WO2004093252B1 - Electrical connector and method for making - Google Patents

Electrical connector and method for making

Info

Publication number
WO2004093252B1
WO2004093252B1 PCT/US2004/011074 US2004011074W WO2004093252B1 WO 2004093252 B1 WO2004093252 B1 WO 2004093252B1 US 2004011074 W US2004011074 W US 2004011074W WO 2004093252 B1 WO2004093252 B1 WO 2004093252B1
Authority
WO
Grant status
Application
Patent type
Prior art keywords
array
sheet
contact elements
contact
conductive
Prior art date
Application number
PCT/US2004/011074
Other languages
French (fr)
Other versions
WO2004093252A3 (en )
WO2004093252A2 (en )
Inventor
Dirk D Brown
John D Williams
Hongjun Yao
Hassan O Ali
Eric Radza
Original Assignee
Neoconix Inc
Dirk D Brown
John D Williams
Hongjun Yao
Hassan O Ali
Eric Radza
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RLINE CONNECTORS; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCBs], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/52Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RLINE CONNECTORS; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCBs], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RLINE CONNECTORS; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00-H01R33/00
    • H01R13/02Contact members
    • H01R13/03Contact members characterised by the material, e.g. plating, or coating materials
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RLINE CONNECTORS; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00-H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RLINE CONNECTORS; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00-H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H01R13/2492Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point multiple contact points
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/10Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416Connectors, terminals
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/32Holders for supporting the complete device in operation, i.e. detachable fixtures
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01004Beryllium [Be]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01005Boron [B]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01015Phosphorus [P]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01019Potassium [K]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01074Tungsten [W]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01078Platinum [Pt]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/102Material of the semiconductor or solid state bodies
    • H01L2924/1025Semiconducting materials
    • H01L2924/10251Elemental semiconductors, i.e. Group IV
    • H01L2924/10253Silicon [Si]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19041Component type being a capacitor
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19042Component type being an inductor
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19043Component type being a resistor
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/30107Inductance
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3011Impedance
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RLINE CONNECTORS; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current connectors or for joining electric conductors
    • H01R43/007Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current connectors or for joining electric conductors for elastomeric connecting elements
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RLINE CONNECTORS; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current connectors or for joining electric conductors
    • H01R43/20Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current connectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/205Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current connectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits

Abstract

An electrical connector includes an electrical contact array (17) having a plurality of contact elements (15) where each contact element has at least one conductive, resilient spring portion.

Claims

38AMENDED CLAIMS [received by the International Bureau on 25 April 2005 (25.04.2005); original claims 1-21 replaced by amended claims 1-19]
1. An electrical connector, comprising; a diejecmc substrate having surfaces with vies connecting the surfaces; m electrical contact array including a plurality of contact elements, each contact element having at least one conductive spring portion biased outwardly from the array and a base portion, said contact array bonded to a first surface of said substrate to align at least one of said con act element base portions with one of the vias in said substrate, respective ones of said contact elements an vias plated with conductive material to form a unitary structure; and said contact elements electrically isolated from each other.
2. The connector according to claim 1, the dielectric substrate comprising a plurality of relief openings.
3. The connector according to claim 2, in which the contact elements of the contact array are arranged in a predetermined pattern and at least some of the plurality of relief openings are arranged in a pattern that corresponds to the predetermined pattern.
4. The connector according to claim I, in which the at least one spring portion is formed by a photolithographic masking and a chemical etching of the eonduciive sheet.
5. The connector according to claim 1, tuπher comprising: a second electrical contact array including a plurality of contact elements, each contact element having at least one conductive spring portion biased outwardly from the array and a base portion, said second contact array bonded to a second surface of said substrate to align at least one of said contact element base portions with one of the vias said subsirate, 39
respective ones of said contact elements and vias plated with conductive material to form a unitary structure; and said contacts electrically isolated from each other.
6. The connector according to claim 5. in which the connector forms an mterposer located between an electrical device and a socket.
7. The connector according to claim 1, in which the dielectric substrate is a printed circuit board,
8. The connector according to claim 1 , in which the at least one conductive spring portion includes a non-Imear flat pattern to provide an extended length resilient contact.
9. The connector according iα claim 1, in which the at least one conductive spring portion of ai least some of the contact elements has at least one of a different shape, elastic spring rate, contact force, or effective working range than other spnng portions of other ones of the contact elements.
10. The connector according to claim 1. further comprising a coating of a second conductive material on at least the at least one conductive spring portion.
11. The connector according to claim 1 , in which a spnng force of the at least one conductive spring portion is between 10 and 40 grams.
12. A method of producing an eleemeal connector, comprising the steps of: forming an array of electrical contact elements m a conductive, resilient sheet, the electrical contact array being arranged m a first predetermined pattern, each contact element including at least one spring poπion and a base portion; biasing the at least one spnng portion outwardly away from the conductive sheet; 40
bonding the conductive sheet to a first surface of a dielectric substrate having through holes, the at least one spring portion extending outwardly away from the first surface of the dielectric substrate; plating the through holes and the contact elements to electrically connect, with a unitary structure, respective ones of the contact elements to respective ones of the though holes in the dielectric substrate; masking the conductive sheet according to a predetermined arrangement of the contact elements; and chemically etching the conductive sheet io singulate at least some of the contact elements from one another.
13. The method according to claim 12. further comprising the step of: biasing the at least one spnng portion outward such that the at least one spring portion is three-dimensionally formed to a portion of a generally spherical surface.
14. The method according to claim 12, rurraer comprising the step of: providing a biasmg die formed from an array of ball bearings of at least one selected si2e located in an array of openings corresponding to the array of contact elemenis.
15 The method according to claim 12, further comprising the step of: pre-treat g a bonding surface of the conductive sheet by micro-etching to enhance bonding.
16 The method according to claim 12, further compπsing the step of: pre-rreatmg a bonding surface of the conductive sheet by an oxide treatment to enhance bonding.
] 7. The method according to claim 12, further comprising the step of: plating a second conductive material on al least the at least one spnng portion.
18. The method according to claim 12, further comprising the steps of: forming a second array of contact elements in a second conductive, resilient sheet, in a second predetermined pattern, at least a portion of which corresponds to the first predetermined pattern, each contact element in the second array including at least one spring portion and a base portion; biasing the at least one spring portion outwardly away from the second sheet; bonding the second conductive sheet to a second surface of the dielectric substrate, the at least one spring portion of the second array of contact elements extending outwardly and away from the second surface of the dielectric substrate; plating the contact elements to electrically connect, with a unitary structure, respective ones of the contact elements to respective ones of the though holes in the dielectric substrate, and chemically etching the second conductive sheet to smguiate at least some of the second plurality of contact elements from one another.
19. A method for batch fabrication of an array of electrical contacts, compnsing the steps of: creating a photolithographic image of the array of contacts; applying a lithographically sensitive film to a first conductive sheet and a second conductive sheet; creating the array of contacts on the first sheet and the second sheet via a lithographic process using the image of the array of contacts; etching the array of contacts on the first sheet and the second sheet; using a forming tool to form the array of contacts in three dimensions on the first sheet and the second sheet; laminating first sheet and the second sheet to opposite sides of a substrate to a panel; applying a photoresist film to both sides of the panel; exposing a patiern io define individual contact elements on both sides of the panel; and singujating the contact elements on both sides of the pane] by etching.
PCT/US2004/011074 2003-04-11 2004-04-09 Electrical connector and method for making WO2004093252B1 (en)

Priority Applications (16)

Application Number Priority Date Filing Date Title
US10/412,729 2003-04-11
US10412729 US7056131B1 (en) 2003-04-11 2003-04-11 Contact grid array system
US46049603 true 2003-06-11 2003-06-11
US46050403 true 2003-06-11 2003-06-11
US10460501 US6916181B2 (en) 2003-06-11 2003-06-11 Remountable connector for land grid array packages
US10/460,496 2003-06-11
US10/460,504 2003-06-11
US10/460,497 2003-06-11
US10460497 US7113408B2 (en) 2003-06-11 2003-06-11 Contact grid array formed on a printed circuit board
US10/460,501 2003-06-11
US10731669 US7244125B2 (en) 2003-12-08 2003-12-08 Connector for making electrical contact at semiconductor scales
US10731213 US20050120553A1 (en) 2003-12-08 2003-12-08 Method for forming MEMS grid array connector
US10/731,213 2003-12-08
US10/731,669 2003-12-08
US54791204 true 2004-02-26 2004-02-26
US60/547,912 2004-02-26

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US10960043 US20050227510A1 (en) 2004-04-09 2004-10-08 Small array contact with precision working range
PCT/US2004/040867 WO2005057735A1 (en) 2003-12-08 2004-12-07 Small array contact with precision working range
JP2006542871A JP2007535657A (en) 2003-12-08 2004-12-07 Small array contacts with precise operating range
PCT/US2005/009065 WO2005091996A3 (en) 2004-03-19 2005-03-18 Method and systems for batch forming spring elements in three dimensions

Publications (3)

Publication Number Publication Date
WO2004093252A2 true WO2004093252A2 (en) 2004-10-28
WO2004093252A3 true WO2004093252A3 (en) 2005-04-28
WO2004093252B1 true true WO2004093252B1 (en) 2005-07-21

Family

ID=33304299

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/011074 WO2004093252B1 (en) 2003-04-11 2004-04-09 Electrical connector and method for making

Country Status (1)

Country Link
WO (1) WO2004093252B1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2689259A4 (en) * 2011-03-21 2014-12-17 Univ Windsor Apparatus for the automated testing and validation of electronic components
KR101284212B1 (en) 2012-04-27 2013-07-09 주식회사 아이에스시 Test socket which can be aligned easily
CN105486333A (en) * 2015-11-19 2016-04-13 业成光电(深圳)有限公司 Sensor structure for handling lamination offset of bonding pads of narrow line space

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19713661C1 (en) * 1997-04-02 1998-09-24 Siemens Nixdorf Inf Syst Contact configuration

Also Published As

Publication number Publication date Type
WO2004093252A3 (en) 2005-04-28 application
WO2004093252A2 (en) 2004-10-28 application

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