plate has a first surface and a second surface opposite to each other; and
复数个发光二极管组件,对应该穿槽配置,其中,每一该发光二极管组件由一发光二极管以及一载体所组成,并于该载体底部形成有外缘大于该穿槽宽度的一固定部,该固定部由该载体的底部延伸而凸出该载体的侧壁,使得复数个发光二极管组件自该基板的该第一表面插入该穿槽时,该复数个发光二极管能够同时通过该穿槽而突出于该第二表面,而该固定部则抵靠于该第一表面上邻近该穿槽的周围。A plurality of light-emitting diode components are arranged corresponding to the groove, wherein each light-emitting diode component is composed of a light-emitting diode and a carrier, and a fixing part whose outer edge is larger than the width of the groove is formed on the bottom of the carrier, the The fixing part extends from the bottom of the carrier and protrudes from the side wall of the carrier, so that when a plurality of light emitting diode assemblies are inserted into the through groove from the first surface of the substrate, the plurality of light emitting diodes can protrude through the through groove at the same time on the second surface, and the fixing part abuts against the periphery of the first surface adjacent to the through groove.
本发明的技术效果为:光源模块中发光二极管组件与承载基板的组合方法及其结构,在发光二极管组件内用来承载发光二极管的载体底部延伸出一固定部而形成抵靠面,并配合在承载基板上形成外径略大于二极管外径并小于固定部外缘的穿孔,如此一来,当发光二极管组件贴覆于一散热件上时,基板便可施予一压力让发光二极管组件与散热件之间有一更紧密的结合而增加散热的功效。The technical effect of the present invention is: the combination method and structure of the light-emitting diode component and the carrier substrate in the light source module, a fixing part extends from the bottom of the carrier used to carry the light-emitting diode in the light-emitting diode component to form an abutment surface, and fits on the A perforation with an outer diameter slightly larger than the outer diameter of the diode and smaller than the outer edge of the fixing part is formed on the carrier substrate. In this way, when the LED assembly is attached to a heat sink, the substrate can apply a pressure to allow the LED assembly to dissipate heat. There is a tighter bond between the components to increase the efficiency of heat dissipation.
附图说明 Description of drawings
图1A至图1C为已知技术,将发光二极管组件装配至承载基板上并抵靠于散热件上的步骤流程;Figures 1A to 1C are the steps of assembling the light-emitting diode assembly on the carrier substrate and leaning against the heat sink in the known technology;
图2A至图2C依据本发明的一较佳具体实施例所提供将发光二极管组件装配至承载基板上并抵靠于散热件上的步骤流程;2A to 2C provide a flow of steps for assembling the light-emitting diode assembly on the carrier substrate and leaning against the heat sink according to a preferred embodiment of the present invention;
图2D依据本发明的一较佳具体实施例所提供组合完成的光源模块立体示意图;FIG. 2D is a schematic perspective view of a light source module assembled according to a preferred embodiment of the present invention;
图2E依据本发明的其它较佳具体实施例所提供具有穿槽的基板与发光二极管组件组合在一起时的立体示意图;FIG. 2E is a three-dimensional schematic diagram of a combination of a substrate with through grooves and a light-emitting diode assembly according to other preferred embodiments of the present invention;
图2F与图2G依据本发明的一较佳具体实施例所提供形成一反射片于光源模块上的剖面示意图;FIG. 2F and FIG. 2G are schematic cross-sectional views of forming a reflective sheet on the light source module according to a preferred embodiment of the present invention;
图2H依据本发明的其它较佳具体实施例所提供在光源模块中形成一散热鳍片外型的散热件时的剖面示意图;FIG. 2H is a schematic cross-sectional view when a heat sink in the form of a heat sink is formed in the light source module according to other preferred embodiments of the present invention;
图2I至图2J为本发明发光二极管组件其固定部的外形变化。FIG. 2I to FIG. 2J are the appearance changes of the fixing part of the light emitting diode assembly of the present invention.
图中符号说明:Explanation of symbols in the figure:
11 基板11 Substrate
111 第一表面111 first surface
112 第二表面112 second surface
113 穿孔113 piercing
114 图案化导电线路114 patterned conductive lines
12 发光二极管组件12 LED components
121 发光二极管121 LEDs
122 载体122 carrier
124 引脚124 pins
13 焊液13 soldering fluid
14 导热垫14 thermal pad
15 散热件15 heat sink
21 基板21 Substrate
211 第一表面211 first surface
212 第二表面212 second surface
213 第一穿孔213 first piercing
214 图案化导电线路214 patterned conductive lines
215 穿槽215 Grooving
22 发光二极管组件22 LED components
221 发光二极管221 LEDs
222 载体222 carrier
223 固定部223 Fixed part
2231 抵靠面2231 abutment surface
224 引脚224 pins
23 焊液23 soldering fluid
24 导热垫24 thermal pad
25 散热件25 heat sink
26 反射片26 reflector
261 第二穿孔261 second piercing
27 散热鳍片27 cooling fins
具体实施方式 Detailed ways
接下来是本发明的详细说明,下述说明中对光源模块以及发光二极管组件本身的描述并不包括详细的构造组成以及运作原理,本发明所沿用的现有技艺,在此仅作重点式的引用,以助本发明的阐述。而且下述内文中有关光源模块的附图亦并未依据实际比例绘制,其作用仅在表达出本发明的特征。其次,当本发明的实施例图式中的各组件或结构在描述说明时,不应以此作为有限定的认知,即如下的说明未特别强调数目上的限制时,本发明的精神与应用范围可推及多数个组件或结构并存的结构上。The following is a detailed description of the present invention. The description of the light source module and the light emitting diode assembly itself in the following description does not include detailed structural components and operating principles. The prior art used by the present invention is only emphasized here. Cited to help explain the present invention. Moreover, the drawings related to the light source module in the following texts are not drawn according to the actual scale, and their function is only to express the characteristics of the present invention. Secondly, when each component or structure in the drawings of the embodiments of the present invention is described, it should not be regarded as a limited cognition, that is, when the following description does not particularly emphasize the limitation on the number, the spirit of the present invention and The scope of application can be extended to structures where multiple components or structures coexist.
依据本发明的一较佳具体实施例提供一种光源模块内发光二极管组件与承载基板的组合方法及其结构,并可将此组合结构紧密贴覆于一散热件上。首先参照图2A所示的剖面示意图,光源模块主要由复数个发光二极管组件22以及用来承载发光二极管组件的基板21所组成。在本实施例中,基板21可以是一印刷电路板或其它多层板,其具有相对的第一表面211(底面)与第二表面212(顶面),并形成复数个贯穿基板21且对应发光二极管组件22位置以及数量的第一穿孔213;此外,在基板21的第一表面211上暴露出由铜箔或其它导电层所形成的图案化导电线路214。According to a preferred embodiment of the present invention, there is provided a combination method and structure of a light emitting diode component in a light source module and a carrier substrate, and the combined structure can be closely attached to a heat sink. Referring first to the schematic cross-sectional view shown in FIG. 2A , the light source module is mainly composed of a plurality of
继续参照图2A,本实施例所提供的发光二极管组件22由一发光二极管221以及一载体222所组成,其中,发光二极管221的外径略小于第一穿孔213的外径,但载体222底部则延伸形成一外缘大于第一穿孔213外径的固定部223,并且复数个与发光二极管221电性连接的引脚224也自固定部223侧壁上外露出来。Continuing to refer to FIG. 2A, the light emitting
参照图2B,当移动发光二极管组件22并自第一表面211插入对应的第一穿孔213时,发光二极管221就可通过第一穿孔213并突出于基板21的第二表面212,而固定部223则抵靠于第一表面211上邻近第一穿孔213周围的部分而无法穿设;如此,就可利用焊液23将引脚224焊接于图案化导电线路214上而完成发光二极管组件22与基板21间的电性连接与组合结构。Referring to FIG. 2B, when the light emitting
参照图2C,为了将发光二极管221运作时所产生的热能有效排出,本实施例将发光二极管组件22与基板21的组合结构做一180度的翻转后直接藉复数个导热垫24而将载体222底面与一散热件25的表面接触;而由于本实施例所提供的载体222具有外缘大于第一穿孔213外径的固定部223,因此可沿箭头方向施予基板21一向下的压力而让发光二极管组件22与散热件25之间有一更紧密的结合而增加散热的功效,而已知的发光二极管组件的载体其引脚因为基板下压而产生变形甚至与图案化导电线路脱离的问题就可以避免。Referring to FIG. 2C , in order to effectively discharge the heat energy generated when the
而组合完成的光源模块其立体示意图可参照图2D,此图显示每一发光二极管221已通过对应的第一穿孔213并突出于基板21的第二表面212。而在依据本发明的其它具体实施例中,基板也可直接形成有对应复数个发光二极管组件的穿槽,例如参照图2E,在基板21上形成有一穿槽215,并且此穿槽215宽度介于发光二极管221外径以及固定部213外缘之间,如此一来,复数个发光二极管221就可同时通过此穿槽215并且突出于基板21的第二表面212,而每一发光二极管组件的固定部223所形成的抵靠面2231均可抵靠于基板21的第一表面(图中未示)上邻近此穿槽215的周围。The perspective view of the assembled light source module can be referred to FIG. 2D , which shows that each
另外,参照图2F,本发明也可视发光二极管组件22的特性或光源模块的需要而增加一反射件,例如当本实施例所采用的发光二极管221为一边射型(side emitting)的发光二极管22时,就可在基板21的第二表面212上贴覆一反射片26(或形成一反射表面),而在反射片26上形成复数个对应第一穿孔213位置的第二穿孔261,并且此第二穿孔261的外径可选择如第二F图中所示,大于发光二极管外径,而让发光二极管221直接通过此第二穿孔261并突出于反射片26外;或者在依据本发明的其它具体实施例中,在反射片上形成一外径等于或小于发光二极管的第二穿孔,如图2G所示,而能让反射片与发光二极管之间有一更紧密的贴合效果而避免发生漏光的现象,故可以达到更有效能的光输出。In addition, referring to FIG. 2F, the present invention may also add a reflector according to the characteristics of the light emitting
另外,在依据本发明的其它实施例中,散热件除了可选自一散热片外,也可如图2H中所示选自一散热鳍片27(heat sink)而增加散热的效果;而设置于每一载体222底面与散热鳍片27之间的导热垫24也可如图2H中所示为一整片的结构。In addition, in other embodiments according to the present invention, in addition to being selected from a heat sink, the heat sink can also be selected from a heat sink 27 (heat sink) as shown in Figure 2H to increase the effect of heat dissipation; and set The
参照图2I与第二J图2J,其本实施例所提供的发光二极管组件22具有不同外型变化的立体示意图,其中,每一种固定部223均为载体222底部的延伸,其目的在产生断差而形成一抵靠面2231,使得发光二极管221自基板上方插入第一穿孔而让发光二极管221以及部分载体222通过时,外缘大于穿孔孔径的固定部223就能藉此抵靠面2231而被抵靠在第一穿孔外,因而能顺利进行后续引脚224与图案化导电线路的焊接步骤;此外,当发光二极管组件22与基板的组合结构藉导热垫而抵靠至散热件表面时,基板所施予发光二极管组件22的压力就不会直接压迫与图案化导电线路焊接在一起的引脚224。而本发明所提供的发光二极管组件22其固定部223的外型可如图2I以及图2J中所示,为一立方体型或是圆柱型,其均可形成大于穿孔(或穿槽)范围的抵靠面2231而达到相同的抵靠效果。Referring to FIG. 2I and the second J to FIG. 2J, the light-emitting
以上所述的实施例仅为说明本发明的技术思想及特点,其目的在使熟习此项技艺的人士能够了解本发明的内容并据以实施,当不能以的限定本发明的专利范围,即大凡依本发明所揭示的精神所作的均等变化或修饰,仍应涵盖在本发明的专利范围内。The above-described embodiments are only to illustrate the technical ideas and characteristics of the present invention, and its purpose is to enable those who are familiar with this art to understand the content of the present invention and implement it accordingly, and should not limit the patent scope of the present invention, that is, All equivalent changes or modifications made according to the spirit disclosed in the present invention should still fall within the patent scope of the present invention.
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CN100552990C (en) * | 2006-12-29 | 2009-10-21 | 富准精密工业(深圳)有限公司 | Light emitting diode module |
KR101524005B1 (en) * | 2007-05-07 | 2015-05-29 | 코닌클리케 필립스 엔.브이. | Led-based lighting fixtures for surface illumination with improved heat dissipation and manufacturability |
US8115369B2 (en) * | 2009-11-09 | 2012-02-14 | Lg Innotek Co., Ltd. | Lighting device |
CN101975376B (en) * | 2010-10-08 | 2012-07-11 | 深圳市华星光电技术有限公司 | Luminous source heat-dissipation structure of backlight module |
CN102679210B (en) * | 2012-04-01 | 2014-08-13 | 深圳市超频三科技有限公司 | LED (light-emitting diode) lamp and LED light source component |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5857767A (en) * | 1996-09-23 | 1999-01-12 | Relume Corporation | Thermal management system for L.E.D. arrays |
US6428189B1 (en) * | 2000-03-31 | 2002-08-06 | Relume Corporation | L.E.D. thermal management |
US20050024834A1 (en) * | 2003-07-28 | 2005-02-03 | Newby Theodore A. | Heatsinking electronic devices |
CN1588658A (en) * | 2004-07-01 | 2005-03-02 | 友达光电股份有限公司 | LED light source module with support |
CN1591924A (en) * | 2003-07-29 | 2005-03-09 | 西铁城电子股份有限公司 | Surface-mounted LED and light emitting device with same |
-
2005
- 2005-06-07 CN CNB2005100759925A patent/CN100388516C/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5857767A (en) * | 1996-09-23 | 1999-01-12 | Relume Corporation | Thermal management system for L.E.D. arrays |
US6428189B1 (en) * | 2000-03-31 | 2002-08-06 | Relume Corporation | L.E.D. thermal management |
US20050024834A1 (en) * | 2003-07-28 | 2005-02-03 | Newby Theodore A. | Heatsinking electronic devices |
CN1591924A (en) * | 2003-07-29 | 2005-03-09 | 西铁城电子股份有限公司 | Surface-mounted LED and light emitting device with same |
CN1588658A (en) * | 2004-07-01 | 2005-03-02 | 友达光电股份有限公司 | LED light source module with support |
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CN1697207A (en) | 2005-11-16 |
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