CN111050464A - Circuit board with sandwich metal heat sink - Google Patents

Circuit board with sandwich metal heat sink Download PDF

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Publication number
CN111050464A
CN111050464A CN201911391492.0A CN201911391492A CN111050464A CN 111050464 A CN111050464 A CN 111050464A CN 201911391492 A CN201911391492 A CN 201911391492A CN 111050464 A CN111050464 A CN 111050464A
Authority
CN
China
Prior art keywords
conductive
insulating
metal heat
circuit board
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201911391492.0A
Other languages
Chinese (zh)
Inventor
袁绪彬
黄广新
陈爱兵
高卫东
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rayben Technologies Hk Ltd
Original Assignee
Rayben Technologies Hk Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rayben Technologies Hk Ltd filed Critical Rayben Technologies Hk Ltd
Priority to CN201911391492.0A priority Critical patent/CN111050464A/en
Publication of CN111050464A publication Critical patent/CN111050464A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation

Abstract

The embodiment of the invention discloses a circuit board with a sandwich metal radiator, which comprises: the metal heat radiation body is provided with a metal heat radiation plate and metal heat conduction bosses formed on two opposite surfaces of the metal heat radiation plate; insulating substrates disposed on two opposite surfaces of the metal heat dissipation plate; a conductive circuit formed on the surface of the insulating substrate; the conductive circuits on the two opposite surface sides of the circuit board are electrically connected through conductive through holes, and the conductive through holes penetrate through the insulating substrate and the metal heat dissipation plate; the device heat conduction welding pads are formed on two opposite surfaces of the circuit board and are directly connected with the heat conduction bosses; the metal cooling plate is provided with a first insulating hole for the conductive through hole to pass through, and the first insulating hole is filled with an insulating medium for electrically insulating the conductive through hole and the metal cooling plate; the insulating substrate is provided with a second insulating hole for the conductive through hole to pass through, and the diameter of the second insulating hole is smaller than that of the first insulating hole. The circuit board has the advantages of good electrical insulation capability and heat dissipation capability.

Description

Circuit board with sandwich metal heat sink
Technical Field
The present invention relates to the field of printed circuit boards; and more particularly, to a circuit board having a sandwich metal heat sink.
Background
Power semiconductor devices such as LEDs (light emitting diodes), MOSFETs (power field effect transistors), IGBTs (insulated gate bipolar transistors) and the like generally have a circuit board as a mounting carrier, and the circuit board as the mounting carrier is required to have good heat conductivity because the power semiconductor devices generate a large amount of heat during operation.
Chinese patent application CN201110032105.1 discloses a double-layer high heat dissipation sandwich metal-based printed circuit board, which is formed by disposing copper-based or aluminum-based heat dissipation plates in the core of an insulating substrate to form a sandwich metal circuit board, so as to utilize the copper-based or aluminum-based heat dissipation plates to enhance the heat dissipation performance of the circuit board. However, since the copper-based or aluminum-based heat dissipation plate is disposed in the core portion of the insulating substrate, the power semiconductor device mounted on the insulating substrate cannot be directly connected to the copper-based or aluminum-based heat dissipation plate, and therefore the heat dissipation performance of the circuit board is still to be further improved.
Chinese patent application CN201110139948.1 discloses a printed circuit board with a metal micro-radiator, which comprises a metal bottom layer and a metal micro-radiator connected into a whole, and a conventional printed circuit board arranged on the metal bottom layer; the power semiconductor device is arranged on the surface of the metal micro radiator, and heat emitted during working can be conducted to the metal bottom layer through the metal micro radiator and then conducted to the outside of the printed circuit board through the metal bottom layer, so that the problem of heat conduction between the power semiconductor device and the metal plate is effectively solved. However, the circuit board can only mount a power device on one side of the circuit board, and is limited in application.
Disclosure of Invention
The invention mainly aims to provide a circuit board with a sandwich metal radiator, which has good heat radiation performance and electrical insulation performance, and conductive circuits are arranged on two surfaces of the circuit board, so that the circuit board is convenient to miniaturize and widen the application range.
In order to achieve the above-mentioned main object, the present invention provides a circuit board with a sandwich metal heat sink, comprising:
the heat dissipation body is provided with a metal heat dissipation plate and metal heat conduction bosses formed on two opposite surfaces of the metal heat dissipation plate;
insulating substrates provided on both opposite surface sides of the metal heat dissipation plate;
the patterning metal layer is provided with a conductive circuit formed on the surface of the insulating substrate, and the conductive circuit comprises a plurality of conductive bonding pads; the conductive circuits on the two opposite surfaces of the circuit board are electrically connected through conductive through holes, and the conductive through holes penetrate through the insulating substrate and the metal heat dissipation plate;
the device heat conduction welding pads are formed on two opposite surfaces of the circuit board and are directly connected with the metal heat conduction bosses;
solder masks formed on two opposite surfaces of the circuit board; the solder mask is provided with a window for exposing the heat conducting bonding pad and the electric conducting bonding pad of the device;
the metal cooling plate is provided with a first insulating hole for the conductive through hole to pass through, and insulating resin for electrically insulating the conductive through hole and the metal cooling plate is filled in the first insulating hole; the insulating substrate and the insulating resin have a second insulating hole through which the conductive via passes, the diameter of the second insulating hole being smaller than the diameter of the first insulating hole.
According to the invention, the first insulating hole of the metal heat dissipation plate is filled with insulating resin, and the conductive via hole is formed in the second insulating hole, so that the conductive via hole and the metal heat dissipation plate are reliably and electrically insulated by the insulating resin in the first insulating hole, and the circuit board has good electrical insulation performance; the second insulation hole penetrating through the insulation substrate has a diameter smaller than that of the first insulation hole, so that the conductive circuit (particularly the conductive circuit at the connection part of the conductive via hole) and the insulation substrate have good bonding force.
In the invention, the two opposite surfaces of the circuit board are provided with the conductive circuits which are mutually and electrically connected, so that the circuit board can be provided with semiconductor devices on two sides, the wiring is flexible, and the miniaturization of the circuit board is facilitated; the device heat conduction pad is directly connected with the metal heat conduction boss, and heat generated by the power device arranged on the device heat conduction pad during working can be quickly diffused through the metal heat conduction boss and the metal heat dissipation plate, so that the circuit board has good heat conduction performance.
According to a preferred embodiment of the present invention, the height of the metal heat conductive bosses is 0.1 mm to 1 mm, and the heights of the metal heat conductive bosses provided on the two opposite surfaces of the metal heat dissipation plate are equal.
According to a preferred embodiment of the present invention, the metal heat dissipation plate is a copper heat dissipation plate, and the metal heat conduction projection is a copper projection integrally formed with the copper heat dissipation plate.
According to a preferred embodiment of the invention, the device heat conducting pad completely covers the metal heat conducting boss.
In the invention, the conductive via hole comprises a conductive ring and plug hole resin filled in the conductive ring, and the conductive ring penetrates through the insulating substrate and the metal heat dissipation plate.
According to one embodiment of the present invention, a conductive pad is formed at least partially over the conductive via, and the patterned metal layer includes a copper foil layer formed on the insulating substrate, a first copper-clad layer overlying the copper foil layer, and a second copper-clad layer overlying the conductive via and the first copper-clad layer.
Preferably, the first copper-clad layer and the second copper-clad layer further cover the metal heat conduction boss, so that the device heat conduction pad is flush with the surface of the conductive circuit.
According to another embodiment of the present invention, a solder resist covers a conductive via, and a conductive line includes a copper foil layer formed on an insulating substrate and a copper clad layer covering the copper foil layer; preferably, the copper-clad layer also covers the metal heat conduction boss, so that the device heat conduction pad is flush with the surface of the conductive circuit.
In one embodiment of the present invention, the insulating substrate includes an insulating core plate, and an insulating adhesive layer adhesively connecting the insulating core plate and the metal heat dissipation plate, the insulating adhesive layer having a thermal expansion coefficient between that of the insulating core plate and that of the insulating resin.
In the technical scheme, through controlling the thermal expansion coefficient of the material, the bonding performance deterioration caused by the difference of the thermal expansion coefficients between the insulating adhesion layer and the insulating core plate and between the insulating adhesion layer and the insulating resin can be reduced, and the bonding force between the conductive circuit and the insulating substrate can be further improved. In particular, by controlling the thermal expansion coefficient of the material, the probability of generating a gap between the insulating adhesive layer and the insulating resin due to a difference in thermal expansion coefficient after long-term use can be reduced, which gap will significantly reduce the electrical insulating ability between the conductive via and the metal heat sink.
To more clearly illustrate the objects, technical solutions and advantages of the present invention, the present invention will be further described in detail with reference to the accompanying drawings and detailed description.
Drawings
FIG. 1 is a schematic structural diagram of a circuit board of embodiment 1 of the present invention;
FIG. 2 is a schematic structural diagram of a circuit board of embodiment 2 of the present invention;
FIG. 3 is a schematic structural diagram of a circuit board of embodiment 3 of the present invention;
fig. 4 is a schematic structural diagram of a circuit board embodiment 4 of the present invention.
Detailed Description
Example 1
Referring to fig. 1, in the circuit board of embodiment 1, the heat sink includes a metal heat dissipation plate 11 and metal heat conduction bosses 12 formed on two opposite surfaces of the metal heat dissipation plate 11; the gold heat sink 11 is preferably a copper heat sink, and the metal heat conductive bosses 112 are heat conductive copper bosses integrally connected to the copper heat sink. The height of the metal heat conducting boss 12 is 0.1 mm to 1 mm, preferably 0.1 mm to 0.5 mm. The heights and/or shapes of the metal heat conductive bosses 112 on the two opposite surfaces of the metal heat sink 11 may be the same or different.
The metal heat sink 111 has a first insulating hole 111 provided therein, and the first insulating hole 111 is filled with an insulating resin 13. The metal heat dissipation plate 11 has insulating substrates provided on opposite surfaces thereof, the insulating substrates including, for example, an insulating adhesive layer 21 formed by curing a prepreg, and an insulating core 22; among them, the thermal expansion coefficient of the insulating adhesive layer 21 is preferably between the thermal expansion coefficient of the insulating core plate 22 and the thermal expansion coefficient of the insulating resin 13.
The insulating substrate and the insulating resin 13 have a second insulating hole 131 through which the conductive via passes, and the diameter of the second insulating hole 131 is smaller than that of the first insulating hole 111. The conductive via penetrates the insulating substrate and the metal heat dissipation plate 11, and includes a conductive ring 41 formed on an inner wall of the second insulating hole 131 and a plug resin 42 filled in the conductive ring 41.
The surface of the insulating substrate is provided with a patterned metal layer, the patterned metal layer is provided with a conductive circuit, the conductive circuit comprises a plurality of conductive pads 302, the conductive pads 302 are formed at the positions of the conductive through holes, and the conductive circuits on two opposite surfaces of the circuit board are electrically connected through the conductive through holes. A device heat conduction pad 301 is formed on the metal heat conduction boss 112, the device heat conduction pad 301 completely covers the metal heat conduction boss 112, and the surface of the device heat conduction pad 301 is flush with the surface of the electric conduction pad 302. Solder masks 50 are formed on two opposing surfaces of the circuit board and have windows that expose the device thermal and electrical conductive pads 301 and 302.
The patterned metal layer of the surface of the insulating substrate includes a copper foil layer 31 formed on the insulating substrate, a first copper-clad layer 32 covering the copper foil layer 31, and a second copper-clad layer 33 covering the conductive via and the first copper-clad layer 32. The first copper-clad layer 32 and the conductive ring 41 are integrally formed by, for example, an electroplating process. The first copper-clad layer 32 and the second copper-clad layer 33 cover the metal heat conductive bump 12 so that the device heat conductive pad 301 formed on the metal heat conductive bump 12 is flush with the surface of the conductive line.
Example 2
Referring to fig. 2, the difference between the embodiment 2 and the embodiment 1 is only that: the insulating substrate 20 has a single-layer structure. The insulating substrate 20 is, for example, an insulating resin layer having adhesiveness, and is press-fitted and adhesively fixed to the surface of the metal heat dissipation plate 11.
Example 3
Referring to fig. 3, embodiment 3 differs from embodiment 1 only in that: conductive vias and pads 302 are formed at different locations on the circuit board, with the solder mask 50 covering the conductive vias; accordingly, the patterned metal layer may include only the copper foil layer 31 formed on the insulating substrate, and the copper clad layer 32 covering the copper foil layer 31 and the metal heat conductive boss 12.
Example 4
Referring to fig. 4, embodiment 4 differs from embodiment 1 only in that: the metal heat conductive bosses 12 and the metal heat dissipation plate 11 are connected to each other, not integrally formed. In embodiment 4, the metal heat conductive bosses 12 and the metal heat sink 11 may be made of the same material or different materials, for example, the metal heat sink 11 is an aluminum heat sink, and the metal heat conductive bosses 12 are copper bosses.
Although the present invention has been described with reference to specific embodiments, these embodiments are not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that various changes/substitutions may be made without departing from the scope of the invention, and it is intended that all equivalent changes and modifications made in accordance with the present invention shall be embraced by the scope of the invention.

Claims (10)

1. A circuit board with a sandwiched metal heat sink, comprising:
the heat dissipation body is provided with a metal heat dissipation plate and metal heat conduction bosses formed on two opposite surfaces of the metal heat dissipation plate;
insulating substrates provided on both opposite surface sides of the metal heat dissipation plate;
the patterning metal layer is provided with a conductive circuit formed on the surface of the insulating substrate, and the conductive circuit comprises a plurality of conductive bonding pads; the conductive circuits on the two opposite surfaces of the circuit board are electrically connected through conductive through holes, and the conductive through holes penetrate through the insulating substrate and the metal heat dissipation plate;
the device heat conduction welding pads are formed on two opposite surfaces of the circuit board and are directly connected with the metal heat conduction bosses;
solder masks formed on two opposite surfaces of the circuit board; the solder mask has windows exposing the device thermal conductive pads and the electrical conductive pads;
wherein the metal heat dissipation plate has a first insulation hole through which the conductive via passes, the first insulation hole being filled with an insulating resin that electrically insulates the conductive via and the metal heat dissipation plate; the insulating substrate and the insulating resin have a second insulating hole through which the conductive via hole passes, and the diameter of the second insulating hole is smaller than that of the first insulating hole.
2. The circuit board of claim 1, wherein: the height of the metal heat conduction bosses is 0.1 mm to 1 mm, and the height of the metal heat conduction bosses arranged on the two opposite surfaces of the metal heat dissipation plate is equal.
3. The circuit board of claim 1, wherein: the metal heat dissipation plate is a copper heat dissipation plate, and the metal heat conduction boss is a copper boss integrated with the copper heat dissipation plate.
4. The circuit board of claim 1, wherein: the device heat conduction pad completely covers the metal heat conduction boss.
5. The circuit board of claim 1, wherein: the conductive via hole comprises a conductive ring and plug hole resin filled in the conductive ring, and the conductive ring penetrates through the insulating substrate and the metal heat dissipation plate.
6. The circuit board of claim 5, wherein: the conductive pad is formed at the position of at least part of the conductive via hole, and the patterned metal layer comprises a copper foil layer formed on the insulating substrate, a first copper-clad layer covering the copper foil layer, and a second copper-clad layer covering the conductive via hole and the first copper-clad layer.
7. The circuit board of claim 6, wherein: the first copper-coated layer and the second copper-coated layer further cover the metal heat conduction boss, so that the device heat conduction pad is flush with the surface of the conductive circuit.
8. The circuit board of claim 5, wherein: the solder mask covers the conductive via hole, and the conductive circuit comprises a copper foil layer formed on the insulating substrate and a copper-clad layer covering the copper foil layer.
9. The circuit board of claim 8, wherein: the copper-clad layer also covers the metal heat conduction boss, so that the device heat conduction pad is flush with the surface of the conductive circuit.
10. The circuit board of claim 1, wherein: the insulating substrate comprises an insulating core plate and an insulating adhesive layer which is used for adhering and connecting the insulating core plate and the metal heat dissipation plate, and the thermal expansion coefficient of the insulating adhesive layer is between that of the insulating core plate and that of the insulating resin.
CN201911391492.0A 2019-12-30 2019-12-30 Circuit board with sandwich metal heat sink Pending CN111050464A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911391492.0A CN111050464A (en) 2019-12-30 2019-12-30 Circuit board with sandwich metal heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911391492.0A CN111050464A (en) 2019-12-30 2019-12-30 Circuit board with sandwich metal heat sink

Publications (1)

Publication Number Publication Date
CN111050464A true CN111050464A (en) 2020-04-21

Family

ID=70241458

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201911391492.0A Pending CN111050464A (en) 2019-12-30 2019-12-30 Circuit board with sandwich metal heat sink

Country Status (1)

Country Link
CN (1) CN111050464A (en)

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WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20200421

WD01 Invention patent application deemed withdrawn after publication