TWI231621B - Electrical connector and method for making - Google Patents

Abstract

An electrical connector includes an electrical contact array having a plurality of contact elements. Each contact element has at least one conductive, resilient spring portion formed in a conductive, resilient sheet, each spring portion being biased outwardly from the sheet. The electrical contact array is arranged in a predetermined pattern corresponding to an electrical device to be connected. The conductive sheet is bonded to a first surface of a dielectric substrate, each spring portion extending outwardly away from the dielectric substrate. The spring portions are electrically connected to conductors that are at least one of embedded in or extending through the dielectric substrate. At least some of the plurality of contact elements are singulated from one another on the dielectric substrate by a chemical etchant.

Description

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V. Description of the Invention (1) Scope of the Invention The present invention relates to electrical connectors, and in particular, to reconnectable and re-electrical connectors, and a method for manufacturing the same. The meaning of the context is the electrical connection or connector used to connect two or more self-connected components to the J-connected component to an electrical device, such as a computer, router, or test or an electrical component. The meaning of "quote" includes but is not limited to printed circuit boards , Connector ϋ: board connector. For example, '-electrical interconnections are used to connect-electrical groups; integrated circuits (an IC or a chip)' to-printed circuit boards. Interconnections can also be used to connect an electrical interconnection system during the manufacture of integrated circuits. In some applications, the electrical connection may be tested or reinstalled, and the connection may be separated or may be connected, for example, if a detachable interconnection device can be used. Upgraded chip. Displacement, and the parts can be removed, or set up. There are also electrical connections for direct electrical connections in applications. This electrical connection is crying. The metal pad on the circle is used for wafer testing in the manufacturing process. The card ‘Typical Tester’ provides consistency from the tester to the heart-type mounting. It has been tested for its functionality, and limited with special parameters. The traditional electrical connection $ 福 + is inserted into an insulating carrier to chalk metal springs. Other methods after its manufacture include the use of an array of 6 J-connected components. Form an electrical connector. Use isotropic conductive bonding to inject a molded conductive junction.

Page 8 1231621 V. Description of the invention (2) :: bunched wire conductive elements, springs made of wiring technology and small solid-state thin films are referred to as array metal pads (also known as land), which are used as: body circuit packages For printed circuit boards or other electrical mines: Metal pads are usually formed by thin film deposition technology, and are: Ball grid array (i) refers to an array of solder balls or solder joints, for guidance: electrical contacts. lga and bga packets are widely used for = removable and reinstallable socket capabilities to

Or chip modules. The progress of m from the dagger to the increase of the PC has resulted in a reduction in the shape of the packet and a reduction in pitch, and the total number of connections has increased. Also: As cited, ^ packets are connected by Irnn or less than _ or more. In addition, juices tend to operate at a higher frequency. For example, the mouth of the 1C dream department ^ two 胄 communication and network applications use fall frequency and output signal is more than 1GHZ. The number of leads of an electronic device is equal to the inch size, the number of leads of the package is used for testing a tight connection with the interconnection system of these 4 devices. Inch requirements have led to a shrinking scale in semiconductor integrated circuits :: Example: The pitch of the contacts on a mold or a semiconductor package ^-The pads on a semiconductor wafer may have a diameter of 250 microns or less ★. This problem becomes more difficult when the semiconductor device is ===, when it is permanently connected, and a connection is connected to a plurality of pads in an array at the same time. 1231621 ----- ^ 5. Description of the invention (3). The mechanical and reliability performance needs to be connected to the power of the system. The technology cannot be used for high speeds: m is the case. The traditional interconnection technology and the nature of the Ic device relying on the nature of the two :: and the big bow, the number of lines of machinery, the changes encountered in today's interconnection system, and the connection of the electrical group is from co-planarity (vertical) Offset) causes contact elements to be misaligned. Coplanarity changes The following three factors are under greater pressure. This-difference comes from sexual changes (3) packet fish plate, coplanarity change in the dagger (2) coplanarity of the board) any tilt of the board. In traditional LGA packets, the sleeves become non-planar. When the vertical line) some pads cannot be connected with others due to the surrounding of the substrate, the coplanarity change of the LGA connector makes it impossible to fish = C. LGA component pads are electrically connected. , All electrical component leads are reliable and high-quality. In addition, the position of the lead is not possible due to the deviation of the system. The level of the lead of the electronic component at the ideal position must be predicted together. An effective interconnection must be able to accommodate the connection = the line size itself. The position changes due to the increase of the common = line. 2. § The flatness problem is not limited to j Γ when the package size is reduced. ^ "CB}, because the package is connected: Guang Er exists in the printed circuit board LGA ^ ^ The flatness of the PCB has flatness. Question. Mother-in-inch 75_125 microns or more. LGA connector must

Page 10 V. Description of the invention (4) It must be able to accommodate the connected components. This meaning represents the full power of the contact plane, the coplanarity between the PCB and the PCB. At this time, the packet _ ;; mm function at 0 is a retractable electrical contact element, and the deflection is the closest. Therefore, it is better to allow constant change and position misalignment. Flat, action can make the coplanarity of the contacts positive LGA connector can be used effectively ^ connection = the interface between the connector and the component to be connected only two "electricity or Λ special gray // enter ⑽: the connector is degraded, resulting in Breaking the mm connection and 1 and ^ can be electrically connected. When electrically connected to the contact, when the contact element contacts 塾, ^ or the metal pad on the LGA so that any oxygen can be broken. = Yes === Through action, Metal 塾 on the board. Please refer to Figure 1, and $ to connect the base and the base. The upper metal _ is used for electrical storage :: the lower element film is formed on the _. When contacting the two 102 must penetrate the film 108 in order to contact the ^ Wu Zan Yuan Zan contacted her, thin film: ；; = 当当 = frictional contact or through motion. The frictional contact or f Φ1 provided by the contact element 102 is necessary, good frictional contact 1231621 V. Description of the invention (5) The penetration action is very important, because the penetration action is strong enough to penetrate the surface film 108, but soft enough to avoid damaging the metal pad during electrical connection. In addition, any frictional contact action must be provided Sufficient friction distance, enough metal surface is exposed for The intended electrical connection is very important. Similarly, when in contact with the solder ball, sufficient penetration or friction must be provided to overcome the original oxide layer on the solder ball. However, when traditional methods are used for electrical contact with the solder ball, When in contact, the solder ball may be damaged or detached from the package. Figure 2a illustrates that the existing contact element 〇2 is used to contact the solder ball 200 formed on the substrate 200. When the contact element 102 is in contact with the solder ball 200 For testing, the force ^ penetrates through the action, this action forms a hole 2 0 4 on the top surface (also known as the basic surface) of the solder ball 200. [IT] When the subsequent connection to another semiconductor device, the solder ball _Middle H hole 204 can cause voids and holes to form in the interface of the solder ball

) ° ^ ^ ^ (V 2C) force dry ball 2 00 is connected to the metal pad 210. However, due to the pits m on the surface of 9 惶 ^ on the surface of A, it is formed as the top of the table 2000, which is the same as 2 1 4 in the solder ball interface. The appearance of 、 and 214 can affect the connection. The electricity ^ Second, the degradation of the door. And important is the connection reliability. Traditional interconnecting devices such as stamped metal are electrically combined at the size of the swallow hours, which are already: * beam lines, such as molding guides, electrical components with positive length position changes. ^ Makes it unsuitable for the container to be true. At this time, the length of the electrical path is reduced to one, the space between them is smaller than one millimeter, and it meets the high-frequency performance requirements. Below 氅 m, in order to make the inductor the most strict and inelastic, the current interconnection technology under the cup λ 丄 size specification, the insertion force is about 30-40 grams per contact 1231621

When it comes to control without cause. The mold wipes an electrical connection and does not cause damage compared to normal position. The invention that provides electrical operation does not accommodate this, and the most frictional connections also have a reasonable distance. The contact element damages its welding. Canon provides tolerances and interconnects with each other. The electronic device requires the system to be ideal. In addition, it can be connected to the ball for an electric power. When the frictional contact is in contact with the welding control surface, the surface change is suitable for changes and poor position alignment. Contact element, which can provide contact action on metal pads with a pitch of less than 50 microns, can provide contact pads as high as 5000 / 〇 ball to complete electrical contact, the most rational is the friction contact action on the solder On the ball, and the system, it can accommodate the connected electrical components and their positions are not aligned. In addition, it is preferred to be able to work with a small 'high lead density at high frequencies. The present invention discloses a method of an electrical connector. On the other hand, revealing a manufacturing electrical connection ~ A more detailed understanding of the present invention can be obtained from the following description of preferred implementations' by way of example and in conjunction with the drawings. Detailed Description of the Preferred Embodiments Figures 3a and 3b are cross-sectional views of a bbga system constructed in accordance with the present invention. In the first structure 300 in FIG. 3a, the solder ball 300 provides a method to establish an electrical contact between the device, the package, or the module 300 and a carrier 300. The solder ball 302 displays the configuration In the carrier 306 via the printed circuit technology 308. The solder ball 3 0 2 is elastic due to its elastic contact " arm 310, which hangs over a portion of the layer 312. The contact arm 310 supports the solder ball 302 as shown in the figure, and provides a support such as a bomb, as shown in Figs. 3c and 3d.

Page 13 1231621

The array of contact H-arms 310 is built in layer 312 'can be clearly seen from Figure 3f. The different patterns of teeth 01 are illustrated by 31a and 31b in Fig. 3g, respectively. In PCB 31, as shown in FIG. 6, the structure connects the structure 300 to a pad 3 1 4 in the manner of an electrical contact element 318. The element includes a blga L array and a pin grid array (pgA). ), Or one of the following types of contact elements. In Fig. 3c, the carrier 3 0 6 and the PCB 316 are in electrical contact by the contact between the solder ball 320 and the pad 314. In Figure 3d, the carrier 3 0 6 and pad 3 14 are in electrical contact with the contact arm 318. The contact arm 3 1 0 can be stamped or etched in a desired shape. As detailed below, they are assembled in a similar construction method to PCB. FIG. 4a is a plan view of the surface mounting surface of the BLG A electrical contact element 400 constructed according to the basic invention. The BLGA system includes a carrier 402, which has an array of arms 400 that form an elastic element outside the plane of the spring carrier 402. The angle, thickness, and thickness of the arm 404 can be changed to provide special design characteristics such as contact force, current carrying capacity, and contact resistance. Carrier 402 is shown in electrical contact with pCB with solder balls 408 of contact pad 41o. The shape of the arm 404 is similar to that of the arm 301a-d. Figure 4b is a cross-sectional view of a separable contact element 400 & constructed according to the present invention, which includes a carrier 40, which contacts the pad 410 with a contact brush 412, and the brush and the carrier 402. The middle contact arm 404 is similar. Fig. 5 is a cross-sectional view of the connector 500 of the present invention, including an example size of a portion of the contact element 502 shown. The clearance between the distal ends of the 504 opposite spring portions was 5 mils. The height of the contact element 502 from the surface of the substrate to the top of the spring portion is 10 mils. The width of the through substrate can be in the range of 10 mils. The width of the contact element 5 0 2 from the outer edge of the base part to the edge of the other base is 16

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Blanket ears. Such contacts can be formed with a pitch of less than 50 mils and a range of less than 20 mils according to the method of the present invention. It should be noted that these dimensions are only connectors that can be achieved by the present invention. It can be understood from the present invention that the larger or smaller size :: fine contact: this technique is artificial. <The contact element can be shaped according to an embodiment of the present invention. The following unit contact elements _ 彳 #, U # 4 maple characteristic contact elements or one M2 achieve a certain—ideal operating characteristics HI—contact force of the contact element can be Choose to ensure 'connect' or low overall contact force for the connector. Touch: Low-resistance, flexible work piece Mengmin_ ^ 7 Second, each contact element can be ticked &amp; 17 to k. Third, the vertical height of each contact element can be changed by one to four. The pitch or horizontal size of the contact element can be designed by m, the display leg system and the blga system's multiple contact arm structure and description. The contact arm can be punched, etched into the spring type ... structure i, and can be heat treated before or after formation. ”__ shows the first of the electrical substrate m of the connector according to an embodiment of the present invention? The m 'group of contact elements 702' is located on the second Φ bundle main surface of the substrate 704, and the second group of contact elements 706 is located in the substrate plate 704. π &amp; surface. Each pair of contact elements 702, 70 6 is preferably aligned with a base hole 708. A metal track is formed through the hole to connect the contact elements with ..., the two main surfaces are connected to one Contactor Figure. 7: I in :: Connect J: 2 One of the middle steps of the process ten is connected with one of the contact element arrays shown together connected in metal or

1231621 V. Description of the invention (9) Made of metal material> u * Adding the pattern 2: In the manufacturing steps after 制造, the sheets of the contact elements are isolated (individually ^ do not need part of the contact elements as needed or all contact) For example, the sheet may be masked or etched to isolate some of the connectors with the present invention formed as follows. First, the substrate may be a conductive path dielectric substrate between the bottom surface and the conductive path. The conductive path is a sheet ^ Ho ^ f or pores 708. In one embodiment, the 'dielectric substrate 704' is a thin layer of dielectric material with through holes. A conductive sheet or more is connected to: forming includes: a base part or more elastic Part t is formed in other ways. Several pieces including the elastic part can be stamped by etching, or when including a second and connected: sheet on the first-major surface of the dielectric substrate 704. As such, the second conductive material sheet or multilayer sheet They are isolated from each other as needed. F iH # u is a contact pattern. (Patterns are patterned according to the type.) M is stamped or other figures have been shown in this example. The protruding part of the elastic part can be included in the sheet = patterned. Contact element connected to the bracket Do not part can be eliminated before completion. In addition, thin In addition, as shown in the real two two electric Λ = hole opening J two: ΐ The surface is surrounded by a circular pattern 71 〇 per-through. And the conductive ring 71 〇 can provide electrical connection between the conductive track formed by the mother penetrating W, the conductive ring 7ι〇 and page 16 1231621

-1 «丨 丨 I V. Description of Invention (10) Two pieces. In one embodiment, the connector can cover all components after the element touches the component; the structure can be formed after the case; after that, each contact is formed, and the contact element is connected to the transmission rail in the dielectric hole through a hole Ming spoon km Terminals on the other side of the substrate. Fig. 85 Yun Yue includes a connector 800 using a contact element according to another embodiment of the present invention. Referring to FIG. 8, a layer structure is formed to form a first group of contact elements 802, 802, and 800. The contact element 802 and the second group of contact elements 804 are pressed on the skin wall. In this example, the n-contact element 802 is used as a component, and the second group of contact elements 804 is used as a component and the second metal layer 8.8 is made of a dielectric layer 81. Every two pictures it ’# A group of contact elements are opened at the desired position on a specific metal layer. For example, 'the contact element 802 is formed at a predetermined position in the metal layer 806. The bit 804 is formed in the metal layer 808 at the position where the contact element 8 ° 2 is not occupied. Different metal layers can include metal layers of different thicknesses or different alloys, and the operating characteristics of the concrete contact elements can be specially matched. Therefore, by forming a selected contact element or a selected contact element group in the same metal layer, the contact elements of the connector 800 can exhibit different electrical and mechanical characteristics. In one embodiment, the connector 800 can be formed by the following method. The metal layer 806 is processed to form a first group of contact elements 802. Gold 806 is then connected to the dielectric substrate 812. Subsequently, an insulating layer, such as a layer wo, is located on the first metal layer 80 6. The second metal layer 808 is electrified to form a contact element and is connected to the dielectric layer 810. Via holes and vias are formed in the dielectric substrate 812 and, if necessary, in the dielectric layer 810, = page 17 1231621 V. Description of the invention (11) The conductive path between the contact elements is on the opposite side of the substrate 812 Of each terminal. 1j process Figures 9 &amp; and 913 are cross-sectional views of a connector according to an embodiment of the present invention. a and 9b show that the connector 900 is connected to the semiconductor device 91, and a metal pad 912 as a contact is formed on the device. Semiconductor device == wafer '. Metal pad 912 is a metal bond formed on a wafer. It can also be a package. Metal 912 represents "a land or a metal connection pad formed on an LGA package." ^ 00 = Into the semiconductor device 91〇 is for illustration only. It is not intended to limit the connector θοο to only be used to connect wafers or LGA packages. The figure "and 9" is reversed and connected to the conductor device 910. Directional words used in the present invention are such as Π up / square Π, "and the top surface Π is intended to explain the relationship of the relative positions of the components of the connector. 'Dead as the connector is configured with the contact elements facing up. As shown in FIG. 9a, the connector 900 includes an array contact 902 on the substrate 904. Since the connector 900 is constructed on a semiconductor scale to be connected to a semiconductor device, the connector 900 is usually manufactured using a semiconductor material used in a semiconductor manufacturing method. In one embodiment, the substrate 904 is made of quartz, silicon or ceramic wafer, and the contact element 902 is located on the dielectric layer, which may be a spin on silica formed on the substrate 904. (SOS), spin-on-glass (SOG), boron-phosphorus 5% oxysilane (BpTE0S), or pentaoxysilane (TE0S) layer. The 902 array of contact elements is typically formed in a two-dimensional array to match corresponding contact points on the semiconductor device 910 to be connected. In one embodiment, the connector 900 is formed to contact a contact metal pad having a pitch of 50 microns or less. Each contact element 90 2 includes a base portion 9 0 6 connected to the top surface of the substrate 90 4 and a curve

Page 18 1231621 V. Description of the invention (12) or linear spring portion 908 extends from the base 906. The spring portion 908 has a proximal end that is continuous with the base portion 906, and a distal end that penetrates above the base plate 904. After the spring portion 908 is formed, it is separated from the contact plane at an angle or a curve. The plane is the plane of the contact point, and the contact element 902 is connected to the surface of the contact element 912 and the metal 塾 912. After the spring portion 908 is formed, it forms a concave meandering radius with the surface of the substrate or it is separated from the surface of the substrate 904 after being formed. Therefore, the elastic part 908 is separated from the surface of the metal pad 912, and thus provides a controlled frictional force when contacting the metal pad 91 ^. During operation, an external biasing force, represented by F in Fig. 9a, is added to the connector 900 to compress the connector 900 against the metal pad 912. The spring portion 90 8 of the contact element 902 is connected to each metal pad 912 by a controlled friction action, so each contact element 90 2 is effectively electrically connected to each pad 912. The curvature or angle of the contact element 902 ensures that the optimal friction distance is used to achieve the optimal connection. The elastic part 90 8 is the amount of the distance from the through end when the metal pad 912 contacts the metal pad 912. The contact force is usually 5-100 g, depending on the application, and the grinding distance is in the range of 5-400 microns. Another characteristic of the contact element 902 is that the spring portion 908 can have a large m 1. Don't because the '箦 portion 9 ° 8 can move in the vertical * horizontal direction ^. The flexible working range of the length of the electric path can reach J contact all parts 9 0 2 of the circuit stove sound ”pp in the remote part of the Yantai part 908 flow to the contact _ = 、,,, k must be opened from the spring Strain ρμΪ The distance between the base parts of the contact piece 〇2. Connecting it can make the connector change in length and position misalignment in the semiconductor to be connected 导体 王 王. King conductor into an electronic dress to accommodate a normal coplanar section Page 19 V. Description of the invention (13) The contact element 9 0 2 is formed using a conductive metal, ==-Example, contact element, system ^ and Λ Λ: shape *, which can be electroplated afterwards to obtain the desired electricity and / Or in other embodiments, in another embodiment, the contact element 9G2 is a lido] sheet such as a stainless steel plate is plated with copper-nickel-gold (Cu / Ni / Au). In a preferred embodiment, the contact element 9 ° 2 is The particles are used to provide a non-oxidized surface. In another embodiment, the base is formed by using different metals as the base portion and the spring portion. In the illustrated embodiment, the connector 902 is shown to have a rectangular base portion I. 、 / / Part 908 ° The configuration of the contact element m of the present invention is formed: a contact element only needs one base The part is sufficient to connect the spring part to the 旯 J: This: The spring part can be any larger 'and form a ring or other; Since the Ameri Post? Contact how many pieces to the substrate. A contact element can include the spring part from the base Partially extended. Fig. NL0aA10b illustrates a connector 100 of another embodiment of the present invention. The connection == an array of contact elements 1002 is formed on the substrate 1004. Each contact 7L pieces 100 2 includes a base portion 1006, and a curved line 3 = 1¾010 extending from the base portion 1006. The spring portions 1008 and ⑺1: 1 oil blood strength f on the substrate 1 004, and facing each other Yes. The spring part 10 08 and the half and the hertz part 9 ° 8 are the same. That is, the spring part ⑽8 and 1 () 1 ° self-contacts and each has a curved diameter so that when the connection of the semiconductor device to be connected is provided, Controlled friction action. Connector 1 0 0 can be used to contact semiconductor device 1020, such as BGA seal 1231621.

The package includes an array of solder balls 1022 mounted on a substrate 1 024 as one of the contacts. Figure Ijb illustrates that the connector 1000 is sufficiently connected to the semiconductor device 1020. The connection 1 100 can be used to contact a metal pad on a land grid array packet. However, the use of the connector 1000 to contact the solder balls provides special advantages. First, the 'contact element 1 0 2 contacts the solder ball along the side of the solder ball. Not in contact with the base surface of solder ball 1022. Therefore, the contact element 1002 does not damage the base surface of the solder ball 10 2 2 during the contact, and can effectively eliminate the possibility of pit formation when the solder ball 1 2 is subsequently reflowed for permanent connection. Secondly, since the formation of the spring portions 1008 and 1010 of the contact element 1002 is separated from the contact plane, in this case, it is tangent to the side surface of the contact solder ball 1022, and the contact element 1002 is in contact with each solder ball Provides a controlled friction action. In this way, an effective electrical connection can be made without damaging the surface of the solder ball 10 2 2. Third, the connector 1000 is scaled and can be used to contact solder balls with a pitch of 250 microns or less. Finally, because each contact element 1002 has a large elastic working range over the length of the electrical path, the contact element 0 02 can accommodate a wide range of compression. Therefore, the connector of the present invention can be used to effectively contact a conventional device having a normal coplanar change and a misaligned position. 11 and 12 illustrate a connector according to another embodiment of the present invention. Referring to FIG. 11 ', the connector 1100 includes a contact element 1102 formed on a substrate 1104. The contact element 110 2 includes a base portion 110, a first curved spring portion 1108, and a second curved spring portion 1110. The first curved spring portion 1108 and the second curved spring portion 丨 丨 丨 〇 have distal ends and are separated from each other. Contact element

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1102 can be used to connect a contact point including a metal pad or solder ball. When rolling and connecting a solder ball, the contact element 1102 forms the solder ball between the first and second: spring portions 11 08 and mo, similar to that shown in FIG. 3e. ~ Prisoner, No.

The first and second spring portions i 丨 08 and 丨 丨 丨 〇 contact the side surfaces of the solder 2 in a direction away from the plane of the solder ball with a controlled friction action. , V FIG. 12 illustrates a contact element 120 on a substrate 1 202. The contact element 1200 includes a base portion 1204 and a second curved spring portion 1208, which extends from the base portion 1204. The first spring portion 1206 and the second spring portion 120 &quot; 8 = the spiral configuration penetrates out of the substrate 1 2 02. The contact element 1 2 0 0 can be used to contact j metal pads or solder balls. In two cases, the first and second spring portions 1206 and 1208 leave from the contact plane curve and provide a controlled friction action. 13a-13c are cross-sectional views of the connector 1300, which can be used in heat exchange operations. Referring to FIG. 13a, connector 130 is shown as a no-load condition. The connector 1 3 0 0 will be connected to a Luger Array (LGA) package 132 0 and a printed circuit board (PC board) 1 330. Pad 1 322 on LGA packet 1 32 0 represents a power connection (positive power supply voltage or ground potential) of one of the integrated circuits in LGA packet 1320, which will be connected to pad 1332 on PC board 1330. The pad 1332 is electrically active or powered. Pad 1 324 on LGA packet 1 320 represents the signal pin of the integrated circuit, which will be connected to pad i 334 on PC board 1 330. To complete the heat exchange operation, the power supply pad 1322 should be connected to the pad 1332 before the signal pad 1324 is connected to the pad 1334. The connector 1300 includes the contact elements 1304 and 1306 in the substrate 1302. The L-side element has an extended height and has a larger elastic working range than the contact elements 1308 and 1310. 俾 LGA package The heat exchange operation between the 1 320 and the PC board 1 330 is realized by the connector 1 300. The height of the contact elements 1304 and 1306 needs

1231621 V. Description of the invention (16) Choose to obtain the ideal contact force and the ideal space for reliable heat exchange operations. FIG. 13 illustrates an intermediate step of mounting the LGA packet 1 320 on the PC board 1 330 by using the connector 1300. When the LGa packet i 32 and the pc board 1 330 are compressed together against the connector 1300, the pads 1322 and 1332 will be electrically connected to the respective contact elements 1 308 and 1310. In this way, the power connection between the LGA packet 1 32 0 and the PC 1 330 is established before the signal pads are connected. FIG. 13c illustrates the mounting of the LGA packet 1320 on the PC board 1 330 under a fully loaded condition. With further pressure applied, the lga packet 1 320 is compressed against the connector 1 300, and the contact element 1 3 08 is connected to the signal pad 1 324. Similarly, the PC board 1 330 is compressed against the connector 1300, and the contact element 131 is connected to the pad 1334. The LGA packet 1 320 is therefore mounted on the pc board 1 330. In the connector 1300, the higher contact elements 1304 and 1306 are more compressed, so that the shorter contact elements 1308 and 1310 are connected, and the contact force required by the connector will increase. In order to minimize the total contact force required by the connector, the higher contact elements 1 304 and 1 306 can be designed to have a lower elastic constant, which can be the best connection force under sufficient load. Contacts Figure 14a illustrates an embodiment of a circuitized connector 1400 of the present invention. The connector 1 400 includes a contact element 1 404 on the top surface of the dielectric substrate 1402. The substrate is on the bottom surface of the dielectric substrate 1402 and is connected to the contact element 1406. The contact element 1 404 is connected to a surface-mounted electrical component. . Electrical components 1412. The electrical components ㈣ and 1412 may be decoupling capacitors; = capacitors on the connector 1 400 may be placed as close as possible to the electronic components. In traditional integrated circuits, such decoupling capacitors

1231621 V. Description of the invention (17) Brush the circuit board, far from the electronic components. ^ ^ There is an actual decoupling capacitor _ Λ Electronic components to be compensated The container effect is minimized. Take advantage of circuitization: / and thus make the decoupling capacitors as close as possible to the electronic components Λ% / 40 0, the benefits of decoupling capacitors. Others can make connectors = 2 electrical = to = capacitors, inductors, and other active or passive electronic components. Figure 14b illustrates the circuitized connection of the present invention. Device 1 420 includes a dielectric substrate! The implementation of f on 422. Connection_light-on to solder ball terminal "26. Connection = J; electronic component 143〇 and arrogant electronic component connection; = surface two: =: 1 426 does not need to be aligned with the contact element" 24, as long as the contact = = terminal That is, if it is coupled to the terminal via the path 142. Note that the present invention can be UP-connector structure without the release hole in the substrate. The electrical contacts or vias may be trapped in the offset holes, or in a suitable manner to provide an integral electrical connection or to the opposite side of the substrate. According to another aspect of the invention, the connector may include one or more coaxial contacts. 15a and 15b show a connector 150 including a coaxial f-contact element according to an embodiment of the present invention. 15 &amp; A connector 150 includes a first contact element 1504 and a second contact element 1506 formed on a top surface of a dielectric substrate 1502. The contact elements 504 and 506 are formed close to each other, but are electrically isolated from each other. The contact element 1504 includes a base portion formed as an outer ring of the aperture 1508, and the contact element 1506 includes a base portion formed as an inner ring of the gap 1508. Each contact element 1504 and 1506 includes two elastic portions (Fig. 15b). The elastic part of the contact element 1 504 is not connected.

Page 24 1231621 V. Description of the invention (18) The elastic part of the contact element 1 5 0 6 overlaps. The contact element 1 504 is connected to the contact element 1510 on the bottom surface of the dielectric substrate 1502 via at least one via 1512. The contact elements 15 0 4 and 15 10 form a first current path, which is called a circuit path outside the connector 5500. The contact element 15 0 6 is connected to the contact element 1514 on the bottom surface of the dielectric substrate 1502 via the metal track 丨 5 丄 6 in the aperture 1 5 0 8. The contact elements 1504 and 1514 form a second current path of the connector 1500, which is called a current path within the connector 1500. With this structure, the connector 1 500 can interconnect the coaxial connection on an LGA packet 1520 to the coaxial connection on the PC board 1530. Figure 16 illustrates the matching between the LGA packet 1 52 0 and the PC board 1 5 30 via the connector 15 0 0. When the LGA packet 1 520 is mounted on the connector 1500, the 'contact element 1504 is connected to the pad 1522 on the LGA packet 1520. Similarly, when? (] When the board 1530 is mounted on the connector 1500, the contact element 1510 is connected to the pad 1 5 32 on the PC board 1 53 0. As a result, a current path outside the pad 1522 and 塾 1 5 3 2 is formed. External current The path constitutes a ground potential connection. The contact element 15 0 6 is connected to the pad 1 524 on the LGA package 1 520, and the contact element 1514 is connected to the pad 1 534 on the PC board 1 53 0. As a result, the pad 1 524 and the pad 1 An internal current path is formed between 534. The internal current path constitutes a high-frequency signal. [J〇97] The special advantage of the connector 1500 is that the coaxial contact element can be sized / mm or smaller. Therefore, the connector 15 〇〇 can be used to provide a coaxial connection 'even small form factor electronic components are also possible. Electrical connector manufacturing method Figures 17a-17h illustrate an embodiment of the present invention in Figure 9a connector 900 formation process steps. Referring to Figure 17a, A substrate 1700 is prepared, and a contact π is located thereon. The substrate 1700 can be a silicon wafer or a ceramic wafer, which can be packaged.

Page 25 1231621 V. Description of the invention (19) Including a dielectric layer formed thereon (not shown in FIG. 17a) ° SOS, SOG, BPTEOS or TEOS dielectric layer can be formed on the substrate 1700 Isolate the contact element from the substrate. After that, a support layer 17 2 is formed on the substrate 1 700. The support layer 1 702 may be a deposited dielectric layer, such as an oxide layer, a nitride layer, a dielectric spin, a polymer, or any etchable material. The support layer 1 702 may be deposited by different methods, including chemical vapor deposition (cvd), plasma sacrificial gas deposition (PVD) 'spin methods, or when the substrate 1700 is not covered by a dielectric layer or a conductive bonding layer, The support layer 1702 can be grown using an oxidation method used in semiconductor manufacturing. After the support layer 1 70 2 is deposited, a mask layer 1 7 04 is formed on the top surface of the support layer 1 702. The mask layer 17 0 4 is traditionally used in combination with the mask layer 17 0 4 to define a pattern on the support layer 1 7 2. After the mask layer is printed and developed, (Figure 17b) a mask pattern including areas 1 704a and 1 704c is formed on the support layer 1702 to define one of the areas of the support layer 1 7 2 and be protected from subsequent money engraving. influences. Referring to Fig. 17c, anisotropic etching is performed using the regions 1704a-1704c as a mask. As a result of the anisotropic etching, the portion of the support layer 17 2 that is not covered by the patterned eye mask is eliminated. In this way, support areas 1702a-172c are formed. The mask pattern including areas 1 704a-1 704c was then removed to expose the support area (Figure 17d). The support regions 1702a-1702c are then subjected to isotropic etching. The isotropic #etching method can eliminate the material engraved in the vertical and horizontal directions with the same remaining rate. Therefore, as a result of the isotropic etching, the support region 17 2 &amp; 1 70 2 c is rounded, as shown in FIG. 17 e. In one embodiment, isotropic

Page 26 1231621 V. Description of the invention (20) ----- The etching method is plasma etching, using SF6, CHF3, CF4 (b0e) or other well-known chemical substances used to etch dielectric materials. In another embodiment, the isotropic etching is a wet etching method, such as wet etching using buffered oxide etching (B0E). Referring to FIG. 17f, a metal layer 1706 is formed on the upper surface of the substrate 1700 and the support regions 170 2a-170 2c. The metal layer 1706 may be a copper layer, a copper alloy (Cu alloy) layer, or a multilayer metal deposition such as tungsten plated with copper_nickel-gold (Cu ~ Ni-Au). In one embodiment, the contact element is formed using a particulate copper beryllium (CuBe) alloy, and then chemically bonded with nickel-gold (Ni-Au) to provide a non-oxidized surface. The metal layer 1706 may be deposited by CVD, electroplating, sputtering, PVD, or other conventional metal thin film deposition methods. A mask layer is formed using a deposition and patterning method to mask the regions 1 708a-1 708c. The mask area I 708a- 1 70 8c defines the area of the metal layer 17 0 6 and is protected by subsequent etching. The structure in Fig. 17f is then etched to eliminate portions of the metal layer that are not covered by the masked area. As a result, the metal portions 7o6a to 7o6c are formed, as shown in Fig. 17g. Each metal portion 17063-1760c includes a base portion formed on the substrate 1700, and a curved elastic portion is formed in each support area (1702a-1702c). In this way, the curved spring portion of each metal portion has the same shape as the supporting area below, and penetrates out of the surface of the substrate 1700. In order to complete the connector's supporting area 17 0 2 a-1 7 0 2 c, it is etched with a wet name, and anisotropic plasma etching or other etching methods are used to remove it (Fig. 17h). If the support layer is formed using an oxide layer, a buffer oxide etchant can be used to eliminate the support area. As a result, the free standing contact elements 1710a-171oc are formed on the substrate 1700.

1231621 V. Description of the invention (21)-The above-mentioned procedure can also be used to manufacture the connector of the present invention. For example, the chemistry and etching conditions of the isotropic coin engraving process can be matched to provide an ideal shape in the support area. The contact element has an ideal labyrinth. With semiconductor processing technology, connectors can be manufactured with contact elements with different characteristics. For example, the first group of contact elements may be formed at a first pitch, and the first contact element may be formed at a second pitch that is larger than the first pitch. Changes in electrical and mechanical characteristics are also possible. Figures 18a and 18b illustrate the first and final processing steps of forming a circuitized connector similar to the connector 1400 according to another embodiment of the present invention. Referring to FIG. 18a ', a substrate 1800 including a pre-defined circuit 1802 is prepared. The predefined / circuitry 1802 includes interconnected metal layers or other electrical devices, such as capacitors and inductors, which are typically formed in a substrate 1800. A top metal portion is formed on the top surface of the substrate 180 to connect the contact elements to be formed. A supporting layer 1806 and a masking layer 1 80 8 are formed on the top surface of the substrate 18A. 17b-17g are similar to the steps described above to form _ (picture called. After formation, the connecting element 1810 electrically connects 1 802. In this way, the connector of the present invention can provide additional functions. For example, circuit 1 After 802 is formed, it can be used to connect some contact elements together. The circuit 1 8 0 2 can also be connected to the circuit device substrate "on the container or inductor. / 上 Φ 成 之 ^ Electrically make the contact element 1 8 1 0 as energy Provides further advantages. Especially formed with the following circuit 180 2. Discontinuities and impedance mismatch. In one part of the integrated circuit manufacturing method, the continuous electrical path is between the contact element 1810 contact element and the related circuit. There is no metal know-how connector using gold connection

Page 28 1231621 ------- V. Description of the invention (22): Line = contact element. However, this structure results in the full f-channel and the interface / surface non-connection between the contact and the underlying metal connection, which leads to undesired electrical characteristics and poor high-frequency operation. Anti-mismatch, a contact element according to another aspect of the invention. That is, the connection of $ 1 6 f ^ a characteristic with different operating characteristics can be selected to achieve the physical phase library. The operation refers to the combination of electrical, mechanical, and usable contact components with mechanical characteristics. ^ ^ Same The electricity and / or the machine's strict electricity are mechanically dependant; need to ... to achieve high-performance interconnection, the mj element should be changed: the mechanical characteristics can be changed by changing the following design parameters and the thickness of the spring part for the contact element can be selected to improve * Touch of #. For example, a spring with a thickness of 30 micrometers can provide a low contact force of about 10 to 1 small, and a spring part with a thickness of 40 micrometers can provide the same: a higher contact force of about 20 grams. The length and shape of the spring part can also be selected to provide the ideal contact force. The reason is that the number of spring parts in the contact element can be selected to achieve the ideal load carrying capacity and the ideal contact resistance. For example, doubling the number of parts can double the contact force and load, but slightly reduce the contact resistance of the two factors. Button B =, special metal composition and treatment can be selected to obtain ideal bombing and track characteristics. For example, a 'steel alloy such as beryllium copper can be used to provide a good compromise between elasticity and electrical conductivity. Or •, metal multilayers can be used for / good electrical and mechanical properties. In one embodiment, the contact element is formed by using titanium (Ti) and copper (Cu), then nickel (Ni), and finally gold

1231621 V. Description of the invention (23) (Aug. 11) Formation of 1 ^ / (: 1 ^: 1 / ^ 11 multilayer components. 1 ^ can provide elasticity and high mechanical toughness, Cu can provide conductivity, and Ni and Au layers provide corrosion Resistance. Finally, different metal deposition techniques such as electroplating or sputtering, and different metal processing techniques such as alloys, annealing, and other metallurgical techniques can also be used to obtain the desired characteristics of the contact element. Fourth, the shape of the spring portion can be designed to provide a certain Some electrical and mechanical characteristics. The height of the spring portion or the amount of protrusion from the base portion can be varied to provide good electrical and mechanical characteristics. Figures 19a-19d are flow diagrams illustrating the touch of a device according to an embodiment of the present invention. The method of component formation is 1 900. Figure 20-23b will discuss within method 1900 =. Method 1900 is also about using masking, etching, forming, and stacking techniques = batching contact components. Method 19 〇 Generate a number of high-tech ;; = in the detachable connector, such as interpolated n, or directly integrated; base t; 2: continuous track, and then as a permanent on-board connector. Plane array ^ 立 之 ί 立And etching steps to form a three-dimensional spring portion It is divided into ten-sided arrays, and then formed into a three-dimensional shape. Spring :: The basic spring material is selected, such as beryllium copper (Be-Cu) 1 902) material t copper two copper // other materials suitable for mechanical properties (step characteristics ．Selection of basic materials—the ideal mechanical and electrical range is the displacement range, and the contact-cluster is the working range of the material. The specification range of the working range is 4 pieces: the contact force (load) and contact resistance: the maximum allowable Contact load II η :: Force: The resistance range of 20 milliohms in the area is more than 10 contact with 70 pieces to achieve a load of less than 20 milliseconds, so the load of the beam member exceeds the maximum 1231621 V. Description of invention (24) ^ = 40 grams, still maintain less than 20 milliohm resistance, so the contact element travels, the distance between 10 grams and 40 grams will be the working range of the contact point. J pieces can be heat treated before subsequent processing (step 1904 ). Whether the sheet is heat-treated by the spleen depends on the type of sheet material selected. The heat treatment f material is moved from a semi-hard state to a hard state or a high tension state to improve the mechanical characteristics of the element 4 to form a contact. A contact element Copy into array after design To prepare bulk for pattern processing step 1906). The number of contacts in the array is a design choice and can vary depending on the connection requirements. The array is repeated into a panel pattern, analogous to a wafer or a die in a semiconductor wafer, resulting in a scaled design directed to batch processing. After the design of the contact elements was completed, (in a CAD environment) the switch was to the Gibbs format, which is a &quot; engineer &quot; that allows the design to shift to a manufacturing facility to produce a master slide or film for subsequent steps. ^ Panel format can be anywhere between one and many contacts, because lithography 'can be used to arrange high density contacts on a panel. This high-density contact is better than the existing method 'because batch processing can be used and the contacts can be individualized compared to stamping and forming individual contacts. Method 1 g 0 q enables a large number of contacts to be immediately patterned, developed, and engraved. A lithographically sensitive anticorrosive film is then applied to both sides of the sheet (Figure 20 and step 1908). Dry films are available for large sizes from 1 to 20 mils, and liquid preservatives can be used for tablets smaller than one mil. Using the original image defined in step 1906, the top and bottom sides of the sheet were exposed to ultraviolet light (UV), and then developed to define the contact characteristics in the photoresist (step 1910, Fig. 21). The area to be etched is not protected by a mask. Using V. Invention Description (25) Shadowing method to limit g-a conductor made of% 1 elements can make the printing of the line have a better definition, similar to those found by half, k. Etching for flakes = etching in a solution for the material selection (step 1 91 2). Etching characteristics 1Γ ^ ^ A special material with a specific etch chemistry can provide the best point for its inflammation rate (speed and extent of liquid etching). The profile of this side wall starts with two. The selected etchant also affects other characteristics, such as the straightness of the characteristics when viewed with the surface commonly used in the industry. In Method 1 900, Ester Chemicals, gasified copper, ferric chloride, hydroxide protection, J &lt; 谩, photoresist 杳 丨 丨 emulsion emulsified sulfur. Qian etched 4 # M f # The protective layer was removed during the stripping process, leaving the h &gt; J feature (step 1914, FIG. 22). According to the original item in step 1906,

In the examples, the scholars and the applicants were approved for approval. In the A format, the best C tools include a plurality of ball bearings arranged in arrays. They are of different sizes and different forces are applied to the contacts. The two ball bearings can be divided into the same _. Therefore, different machines can be used. ^ Contacts on the board. The diameter of the ball bearing is pushed away with # 机 特 面. Use the forming tool to thin the flanges from the thin: Shafts' to create the physical phase in the batch method = flanges can be used in steps 1 9 1 8). The contact element of the heart (the sheet can be heat-treated to correct the physical properties of the forming method and skin application to obtain the best forming conditions. [Inch 4 heat can be solidified and the W at sheet can be surface treated to improve the subsequent stacking. &amp; Sex (step mi such as poor bonding, thin sheet and base ":::; :: 1231621

5. Description of the invention (26) Off-stack. A number method is available. Micro-etching is used for surface treatment methods, including micro-etching and black oxygen surface area (the surface is roughened and / or pits are formed on the surface, which effectively causes large damage without proper control, so it can be damaged several times). Improve the better combination. For example, the micro-etching black oxide method is to produce a &gt; change method on the surface of the flakes in a thin film, which involves limiting the reaction by itself. The thickness is set so that the limit = the upper object. In this reaction, oxygen diffusion can only pass through the rough surface, which is the growth of lice. The oxide has a protrusion-shaped surface treatment step. Where to go? Either political etching or black oxide can be used as a compression & design choice. From the bottom of the component: the compressive material and the dielectric core are located on the flange to prevent it from being processed 4 '= in the stacking process (step 1924). This purpose is moving, and the contact characteristics will change. If such misuse occurs. As a result, the contact elements are not suitable for electrical and mechanical applications. The following table is for stacking laminates. The arrangement can be changed to make the contact _wang ^ // types stacked (step 1 926). Every layer of this. Insert the contact piece with the inner layer. Figure 23a Stacked holes [: One layer is the top pressure and shrink plate material • The layer is the spacer material, the elastic yellow contact element has undulations C. The third layer is the release material, the spring contact element has undulations: Cheng Zhi The top layer of the element is a bonding material, and there are undulating holes under the spring contact

Page 33 1231621

V. Explanation of the invention (27) The undulating hole undulating hole f The sixth layer is the core dielectric, g is above and below the spring contact. The seventh layer is the bonding material, the spring is above the undulating hole h, and the eight layers are forming contact. The bottom layer of the element 1 is the release material. The spring contact element has a layer from the tenth layer as the spacer material. The spring contact element has the layer from the eleventh layer as the bottom compression plate material. The optimal bonding and flow conditions of Feng Zai bonding materials are shown in Figure 2. During operation, the top and bottom are in contact with each other, and on the second electrical material. After cooling ', the stack is removed from the compression plate and the s layer 4-8 panels are removed (step 1930). (The steps are electroplated to electrically connect the top and bottom flanges.) This step makes the electrical connection between the top flange and the bottom flange from a non-electrical surface :: t :; 成,. * The dagger method enables efficient deposition of conductive material on top of the US / 5 to connect the two thin sections of the contact element, and then deposits on the side = $ ^ on the other side. The plating method establishes a current path from one J center of one of the plates to the other side. The case is covered with a photoresist film on both sides of the board (step 1 934). -Draw a shirt to define individual contact elements (step 1936). The final version of the decision, hard or soft gold (step 1 938). In hard gold fixture applications, the number of inserts is very large, such as test sockets. Hard gold itself ', to make gold more durable. Soft gold is pure gold and has no impurities. It is typically used _____ ί Guoyuan 1 liliilli page 34 1231621 V. Description of the invention (28) Inserted into PCB or network space ′ There are very few inserts. For example, the packet-to-board socket used typically has 20 inserts, using hard gold technology 丨 〇 ~, 1 0 0 0 inserts. If the completed contact element is a hard gold type, a partial etch is performed to isolate the contact element (step 1 940). The photoresist film is removed by the primary stripping method (step 1 9 4 2). A new layer of photoresist is added on both sides of the panel (step '1 944). The previously etched area is exposed and developed (step 1 946). The panel is then supplied as an electrolytic Cu / Ni / Au electric shovel by the hard gold method (step 1948). After the photoresist is removed, a scribe line is partially engraved before the exposure (step 1950). The entire panel is etched with electrolyte Ni / Au as a hard mask to completely separate the contact array (step 1 95 2). Final interposer outline = The panel is routed, separating the panels into individual connector arrays (step 1954). The method is then terminated (step 1956). If soft gold is used as the final type (step 1938), then the contact elements are completely separated using etch (step 1960). The photoresist is removed (step 192). The non-electric Ni / Au, also known as soft gold, contacts the π piece on the panel with / moving (step 1 964). Finally, the outline of the inserter is routed from the panel 70 to separate the panel into an array of individual contactors (steps 9 5, 1, 1956). Naaru Termination (Step Soft Gold finish method separates the contact elements before plating. Only plating on metal surfaces, and providing contact elements with a density of Nl / Au: stop the potential life of the contact element system, because 2 is ::: 】. Separate into a way to isolate and seal the copper before electroplating 2 = belong to the contact 'results in a clear image and clear contacts, the short-circuit tendency is small.' Page 35 1231621_ V. Description of the invention (29) Expertise in this technique Persons should understand that the connector of the present invention can be used as an interposer, a PCB connector, or forming a PCB. The proportionality of the present invention is not limited because of the lithography technology used and the three-dimensional formation of the connector components The tool mold makes it easy to customize. The special embodiment of the present invention has been shown and described above. Those skilled in the art can make modifications without departing from the scope of the present invention. The above description is for illustrative purposes and does not constitute a limitation of the present invention. .

Page 36 1231621 Brief Description of Drawings Figure 1 shows a conventional contact element touching a metal pad on a substrate. Figure 2a shows a contact ball with a contact element. Figures 2b and 2c are the results of connecting a damaged helium ball to the metal pad of the substrate. Figures 3a and 3b are enlarged views of the BBGA system of the present invention and its connection to a circuit board (PCB). ° Figures 3c and 3d are cross-sectional views of the contact system plan used to electrically connect Figure 3 &amp; Second connection Fig. 3e is a welding view according to the embodiment shown in Figs. 3a and 3b. , The bracket structure through

FIG. 3f is a plan view of the contact arm array of FIG. 3a. Figure 3g is a plan view of several different contact arms. Figure 4a is a cross-sectional view of the surface PCB of a beam land grid array (BLGA) system. Fig. 4b is a separable BLGA system and its connection to a peg stand. Fig. 5 is an enlarged cross-sectional view of a contact arm of a BLGA contact array. FIG. 6 is an enlarged perspective view of different contact arms. Illustration. FIG. 7 is a perspective view of a connector according to an embodiment of the present invention. Fig. 8 is a connector including a contact element formed using the present invention. ^ Example of polymetallic layer

Figs. 9a and 9b are connectors of another embodiment of the present invention. Figs. 10a and 10b are connectors of another embodiment of the present invention. 11 is a cross-sectional view of a connector according to another embodiment of the present invention. FIG. 12 is a cross-sectional view of a connector according to another embodiment of the present invention. Figures 13a-13c are cross-sections of an adaptor used in one embodiment for heat exchange operations

Page 37 1231621 Brief description of the drawings. Figures 14a-14b show the lightning speed of the invention. Figure 15a is a cross-sectional view of another embodiment of the invention. One of the devices [—The conventional example of the same car consists of a contact element including a contact element. Figure 15b is the coaxial connector of Figure 15a.-The top of the connector is shown in Figure 16. Figure 16 shows Connect the crying master, Figure 0 Figures 17a-17h show the present invention for a while # 包包 至 —PCfe consistent embodiment of Figure 9a Xi, You ,. Saka. Sectional view of the processing steps. Figures 18a and 18b show the connection diagram of another embodiment of the present invention-luxury seven ^ embodiment-&lt; sectional view of the step of forming according to the device 19a-19d is a flowchart 'shows another aspect of the present invention ♦ Manufacturing method steps. Fig. 20 of the known connector is a cross-sectional view of the elastic film added in the method shown in Figs. 19a-19d. The light on the material sheet is added to the photoresistor according to the method of FIGS. 19a-19d according to FIG. Section of UV light on the cross-section of the contact element sheet. Figure 22 is a drawing of the method shown in Figures 19a-19d. Fig. 23a is a cross-sectional view of each of the stacks used in one step in the method of Figs. 19a-19d. a Figure 23b is a side view of the composite stack of Figure 23a. Section Symbol description: 100, 50 0, 70 0, 8 0 0, 9 0 &gt; 1 0 0 0, 1 100, 1 3 0 0-1 400,

Page 38 1231621 Schematic description of 1420, 1 50 0 connector 102, 502, 902 ^ 1102, 1200, 1304, 1306, 1308, 1310, 1404, 1406, 1424, 1504,] 50 6, 1510, '1514 ^ 1710a -1710c, 1810 contact elements 104, 210, 912 metal pads 106, 212, 914, 1004, 1024, 1104, 1202, 1700, 1800 substrate 108 film 202 contact substrate 2 0 0, 302, 320, 408 solder ball 2 0 4 pothole 300 first structure 304 module 306 carrier 308, 1 428, 1512 pathway 312 layer 310 elastic contact arm 316 ^ PCB circuit board 318 electrical contact element 314, 1322, 1324, 1332, 1334, 1522, 1524, 1532 1534 pad 400 BLGA electrical contact element 40 0a separable BLGA contact element 402 spring carrier 404 arm array 410 contact pad 412 BLGA contact brush 504 opposite spring portion 702, 802 first group of contact element 704, 812 dielectric substrate 706, 804 A second group of contact elements 708 A through hole (void) 710 A conductive ring (ring pattern) 806 A first metal layer 808 A second metal layer 810 Section 910 of the semiconductor layer 908 of the base portion 906 of the spring

Page 39

1231621 1 Ο Ο 6, 11 Ο 6 Base part 1 02 0 Semiconductor device 1 204 Base part First curve spring part Second curve spring part Schematic description 1 0 0 2 Array contact element 1 0 0 8, 1 0 1 0 Curve spring part 1 022 Array solder ball 1108 &gt; 1206 1110 、 1208 1 32 0 LGA package 1402, 1422 Dielectric substrate 1 426 Solder ball terminal 1 502 Dielectric substrate 1516 Metal track 1530 PC board 1702a-1702c Support area 1704a, 1704c area 1708a-1708c mask area 1 80 2 pre-defined circuit 1 808 mask layer BGA ball grid array BLGA beam land grid array 1 3 3 0, PC board printed circuit board 1 4 1 0, 1 4 1 2 Component 1 430, 1 432 Electronic component 1508 Pore 1520 LGA package 1702, 1806 Support layer 1 704 Masking layer 1 70 6 Metal layer 1706a-1706c Metal part 1 8 0 4 Top metal part LGA connection array BBGA Beam Grid Array PGA Pin grid array

Page 40

Claims (1)

1231621 VI. Scope of patent application 1 · A conductance, which is elastically divided from the thin device to conduct a plurality of conductors from the dielectric spring electrical substrate to make it 2. as many as 3 · as applied to the undulation 4 · as applied to the conductive thin 5 · as Shen conductor package 6 · If the electrical connector contacts the arrayed spring part, the predetermined thin-sheet junction electrical substrate that is bent outward should extend to a part of the electrical connection; The patent fan fluctuates and the patent fan σ corresponds to the patent fan film. The patent fan contains the hole in the patent fan. The electric contact one-pass missile and one elastic part are placed in the second pass. Formed on a sheet, each spring is partially curved, and the electrical contact array is arranged in a pattern with the ^ to be connected; combined on a first surface of a dielectric substrate, each spring portion extends outside; connected to a conductor, at least one conductive The system embeds or passes at least some of the connectors in the dielectric substrate surrounding Item 1 by a chemical etchant, wherein the dielectric substrate includes the connectors in Section 2 surrounding at least some of the predetermined patterns . The connector of item 1, wherein the spring portion is formed by a shadow mask and chemical etching. The connector of item 1, wherein the dielectric substrate has a through-plated via. The connector surrounding item 1 further includes: an array including a second plurality of contact elements, the flexible spring portion of which is in the second conduction, the elastic sheet is bent outward from the second sheet, and the second electrical contact Array predetermined pattern, at least a part of which corresponds to the first predetermined pattern 1231621 The scope of the patent application for the guide plate is within 7_. 8. Imprint 9. Non-10 standard 11 spring 12 13 13 The second conductive sheet, which is the bullet of several contact elements = a to one of the second surface of the dielectric substrate, The second and second plurality of contact elements I extend outwardly from the dielectric substrate; the body, at least one of the conductors, and the spring portion thereof are electrically connected to at least some; the conductive system is embedded in the dielectric substrate or through a dielectric substrate At least one 4b SA, two younger brothers, and several later a. This is separate. There are 70 pieces on the substrate with a chemical etchant where the connector is formed where the dielectric substrate is in. The spring part includes, for example, the scope of the patent application, the 6th connector is located in the electrical equipment, and the connector electrical settings and sockets are The scope of patent application is the first. Brush the circuit board. The connector of the first item, such as the first linear flat pattern in the scope of the patent application, in order to improve the connection, the spring; the same as the application of the scope of the patent; The Ping κ part is different from other conductive parts when it touches 7L parts, and it has different slugs. On the chip, he / he touches other parts of the slugs | J opening shape, elastic impingement rate, and at least one of the spring selection. Pinggong hand contact force, or cause X works • If the second conductive material on the part of the scope of the patent application-the coating y contains at least the elasticity • As the Ganz of the scope of the patent application-spring force It is between 10-40 grams. Connector, in which a female and a contact element • A method for producing an electrical connector, comprising: forming an array of electrical contact elements in a sheet, the electrical contact Page 42 A conductive, elastic planting · 1231621 VI. Patent application scope The contact element array is set corresponding to the predetermined pattern of the electrical device to be connected, and each contact element includes at least one spring portion; Bend outwardly; bond the conductive sheet to one of the first surfaces of the dielectric substrate, and the elastic portion extends outward from the dielectric substrate; electrically connect the elastic portion to a conductor, and at least one of the conductors is embedded in the dielectric substrate or extends through Wherein, it is preset to cover the conductive sheet according to one of the contact elements; The conductive foil is chemically etched to separate at least some of the contact elements from each other. 14. The method according to item 13 of the scope of patent application, further comprising the steps of: biasing the spring portions, each of which is a portion of a sphere formed in three dimensions. 15. The method according to item 13 of the scope of patent application, further comprising the steps of: providing a deflection die formed from at least one array ball bearing of a selected size from an array of openings corresponding to an array position of a spring portion. 1 6. The method according to item 13 of the scope of patent application, further comprising the following steps: Pre-treating the bonding surface of the conductive sheet by micro-etching to improve the bonding 0 1 7. The method according to item 13 of the scope of patent application The method further includes the following steps: Pretreatment of the bonding surface of the conductive sheet by oxidation treatment to improve bonding. 1 8. The method according to item 13 of the patent application scope, further comprising the following steps: electroplating at least the conductive sheet to electrically connect the contact element to the dielectric substrate Page 43 1231621 VI. Patented conductors. 19. The method according to item 13 of the patent application scope, further comprising the steps of: plating a second conductive material on at least the spring portion. 20. The method according to item 13 of the patent application scope, further comprising the following steps: forming a second array of contact elements in a second conductive elastic sheet in a second predetermined pattern, at least a part of which corresponds to the first predetermined pattern, each The contact element includes at least one spring portion; the spring portion is biased to bend outward from the second sheet; Combining the second conductive sheet to a second surface of the dielectric substrate, the spring portions of the second plurality of contact elements extend outward from the dielectric substrate; electrically connecting the spring portions of the second plurality of contact elements to at least some conductors, which At least one conductive system is embedded in the dielectric substrate or extends through the substrate; the second conductive sheet is chemically etched to separate at least some of the second plurality of contact elements from each other. 2 1. A method of manufacturing an array of electrical contacts in batches, including the following steps: generating a photo-micro-etched image of one of the contact arrays; Applying a lithographic sensitive film to the first conductive sheet and the second conductive sheet; using a micro-engraved image of the contact array on the first sheet and the second sheet to generate an array contact; etching the first sheet and the second sheet Forming a contact array on the first sheet and the second sheet in a three-dimensional manner using a forming tool; stacking the first sheet and the second sheet on opposite sides of the substrate to form a panel; Page 12 1231621 Page 45