CN100388516C - Light source module - Google Patents

Light source module Download PDF

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Publication number
CN100388516C
CN100388516C CN 200510075992 CN200510075992A CN100388516C CN 100388516 C CN100388516 C CN 100388516C CN 200510075992 CN200510075992 CN 200510075992 CN 200510075992 A CN200510075992 A CN 200510075992A CN 100388516 C CN100388516 C CN 100388516C
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CN
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light
source
module
light source
source module
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CN 200510075992
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Chinese (zh)
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CN1697207A (en )
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刘邦炫
周信宏
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友达光电股份有限公司
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

一种光源模块中发光二极管组件与承载基板的组合方法及其结构,发光二极管组件由一发光二极管以及一载体所组成,并且在此载体底部延伸出一固定部而形成抵靠面;而承载基板上则形成有外径略大于发光二极管外径并小于固定部外缘的穿孔,如此一来,当发光二极管组件贴覆于一散热件上时,承载基板便可施予一压力让发光二极管组件与散热件之间有一更紧密的结合而增加散热的功效。 A light source module, a light emitting diode assembly and the combining method and the structure of the carrier substrate, a light emitting diode assembly composed of a light emitting diode and a carrier composition, the carrier and the bottom of this a fixing portion extending abutment surface is formed; the carrier substrate slightly larger than the outer diameter is formed on the light emitting diode and smaller than the outer diameter of the outer edge portion of the perforated fixed, this way, when the light emitting diode component is pasted on a heat sink, the carrier substrate so that pressure can be administered to a light emitting diode assembly between the heat sink and a tighter integration and increased effectiveness of heat dissipation.

Description

光源模块 The light source module

技术领域 FIELD

本发明涉及一种光源模块,特别是涉及一种光源模块内发光二极管组件与承载基板间的组合方式及其结构。 The present invention relates to a light source module, and more particularly to a combination structure between the modules in a light emitting diode assembly with the carrier substrate.

背景技术 Background technique

在己知的光源模块中,发光二极管组件与承载基板之间的组合方 In the known light source module, a combination of a light emitting diode assembly side between the carrier substrate and

法以及将组合完成的结构贴覆于一散热件上的步骤可参照图1A至图1C 。 The method and compositions completed structure is pasted on a heat sink steps 1A to FIG 1C. 首先参照图1A所示的剖面示意图,光源模块主要由复数个发光二极管组件12以及用来承载发光二极管组件12的基板11所组成。 First, 12 and 11 mainly composed of the substrate 12 for carrying a plurality of light emitting diode elements consisting of light emitting diode modules Referring to FIG sectional view, the light source module shown in FIG. 1A. 基板ii具有相对的第一表面lll(底面)与第二表面112(顶面),并形成有复数个贯穿基板11的穿孔113,而在基板11的第一表面111上则形成有图案化导电线路114。 Ii a first substrate having opposite surfaces LLL (bottom surface) 112 and a second surface (top surface), and formed with a plurality of perforations 11 through the substrate 113, and 111 on the first surface of the substrate 11 is formed with a patterned conductive line 114.

继续参照图1A ,每一发光二极管组件12由一发光二极管121以及一载体122所组成,而复数个与发光二极管121电性连接的引脚124 则自载体122侧壁外露。 With continued reference to Figure 1A, each LED assembly 12 is composed of a carrier 121 and a light emitting diode 122, and the pins 124 121 are electrically connected to the plurality of light emitting diode is exposed from the carrier sidewall 122.

参照图1B,当移动发光二极管组件12并自第一表面111插入对应的穿孔113时,发光二极管121穿设基板11并突出于第二表面112, 而外露的引脚124则抵靠在穿孔113周围的图案化导电线路114上:此时,即可利用焊液13将引脚124焊接于图案化导电线路114上而完成发光二极管12与基板11间的电性连接与组合结构。 1B, the LED assembly 12 when moved from the first surface 111 and inserted into a corresponding perforation 113, the light emitting diode 121 is disposed through the substrate 11 and protrudes from the second surface 112, and exposed against the pin 124 through holes 113 on the patterned conductive traces around 114: at this time, the pin 13 welded 124 to the patterned conductive line 114 is completed and the light emitting diode 12 is electrically connected to the composite structure 11 to a substrate using liquid solder.

参照图1C,为了将发光二极管12运作时所产生的热能有效排出, 即可将焊接组合完成的发光二极管12与基板11做一180度的翻转后, 将发光二极管12的载体122的底面抵靠于导热垫14上,而导热垫14 Referring back to Figure 1C, in order to effectively discharge heat energy generated by the operation of the light emitting diode 12, the light emitting diode can be welded to the substrate 12 in combination to complete the inverted 11 to make a 180 degrees, the bottom surface of the light emitting diode 12 of the carrier 122 against in the thermally conductive pad 14, while the thermal pad 14

再与一散热件15表面接触;但是,当沿箭头方向施予基板11 一向下的压力而欲让发光二极管12与散热件115之间有一更紧密的接触而增加散热功效时,发光二极管12上的引脚124由于直接承受基板11所施予的压力,因此容易导致引脚124发生变形弯曲的情况,甚至可能与图案化导电线路114发生脱离而损坏。 Contacted with a surface of the heat dissipation member 15; however, when administered to a downward pressure of the substrate 11 in the arrow direction so that the light emitting diode and wish to have a closer contact between the heat sink 12 and the heat dissipation member 115 to increase the effectiveness of the light emitting diode 12 Since the pins 124 directly receives the substrate 11 administered pressure, easily lead to the occurrence of bending deformation of the pin 124, and may even damage the patterned conductive line 114 from occurring.

发明内容 SUMMARY

有鉴于上述发明背景中,光源模块内的发光二极管组件与承载基板的组合结构无法紧密与散热件接触的问题,于此提供一种光源模块内发光二极管组件与承载基板之间的组合方法及此组合结构,其目的在让发光二极管组件紧密贴覆至散热件上的同时,发光二极管组件本身也不会发生变形或是损坏的情况。 Background of the Invention In view of the above problems, the combined structure of the LED assembly and the carrier substrate of the light source module can not be in close contact with the heat sink, this method provides a combination of a light emitting diode assembly between the carrier substrate and a light module and this composite structure, which allows the light emitting diode assembly object in close contact to cover the heat sink member while the light emitting diode assembly itself is not deformed or damaged occurs.

根据上述的目的,本发明提供的一技术方案如下: According to the above-described object, an aspect of the present invention are as follows:

一种光源模块,包括: A light source module comprising:

一基板,其上具有一第一穿孔;以及 A substrate having thereon a first perforation; and

一发光二极管组件,包括有一发光二极管及一载体,其特征是, 该载体底部形成一外缘大于该第一穿孔外径的一固定部,该固定部由该载体的底部延伸而凸出该载体的侧壁,其中该发光二极管贯穿该第一穿孔,而该固定部则抵接于该基板的底面。 A light emitting diode assembly comprising a light emitting diode and a carrier, characterized in that, a bottom support forming the outer edge of the first fixing portion is larger than a outer diameter of the perforations, the carrier and the fixing portion of the projection extending from the bottom of the carrier side walls, wherein the light emitting diode through the first through hole, and the fixing portion of the bottom surface abuts against the substrate.

本发明还提供另一技术方案: 一种光源模块,其特征是,包括: The present invention further provides a further aspect: a light source module characterized in that, comprising:

一基板,具有一穿槽,且该基板具有相对的一第一表面与一第二表面;以及 A substrate having a through slot and the opposite substrate having a first surface and a second surface;

复数个发光二极管组件,对应该穿槽配置,其中,每一该发光二极管组件由一发光二极管以及一载体所组成,并于该载体底部形成有外缘大于该穿槽宽度的一固定部,该固定部由该载体的底部延伸而凸出该载体的侧壁,使得复数个发光二极管组件自该基板的该第一表面插入该穿槽时,该复数个发光二极管能够同时通过该穿槽而突出于该 A plurality of light emitting diode modules, to be arranged through slot, wherein each of the light emitting diode assembly composed of a light emitting diode and a carrier composed of a fixed portion and an outer edge is formed larger than the width of the through slot in the bottom of the carrier, the when the fixing portion extends from the bottom of the carrier and projecting from the side walls of the carrier, such that a plurality of light emitting diode modules from the first surface of the substrate is inserted into the through slot, the plurality of light emitting diodes can be simultaneously protrudes through the through slot in the

第二表面,而该固定部则抵靠于该第一表面上邻近该穿槽的周围。 A second surface, which abuts against the fixing portion on the first surface adjacent to the periphery of the through groove.

本发明的技术效果为:光源模块中发光二极管组件与承载基板的组合方法及其结构,在发光二极管组件内用来承载发光二极管的载体底部延伸出一固定部而形成抵靠面,并配合在承载基板上形成外径略大于二极管外径并小于固定部外缘的穿孔,如此一来,当发光二极管组件贴覆于一散热件上时,基板便可施予一压力让发光二极管组件与散热件之间有一更紧密的结合而增加散热的功效。 Technical effects of the invention are: a combination method and structure of the light source module of the LED assembly and the carrier substrate, the light emitting diode in the bottom of the light emitting diode assembly for carrying out a fixed carrier extending abutment portion is formed, and fitted slightly larger than the outer diameter of the carrier is formed on a substrate and an outer diameter smaller than the perforations diode fixing portion of the outer periphery, a result, when the light emitting diode component is pasted on a heat sink, the substrate can be administered to a pressure and heat so that the light emitting diode assembly between pieces of a tighter integration and increased effectiveness of heat dissipation.

附图说明 BRIEF DESCRIPTION

图1A至图1C为已知技术,将发光二极管组件装配至承载基板上并抵靠于散热件上的步骤流程; 1A to 1C are known techniques, the light emitting diode assembly fitted onto a carrier substrate and on the heat dissipation member against the step of the process;

图2A至图2C依据本发明的一较佳具体实施例所提供将发光二极管组件装配至承载基板上并抵靠于散热件上的步骤流程; 2A to 2C according to a preferred embodiment of the present invention to provide a light emitting diode component and fitted onto the carrier substrate against the process step of fins;

图2D依据本发明的一较佳具体实施例所提供组合完成的光源模块立体示意图; FIG. 2D accordance with a preferred embodiment of the present invention, the light source module is provided in combination complete a schematic perspective view;

图2E依据本发明的其它较佳具体实施例所提供具有穿槽的基板与发光二极管组件组合在一起时的立体示意图; FIG. 2E accordance with another preferred embodiment of the present invention is provided in a perspective schematic view of the combined substrate through the groove and having a light emitting diode assembly;

图2F与图2G依据本发明的一较佳具体实施例所提供形成一反射片于光源模块上的剖面示意图; FIG. 2F and FIG. 2G according to a particular preferred embodiment of the present invention in a schematic cross-sectional view of the embodiment of the light source module is formed a reflective sheet provided;

图2H依据本发明的其它较佳具体实施例所提供在光源模块中形成一散热鳍片外型的散热件时的剖面示意图; FIG. 2H accordance with another preferred embodiment of the present invention are provided in a cross-sectional schematic view of the heat dissipating fin is formed in the shape of fins in the light source module;

图2I至图2J为本发明发光二极管组件其固定部的外形变化。 FIG. 2I 2J shape change to a light emitting diode assembly fixed portion of the present invention.

图中符号说明: DESCRIPTION OF REFERENCE NUMERALS:

11 基板 11 substrate

111 第一表面 The first surface 111

112 第二表面 The second surface 112

113 穿孔 113 perforation

114 图案化导电线路 The patterned conductive trace 114

12 发光二极管组件 12 light emitting diode assembly

121 发光二极管 121 light emitting diodes

122 载体 122 carrier

124 引脚 124 Pin

13 焊液 Liquid solder 13

14 导热垫 14 thermal pad

15 散热件 The heat sink 15

21 基板 21 substrate

211 第一表面 The first surface 211

212 第二表面 The second surface 212

213 第一穿孔 213 first perforation

214 图案化导电线路 The patterned conductive trace 214

215 穿槽 215 through slots

22 发光二极管组件 22 light emitting diode assembly

221 发光二极管 221 light emitting diodes

222 载体 222 carrier

223 固定部 The fixed portion 223

2231 抵靠面 2231 abutment surface

224 引脚 224 Pin

23 焊液 Liquid solder 23

24 导热垫 24 thermal pad

25 散热件 The heat sink 25

26 反射片 The reflective sheet 26

261 第二穿孔 261 second perforation

27 散热鳍片 27 cooling fins

具体实施方式 detailed description

接下来是本发明的详细说明,下述说明中对光源模块以及发光二极管组件本身的描述并不包括详细的构造组成以及运作原理,本发明所沿用的现有技艺,在此仅作重点式的引用,以助本发明的阐述。 Next is a detailed description of the present invention, is described in the following description of the light source module and a light emitting diode assembly itself does not include a detailed construction and operating principle of the composition, followed by the prior art to the present invention, the focus here only for the formula reference to help illustrate the present invention. 而且下述内文中有关光源模块的附图亦并未依据实际比例绘制,其作用 In the drawings and the following context also not related to the light source module based on actual scale, its role

仅在表达出本发明的特征。 Expressed only in the features of the present invention. 其次,当本发明的实施例图式中的各组件或结构在描述说明时,不应以此作为有限定的认知,即如下的说明未特别强调数目上的限制时,本发明的精神与应用范围可推及多数个组件或结构并存的结构上。 Secondly, when each component or structure of an embodiment of the present invention in the drawings in the description of description and should not have defined as cognition, i.e. the following description when no constraints on the number of special emphasis, and spirit of the invention applications can be pushed, and the plurality of structural components or structures coexist.

依据本发明的一较佳具体实施例提供一种光源模块内发光二极管组件与承载基板的组合方法及其结构,并可将此组合结构紧密贴覆于 The combination method and structure provides a light emitting diode package module with a carrier substrate according to the preferred embodiment of the present invention, and this close contact structures overlying the composition

一散热件上。 A heat sink member. 首先参照图2A所示的剖面示意图,光源模块主要由复数个发光二极管组件22以及用来承载发光二极管组件的基板21所组成。 First, the main assembly of a plurality of light emitting diodes 22 and a substrate for carrying a light emitting diode assembly consisting Referring to FIG 21 a schematic cross-sectional view, the light source module shown in FIG. 2A. 在本实施例中,基板21可以是一印刷电路板或其它多层板,其具有相对的第一表面211(底面)与第二表面212(顶面),并形成复数个贯穿基板21且对应发光二极管组件22位置以及数量的第一穿孔213;此外,在基板21的第一表面211上暴露出由铜箔或其它导电层所形成的图案化导电线路214。 In the present embodiment, the substrate 21 may be a printed circuit board or other multilayer sheet having a first opposing surface 211 (bottom surface) 212 and a second surface (top surface), and forming a plurality of through the substrate 21 and the corresponding LED assembly 22 and the first position of the number of perforations 213; in addition, the first surface 211 is exposed on the substrate 21 patterned conductive line 214 made of copper foil or other conductive layer is formed.

继续参照图2A,本实施例所提供的发光二极管组件22由一发光二极管221以及一载体222所组成,其中,发光二极管221的外径略小于第一穿孔213的外径,但载体222底部则延伸形成一外缘大于第一穿孔213外径的固定部223,并且复数个与发光二极管221电性连接的引脚224也自固定部223侧壁上外露出来。 With continued reference to Figure 2A, a light emitting diode assembly according to the present embodiment 22 is provided by a light emitting diode 221 and a carrier 222, where the outer diameter of the light emitting diode 221 is slightly smaller than the outer diameter of the first through hole 213, but the bottom support 222 a fixing portion 223 formed by extending the outer edge is larger than the outer diameter of the first through hole 213, a plurality of pins 224 and 221 are electrically connected to the light emitting diode 223 is also exposed out from the upper side wall portion is fixed.

参照图2B,当移动发光二极管组件22并自第一表面211插入对应的第一穿孔213时,发光二极管221就可通过第一穿孔213并突出于基板21的第二表面212,而固定部223则抵靠于第一表面211上邻近第一穿孔213周围的部分而无法穿设;如此,就可利用焊液23将引脚224焊接于图案化导电线路214上而完成发光二极管组件22与基板21间的电性连接与组合结构。 2B, the first perforated section when the fixing assembly 22 and moving the light emitting diode 211 is inserted from the first surface 213 corresponding to the light emitting diodes 221 and 213 can be perforated by a first projection 21 on the second surface of the substrate 212, and 223 the abutment portion 213 adjacent the periphery of the first perforations can not be disposed through the first surface 211; thus, the substrate 22 can use the liquid solder 23 on a pin 224 welded to the patterned conductive line 214 is completed light emitting diode assembly 21 is electrically connected to the composite structure.

参照图2C,为了将发光二极管221运作时所产生的热能有效排出, 本实施例将发光二极管组件22与基板21的组合结构做一180度的翻 Referring to Figure 2C, in order to effectively discharge heat emitting diode 221 generated by the operation of the present embodiment, the light emitting diode assembly 22 will make a 180 degree turn in combination with the structure of the substrate 21,

转后直接藉复数个导热垫24而将载体222底面与一散热件25的表面接触;而由于本实施例所提供的载体222具有外缘大于第一穿孔213 外径的固定部223,因此可沿箭头方向施予基板21 —向下的压力而让发光二极管组件22与散热件25之间有一更紧密的结合而增加散热的功效,而已知的发光二极管组件的载体其引脚因为基板下压而产生变形甚至与图案化导电线路脱离的问题就可以避免。 After transfection directly by the plurality of thermally conductive surface contact carrier 24 and the bottom surface 222 and a heat sink pad 25; and as the carrier according to the present embodiment has a fixing portion 222 provided in an outer edge 213 is greater than the outer diameter of the first perforations 223, thus administering the direction of arrow 21 of the substrate - the pressure let-down light emitting diode assembly has a tighter bond between the heat sink 2522 and the cooling effect is increased, and the light emitting diode assembly known carriers of the pin because the voltage at the substrate deformed even with the patterned conductive trace from the problem can be avoided.

而组合完成的光源模块其立体示意图可参照图2D,此图显示每一发光二极管221已通过对应的第一穿孔213并突出于基板21的第二表面212。 While the combination of a light source module which completed a perspective schematic diagram Referring to Figure 2D, this figure shows the light emitting diode 221 each have a first perforation through the corresponding projection 213 and the second surface 212 of the substrate 21. 而在依据本发明的其它具体实施例中,基板也可直接形成有对应复数个发光二极管组件的穿槽,例如参照图2E,在基板21上形成有一穿槽215,并且此穿槽215宽度介于发光二极管221外径以及固定部213外缘之间,如此一来,复数个发光二极管221就可同时通过此穿槽215并且突出于基板21的第二表面212,而每一发光二极管组件的固定部223所形成的抵靠面2231均可抵靠于基板21的第一表面(图中未示)上邻近此穿槽215的周围。 In accordance with other specific embodiments of the invention embodiment, the substrate may be directly formed with a corresponding plurality of through slots the light emitting diode elements, for example, see FIG. 2E, a through slot 215 formed on the substrate 21, and this through 215 width mediated groove between the outer diameter of the light emitting diode 221 and a fixed portion outer edge 213, this way, a plurality of light emitting diodes 221 can be simultaneously through this projecting through slots 215 and 212 on the second surface of the substrate 21, and each of the light emitting diode assembly a fixing portion 223 formed around the abutment surface 2231 can be adjacent to this groove through the first surface against the substrate 21 (not shown) on the 215.

另外,参照图2F,本发明也可视发光二极管组件22的特性或光源模块的需要而增加一反射件,例如当本实施例所采用的发光二极管221为一边射型(sideemitting)的发光二极管22时,就可在基板21的第二表面212上贴覆一反射片26(或形成一反射表面),而在反射片26上形成复数个对应第一穿孔213位置的第二穿孔261,并且此第二穿孔261的外径可选择如第二F图中所示,大于发光二极管外径,而让发光二极管221直接通过此第二穿孔261并突出于反射片26外;或者在依据本发明的其它具体实施例中,在反射片上形成一外径等于或小于发光二极管的第二穿孔,如图2G所示,而能让反射片与发光二极管之间有一更紧密的贴合效果而避免发生漏光的现象,故可以达到更有效能的光输出。 Further, referring to FIG. 2F, the present invention also optionally features or components of the light emitting diode light source module 22 is a reflecting member increases, for example, when the light emitting diode of the present embodiment is used in a light emitting diode 221 side emission type (sideemitting) 22 when the second substrate can be 21 212 pasted on its surface 26 (or forming a reflective surface) a reflective sheet, and a second plurality of perforations 213 corresponding to the first position of the perforations 261 is formed on the reflective sheet 26, and this Alternatively diameter of the second perforation 261 as shown in the second figure F, is greater than the outer diameter of the light emitting diode, light emitting diode 221 and so directly through this second perforation 261 and protrudes outside the reflection sheet 26; or, in accordance with the present invention in other embodiments, the reflective sheet is formed on a second perforated outer diameter less than or equal to the light emitting diode, shown in Figure 2G, and allows a tighter fit results between the reflective sheet and the light emitting diode and to avoid the occurrence of light leakage the phenomenon, it can reach more light output efficiency.

另外,在依据本发明的其它实施例中,散热件除了可选自一散热 Further, in accordance with other embodiments of the present invention, in addition to the heat dissipation member selected from a heat

片外,也可如图2H中所示选自一散热鳍片27(heat sink)而增加散热的效果;而设置于每一载体222底面与散热鳍片27之间的导热垫24也可如图2H中所示为一整片的结构。 An outer sheet, also shown in FIG. 2H selected from a heat-dissipating fins 27 (heat sink) is increased cooling effect; and the thermal conductivity between the heat dissipating fins 27 222 disposed on the bottom surface of each support pad 24 may also be as in the structure shown in FIG whole slice 2H.

参照图2 I与第二J图2J,其本实施例所提供的发光二极管组件22具有不同外型变化的立体示意图,其中,每一种固定部223均为载体222底部的延伸,其目的在产生断差而形成一抵靠面2231,使得发光二极管221自基板上方插入第一穿孔而让发光二极管221以及部分载体222通过时,外缘大于穿孔孔径的固定部223就能藉此抵靠面2231 而被抵靠在第一穿孔外,因而能顺利进行后续引脚224与图案化导电线路的焊接步骤;此外,当发光二极管组件22与基板的组合结构藉导热垫而抵靠至散热件表面时,基板所施予发光二极管组件22的压力就不会直接压迫与图案化导电线路焊接在一起的引脚224。 Referring to FIG. 2 I and J in FIG. 2J second, a light emitting diode assembly according to the present embodiment is provided which has a perspective schematic view of a different shape 22 changes, wherein each of the base fixing portion 223 are extending support 222, the purpose of the forming a difference is generated off abutment surface 2231, such that the light emitting diode 221 is inserted from above the first perforated so that the light emitting diode substrate 221 and the fixed portion when the carrier portion 222, the outer edge of the aperture 223 can be larger than the perforations whereby abutment surface 2231 is against the first perforated outer, which can smoothly follow the pin 224 and the welding step of patterning the conductive lines; in addition, when the light emitting diode assembly 22 in combination with the structure of the substrate by the thermal pad against the surface to the heat sink , the pressure of the light emitting diode substrate assembly 22 does not direct compression administering patterned conductive trace pins 224 are welded together. 而本发明所提供的发光二极管组件22其固定部223的外型可如图21以及图2J中所示,为一立方体型或是圆柱型,其均可形成大于穿孔(或穿槽)范围的抵靠面2231而达到相同的抵靠效果。 The exterior assembly of the present invention, the light emitting diode 22 is provided which may be fixed portion 223 as shown in FIG. 21 and FIG. 2J, is a cubic type or a cylindrical type, which can be formed larger than the perforation (or through slots) range 2231 against the surface to achieve the same effect against.

以上所述的实施例仅为说明本发明的技术思想及特点,其目的在使熟习此项技艺的人士能够了解本发明的内容并据以实施,当不能以的限定本发明的专利范围,即大凡依本发明所揭示的精神所作的均等变化或修饰,仍应涵盖在本发明的专利范围内。 The above-described embodiments are illustrative only and characteristics of the technical idea of ​​the present invention, it is an object to make the person skilled in the art to understand the present invention and according to embodiments, when the scope of the patent is not limited to the present invention, i.e., Generally under this or alterations of the invention disclosed spirit modifications made, it should still fall within the scope of the present invention.

Claims (13)

  1. 1.一种光源模块,包括: 一基板,其上具有一第一穿孔;以及一发光二极管组件,包括有一发光二极管及一载体,其特征是,该载体底部形成一外缘大于该第一穿孔外径的一固定部,该固定部由该载体的底部延伸而凸出该载体的侧壁,其中该发光二极管贯穿该第一穿孔,而该固定部则抵接于该基板的底面。 1. A light source module comprising: a substrate having thereon a first through hole; and a light emitting diode assembly comprising a light emitting diode and a carrier, characterized in that an outer edge forming a bottom portion of the carrier is greater than the first through hole an outer diameter of a fixing portion, the fixing portion extends from the bottom of the carrier and projecting from the side wall of the support, wherein the light emitting diode through the first through hole, and the fixing portion of the bottom surface abuts against the substrate.
  2. 2. 如权利要求l所述的光源模块,其特征是,还包括一散热件连接该载体的底面。 2. The light source module as claimed in claim l, characterized in that the bottom surface further comprising a heat sink member connected to the carrier.
  3. 3. 如权利要求2所述的光源模块,其特征是,该散热件包括一散热片。 The light source module according to claim 2, characterized in that the heat sink comprises a heat sink.
  4. 4. 如权利要求2所述的光源模块,其特征是,还包括一导热垫设置于该载体与该散热件之间。 The light source module according to claim 2, characterized in that, further comprising a thermal pad disposed between the support and the heat sink.
  5. 5. 如权利要求l所述的光源模块,其特征是,还包括一反射片, 该反射片配置于该基板的顶面上。 The light source module as claimed in claim l, characterized in that, further comprising a reflective sheet, the reflective sheet disposed on the top surface of the substrate.
  6. 6. 如权利要求5所述的光源模块,其特征是,该反射片上具有对应于该第一穿孔位置的一第二穿孔,藉以使该发光二极管能够通过该第二穿孔并突出于该反射片。 The light source module according to claim 5, characterized in that, having a second through hole corresponding to the first punching position on the reflective sheet, whereby the light emitting diode through the second through hole and protruding from the reflective sheet .
  7. 7. 如权利要求6所述的光源模块,其特征是,该第二穿孔的孔径相当于或小于该发光二极管的外径。 The light source module according to claim 6, characterized in that the second perforated outer diameter of the pore diameter equal to or smaller than the light emitting diode.
  8. 8. —种光源模块,其特征是,包括-一基板,具有一穿槽,且该基板具有相对的一第一表面与一第二表面;以及复数个发光二极管组件,对应该穿槽配置,其中,每一该发光二极管组件由一发光二极管以及一载体所组成,并于该载体底部形成有外缘大于该穿槽宽度的一固定部,该固定部由该载体的底部延伸而凸出该载体的侧壁,使得该复数个发光二极管组件自该基板的该第一表面插入该穿槽时,该复数个发光二极管能够同时通过该穿槽而突出于该第二表面,而该固定部则抵靠于该第一表面上邻近该穿槽的周围。 8. - seed light source module, which is characterized by comprising - a substrate having a through slot and the opposite substrate having a first surface and a second surface; and a plurality of light emitting diode modules, the configuration of the grooves should wear, wherein each of the light emitting diode assembly composed of a light emitting diode and a carrier composition, and to the outer edge of the bottom support is formed with a fixing portion is greater than the width of the through slot, extending from the bottom of the fixing portion of the support and the projection when the carrier side wall, such that the plurality of light emitting diode elements from the first surface of the substrate is inserted into the through slot, the plurality of light emitting diodes can be simultaneously protrudes through the slot through to the second surface, and the fixing portion of the against the periphery of the through slot is proximate to the first surface.
  9. 9. 如权利要求8所述的光源模块,其特征是,还包括一散热件连接该载体的底面。 The light source module as claimed in claim 8, characterized in that, further comprising a heat sink member connected to a bottom surface of the carrier.
  10. 10. 如权利要求9所述的光源模块,其特征是,该散热件包括一散热片。 10. The light source module according to claim 9, characterized in that the heat sink comprises a heat sink.
  11. 11. 如权利要求9所述的光源模块,其特征是,还包括一导热垫设置于该载体与该散热件之间。 11. The light source module according to claim 9, characterized in that, further comprising a thermal pad disposed between the support and the heat sink.
  12. 12. 如权利要求8所述的光源模块,其特征是,还包括一反射片配置于该基板的第二表面上。 12. The light source module according to claim 8, characterized in that, further comprising a reflective sheet disposed on a second surface of the substrate.
  13. 13. 如权利要求12所述的光源模块,其特征是,该反射片上具有对应该发光二极管组件的一穿孔,藉以使该发光二极管能够通过该穿孔并突出于该反射片。 13. The light source module as claimed in claim 12, characterized in that, having a light emitting diode assembly to be perforated on the reflective sheet, whereby the light emitting diode through the through hole and protruding from the reflective sheet.
CN 200510075992 2005-06-07 2005-06-07 Light source module CN100388516C (en)

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CN100552990C (en) 2006-12-29 2009-10-21 富准精密工业(深圳)有限公司;鸿准精密工业股份有限公司 LED module group
RU2490540C2 (en) 2007-05-07 2013-08-20 Конинклейке Филипс Электроникс Нв Led-based lighting fixture purposed for surface illumination with improved heat dissipation and fabricability
US8115369B2 (en) * 2009-11-09 2012-02-14 Lg Innotek Co., Ltd. Lighting device
CN101975376B (en) * 2010-10-08 2012-07-11 深圳市华星光电技术有限公司 Luminous source heat-dissipation structure of backlight module
CN102679210B (en) * 2012-04-01 2014-08-13 深圳市超频三科技有限公司 LED (light-emitting diode) lamp and LED light source component

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5857767A (en) 1996-09-23 1999-01-12 Relume Corporation Thermal management system for L.E.D. arrays
US6428189B1 (en) 2000-03-31 2002-08-06 Relume Corporation L.E.D. thermal management
US20050024834A1 (en) 2003-07-28 2005-02-03 Newby Theodore A. Heatsinking electronic devices
CN1588658A (en) 2004-07-01 2005-03-02 友达光电股份有限公司 Light-emitting diode light source module with support piece
CN1591924A (en) 2003-07-29 2005-03-09 西铁城电子股份有限公司 Surface-mounted LED and light emitting device with same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5857767A (en) 1996-09-23 1999-01-12 Relume Corporation Thermal management system for L.E.D. arrays
US6428189B1 (en) 2000-03-31 2002-08-06 Relume Corporation L.E.D. thermal management
US20050024834A1 (en) 2003-07-28 2005-02-03 Newby Theodore A. Heatsinking electronic devices
CN1591924A (en) 2003-07-29 2005-03-09 西铁城电子股份有限公司 Surface-mounted LED and light emitting device with same
CN1588658A (en) 2004-07-01 2005-03-02 友达光电股份有限公司 Light-emitting diode light source module with support piece

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