JP2001228174A - Manufacturing method for probe sheet - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily and surely connect all the wires working as a part of a probe element or areas corresponding to them to a plating electrode. SOLUTION: The manufacturing method for probe sheet includes a first process, in which a plurality of conductive areas and connection areas electrically connecting the adjacent conductive areas mutually are formed on one side face of an electrically insulated film, a second process for applying electroplating of a conductive material onto a part of the conductive areas at least, and a third process for removing the connection areas. Electroplating in the second process is carried out with one or more conductive/connection area connected to a plating power source.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a probe sheet used for inspecting an object to be inspected such as a semiconductor device or a liquid crystal substrate.

[0002]

2. Description of the Related Art As one of probe cards used in a current test of a flat test object, a probe sheet having an electrically insulating film such as polyimide as a base material and a plurality of probe elements formed on the base material is used. There was something. In this probe sheet, each probe element includes one end of a strip-shaped wiring formed on the base, a region of the base corresponding to the one end of the wiring, and an electrode portion such as a pad electrode of a device under test. And a protruding electrode formed at one end of the wiring so as to be pressed by the wire.

As one method of manufacturing such a probe sheet, a plurality of strip-shaped wirings are formed on one surface of a base material by an appropriate method such as electroplating technology or printed wiring technology, and a protruding electrode is formed. Is formed at one end of each wiring by an electroplating technique such as electroforming. In such a manufacturing method, one end of the wiring is used as an electrode for plating when the protruding electrode is formed.

However, if there is a wiring or a region corresponding to the wiring that is not electrically connected to the power supply at the time of plating,
No plating is performed on the wiring or a region corresponding to the wiring. For example, when forming a protruding electrode, if there is a wiring that is not connected to the plating power supply, the protruding electrode is not formed on the wiring, and the probe sheet itself becomes defective.

[0005]

Therefore, in a method of manufacturing a probe sheet using an electroplating technique, all wirings acting as a part of a probe element or all areas corresponding to the wiring are securely connected to a plating power supply. The work is complicated and cumbersome.

Therefore, in the technique of manufacturing a probe sheet using a plating technique, it is necessary to easily and surely connect all the wirings acting as a part of the probe element or an area corresponding thereto to a plating power supply. is important.

[0007]

According to the method of manufacturing a probe sheet of the present invention, a plurality of strip-shaped conductive regions and a connection region for electrically connecting adjacent conductive regions are formed on one of the electrically insulating films. A first step of forming a surface, a second step of electroplating a conductive material on at least a part of the conductive region, and a third step of removing the connection region.

When one or more conductive regions or connection regions are connected to the plating power supply, all the conductive regions are connected to the plating power supply. Therefore, the electroplating in the second step is performed in a state where one or more conductive regions or connection regions are connected to a plating power supply. A portion of the plated conductive area, together with the corresponding sheet-like member area, acts as a probe element of the probe sheet.

As described above, a plurality of conductive regions and a connection region for electrically connecting adjacent conductive regions are formed on one surface of the electrically insulating film, and the conductive regions are subjected to electroplating of a conductive material. In addition, all the wirings acting as a part of the probe element or all the areas corresponding thereto can be easily and reliably connected to the plating power supply.

[0010] The first step is a step of preparing a sheet-like member having a conductive film on one surface of the electrically insulating film, and etching using a photoresist to form the conductive region and the connection region. Performing a treatment on the conductive film. Thus, the conductive region is formed by the remaining region of the conductive film.

When the first step includes the above steps,
In the second step, a hole that reaches the conductive region is formed at a position corresponding to one end of the conductive region in the electrically insulating film, and the conductive material is formed at one end of the conductive region. And plating the other surface of the conductive region. By connecting one or more conductive regions or connection regions to a plating power source during plating in this step, all the conductive regions can be easily and reliably connected to the plating power source.
As a result, an electrode corresponding to the hole and penetrating the electric insulating film is formed in the conductive region, and the conductive region, which is the remaining region of the conductive film, is covered with the conductive material. The electrode and the coating may be performed simultaneously or separately.

[0012] Instead of the first step as described above, the first step is to prepare a sheet-like member having a conductive film on one surface of the electrically insulating film and to correspond to the conductive region. And forming a photoresist layer having a recess reaching the conductive film in the conductive material, plating the conductive material on the conductive film using the recess, and etching using a second photoresist. Processing can be performed on the conductive film to form the conductive region and the connection region. At the time of plating in this step, by connecting appropriate portions of the conductive film to the plating power source, all portions of the conductive film corresponding to the recesses can be easily and reliably connected to the plating power source. it can. Thereby, the conductive region is
It is formed by the remaining portion of the conductive film and is covered with a conductive material.

In the case where the first step is the latter, the second step includes a step of making a hole that reaches the conductive area in a position corresponding to one end of the conductive area in the electrically insulating film; Plating the conductive material on one end of the conductive region through a hole. At the time of plating in this step, by connecting one or more conductive regions, connection regions or plating layers to a power supply for plating,
All conductive regions and plating layers can be easily and reliably connected to a plating power supply. As a result, an electrode corresponding to the hole and penetrating the electric insulating film is formed in the conductive region, and the conductive material is coated on the conductive region that is the remaining region of the conductive film.

[0014] The second step may further include a step of forming a protruding electrode at a position corresponding to the other end of the conductive region in the plated conductive material.
At the time of plating in this step, by connecting one or more conductive regions or connection regions to a power source for plating, all the conductive regions and plating regions can be easily and reliably connected to a power source for plating. Thus, an electrode corresponding to the hole is formed in the plating area.

The third step may include removing the connection region by an etching process using a photoresist.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIGS.
An example will be described.

First, as shown in FIG. 1, a sheet member 10 having a conductive film 12 such as a copper foil on one surface (an upper surface in the illustrated example) of an electrically insulating film 14 such as a polyimide film is provided. Be prepared. As such a sheet-like member 10, a commercially available general material can be used.

Next, as shown in FIG. 2, a photoresist layer 16 is formed at a portion corresponding to a plurality of conductive regions and a connection region connecting adjacent conductive regions. The photoresist layer 16 may be formed by, for example, applying a photoresist on the upper surface of the conductive film 12 and exposing and developing the photoresist so as to leave the photoresist at a portion corresponding to each conductive region and each connection region. it can.

Next, as shown in FIG.
The conductive film 12 is etched so that the conductive film 12 in each connection region 20 remains, and the photoresist 16 is removed. As a result, the remaining region of the conductive film 12 is formed on the electrically insulating film 14 as a connection region 20 connecting the plurality of conductive regions 18 and the adjacent conductive regions 18.

Next, as shown in FIG. 4, a hole 22 reaching the lower surface of the conductive region 18 is formed in the electrically insulating film 14 at a position corresponding to one end of each conductive region 18. Each hole 22 can be formed by an appropriate drilling technique such as laser processing or etching processing using a photoresist.

Next, as shown in FIG.
Is covered with the photoresist 24. Photo resist 24
Can be formed, for example, by applying a photoresist on the upper surface of the conductive film 12 and exposing and developing the photoresist so as to leave the photoresist at a portion corresponding to each connection region 20.

Next, as shown in FIG.
0 is plated with a conductive material different from the conductive film 12, such as nickel. At this time, one or more conductive regions 18 or connection regions 20, preferably connection regions 20
Is connected to a plating power supply. Therefore, all the conductive regions 18 can be easily and reliably connected to the plating power supply. Thereby, the conductive material is plated on each conductive region 18, and the conductive region 18 is covered with the conductive material layer 26, and the conductive material is provided on the lower surface of one end of each conductive region 18 through the hole 22. An electrode 28 corresponding to the hole 22 and penetrating the electrical insulating film 14 is formed at one end of all the conductive regions 18.

In the steps shown in FIGS. 5 and 6, the connection region 20 is covered with a photoresist, and a conductive material layer 26 is formed in the conductive region 18;
4, a step of forming an electrode 28 by plating a conductive material in the hole may be performed separately.

Next, as shown in FIG. 7, the photoresist 24 covering the connection region 20 is removed. Thereby, each connection region 20 is exposed again. However, this step may be omitted.

Next, as shown in FIG. 8, a photoresist layer 32 having a hole 30 reaching the end of each conductive material layer 26 opposite to the electrode 28 is formed on one surface of the sheet-like member 10. Similarly to the above-described photoresist layers 16 and 24, the photoresist layer 32 can be formed by applying a photoresist in a predetermined range, exposing the photoresist, and developing the photoresist. Photoresist layer 32
May be formed at least in the conductive region 18, the connection region 20, and the conductive material layer 26.

Next, as shown in FIG.
0 is plated with a conductive material different from the conductive film, such as nickel, and the photoresist layer 32 is removed. During plating in this step, one or more conductive regions 18, connection regions 20, or conductive material layer 26, preferably other regions following connection region 20, are connected to a plating power supply. Therefore, all the conductive regions 18 and the conductive material layer 26 can be easily and reliably connected to the plating power source. Thereby, the conductive material is plated on each conductive material layer 26, and the protruding electrodes 34 made of the plated conductive material are formed on the upper surface of each conductive material layer 26.

Next, as shown in FIG. 10, each connection region 20 is removed by etching. This allows
The probe sheet 36 is formed. This etching treatment may be performed after forming a photoresist layer in a portion other than the connection region.

In the probe sheet 36, each conductive region 18 and the corresponding conductive material layer 26 are used as a probe element together with the corresponding portion of the electrically insulating film 14 and the protruding electrode 34.

Next, referring to FIG. 11 to FIG.
An example will be described.

First, in the same manner as in the above embodiment, as shown in FIG. 11, a sheet-like member 10 having a conductive film 12 such as a copper foil on one surface of an electrically insulating film 14 such as a polyimide film is prepared. Is done.

Next, as shown in FIG. 12, a photoresist layer 40 is formed on the conductive film 12. The photoresist layer 40 has a concave portion 42 reaching each position corresponding to the conductive region of the conductive film 12. Such a photoresist layer 40 is formed by applying a photoresist on the upper surface of the conductive film 12, exposing a predetermined portion of the photoresist to a predetermined shape, and developing the photoresist.
Can be formed.

Next, as shown in FIG. 13, the sheet member 10 is plated with a conductive material different from the conductive film 12 such as nickel, and a photoresist layer 40 is formed.
Is removed. During plating in this step, the conductive film 12 is connected to a power supply for plating. Therefore, the portions corresponding to all the conductive regions can be easily and reliably connected to the power supply for plating. As a result, the conductive material is plated through the recesses 42 at portions corresponding to the respective conductive regions of the conductive film 12, and the conductive material layer 44 is formed at those portions.

Next, as shown in FIG. 14, a photoresist layer 46 is formed at each location corresponding to the connection region of the conductive film 12. The photoresist layer 46 can also be formed by performing each process of coating, exposing, and developing a photoresist.

Next, as shown in FIG. 15, the conductive film 12 is subjected to an etching process, and the photoresist layer 46 is removed. Thus, the conductive film 12 is removed except for the conductive region 48 and the connection region 50.

Next, as shown in FIG.
Are formed in the electrically insulating film 14 at locations corresponding to one end of each conductive region 48.
Each hole 52 can be formed by an appropriate drilling technique such as laser processing or etching processing using a photoresist.

Next, as shown in FIG. 17, a photoresist layer 56 having a hole 54 reaching the end opposite to the hole 52 in each conductive material layer 44 is formed on one surface of the sheet-like member 10. Similarly to the above-described photoresist layer, the photoresist layer 56 can be formed by applying a photoresist in a predetermined range, exposing the photoresist, and developing the photoresist. The photoresist layer 56 may be formed on at least the conductive region 48, the connection region 50, and the conductive material layer 44.

Next, as shown in FIG. 18, the sheet member 10 is plated with a conductive material different from the conductive film such as nickel. During plating in this step, one or more conductive regions 48, connection regions 50 or conductive material layers 44, preferably other regions following the connection regions 50, are connected to a plating power supply. Therefore, all the conductive regions 48 and the conductive material layer 44 can be easily and reliably connected to the plating power source. Accordingly, the conductive material is plated on each conductive region 48 and each conductive material layer 44, and the electrode 58 and the protruding electrode 60 made of the plated conductive material are formed on the lower surface of each conductive region 48 and each conductive material layer. 44 formed on the upper surface.

Next, as shown in FIG. 19, the photoresist layer 56 is removed.

Next, as shown in FIG.
0 is removed by the etching process. Thus, the probe sheet 64 is formed. This etching treatment may be performed after forming a photoresist layer in a portion other than the connection region.

In the probe sheet 64, each conductive region 48 and the corresponding conductive material layer 44 are used as a probe element together with the corresponding portion of the electrically insulating film 14 and the protruding electrode 60.

In the steps shown in FIGS. 16, 17 and 18, a step of forming an electrode 58 by forming a hole 52 in the electrically insulating film 14 and a step of forming a photoresist layer 56 having a hole 54 to form an electrode 60 The step of forming may be performed separately.

In each of the above embodiments, the probe sheets 36 and 64 are shown to have three probe elements, but this is for easy understanding.
However, in actuality, the probe sheets 36 and 64 have the number of probe elements equal to or larger than the number of electrodes of the device under test, and the probe elements are formed according to the electrode arrangement of the device under test. 60 comprises one or more groups of probe elements arranged in a single row, zigzag or multiple rows. The lengths of the conductive regions 18 and 48 and the corresponding conductive material layers 26 and 44 vary depending on the type of the test object and the probe card. The tip surfaces of the electrodes 28 and 58 may be surfaces having other shapes such as flat surfaces other than the hemispherical surfaces.

Next, an embodiment of the probe card 100 using a plurality of probe sheets manufactured as described above will be described with reference to FIGS.

The probe card 100 is used for a conduction test of a plurality of semiconductor devices (ie, IC chips) formed in a matrix on a semiconductor wafer. In the following description, it is assumed that all chips have a rectangular shape, and that each side of the rectangle has an electrode group including a plurality of plate-like electrodes arranged in a row.

The probe card 100 has a probe sheet assembly 102, a disk-shaped wiring board 104 on which the probe sheet assembly 102 is mounted on the lower side, and a probe sheet assembly 102 mounted on the wiring board 104. It includes a plurality of inverted L-shaped holders 106 and a plurality of film substrates 108.

In the probe sheet assembly 102, a plurality of probe sheets 110 individually corresponding to IC chips are disposed on one surface side of the conversion board 112 via a plurality of long elastic bodies 114, and the other of the conversion board 112 is provided. Side of the reinforcing plate 1
16 on one side. Each probe sheet 1
10 and the conversion substrate 112, the anisotropic conductive sheet 1
18 are arranged.

Each probe sheet 110 is the probe sheet 36 (or 64) manufactured as described above, and has a rectangular shape corresponding to the IC chip to be inspected. Each probe sheet 110 has a plurality of wirings 120.
And a protruding electrode 122 provided at one end of each wiring are formed on one surface of the electrically insulating film 124, and have an electrode 126 that passes through the film 124 and reaches each wiring 120.

Each wiring 120 is connected to the conductive region 18 (or 4
8) and the conductive material layer 26 (or 44). Electrodes 122 and 126 are each electrode 34 (or 60)
And 28 (or 58). The film 124
Corresponds to film 14.

The protruding electrodes 122 of each probe sheet 110
Are arranged in a line in an area corresponding to each side of the rectangle according to the IC chip. However, when the IC chip has a plurality of electrodes arranged in a plurality of rows like a zigzag, the protruding electrodes 122 of each probe sheet 110 are also arranged in a plurality of rows. Each wiring 124 of each probe sheet 110 extends from the corresponding protruding electrode 122 to the inside of the rectangle.

The conversion substrate 112 is formed from an electrically insulating material such as polyimide or ceramic,
It is attached to the lower surface of the reinforcing plate 116 by a screw member or the like. The conversion board 112 includes a plurality of conductive members 12 connected one-to-one to the electrodes 126 of the probe sheet 110.
8 and a lattice-shaped recess opened on the lower surface to receive the elastic body 114. Each conductive member 128 is bent in a crank shape, and penetrates the conversion board 112 in the thickness direction.

Each elastic body 114 is made of an elastic material such as silicone rubber and has a rectangular cross-sectional shape, and corresponds to a part of a matrix row or column and extends in a corresponding row or column direction. Are arranged on the conversion substrate 112. Each elastic body 114 has a flat surface corresponding to one side of the rectangle protruding from the lower surface of the conversion substrate 112.

The reinforcing plate 116 has a rectangular shape, and has a plurality of cutouts 130 that open outward to receive one end of the film-like substrate 108. The conversion board 112 and the reinforcing plate 116 are mutually connected by appropriate means such as a plurality of screw members.

The anisotropic conductive sheet 118 has conductivity only in the thickness direction. Probe sheet 110 and conversion board 1
Reference numeral 12 indicates that the anisotropic conductive sheets 118 are arranged between the two, and both are fixed by heating and pressure bonding.

Each of the probe sheets 110 has an anisotropic conductive sheet in a region inside the rectangle with respect to the protruding electrodes 122 such that the plurality of protruding electrodes 122 arranged on the same side of the rectangle are located on the lower surface of the elastic body 114. 118 is mounted on the lower surface. Thereby, each electrode 126 of each probe sheet 110 is connected to the corresponding conductive member 12 of the conversion board 112.
8 is electrically connected in a one-to-one manner.

In each probe sheet 110, the area inside the area where the protruding electrodes 122 are formed is divided into four triangular areas by cross-shaped slits 132 extending in the direction of a rectangular diagonal. Each slit 32 is formed in the electrically insulating film-like member 124.

The wiring board 104 has a rectangular opening 134 at the center penetrating the wiring board 104 in the thickness direction, a plurality of tester lands 136 on the outer peripheral upper surface, and is individually connected to the tester lands 136. A plurality of wirings (wiring patterns) not shown are provided in a region inside the tester land 136. The wiring board 104 can be manufactured by a known printed wiring technique using an electrically insulating material.

Each of the film-like substrates 108 is a connection substrate having a plurality of wirings (not shown) on one surface of an electrically insulating film such as polyimide.
Is pulled out of the probe sheet assembly 102 from the notch portion 130 and is connected to the lower surface of the wiring board 104.
One end of each wiring of the film substrate 108 is electrically connected to the conductive member 128 of the conversion substrate 112 in one-to-one manner, and the other end of the wiring is connected to the wiring (not shown) of the wiring board 104 at the other end. It is electrically connected in one form.

Each holder 106 is attached to the wiring board 104, and the reinforcing plate 116 of the probe sheet assembly 102 is attached to the lower end. As a result, the probe sheet assembly 102 is assembled on the wiring board 104. Each film-like substrate 108 is connected to the wiring substrate 1
It is mounted on the lower surface of the wiring board 104 in a state of being electrically connected to the corresponding wiring 04.

The wiring substrate 104 and each film-like substrate 108
In other words, the wiring of the film substrate 108 and the wiring of the wiring substrate 104 can be assembled to each other by soldering. However, the wiring substrate 104 and the film-like substrate 108 may also be fixed by disposing an anisotropic conductive sheet having conductivity only in the thickness direction between the two, and pressing them by heat and pressure.

At the time of inspection, the probe card 100 and the semiconductor wafer are relatively moved and the probe sheet 110 is moved.
Are pressed by the electrodes of the IC chip, whereby each wiring region is slightly curved in an arc shape. At this time, the protruding electrode 122 slides with respect to the electrode of the IC chip, whereby the protruding electrode 122 rubs the surface of the electrode of the IC chip and scrapes an oxide film on the surface of the electrode. For this reason, the protruding electrode 122 contacts the electrode of the IC chip even more reliably.

The present invention is not limited to the above embodiment. The present invention can be variously modified without departing from the gist thereof.

[Brief description of the drawings]

FIG. 1 is a view showing steps in one embodiment of a method for manufacturing a probe sheet according to the present invention, wherein (A) is a plan view,
(B) is a sectional view

FIG. 2 is a view showing a step that follows the step of FIG. 1;
(A) is a plan view, (B) is a sectional view.

FIG. 3 is a view showing a step that follows the step of FIG. 2;
(A) is a plan view, (B) is a sectional view.

FIG. 4 is a view showing a step that follows the step of FIG. 3;
(A) is a plan view, (B) is a sectional view.

FIG. 5 is a view showing a step that follows the step of FIG. 4,
(A) is a plan view, (B) is a sectional view.

6 is a view showing a step that follows the step of FIG. 5,
(A) is a plan view, (B) is a sectional view.

FIG. 7 is a view showing a step that follows the step of FIG. 6;
(A) is a plan view, (B) is a sectional view.

8 is a view showing a step that follows the step of FIG. 7,
(A) is a plan view, (B) is a sectional view.

FIG. 9 is a view showing a step that follows the step of FIG. 8;
(A) is a plan view, (B) is a sectional view.

FIG. 10 is a view showing a step that follows the step of FIG. 9;
(A) is a plan view, (B) is a sectional view.

11A and 11B are diagrams showing steps in another embodiment of the method for manufacturing a probe sheet according to the present invention, wherein FIG. 11A is a plan view and FIG.

FIG. 12 is a view showing a step that follows the step of FIG. 11;
(A) is a plan view, (B) is a sectional view.

FIG. 13 is a view showing a step that follows the step of FIG. 12;
(A) is a plan view, (B) is a sectional view.

FIG. 14 is a view showing a step that follows the step of FIG. 13;
(A) is a plan view, (B) is a sectional view.

FIG. 15 is a view showing a step that follows the step of FIG. 14;
(A) is a plan view, (B) is a sectional view.

FIG. 16 is a view showing a step that follows the step of FIG. 15;
(A) is a plan view, (B) is a sectional view.

FIG. 17 is a view showing a step that follows the step of FIG. 16;
(A) is a plan view, (B) is a sectional view.

FIG. 18 is a view showing a step that follows the step of FIG. 17;
(A) is a plan view, (B) is a sectional view.

FIG. 19 is a view showing a step that follows the step of FIG. 18;
(A) is a plan view, (B) is a sectional view.

FIG. 20 is a view showing a step that follows the step of FIG. 19;
(A) is a plan view, (B) is a sectional view.

FIG. 21 is a bottom view showing one embodiment of a probe card.

FIG. 22 is a front view of the probe card shown in FIG. 21;

FIG. 23 is a sectional view of the probe card shown in FIG. 21;

FIG. 24 is an enlarged sectional view of a part of the probe card shown in FIG. 21;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Sheet-like member 12 Conductive film 14 Electrically insulating film 16, 24, 32, 40, 46, 56 Photoresist layer 18, 48 Conductive area 20, 50 Connection area 22, 30, 52, 54 Hole 26, 44 Conductive material Layer 28, 58 Electrode 34, 60 Protruding electrode 36, 64 Probe sheet 42 Recess

 ────────────────────────────────────────────────── ─── Continuing from the front page (72) Inventor Isao Tanabe 2-6-8 Kichijoji Honcho, Musashino City, Tokyo F-term in Japan Micronics Co., Ltd. (reference) 2G011 AA03 AA15 AA21 AB06 AB08 AE01 AE03 4M106 AA02 BA01 CA01 DD04 DD09 DD10

Claims (7)

[Claims] A first step of forming, on one surface of an electrically insulating film, a plurality of strip-shaped conductive regions and a connection region for electrically connecting adjacent conductive regions; and at least one of the conductive regions. A method of manufacturing a probe sheet, comprising: a second step of partially electroplating a conductive material; and a third step of removing the connection region. 2. The first step comprises preparing a sheet-like member having a conductive film on one surface of the electric insulating film, performing an etching process using a photoresist on the conductive film, The method of claim 1, comprising forming a region and the connection region. 3. The method according to claim 2, wherein the second step includes forming a hole in the electrically insulating film corresponding to one end of the conductive region, the hole reaching the conductive region, and supplying the conductive material to one end of the conductive region. The manufacturing method according to claim 2, further comprising plating the portion through the hole and plating the other surface of the conductive region. 4. The first step includes preparing a sheet-like member having a conductive film on one surface of the electrical insulating film, and forming a recess corresponding to the conductive region and reaching the conductive film. Forming a photoresist layer having on the conductive material, plating the conductive material on the conductive film using the recesses, performing an etching process using a second photoresist on the conductive film, The method according to claim 1, comprising forming a conductive region and the connection region. 5. The method according to claim 5, wherein a hole is formed in the electrically insulating film at a position corresponding to one end of the conductive region, the hole reaching the conductive region, and one end of the conductive region is formed through the hole. The method according to claim 4, further comprising plating the conductive material. 6. The method according to claim 3, wherein the second step further includes forming a protruding electrode at a position corresponding to the other end of the conductive region in the plated conductive material.
6. The production method according to 4 or 5. 7. The manufacturing method according to claim 1, wherein said third step includes removing said connection region by etching using a photoresist.