CN108571695A - A kind of car light projection lamp module - Google Patents
A kind of car light projection lamp module Download PDFInfo
- Publication number
- CN108571695A CN108571695A CN201710894950.7A CN201710894950A CN108571695A CN 108571695 A CN108571695 A CN 108571695A CN 201710894950 A CN201710894950 A CN 201710894950A CN 108571695 A CN108571695 A CN 108571695A
- Authority
- CN
- China
- Prior art keywords
- led
- dipped beam
- wiring board
- distance light
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000002788 crimping Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 238000009738 saturating Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 238000013461 design Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Microscoopes, Condenser (AREA)
Abstract
The invention belongs to LED headlamp lens mould technical group fields, to solve the bad technical problem of existing far and near double light LED projection lamp module integral heat sink performances, provide a kind of car light projection lamp module, including radiator, dipped beam wiring board, speculum, lens, lens carrier, distance light wiring board, transparent baffle, distance light LED and dipped beam LED, lens are mounted on lens carrier, lens carrier is fixed with radiator, dipped beam wiring board is mounted on the horizontal plane of radiator, dipped beam LED is arranged between dipped beam wiring board and radiator, distance light wiring board is mounted on the inclined-plane of radiator, distance light LED is arranged between distance light wiring board and radiator, dipped beam LED and distance light LED is all made of ultra-thin ceramic as substrate.The dipped beam LED and distance light LED of the present invention is all made of ultra-thin ceramic as substrate, significantly reduces the thermal resistance of chip, improves the heat dissipation performance of module.
Description
Technical field
The invention belongs to LED headlamp lens mould technical group fields, and in particular to a kind of car light projection lamp module.
Background technology
With large-scale use of the LED light source in automobile lamp, LED headlights also gradually occupy a seat in headlight market
Ground, and increased with faster speed, it is contemplated that LED headlamps will will appear blowout before and after the year two thousand twenty.And LED headlight projection lamps
Nucleus module of the module as LED headlights, design (optical system and structure design) method are also looked forward to by more and more car lights
The concern and attention of industry and main engine plants.Currently, a variety of far and near double light LED projection lamp modules have been emerged in large numbers on the market, but existing distance
The integral heat sink performance of double light LED projection lamp modules is bad.
Invention content
The present invention is to solve the bad technical problem of existing far and near double light LED projection lamp module integral heat sink performances, is provided
A kind of car light projection lamp module.
The technical solution adopted by the present invention is as follows：
A kind of car light projection lamp module, including radiator, dipped beam wiring board, speculum, lens, lens carrier, distance light
Wiring board, transparent baffle, distance light LED and dipped beam LED, the lens are mounted on lens carrier, the lens carrier and heat dissipation
Device is fixed, and the section of the radiator is bent structure, including horizontal plane and the inclined-plane that is connected with horizontal plane, the dipped beam line
Road plate is mounted on the horizontal plane of radiator, and the dipped beam LED is arranged between dipped beam wiring board and radiator, the reflective mirror
It is arranged above dipped beam LED, the distance light wiring board is mounted on the inclined-plane of radiator, and the distance light LED is arranged in distance light line
Between road plate and radiator, the transparent baffle is arranged above distance light LED, and the dipped beam LED and distance light LED is all made of ultra-thin
Ceramics are used as substrate.
The dipped beam wiring board is equipped with the metal spring leaf for crimping fixed dipped beam LED, is set on the distance light wiring board
It is useful for crimping the metal spring leaf of fixed distance light LED, the metal spring leaf is arch bridge-type structure.
The metal spring leaf uses thickness to be made for the copper base of 0.15~0.3mm.
The metal spring leaf is equipped with coating.
It is respectively equipped with thermistor on the dipped beam wiring board and distance light wiring board.
The reflecting surface of the speculum is curved-surface structure.
Beneficial effects of the present invention：
1. the dipped beam LED and distance light LED of the present invention are all made of ultra-thin ceramic as substrate, the heat of chip is significantly reduced
Resistance, improves the heat dissipation performance of module.
2. the dipped beam wiring board and the metal spring leaf on distance light wiring board of the present invention can be very good fixed dipped beam LED and remote
Light LED, and realize electrical connection.
3. the dipped beam wiring board and distance light wiring board of the present invention are equipped with thermistor, can be to dipped beam LED and distance light LED
Into the real time monitoring of trip temperature.
4. the reflecting surface of the speculum of the present invention is set as curved-surface structure, the side being combined using oval and free form surface
Formula, quantity and model for different LED possess stronger compatibility, on the one hand can be directed to the price and performance of LED chip, choosing
Suitable product is selected, different LED chips on the other hand may be selected, realize the diversification of module.
Description of the drawings
Fig. 1 is the design schematic diagram of apparatus of the present invention；
Fig. 2 is the schematic diagram of apparatus of the present invention baffle；
Fig. 3 is the dipped beam wiring board schematic diagram of apparatus of the present invention；
Fig. 4 is the scheme of installation of the dipped beam LED chip of apparatus of the present invention.
In figure：1- radiators, 2- dipped beams wiring board, 3- speculums, 4- lens, 5- lens carriers, 6- distance light wiring board, 7-
Transparent baffle, 8- distance light LED, 9- dipped beam LED, 21- metal spring leaf, 22- thermistors.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
As shown in Figure 1, a kind of car light projection lamp module, including radiator 1, dipped beam wiring board 2, speculum 3, lens 4,
Lens carrier 5, distance light wiring board 6, transparent baffle 7, distance light LED8 and dipped beam LED9, the lens 4 are mounted on lens carrier 5
On, the lens carrier 5 is fixed with radiator 1, and the section of the radiator 1 is bent structure, including horizontal plane and and water
The connected inclined-plane of plane, the dipped beam wiring board 2 are mounted on the horizontal plane of radiator 1, and the dipped beam LED9 is arranged in dipped beam
Between wiring board 2 and radiator 1, the reflective mirror is arranged above dipped beam LED9, and the distance light wiring board 6 is mounted on radiator
On 1 inclined-plane, the distance light LED8 is arranged between distance light wiring board 6 and radiator 1, and the transparent baffle 7 is arranged in distance light
Above LED8, the dipped beam LED9 and distance light LED8 is special LED chip, is all made of ultra-thin ceramic as substrate, i.e., directly
LED fluorescent powder is produced on ultra-thin ceramic substrate, the thermal resistance of chip is significantly reduced, in addition, the distance light LED8 and
Dipped beam LED9 is positioned by 1 structure of radiator, and its back side is directly bonded with radiator 1, improves mould
The heat dissipation performance of group.
As shown in Figure 1, 2, it after the dipped beam LED9 chip light emittings, after a part of light is blocked by transparent baffle 7, is formed
The light type of dipped beam dead line；A part is mapped in the transparent baffle 7, and is occurred inside it after repeatedly reflecting again from dipped beam
The plane of incidence projects, and forms the illuminating effect in 3rd area of dipped beam.After the distance light LED8 chip light emittings, light is in transparent baffle 7
Inside is projected after refraction from baffle front surface by twice or repeatedly, forms high-beam pattern.Described its material of transparent baffle 7 is
Plastics (PC or PMMA), light transmittance need to reach 90% or more.The transparent baffle 7, you can as the optically focused in distance light system
Device can also use as the baffle in dipped beam system, reduce the number of parts of module, reduce module cost.
As shown in Figure 3,4, metal spring leaf 21, shape are welded on the dipped beam wiring board 2 and distance light wiring board 6
For arch bridge type；Its role is to when dipped beam LED9 or distance light LED8 is placed on the radiator 1 for the metal spring leaf 21
Afterwards, nearly Optical Line Board OL 2 or distance light wiring board 6 is installed to again on radiator 1, at this time the arch end pair of the metal spring leaf 21
Dipped beam LED9 or distance light LED8 are crimped, and realize electrical connection.The metal spring leaf 21, can basis using copper as base material
LED power size decides whether coating or coating type.In general, the thickness of metal spring leaf 21 is 0.15~0.3mm.
Thermistor 22 is further respectively had on the dipped beam wiring board 2 and distance light wiring board 6, the thermistor 22 can
Dipped beam LED9 or distance light LED8 chip temperatures are monitored in real time.When the dipped beam LED9 or distance light LED8 are lighted for a long time
When, the thermistor 22 can detect the temperature of LED chip, and reduce circuital current to reduce the power of LED, while close
The temperature of light LED9 or distance light LED8 chips is also inhibited, it is ensured that the lumen of LED chip exports and service life.
The speculum 3, reflector design is the curved-surface structure that oval and free form surface combines, for different LED
Quantity and model possess stronger compatibility, can be directed to LED chip price and performance, select suitable product.In addition, because
The speculum 3 has larger compatibility, and different LED chips may be selected, and the power without same chip generally also has difference
Different or even otherness is larger, you can the module of different volumes/weight is made according to LED power, realizes the diversification of module.
The lens carrier 5 is fixed with the radiator 1 by the way of installing up and down, using upper and lower installation
Mode both optimized the mounting means of lens carrier 5 and radiator 1, also effectively reduce the sliding block of radiator 1 (die casting aluminium)
Quantity optimizes its processing technology.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
Understanding without departing from the principles and spirit of the present invention can carry out these embodiments a variety of variations, modification, replace
And modification, the scope of the present invention is defined by the appended.
Claims (6)
1. a kind of car light projection lamp module, including radiator (1), dipped beam wiring board (2), speculum (3), lens (4), lens
Holder (5), distance light wiring board (6), transparent baffle (7), distance light LED (8) and dipped beam LED (9), the lens (4) are mounted on saturating
On mirror support (5), the lens carrier (5) is fixed with radiator (1), it is characterised in that：The section of the radiator (1) is curved
Roll over shape structure, including horizontal plane and the inclined-plane that is connected with horizontal plane, water of the dipped beam wiring board (2) mounted on radiator (1)
In plane, the dipped beam LED (9) is arranged between dipped beam wiring board (2) and radiator (1), and the reflective mirror is arranged in dipped beam
Above LED (9), the distance light wiring board (6) is mounted on the inclined-plane of radiator (1), and the distance light LED (8) is arranged in distance light
Between wiring board (6) and radiator (1), the transparent baffle (7) setting above distance light LED (8), the dipped beam LED (9) with
Distance light LED (8) is all made of ultra-thin ceramic as substrate.
2. a kind of car light projection lamp module according to claim 1, it is characterised in that：On the dipped beam wiring board (2)
Equipped with the metal spring leaf (21) for crimping fixed dipped beam LED (9), the distance light wiring board (6) is equipped with for crimping fixation
The metal spring leaf (21) of distance light LED (8), the metal spring leaf (21) are arch bridge-type structure.
3. a kind of car light projection lamp module according to claim 2, it is characterised in that：The metal spring leaf (21) uses
The copper base that thickness is 0.15~0.3mm makes.
4. a kind of car light projection lamp module according to claim 2 or 3, it is characterised in that：The metal spring leaf (21)
It is equipped with coating.
5. a kind of car light projection lamp module according to claim 1, it is characterised in that：The dipped beam wiring board (2) and
Thermistor (22) is respectively equipped on distance light wiring board (6).
6. a kind of car light projection lamp module according to claim 1, it is characterised in that：The reflection of the speculum (3)
Face is curved-surface structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710894950.7A CN108571695A (en) | 2017-09-28 | 2017-09-28 | A kind of car light projection lamp module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710894950.7A CN108571695A (en) | 2017-09-28 | 2017-09-28 | A kind of car light projection lamp module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108571695A true CN108571695A (en) | 2018-09-25 |
Family
ID=63576282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710894950.7A Pending CN108571695A (en) | 2017-09-28 | 2017-09-28 | A kind of car light projection lamp module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108571695A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109681843A (en) * | 2019-02-26 | 2019-04-26 | 华域视觉科技(上海)有限公司 | Car light mould group and the automobile for applying it |
| CN115236925A (en) * | 2022-08-01 | 2022-10-25 | 常州星宇车灯股份有限公司 | Holographic projection lighting structure for vehicle |
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| CN102330933A (en) * | 2010-07-12 | 2012-01-25 | 株式会社小糸制作所 | Lamps apparatus for vehicle |
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| CN206100551U (en) * | 2016-10-09 | 2017-04-12 | 武汉通畅汽车电子照明有限公司 | Matrix LED headlight |
| CN206268977U (en) * | 2016-08-17 | 2017-06-20 | 上海小糸车灯有限公司 | A kind of LED light source distance-light one car light module |
| CN107120542A (en) * | 2017-04-20 | 2017-09-01 | 江苏大学 | The heat abstractor and method of a kind of high-powered LED lamp |
| CN207674343U (en) * | 2017-09-28 | 2018-07-31 | 常州星宇车灯股份有限公司 | A kind of car light projection lamp module |
-
2017
- 2017-09-28 CN CN201710894950.7A patent/CN108571695A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1830085A (en) * | 2003-07-28 | 2006-09-06 | 霍尼韦尔国际公司 | Heatsinking electronic devices |
| CN102330933A (en) * | 2010-07-12 | 2012-01-25 | 株式会社小糸制作所 | Lamps apparatus for vehicle |
| CN203273499U (en) * | 2013-01-19 | 2013-11-06 | 安徽众和达光电有限公司 | LED (light emitting diode) street lamp luminescence module |
| CN203595105U (en) * | 2013-12-09 | 2014-05-14 | 中山市立体光电科技有限公司 | LED lamp |
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| CN205956987U (en) * | 2016-08-16 | 2017-02-15 | 常州星宇车灯股份有限公司 | Two light lens module of light collecting LED |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109681843A (en) * | 2019-02-26 | 2019-04-26 | 华域视觉科技(上海)有限公司 | Car light mould group and the automobile for applying it |
| CN115236925A (en) * | 2022-08-01 | 2022-10-25 | 常州星宇车灯股份有限公司 | Holographic projection lighting structure for vehicle |
| CN115236925B (en) * | 2022-08-01 | 2024-04-26 | 常州星宇车灯股份有限公司 | Holographic projection lighting structure for vehicle |
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