WO2004093252B1 - Electrical connector and method for making - Google Patents

Electrical connector and method for making

Info

Publication number
WO2004093252B1
WO2004093252B1 PCT/US2004/011074 US2004011074W WO2004093252B1 WO 2004093252 B1 WO2004093252 B1 WO 2004093252B1 US 2004011074 W US2004011074 W US 2004011074W WO 2004093252 B1 WO2004093252 B1 WO 2004093252B1
Authority
WO
WIPO (PCT)
Prior art keywords
array
sheet
contact elements
contact
conductive
Prior art date
Application number
PCT/US2004/011074
Other languages
French (fr)
Other versions
WO2004093252A2 (en
WO2004093252A3 (en
Inventor
Dirk D Brown
John D Williams
Hongjun Yao
Hassan O Ali
Eric Radza
Original Assignee
Neoconix Inc
Dirk D Brown
John D Williams
Hongjun Yao
Hassan O Ali
Eric Radza
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/412,729 external-priority patent/US7056131B1/en
Priority claimed from US10/460,501 external-priority patent/US6916181B2/en
Priority claimed from US10/460,497 external-priority patent/US7113408B2/en
Priority claimed from US10/731,213 external-priority patent/US20050120553A1/en
Priority claimed from US10/731,669 external-priority patent/US7244125B2/en
Application filed by Neoconix Inc, Dirk D Brown, John D Williams, Hongjun Yao, Hassan O Ali, Eric Radza filed Critical Neoconix Inc
Priority to US10/960,043 priority Critical patent/US20050227510A1/en
Publication of WO2004093252A2 publication Critical patent/WO2004093252A2/en
Priority to TW093137785A priority patent/TWI249273B/en
Priority to PCT/US2004/040867 priority patent/WO2005057735A1/en
Priority to BRPI0417379-1A priority patent/BRPI0417379A/en
Priority to JP2006542871A priority patent/JP2007535657A/en
Priority to TW094108354A priority patent/TWI265657B/en
Priority to PCT/US2005/009065 priority patent/WO2005091996A2/en
Publication of WO2004093252A3 publication Critical patent/WO2004093252A3/en
Publication of WO2004093252B1 publication Critical patent/WO2004093252B1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H01R13/2492—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point multiple contact points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

An electrical connector includes an electrical contact array (17) having a plurality of contact elements (15) where each contact element has at least one conductive, resilient spring portion.

Claims

38AMENDED CLAIMS [received by the International Bureau on 25 April 2005 (25.04.2005); original claims 1-21 replaced by amended claims 1-19]
1. An electrical connector, comprising; a diejecmc substrate having surfaces with vies connecting the surfaces; m electrical contact array including a plurality of contact elements, each contact element having at least one conductive spring portion biased outwardly from the array and a base portion, said contact array bonded to a first surface of said substrate to align at least one of said con act element base portions with one of the vias in said substrate, respective ones of said contact elements an vias plated with conductive material to form a unitary structure; and said contact elements electrically isolated from each other.
2. The connector according to claim 1, the dielectric substrate comprising a plurality of relief openings.
3. The connector according to claim 2, in which the contact elements of the contact array are arranged in a predetermined pattern and at least some of the plurality of relief openings are arranged in a pattern that corresponds to the predetermined pattern.
4. The connector according to claim I, in which the at least one spring portion is formed by a photolithographic masking and a chemical etching of the eonduciive sheet.
5. The connector according to claim 1, tuπher comprising: a second electrical contact array including a plurality of contact elements, each contact element having at least one conductive spring portion biased outwardly from the array and a base portion, said second contact array bonded to a second surface of said substrate to align at least one of said contact element base portions with one of the vias said subsirate, 39
respective ones of said contact elements and vias plated with conductive material to form a unitary structure; and said contacts electrically isolated from each other.
6. The connector according to claim 5. in which the connector forms an mterposer located between an electrical device and a socket.
7. The connector according to claim 1, in which the dielectric substrate is a printed circuit board,
8. The connector according to claim 1 , in which the at least one conductive spring portion includes a non-Imear flat pattern to provide an extended length resilient contact.
9. The connector according iα claim 1, in which the at least one conductive spring portion of ai least some of the contact elements has at least one of a different shape, elastic spring rate, contact force, or effective working range than other spnng portions of other ones of the contact elements.
10. The connector according to claim 1. further comprising a coating of a second conductive material on at least the at least one conductive spring portion.
11. The connector according to claim 1 , in which a spnng force of the at least one conductive spring portion is between 10 and 40 grams.
12. A method of producing an eleemeal connector, comprising the steps of: forming an array of electrical contact elements m a conductive, resilient sheet, the electrical contact array being arranged m a first predetermined pattern, each contact element including at least one spring poπion and a base portion; biasing the at least one spnng portion outwardly away from the conductive sheet; 40
bonding the conductive sheet to a first surface of a dielectric substrate having through holes, the at least one spring portion extending outwardly away from the first surface of the dielectric substrate; plating the through holes and the contact elements to electrically connect, with a unitary structure, respective ones of the contact elements to respective ones of the though holes in the dielectric substrate; masking the conductive sheet according to a predetermined arrangement of the contact elements; and chemically etching the conductive sheet io singulate at least some of the contact elements from one another.
13. The method according to claim 12. further comprising the step of: biasing the at least one spnng portion outward such that the at least one spring portion is three-dimensionally formed to a portion of a generally spherical surface.
14. The method according to claim 12, rurraer comprising the step of: providing a biasmg die formed from an array of ball bearings of at least one selected si2e located in an array of openings corresponding to the array of contact elemenis.
15 The method according to claim 12, further comprising the step of: pre-treat g a bonding surface of the conductive sheet by micro-etching to enhance bonding.
16 The method according to claim 12, further compπsing the step of: pre-rreatmg a bonding surface of the conductive sheet by an oxide treatment to enhance bonding.
] 7. The method according to claim 12, further comprising the step of: plating a second conductive material on al least the at least one spnng portion.
18. The method according to claim 12, further comprising the steps of: forming a second array of contact elements in a second conductive, resilient sheet, in a second predetermined pattern, at least a portion of which corresponds to the first predetermined pattern, each contact element in the second array including at least one spring portion and a base portion; biasing the at least one spring portion outwardly away from the second sheet; bonding the second conductive sheet to a second surface of the dielectric substrate, the at least one spring portion of the second array of contact elements extending outwardly and away from the second surface of the dielectric substrate; plating the contact elements to electrically connect, with a unitary structure, respective ones of the contact elements to respective ones of the though holes in the dielectric substrate, and chemically etching the second conductive sheet to smguiate at least some of the second plurality of contact elements from one another.
19. A method for batch fabrication of an array of electrical contacts, compnsing the steps of: creating a photolithographic image of the array of contacts; applying a lithographically sensitive film to a first conductive sheet and a second conductive sheet; creating the array of contacts on the first sheet and the second sheet via a lithographic process using the image of the array of contacts; etching the array of contacts on the first sheet and the second sheet; using a forming tool to form the array of contacts in three dimensions on the first sheet and the second sheet; laminating first sheet and the second sheet to opposite sides of a substrate to a panel; applying a photoresist film to both sides of the panel; exposing a patiern io define individual contact elements on both sides of the panel; and singujating the contact elements on both sides of the pane] by etching.
PCT/US2004/011074 2003-04-11 2004-04-09 Electrical connector and method for making WO2004093252A2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
US10/960,043 US20050227510A1 (en) 2004-04-09 2004-10-08 Small array contact with precision working range
JP2006542871A JP2007535657A (en) 2003-12-08 2004-12-07 Small array contact with precise operating range
BRPI0417379-1A BRPI0417379A (en) 2003-12-08 2004-12-07 electrical contact in contact set and method of manufacturing the same, electrical connector contact, connector joint rolling beam contact, multi-flange spherical weld contact, two-sided contact
PCT/US2004/040867 WO2005057735A1 (en) 2003-12-08 2004-12-07 Small array contact with precision working range
TW093137785A TWI249273B (en) 2003-12-08 2004-12-07 Small array contact with precision working range
PCT/US2005/009065 WO2005091996A2 (en) 2004-03-19 2005-03-18 Method and systems for batch forming spring elements in three dimensions
TW094108354A TWI265657B (en) 2004-03-19 2005-03-18 Method and system for batch forming spring elements in three dimensions

Applications Claiming Priority (16)

Application Number Priority Date Filing Date Title
US10/412,729 US7056131B1 (en) 2003-04-11 2003-04-11 Contact grid array system
US10/412,729 2003-04-11
US46049603A 2003-06-11 2003-06-11
US46050403A 2003-06-11 2003-06-11
US10/460,497 2003-06-11
US10/460,497 US7113408B2 (en) 2003-06-11 2003-06-11 Contact grid array formed on a printed circuit board
US10/460,496 2003-06-11
US10/460,501 US6916181B2 (en) 2003-06-11 2003-06-11 Remountable connector for land grid array packages
US10/460,501 2003-06-11
US10/460,504 2003-06-11
US10/731,669 US7244125B2 (en) 2003-12-08 2003-12-08 Connector for making electrical contact at semiconductor scales
US10/731,669 2003-12-08
US10/731,213 2003-12-08
US10/731,213 US20050120553A1 (en) 2003-12-08 2003-12-08 Method for forming MEMS grid array connector
US54791204P 2004-02-26 2004-02-26
US60/547,912 2004-02-26

Publications (3)

Publication Number Publication Date
WO2004093252A2 WO2004093252A2 (en) 2004-10-28
WO2004093252A3 WO2004093252A3 (en) 2005-04-28
WO2004093252B1 true WO2004093252B1 (en) 2005-07-21

Family

ID=33304299

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/011074 WO2004093252A2 (en) 2003-04-11 2004-04-09 Electrical connector and method for making

Country Status (2)

Country Link
TW (1) TWI231621B (en)
WO (1) WO2004093252A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014508944A (en) * 2011-03-21 2014-04-10 ユニバーシティ・オブ・ウィンザー Equipment for automatic testing / verification of electronic components
KR101284212B1 (en) 2012-04-27 2013-07-09 주식회사 아이에스시 Test socket which can be aligned easily
CN105486333B (en) * 2015-11-19 2018-08-24 业成光电（深圳）有限公司 Improve the sensor structure of narrow line-spacing joint sheet pressing dislocation
WO2018060922A1 (en) * 2016-09-29 2018-04-05 3M Innovative Properties Company Connector assembly for solderless mounting to a circuit board
US10128593B1 (en) * 2017-09-28 2018-11-13 International Business Machines Corporation Connector having a body with a conductive layer common to top and bottom surfaces of the body as well as to wall surfaces of a plurality of holes in the body

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19713661C1 (en) * 1997-04-02 1998-09-24 Siemens Nixdorf Inf Syst Contact arrangement

Also Published As

Publication number Publication date
WO2004093252A2 (en) 2004-10-28
TWI231621B (en) 2005-04-21
TW200427138A (en) 2004-12-01
WO2004093252A3 (en) 2005-04-28

Similar Documents

Publication Publication Date Title
US7114961B2 (en) Electrical connector on a flexible carrier
US6558560B2 (en) Method for the fabrication of electrical contacts
US7597561B2 (en) Method and system for batch forming spring elements in three dimensions
US7758351B2 (en) Method and system for batch manufacturing of spring elements
US4813129A (en) Interconnect structure for PC boards and integrated circuits
US5173055A (en) Area array connector
US6948941B2 (en) Interconnect assemblies and methods
US6042387A (en) Connector, connector system and method of making a connector
US20080045076A1 (en) Clamp with spring contacts to attach flat flex cable (FFC) to a circuit board
US6627092B2 (en) Method for the fabrication of electrical contacts
US7455915B2 (en) Selective application of conductive material to substrates by pick and place of compliant contact arrays
CA2345829A1 (en) Process to manufacture tight tolerance embedded elements for printed circuit boards
WO2004093252B1 (en) Electrical connector and method for making
US20050042851A1 (en) Connector terminal device and its fabrication method
US20040021207A1 (en) Dual gauge lead frame
WO2024062559A1 (en) Cantilever-type probe for probe card
JP2003121470A (en) Probe manufacturing method and probe
KR100375248B1 (en) Method for mounting a semiconductor chip on a substrate, and semiconductor device adapted for mounting on a substrate
CN1973407A (en) Method and systems for batch forming spring elements in three dimensions
JPH05327155A (en) Connector for circuit module
KR100999536B1 (en) printed circuit board having a electro device and manufacturing method thereof
JP2001228174A (en) Manufacturing method for probe sheet
KR20060020808A (en) Semiconductor module and method for manufacturing thereof
KR20030048746A (en) the method of manufacturing micro-strip
KR19980034121A (en) Printed wiring board

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 10960043

Country of ref document: US

AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): BW GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
B Later publication of amended claims

Effective date: 20050425

WWE Wipo information: entry into national phase

Ref document number: 1112/MUMNP/2005

Country of ref document: IN

WWE Wipo information: entry into national phase

Ref document number: 20048097355

Country of ref document: CN

122 Ep: pct application non-entry in european phase