WO2004105073A1 - Procede de production de dispositif d'espacement d'ecran plat et dispositif d'espacement d'ecran plat - Google Patents

Procede de production de dispositif d'espacement d'ecran plat et dispositif d'espacement d'ecran plat Download PDF

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Publication number
WO2004105073A1
WO2004105073A1 PCT/JP2004/007339 JP2004007339W WO2004105073A1 WO 2004105073 A1 WO2004105073 A1 WO 2004105073A1 JP 2004007339 W JP2004007339 W JP 2004007339W WO 2004105073 A1 WO2004105073 A1 WO 2004105073A1
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WO
WIPO (PCT)
Prior art keywords
section
spacer
panel display
metal film
substrate
Prior art date
Application number
PCT/JP2004/007339
Other languages
English (en)
Japanese (ja)
Inventor
Yukio Kawaguchi
Atsushi Hitomi
Kazumitsu Tanaka
Takao Matsumoto
Masahiro Itoh
Kenichi Jinguji
Tsutomu Koyanagi
Katsuyuki Kurachi
Original Assignee
Tdk Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdk Corporation filed Critical Tdk Corporation
Publication of WO2004105073A1 publication Critical patent/WO2004105073A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/241—Manufacture or joining of vessels, leading-in conductors or bases the vessel being for a flat panel display
    • H01J9/242—Spacers between faceplate and backplate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
    • H01J29/02—Electrodes; Screens; Mounting, supporting, spacing or insulating thereof
    • H01J29/028—Mounting or supporting arrangements for flat panel cathode ray tubes, e.g. spacers particularly relating to electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
    • H01J29/86—Vessels; Containers; Vacuum locks
    • H01J29/864—Spacers between faceplate and backplate of flat panel cathode ray tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H01J9/18—Assembling together the component parts of electrode systems
    • H01J9/185—Assembling together the component parts of electrode systems of flat panel display devices, e.g. by using spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
    • H01J2211/20—Constructional details
    • H01J2211/34—Vessels, containers or parts thereof, e.g. substrates
    • H01J2211/36—Spacers, barriers, ribs, partitions or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2329/00—Electron emission display panels, e.g. field emission display panels
    • H01J2329/86—Vessels
    • H01J2329/8625—Spacing members
    • H01J2329/863—Spacing members characterised by the form or structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2329/00—Electron emission display panels, e.g. field emission display panels
    • H01J2329/86—Vessels
    • H01J2329/8625—Spacing members
    • H01J2329/864—Spacing members characterised by the material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2329/00—Electron emission display panels, e.g. field emission display panels
    • H01J2329/86—Vessels
    • H01J2329/8625—Spacing members
    • H01J2329/8645—Spacing members with coatings on the lateral surfaces thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2329/00—Electron emission display panels, e.g. field emission display panels
    • H01J2329/86—Vessels
    • H01J2329/8625—Spacing members
    • H01J2329/8665—Spacer holding means

Definitions

  • the present invention relates to a method for manufacturing a spacer for a flat panel display and a spacer for a flat panel display.
  • a field emission display is known as a self-luminous type flat panel display using a conventional cathode ray tube (CRT).
  • the FED has a cathode structure in which many cathodes (field emission devices) are two-dimensionally arranged.
  • cathodes field emission devices
  • the fluorescent pixel region includes a phosphor layer.
  • the flat panel display includes a back plate having a cathode structure.
  • a flat panel display is described in U.S. Pat. No. 5,541,473.
  • the back plate of this display is formed by depositing a cathode structure on a glass plate.
  • the flat panel display has a glass face plate on which a phosphor layer is deposited.
  • a conductive layer for applying an electric field is deposited on the glass or phosphor layer.
  • the face plate is 0. I mn! ⁇ 1 mm to 2 mm apart.
  • a strip spacer made of a wall is vertically interposed between the face plate and the back plate. It is desirable that this spacer be placed at an accurate position. However, when the inside of the display is depressurized, a large load is applied to the spacer due to the atmospheric pressure.
  • the spacer is required to have high voltage resistance and secondary radiation characteristics. It is known that a conventional spacer is formed by coating an insulating material made of alumina with a conductive material.
  • Japanese Patent Application Publication No. 2002-508110 and Japanese Patent Application Publication No. 2001-508926 disclose techniques relating to these.
  • the present invention has been made in view of such problems, and provides a method of manufacturing a spacer for a flat panel display and a spacer for a flat panel display, which can reduce image distortion and bleeding.
  • the purpose is to:
  • AlTiC i.e., formed of a sintered body of the composite ceramic composed mainly of the A 1 2 0 3 (alumina) and T i C (titanium carbide)
  • spacers are preferable for flat panel displays in terms of strength and specific resistance, and have come to the present invention.
  • the substrate of Aruti' click generally, after forming the raw material powder obtained by mixing and T i C A 1 2 ⁇ 3 in a plate shape, both major surfaces of the molded body in the form of carbon made such It is manufactured by sintering by heating while applying pressure from the side.
  • the present inventors have further studied and found that a large distribution of specific resistance values may occur in the thickness direction of the Altic substrate manufactured in this manner. Was. Therefore, the Altic substrate When the spacer is cut out from the spacer, a spacer having a large distribution of the specific resistance value may be formed. If the spacer has a large distribution of specific resistance values, when used as a spacer for a flat panel display, electron beam deflection or the like may occur, and an image may bleed.
  • the production method of the spacer for a flat panel display according to the present invention is a method for producing a spacer for a flat panel display, the sintered body containing A 1 2 0 3 and T i C Cutting the substrate formed by the first section along a pair of first sections that intersect and are parallel to the main surface of the substrate to form a first section; and the first section. Cutting along a pair of second cut surfaces parallel to a surface corresponding to the surface of the soil substrate in the first slice to obtain a second slice.
  • the spacer for a flat panel display according to the present invention intersects a substrate formed of a sintered body containing Al 2 O 3 and T i C with a main surface of the substrate. And cutting along a pair of first cutting planes parallel to each other to form a first slice, and the first slice is parallel to a surface corresponding to the surface of the substrate in the first slice. Na — formed by cutting along a pair of second cut surfaces.
  • the spacer is formed from a substrate containing a high-strength, high-hardness ceramic, Altic, it is possible to withstand deformation due to compressive force and suppress distortion of an image. Can be.
  • the substrate containing the Altic is divided into a plurality of pieces in the thickness direction of the substrate, and a second piece having a thickness smaller than the thickness of the substrate is formed. Therefore, even when the distribution of the specific resistance value occurs in the thickness direction of the substrate, the section is obtained by simply dividing the substrate in the width direction of the substrate without dividing the substrate into a plurality of pieces in the thickness direction of the substrate. Compared with the case of forming, the variation of the specific resistance value in the intercept is reduced. Therefore, by using such a second section as a spacer for a flat panel display, electron beam deflection in the flat panel display is suppressed. Thus, blurring of the image is suppressed.
  • a step of forming a metal film on a surface of the first section corresponding to the first cut surface is further included. Is preferred.
  • the second section on which the metal film is formed on both sides can be easily formed. Can be manufactured.
  • a step of forming a patterned metal film on a surface corresponding to the second cut surface in the second section is further performed. It is preferred to include.
  • the internal electric field distribution in the second section can be set to a desired distribution.
  • FIG. 1 is a plan view of a flat panel display.
  • FIG. 2 is a cross-sectional view taken along the line II-II of the flat panel display.
  • FIG. 3 is a perspective view of the spacer.
  • FIG. 4 is a side view of the flat panel display showing the internal structure of the flat panel display on the face plate side.
  • FIG. 5A and FIG. 5B are perspective views for explaining a method of manufacturing the spacer 103 according to the first embodiment.
  • FIG. 6 is an explanatory diagram for explaining the method for manufacturing the Altic-containing substrate.
  • FIGS. 7A and 7B are diagrams for explaining a method of manufacturing the spacer 103.
  • FIG. 8 is a perspective view subsequent to FIG. 7 for illustrating a method of manufacturing the spacer 103.
  • FIGS. 9A and 9B are diagrams for explaining a method of manufacturing the spacer 103.
  • FIG. 8 is a perspective view following FIG.
  • FIG. 10 is a perspective view subsequent to FIG. 9B for explaining the method of manufacturing the spacer 103.
  • FIG. 11A and FIG. 11B are perspective views subsequent to FIG. 10 for explaining the method of manufacturing the spacer 103.
  • FIG. 11A and FIG. 11B are perspective views subsequent to FIG. 10 for explaining the method of manufacturing the spacer 103.
  • FIGS. 12A and 12B are perspective views for explaining a method of manufacturing the spacer 103 according to the second embodiment.
  • FIGS. 13B and 13B are perspective views subsequent to FIGS. 12B for explaining a method of manufacturing the spacer 103 according to the second embodiment.
  • FIG. 14 is a perspective view following FIG. 13B for explaining the manufacturing method of the spacer 103 according to the second embodiment. JP2004 / 007339
  • FIG. 15 is a perspective view following FIG. 14 for explaining the manufacturing method of the spacer 103 according to the second embodiment.
  • FIG. 16 is a perspective view following FIG. 15 for explaining the method of manufacturing the spacer 103 according to the second embodiment.
  • FIG. 17 is a perspective view following FIG. 16 for explaining the method of manufacturing the spacer 103 according to the second embodiment.
  • FIG. 18 is a perspective view following FIG. 17 for explaining the manufacturing method of the spacer 103 according to the second embodiment.
  • FIG. 19 is a perspective view following FIG. 18 for explaining the method of manufacturing the spacer 103 according to the second embodiment.
  • FIG. 1 is a plan view of a flat panel display
  • FIG. 2 is a cross-sectional view of the flat panel display taken along a line II-II.
  • a black matrix structure 102 is formed on the face plate 101 made of glass.
  • the black matrix structure 102 includes a plurality of fluorescent pixel regions composed of a phosphor layer.
  • the phosphor layer emits light when struck by high-energy electrons to form a visible display.
  • Light emitted from a specific fluorescent pixel area is output to the outside via a black matrix structure.
  • the black matrix is a lattice-like black structure for suppressing the mixing of light from the fluorescent pixel regions adjacent to each other.
  • a spacer (a spacer for a flat panel display) 1 0 3— 1 1 9 which is a wall standing upright to the surface is attached.
  • the spacers 103 to: L 19 (103, 104, 105, 106, 107, 108, 109, 1 10, 1 1 1, 1 12, 1 1 3, 1 14,
  • a back plate 201 is provided via the bases 115, 116, 117, 118, 119) (see FIG. 2).
  • the spacers 103 to 119 maintain a uniform distance between the face plate 101 and the back plate 201.
  • the active area surface of the back plate 201 includes the cathode structure 202.
  • the cathode structure 202 has a plurality of cathodes (electric field (electron) emission elements) formed of projections for emitting electrons.
  • the formation region of the cathode structure 2-02 is smaller than the area of the back plate 201.
  • a glass seal 203 is interposed between the outer peripheral region of the face plate 101 and the outer peripheral region of the back plate 201, and provides a closed chamber at the center. The pressure inside this sealed room is reduced to such a degree that electrons can fly. Further, the cathode structure 202, the black matrix structure 102, and the spacers 103-119 are to be arranged in the closed chamber. Seal 203 is formed by a fused glass frit.
  • Fig. 3 is a perspective view showing the spacer 103 according to the present invention.
  • the spacer 03 is a substantially plate-shaped rectangular parallelepiped, and has main surfaces 50A and 50B and a longitudinal direction.
  • a rectangular flat base 50 having extended side surfaces 50C and 50D, and end surfaces 50E and 50F at both ends in the longitudinal direction and formed from an artic-containing substrate, and a metal film formed on the side surface 50C of the base 50 42a and a metal film 40a formed on the side surface 50D of the base 50.
  • a patterned metal film 65 is formed on the main surface 5 OA of the base 50. The metal film 65 extends in the longitudinal direction of the spacer 103.
  • the metal film 65 is separated from the metal film 42a and the metal film 40a and is insulated.
  • the metal film 65 is divided into a plurality of pieces in the longitudinal direction.
  • the spacer 103 is formed by adhesives 301 and 302 provided at both ends in the longitudinal direction of the spacer 103, the face plate 101 and the back plate 20. Fixed to 1.
  • the material of the adhesives 301 and 302 in this example is a UV-curable polyimide adhesive, but a thermosetting adhesive or an inorganic adhesive can be used.
  • the adhesives 301 and 302 are arranged outside the black matrix structure 102 and the cathode structure 202. At this time, the metal films 40a and 42a of the spacer 103 come into contact with the cathode structure 202 of the back plate 201 and the black matrix structure 102 of the face plate 101, respectively. Placed in
  • FIG. 5 is an explanatory diagram for explaining a method of manufacturing the spacer 103 according to the first embodiment.
  • the method of manufacturing the spacer 103 involves interposing a back plate 201 having the above-described cathode structure 202 and a face plate 101 having a fluorescent pixel region (black matrix structure 102). This is a method of manufacturing a spacer for a flat panel display.
  • an Altic (A1TiC) -containing substrate (substrate) 10 having a predetermined size is prepared (FIG. 5A).
  • a rectangular flat substrate having a length of 1334 mm, a width of 67 mm, and a thickness of 2.5 mm can be used.
  • the Altic-containing substrate 10 has main surfaces 10A and 10B, side surfaces 1OC and 10D parallel to the longitudinal direction, and end surfaces 10E and 1OF orthogonal to the longitudinal direction.
  • Such an Altic-containing substrate 10 is prepared, for example, by mixing alumina powder and titanium carbide powder at a predetermined ratio, and placing the mixed powder 260 in a vacuum device 250 as shown in FIG.
  • a carbon disk-shaped partition plate 25 is sandwiched between plates in a plate shape. It is obtained by sintering at about 100 ° C.
  • the pressure is preferably about 20 MPa (200 kg2 / cm 2 ).
  • the sintered body thus obtained is cut and polished into a rectangular flat plate having a predetermined size, thereby obtaining the substrate 10 containing the artic. It is.
  • an oxide such as a titanium oxide powder or an oxidized magnesium powder, or a mixture of these oxides may be further mixed and sintered.
  • AlTiC-containing substrate 10 is intended to include A 1 2 0 3 and T i C in order to configure the AlTiC, the content of T i C is preferably 50 wt% or less, further However, it is preferably 30 wt% or less, specifically 7 wt%, which is the phase change point.
  • T i C of ⁇ Ka ⁇ is 5 to 40 wt% of Al tick, density 4. 0 9 ⁇ 4. 31 (g / cm 2), Vickers strength 2100 ⁇ 2200 (Hv 20>, bending Strength 700-760 (MPa), Young's modulus 380-410 (GPa), Specific resistance 4
  • a chamfered portion 15 is formed on a ridge formed by one main surface 1OA and one end surface 10E of the Altic-containing substrate 10. .
  • the Altic-containing substrate 10 At predetermined intervals (Fig. 7A).
  • the first section 30 has a main surface 3 OA, 30B corresponding to the main surface 10 A, 10 B of the art-containing substrate 10, and side surfaces 30 C, 30 D, corresponding to the first and second cross sections 91, 91, respectively.
  • the first section 30 has a chamfer corresponding to the chamfered portion 15 of the Altic-containing substrate 10 having end surfaces 30E and 3OF corresponding to the end surfaces 10E and 10F of the artic-containing substrate 10.
  • the part 15a is formed.
  • the distance between the first cut surfaces 91 may be set so that the width 30W between the side surfaces 30C and 30D of the first section 30 is about 2.15 mm each. it can.
  • the members 32, 32 at both ends cut out from the Altic-containing substrate 10 are preferably discarded.
  • the first section 30 is placed, and the side surfaces 30C and 30D of the first section 30 are placed on the lower side.
  • the polishing pad 7 and the upper polishing pad 71 are arranged so as to be in contact with each other, and both side surfaces 30 C and 30 D of these first sections 30 are mirror-polished.
  • polishing is performed so that the width 30W between the side surfaces 30C and 30D is approximately 2.15 mm.
  • the first section 30 is washed with an alkaline solution.
  • a metal film 40 is formed on one side surface 30D of the first section 30.
  • a metal film 40 having a thickness of several nm to lim and made of a metal such as Ti, Au, Cr, or Pt can be formed by a sputtering method.
  • the first section 30 is turned over, and a metal film 42 similar to the metal film 40 is formed on the other side surface 30C of the first section 30.
  • the first section 30 is cut in a direction perpendicular to the longitudinal direction of the first section 30. Then, the portion having the chamfered portion 15a is removed (FIG. 10).
  • the second section 60 includes main surfaces 50A and 50B corresponding to the second cut surface 92, side surfaces 50C and 50D extending in the longitudinal direction, and end surfaces at both ends in the longitudinal direction.
  • the first section 30 is set so that the interval 50 W between the main surface 5 OA and the main surface 50 B of the second section 60 is smaller than the width 30 W of the first section 30. Disconnect.
  • a patterned metal film 65 is formed on the main surface 5OA of the second section 60, thereby completing the spacer 103 shown in FIG.
  • the main surface 50A is cleaned, and then a metal film of Ti, Au, Cr, Pt, etc. is formed on the main surface 5OA by sputtering to a thickness of 100 nm.
  • the metal film is etched by ion milling while using the resist pattern as a mask, whereby a patterned metal film 65 can be formed. .
  • the flat panel display spacer 103 is completed.
  • the spacer 103 is formed such that the metal film 42 a and the metal film 40 a are in contact with the back plate 201 and the face plate 101 of the flat panel display, respectively. 0 1 and the face plate 101.
  • the spacer 103 contains a high-strength, high-hardness ceramic, Artik, so that it can withstand deformation due to compressive force.
  • Artik high-strength, high-hardness ceramic
  • a more suitable flat panel display can be manufactured in terms of strength, temperature, conductivity, and the like, as compared with spacers consisting of alumina alone. In such a flat panel display, in-plane luminance change and distortion in an image can be significantly reduced.
  • the Altic-containing substrate 10 is divided into two first cut surfaces 91 that are orthogonal to the main surface of the Altic-containing substrate 10 and that are parallel to each other. Cut along the first section 30 to form the first section 30, and further connect the first section 30 to the main surface 3 corresponding to the main surface 1 OA of the Altic-containing substrate 10 in the first section 30.
  • a second section 60 is obtained by cutting along two second cut surfaces 92 each parallel to the OA.
  • the Altic-containing substrate 10 is divided into a plurality in the thickness direction of the substrate 10, and the second substrate having a thickness smaller than the thickness of the Altic-containing substrate 10.
  • a section 60 will be formed. Therefore, even if the distribution of the specific resistance value occurs in the thickness direction of the Altic-containing substrate 10, the substrate 10 is simply divided without dividing the substrate 10 into a plurality in the thickness direction of the substrate 10.
  • the variation in the specific resistance value of the second section 60 is reduced as compared with the case where the section as a spacer is formed by dividing the second section 60 in the width direction. For this reason, by using the spacer 103 based on the second section 60 as a spacer of a flat panel display, the deflection of the electron beam in the flat panel display is suppressed, and the image bleeding is suppressed. Has been reduced.
  • the first section 30 of the first section 30 is further cut off.
  • Metal films 40 and 42 are formed on side surfaces 30 C and 30 D corresponding to 1, respectively.
  • the metal films 40a and 42a in the second section 60 can be easily formed. Can be formed. For this reason, the manufacturing cost is lower than the case where the metal films 42 a and 40 a are formed on both side surfaces 50 C and 50 D of the second section 30 after the second section 30 is formed. Is reduced.
  • the metal films 40a and 42a are a part of the metal films 40 and 42 formed before the cutting step along the second cut surface 92.
  • the metal films 40a and 42a reduce in-plane non-uniformity of contact resistance with the back plate 201 and the face plate 101, and contribute to setting of resistivity and conductivity of the entire spacer.
  • the spacer 103 is a rectangular parallelepiped, and has a main surface 5OA parallel to a plane including the thickness direction and the longitudinal direction, and is patterned on the main surface 5OA. It has a metal film 65. This pattern defines the internal electric field distribution in a desired distribution.
  • the Altic-containing substrate 10 used in the first manufacturing method is first perpendicular to the Altic-containing substrate 10 as shown in FIG.
  • the Altic-containing substrate 10 is cut at predetermined intervals along a plurality of first cut surfaces 91 parallel to the side surfaces 10C and 10D of the substrate. This forms a first section 530, as shown in FIG. 12B.
  • This first section 5 is first perpendicular to the Altic-containing substrate 10 as shown in FIG.
  • the Altic-containing substrate 10 is cut at predetermined intervals along a plurality of first cut surfaces 91 parallel to the side surfaces 10C and 10D of the substrate. This forms a first section 530, as shown in FIG. 12B.
  • the width 530W between the side surfaces 530C and 530D of the first section 530 is about three times the width 30W of the first section 30 in the first embodiment.
  • the side surfaces 530C and 530D of the first section 530 are polished.
  • the first section 530 is cut at predetermined intervals along a plurality of second cut surfaces 92 parallel to the main surface 530A of the first section 530. Obtain a second section 560 as shown in FIG. 13B.
  • the second section 560 includes main surfaces 560A and 560B corresponding to the second cut surface 92, side surfaces 560C and 560D extending in the longitudinal direction, and longitudinal sections 560C and 560D. It has end faces 560 E and 560 F at both ends and is made of an Altic-containing material.
  • the distance 56OW between the main surface 56OA and the main surface 560B of the second section 560 is set to be smaller than the width 53OW of the second section 530. Cut section 5 3 0
  • the side surface 560 extends from the end surface 560E to the end surface 560F.
  • a plurality of grooves 570 extending in parallel with the extending directions of C and 560D are formed at predetermined intervals.
  • each groove 570 connects the side surfaces 560D, the flat side walls 570A and 570B, and the lower ends of the side walls 570A and 570B.
  • the groove 570 has a predetermined width WS and a predetermined depth D.
  • the width WS can be about 100 to 200 / im
  • the depth D can be about 100 to 200.
  • metal atoms, metal microparticles, and the like were formed by sputtering, vapor deposition, or the like on the second section 560 where the groove 570 was formed.
  • Face 5 6 metal atoms, metal microparticles, and the like were formed by sputtering, vapor deposition, or the like on the second section 560 where the groove 570 was formed.
  • the metal film 580 is formed over the surfaces of the side surfaces 560C and 560D, the main surface 560A, and the grooves 570 of the second section 560.
  • the material of the metal film 580 is the same as the metal film 40 or the metal film 42 of the first manufacturing method.
  • a film resist 590 is formed on the surface of the metal film 580 corresponding to the main surface 56 OA of the second section 560. Is heat-pressed. Then, by exposing and developing the film resist 590 with a predetermined mask, the film resist 590 is patterned as shown in FIG. 17 to form a resist pattern 591, and the metal film 58 Expose part of 0.
  • the predetermined thickness is set so that a portion of the metal film 580 formed on the main surface 56 OA can be completely removed. Thereby, at the same time, the portion of the metal film 580 provided on the bottom surface 570C of the groove 570 is also removed. Then, the metal film 58 OC is formed on the side surface 560 C of the second section 560, and the metal film 58 is formed on the side surface 56 OD.
  • the metal film 42a is formed on each of the side walls 570B of the 570.
  • a patterned metal film 65 is formed on the main surface 56 OA of the second section 560.
  • the second section 560 is polished from the back surface of the second section 560, that is, the main surface 560B side, until it reaches the groove 570, and as shown in FIG.
  • the section 560 is divided into a plurality to obtain a spacer 660 for a flat panel display.
  • the metal film 580C becomes the metal film 42a
  • the metal film 580D becomes the metal film 40a
  • the second section 560 is divided into the base 50.
  • the groove 570 is formed in the main surface 56OA of the second section 560.
  • a metal film 580 is formed on the side surfaces 560C and 560D, inside the groove 570, and on the main surface 560A, and is patterned to form a metal film serving as a base for the metal films 40a, 42a and the metal film 65.
  • the film 580 can be formed with a small number of steps.
  • the second section 560 in which the grooves 570 are formed and the metal films 40a, 42a, and 65 are formed is polished from the rear side and divided to obtain a desired flat panel display. Since the spacer 660 is obtained, a metal film 580 can be formed or patterned on the second section 560 larger than the desired flat panel display spacer 103. . Therefore, workability is improved, and the reliability and yield of spacer 103 are improved.
  • the present invention is not limited to the above embodiment.
  • the number of divisions in each cutting step is arbitrary.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
  • Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
  • Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)

Abstract

L'invention concerne un procédé de production de dispositif d'espacement d'écran plat consistant à effectuer une première coupe afin d'obtenir une plaque de base (10) formée par un corps fritté contenant Al2O3 et TiC ainsi qu'une paire de premiers plans de coupe (91) parallèles les uns aux autres traversant la surface principale (10A) de la plaque de base, ce qui forme une première pièce de coupe (30); et à effectuer une seconde coupe afin de couper la première pièce de coupe le long d'une paire de seconds plans de coupe parallèles à une surface (30A) correspondant à la surface de la plaque de base dans la première pièce de coupe, ce qui permet d'obtenir une seconde pièce de coupe. De ce fait, la plaque de base contenant TiC est divisée en parties dans le sens de l'épaisseur, formant ainsi une seconde pièce de coupe plus mince que la plaque de base. L'utilisation de cette seconde plaque de coupe comme dispositif d'espacement d'écran plat supprime la déviation des faisceaux électroniques dans cet écran plat, ce qui permet de supprimer l'effet brouillé des images.
PCT/JP2004/007339 2003-05-23 2004-05-21 Procede de production de dispositif d'espacement d'ecran plat et dispositif d'espacement d'ecran plat WO2004105073A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003146760A JP4200046B2 (ja) 2003-05-23 2003-05-23 平面パネルディスプレイ用スペーサの製造方法、及び、平面パネルディスプレイ用スペーサ
JP2003-146760 2003-05-23

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WO2004105073A1 true WO2004105073A1 (fr) 2004-12-02

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000030613A (ja) * 1998-05-01 2000-01-28 Canon Inc 画像形成装置の製造方法および画像形成装置
JP2003303562A (ja) * 2002-04-11 2003-10-24 Tdk Corp 平面パネルディスプレイ、平面パネルディスプレイ用スペーサ及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000030613A (ja) * 1998-05-01 2000-01-28 Canon Inc 画像形成装置の製造方法および画像形成装置
JP2003303562A (ja) * 2002-04-11 2003-10-24 Tdk Corp 平面パネルディスプレイ、平面パネルディスプレイ用スペーサ及びその製造方法

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JP2004349177A (ja) 2004-12-09

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