JP2007281253A - Circuit board, multilayer circuit board using the same, module and connector structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit board where surface mounting of a component is realized without using solder, and to provide a module using the circuit board, a multilayer circuit board and a connector structure. <P>SOLUTION: The circuit board is provided with an insulating substrate 1; at least one through-hole 2 formed in a thickness direction of a desired position in the insulating substrate 1; and a conductor circuit 3 formed by working metal foil which is bonded to one face of the insulating substrate 1 and has conductivity and spring elasticity, in a state where an opening of the through-hole 2 is closed. A linear conductor 4 is inserted into the through-hole 2 and a conductor structure is formed with the conductor circuit 3. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a circuit board, a multilayer circuit board using the circuit board, a module incorporating a mounting component, an interposer, and a connector structure. More specifically, the present invention is a novel device capable of surface-mounting various mounting components without using solder. The present invention relates to a circuit board having a structure and a multilayer circuit board that can repair a circuit board of each layer by using the circuit board.

  When semiconductor components are surface-mounted on a circuit board, a reflow process using solder is generally performed. In this reflow process, with the connection terminals of the mounted components arranged at predetermined locations on the circuit board via, for example, solder balls, the whole is introduced into a reflow furnace at a predetermined temperature to melt the solder, and then the entire reflow furnace The mounted component is fixed to the circuit board by cooling and solidifying the molten solder, and the conductive relationship between the two is taken.

In that case, since the melting point of the Pb—Sn eutectic solder is about 183 ° C., the circuit board and the mounted component are exposed to a high temperature of 220 to 230 ° C. during the reflow process. Therefore, for example, the resin constituting the insulating base material of the circuit board needs to be a material that can withstand such a high temperature.
For example, in the case of an optical / electric hybrid board to be incorporated into a large-capacity optical wiring module that has recently attracted attention, an optical waveguide is made of an acrylic resin having a heat resistance of about 60 to 80 ° C., and various semiconductor elements However, when manufacturing this optical / electric hybrid board, the semiconductor element cannot be mounted by solder reflow processing. This is because the optical wiring composed of the acrylic resin is damaged.

  In addition, Pb—Sn eutectic solder has been rejected because Pb has an adverse effect on the human body and the environment, and instead, lead-free solder is being developed mainly using Sn. However, since lead-free solder generally has a higher melting point than Pb—Sn eutectic solder, it is meaningless for the problems described above, and because Sn is the main component, There is a problem that whiskers are easy to grow, and therefore a short-circuit accident easily occurs.

In addition, regarding component mounting on the circuit board, for example, a female connector part is formed on the circuit board side, a male connector part is formed on the mounting part side, and both connector parts are mechanically connected to establish a conductive relationship. The parts are also mounted on the board.
In the case of component mounting using this connector structure, since there is a detachable relationship between the circuit board and the mounting component without using solder, for example, even when a failure occurs in the mounting component, the mounting component is removed. Thus, it is possible to replace with a new non-defective part, that is, to perform repair processing.

However, in the case of the conventional connector structure, since each connector part is formed of a mold, the overall shape becomes large, and it is possible to meet the recent strong demand for miniaturization and thinning of the assembled module. There is a problem that you can not.
As a method of mounting a component on a circuit board without using solder, for example, a printed wiring board using paper as an insulating material is inserted into the external lead of the mounted component from the direction of the copper foil pattern, and the spring elasticity of the copper foil pattern A mounting method for electrically connecting the return portion and the external lead has been proposed (see Patent Document 1).

On the other hand, multilayer circuit boards are often used as circuit boards to be built into these devices in order to meet the demands for reducing the size, thickness, and functionality of various electrical and electronic devices, such as mobile phones and personal computers. Has been.
This multilayer circuit board has a multilayer structure in which a plurality of unit circuit boards each having a predetermined pattern of conductor circuits formed on each surface are laminated and integrated. Manufactured by build-up method.

In the case of this multilayer circuit board, generally, through-holes penetrating in the thickness direction are formed at predetermined positions on the board, and electroless plating is applied to the wall surfaces of the formed through-holes, thereby providing an electrical interlayer connection. I'm taking it.
Also, the copper foil and thermoplastic film are laminated, the copper foil is made into a predetermined circuit pattern, a laser via is formed in the thermoplastic film on the back of the circuit pattern at a predetermined location, and a conductive paste is embedded in this laser via to unit A multilayer circuit board having a structure in which a plurality of similar unit circuit boards are integrated by laminating and pressing after the circuit board is manufactured is also known. In the case of this board, a conductive paste filled in a laser via is used as an interlayer. Connection is established (see Non-Patent Document 1).

However, in the case of these multilayer circuit boards, since the unit circuit boards are bonded and integrated with each other, even if a failure occurs in the circuit board of a certain layer, the entire circuit board is disassembled and the failure It is not possible to replace only a circuit board with a good product. That is, the repair process is not possible.
Japanese Patent Laid-Open No. 11-251711 Electrical materials, vol.42, No.10, P.9 (2004)

  The present invention solves the above-mentioned problems in conventional circuit boards and multilayer circuit boards, and enables circuit mounting of mounting components without using solder, and each circuit board by using the circuit board. An object of the present invention is to provide a multi-layer circuit board that can be repaired, a module on which mounting components are detachably mounted, an interposer, and a connector structure that enables fine pitches between terminals.

In order to achieve the above object, in the present invention,
An insulating base material, at least one through hole formed in a thickness direction at a desired position of the insulating base material, and at least an opening of the through hole are bonded to one surface of the insulating base material. A circuit board (hereinafter referred to as circuit board A) is provided, which includes a conductive circuit formed by processing a metal foil having electrical conductivity and spring elasticity.

In the present invention,
The insulating base material, at least one through hole formed in the thickness direction of the desired position of the insulating base material, and bonded to both surfaces of the insulating base material with both openings of the through hole closed. A conductive circuit formed by processing a metal foil having electrical conductivity and spring elasticity, and a metal foil part that closes both openings of the through hole and inserted into the through hole, and the metal foil part A circuit board (hereinafter referred to as circuit board B) is provided.

In that case, it is preferable that a slit hole is formed in the metal foil portion that closes the opening of the through-hole, and the metal foil has a thickness of 50 μm or less and a thickness of 0.1 mm or more. It is preferable to use a metal foil having a value of 350 N / mm ² or more when a spring limit value defined by JIS H3130 is measured in the state of the foil.
In the present invention,
The mounting part having a linear or spherical connection terminal protruding from the bottom is press-fitted into a metal foil part that closes the opening of the through hole in the circuit board A or the circuit board B. A module is provided in which a conductive structure is formed between the circuit board and the conductor circuit of the circuit board.

Furthermore, in the present invention,
A desired through hole in each circuit board is coaxially aligned and has a multilayer structure in which a plurality of circuit boards A are stacked, and the common through hole in the multilayer structure has the above-mentioned in each circuit board. A linear conductor is inserted in a state of detachably penetrating the metal foil portion that closes the through hole, and an electrical interlayer connection structure between the circuit boards is formed via the linear conductor. A featured multilayer circuit board is provided.

In the present invention,
Metal foil for opening and closing the through hole in the circuit board A or the circuit board B, or the uppermost circuit board of the multilayer circuit board, wherein the male connection terminal of the tape cable having the male connection terminal projecting on one side A connector structure is provided that is press-fitted into the part.

When mounting a component on the circuit board of the present invention, a spherical connection terminal such as a linear or BGA ball is arranged at the bottom of the mounting component, and the connection terminal is provided with a through hole formed in the circuit board. What is necessary is just to penetrate the part of the metal foil to close. Since the metal foil is made of a conductive material having a spring limit value of 350 N / mm ² or more, the connection terminal of the mounting component is mechanically secured by the spring elasticity of the metal foil. The conduction structure is realized.

Therefore, the circuit board of the present invention can surface-mount a mounting component without using solder, specifically, without performing a reflow process. Therefore, even in the case of manufacturing an optical / electric hybrid board mainly composed of an acrylic resin having a low melting point, it is possible to cope with the problem by forming a connection part with a mounting part with a metal foil part like the circuit board of the present invention. be able to.
In addition, if this circuit board is overlapped with each through hole coaxially aligned, and a linear conductor is inserted into the common through hole, interlayer connection between the circuit boards is realized. A multilayer circuit board can be manufactured.

In the case of a conventional multilayer circuit board, through-holes are drilled and the wall surfaces are plated to make interlayer connections. However, in the multilayer circuit board of the present invention, the insertion of a linear conductor into a through-hole is called Interlayer connection can be established only by work.
In addition, in the case of this multilayer circuit board, if the linear conductor is removed from the through hole, it can be disassembled into each circuit board. For example, even if a failure occurs in a certain layer of the circuit board in the multilayer circuit board, The defective circuit board can be replaced with a non-defective circuit board.

First, an example of the circuit board A is shown in FIG.
In FIG. 1, a circuit board A has an insulating base material 1 and a through hole formed by drilling the insulating base material vertically at a predetermined position of the insulating base material 1 from one surface 1a to the other surface 1b. 2 and a predetermined conductor circuit 3 formed by processing a metal foil, which will be described later, bonded to one surface (one surface) 1a of the insulating base 1 in a state where the upper opening of the through hole 2 is closed. It has a prepared structure.

In this circuit board A, a linear conductor, which will be described later, is inserted into the through hole 2, and the linear conductor penetrates a metal foil portion (hereinafter referred to as a metal foil portion 3a) that closes the upper opening of the through hole 2. Provided for actual use in the state. The state is shown in FIGS.
2 and 3, the abdominal portion 4a of the linear conductor 4 inserted through the metal foil portion 3a and inserted into the through hole 2 is mechanically gripped by spring elasticity described later of the metal foil portion 3a. They are in pressure contact with each other. Since the metal foil portion 3 a is a connection end of the conductor circuit 3, a conduction structure is formed between the linear conductor 4 and the conductor circuit 3. Therefore, the input / output signal is transmitted through the path of the linear conductor 4 -metal foil portion 3 a -conductor circuit 3.

For this reason, the metal foil portion 3a of the circuit board A functions as an electrical connection portion of the circuit board A.
In the circuit board A of FIG. 1, the metal foil portion 3a may be formed in a state in which the upper opening of the through hole 2 is completely sealed as shown in FIG. As shown, for example, a cross-shaped slit hole 3c may be formed at the center of the metal foil portion 3a.

  When the circuit board A in which the metal foil portion 3a is in the state shown in FIG. 4 is actually used, the metal foil portion 3a that seals the through hole 2 is inserted into the through hole 2 from below as shown in FIG. It is pierced by the front end portion 4b of the linear conductor 4 inserted upward. As a result, a plurality of rupture pieces 3b having a complicated shape curved (upward in the drawing) are generated in the metal foil portion 3a, and each of the rupture pieces 3b exhibits spring elasticity to form the linear conductor 4. By pressing the abdomen 4a and gripping the linear conductor 4, a conduction structure between them is formed.

  When the circuit board A in which the slit hole 3c as shown in FIG. 6 is formed in the metal foil portion 3a is actually used, as shown in FIG. 8, the line inserted into the through hole 2 from below to above. The conductor 4 expands the diameter of the slit hole 3c, curves the four tongue pieces 3d of the slit hole 3c upward, and penetrates the metal foil portion 3a. As a result, the tongue piece 3d exhibits spring elasticity and presses against the abdomen 4a of the linear conductor 4, and by holding the linear conductor 4, a conductive structure between them is formed.

Comparing these two conductive structures, in the latter case, the linear conductor 4 comes into contact with the metal foil portion 3a with the slit hole 3c as a guide, so that the pressure contact state between them is stabilized, and the reliability of the formed conductive structure is confirmed. This is preferable because the property is increased.
The plan view shape of the slit hole 3c exhibiting such an effect is appropriately designed in relation to the diameter of the through hole and the cross-sectional shape of the inserted linear conductor. The slit hole 3c may have a shape as shown in FIGS. 9 and 10, for example, in addition to the shape in plan view shown in FIG.

In addition, as a linear conductor to be used, it is practical that the diameter is about 20-200 micrometers, and the cross-sectional shape is not specifically limited, However, The shape with small conflict resistance with the metal foil part 3a It is preferable that
Examples of the material of the linear conductor 4 include Cu, phosphor bronze, Au, Ni, Ni—P, Cu—P, Cu—Zn, Cu—Sn, Cu—Ni—Zn, Cu—Ni—Si—Mg, Cu-Cr-Sn-Zn, Cu-Ni-Sn-P, Cu-Cr-Zr-Zn, Cu-Be, and the like can be given.

This circuit board A can be manufactured as follows.
First, as shown in FIG. 11, prepared insulating substrate 1, to produce intermediate A ₁ by bonding a metal foil 3A using an adhesive on one surface thereof 1a. Or to produce intermediate A ₁ by semi-curing or an insulating substrate 1 and metal foils 3A precursors to hot pressing.
The insulating base material 1 may be anything as long as it is conventionally used for a circuit board, for example, a rigid such as FR-4, FR-5 made of glass fiber-epoxy resin, or CEM-3. A flexible substrate such as a polyimide film, a liquid crystal polymer film, a polyethylene terephthalate film, or a polyethylene naphthalate film can be used.

As the metal foil 3A, this is converted into the conductor circuit 3, and at the same time, the linear conductor must be secured by the spring elasticity of the metal foil portion that closes the opening of the through hole. From the point of view, it is preferable that the conductor circuit can be easily processed by etching or the like, and is made of a metal material having good conductivity and a high spring limit value described later.
In terms of spring elasticity, it is preferable that the material has a spring limit value of 350 N / mm ² or more when measured by the method defined in JIS H3130 in the state of 0.1 mm thick foil.

If a material with a spring limit value lower than 350 N / mm ² is used, there is a problem that even if it is a material exhibiting high conductivity, the amount of permanent deformation is large and there is no restoring force as a spring. As a result, the reliability of the conductive structure between the linear conductor and the conductor circuit is lowered.
Considering this point and the problem of conductivity, a copper alloy foil is suitable as the metal foil. Specifically, C2600 (brass), C7701 (Western), C7025 (Corson alloy), C5212 ( Phosphor bronze), C1700 (beryllium copper), C18040, C64770, C19400, C64710, C42500, C64725, C64740, C44250, C19020, C19025, and the like.

  In addition, although the above-mentioned copper alloy foil is suitable in terms of spring elasticity, IACS is about 10 to 80%, which is inferior to pure copper in terms of conductivity. However, by forming a layer of a highly conductive metal material suitable for Cu, Au, Ag, for example, by plating on one side or both sides of this copper alloy foil, or only the required part, it is possible to obtain a good Conductivity can also be secured.

A rolled copper foil or an electrolytic copper foil that has been conventionally used as a conductor circuit material of a circuit board cannot be used alone as the metal foil of the present invention. This is because any of these copper foils has a low spring limit value of 300 N / mm ² or less.
However, even with these rolled copper foils and electrolytic copper foils, Cu—Co, Cu—Fe, Cu—Ni, Cu—Sn, Cu—Zn, Copper alloys such as Cu-Fe-Ni, Cu-Ni-P, Cu-Sn-Co, Cu-Sn-Ni, Cu-Sn-Zn, alloys such as Ni-P, metals such as Ni, Fe, and Co It can be used as the metal foil of the present invention by plating to increase the substantial spring limit value of the portion.

The thickness of the metal foil 3A to be used is set to 50 μm or less. This is because if the thickness is greater than 50 μm, it is difficult to obtain a fine conductor circuit with high reliability when a conductive circuit is formed by etching the metal foil. The preferred thickness is set to about 3 to 50 μm, more preferably about 9 to 18 μm.
When bonding such a metal foil 3A to the insulating substrate 1, in order to increase the adhesion between them, the metal foil such as copper is electrodeposited on the bonding surface side of the metal foil and then bonded. It is preferable to perform a surface treatment such as a treatment for roughening the surface, a treatment for applying an adhesion promoter such as a silane coupling agent, or a combination of these treatments.

Next, as shown in FIG. 12, for example, a carbon dioxide laser is irradiated from the back surface of the insulating base material 1 of the intermediate A ₁ to remove only the insulating base material, and the hole (penetration) where the back surface of the metal foil 3A is exposed. holes) 2 and drilled to produce intermediate a ₂ in. The diameter of the through hole 2 is set to about 50 μm to 1 mm, and the place where the through hole 2 is formed is set to a place where the above-described conductive structure is to be formed in the circuit board to be manufactured. Incidentally, in the production of Intermediate A _2, first drilled through-holes 2 in the insulating substrate 1, may then be bonded to the metal foil 3A in the insulating substrate.

Next, the metal foil 3A of the intermediate body A ₂ in FIG. 12 is applied with photolithography and etching techniques to form a metal foil portion 3a at the positions of the conductor circuit 3 and the through hole 2 having a desired pattern. The circuit board A shown in FIG.
In this process, at the same time, the slit hole 3c described above may be formed in the metal foil portion 3a as shown in FIG.

Next, the circuit board B will be described.
In the circuit board B, as shown in FIG. 14, conductor circuits 3.3 are formed on both surfaces of the insulating base 1, and both the upper opening and the lower opening of the through hole 2 are closed to close the metal foil portion 3a. , 3a are formed, and by inserting the linear conductor 4 into the through hole 2, the linear conductor 4 forms a conductive structure with both the lower metal foil portion 3a and the upper metal foil portion 3a. Yes. As a result, in the circuit board B, an interlayer connection is established between the conductor circuit 3 on the upper surface and the conductor circuit 3 on the lower surface.

  In the case of manufacturing the circuit board B, after manufacturing the circuit board A shown in FIG. 1, a metal foil is bonded to the lower surface of the insulating base 1 of the circuit board A, and then the circuit board A is used. Similarly, the conductor circuit 3 and the metal foil portion 3a may be formed on the metal foil. Or after forming the through-hole 2 in the insulating base material 1, metal foil 3A may be adhere | attached on both surfaces, and the conductor circuit 3 and the metal foil part 3a may be formed in each of each metal foil.

Next, the module of the present invention will be described.
This module is assembled by mounting a predetermined mounting component on the circuit board A or the circuit board B.
As shown in FIG. 15, for example, the mounting component 5 is provided with a predetermined arrangement pattern in a state where linear connection terminals 5 a protrude downward from the bottom of an LSI interposer. In addition, as this connection terminal, the spherical thing which made the ball | bowl of BGA small may be sufficient.

On the other hand, on the mounting surface of the circuit board A (or B), as already shown in FIG. 15, the already described metal foil portion 3a is formed in an arrangement corresponding to the arrangement pattern of the connection terminals 5a. .
Then, as indicated by phantom lines, the connection terminals 5a of the mounting component 5 are placed on the respective metal foil portions 3a, and then the whole is pressed downward to bring the connection terminals 5a below the metal foil portions 3a. Press fit into the located through hole.

Each connection terminal 5a is fixed by the spring elasticity of the metal foil portion 3a. Here, a conduction structure between the mounting component and the circuit board A (or B) is realized, and one module is assembled.
In the case of this module, since the connection terminal 5a and the conductor circuit 3 of the circuit board A are not solder-connected, the mounting component 5 is detachable from the circuit board A (or B). Therefore, even if the mounting component 5 has a failure, it can be removed from the circuit board A (or B) and a new good product can be mounted.

Next, the multilayer circuit board of the present invention will be described.
In manufacturing a multilayer circuit board, the circuit board A is used as a unit circuit board.
First, as shown in FIG. 16, for example, four circuit boards A are overlapped to assemble a laminated body having a four-layer structure. In this circuit board A, slit holes 3c are formed in the metal foil portion 3a. At this time, the through hole 2 of each circuit board A is coaxially aligned at a location where the interlayer connection of each circuit board is to be taken.

Next, as shown in FIG. 17, the linear conductor 4 is inserted into the through hole 2 which is a common hole in this multilayer structure. Since a conductive structure is formed between the conductor circuit and the linear conductor of each circuit board A, a multilayer circuit board having a four-layer structure in which an interlayer connection is realized between the circuit boards A is obtained.
In this structure, the pressure contact state between the metal foil portion 3a and the linear conductor 4 can be changed by appropriately setting the shape and size of the slit hole in the circuit board A. That is, it is possible to make it difficult for the linear conductor 4 to be removed from the through-hole 2 or to easily remove it.

Further, for example, in the case of a design specification that does not form a conductive structure between the second layer (from above) circuit board A and the linear conductor 4, as shown in FIG. What is necessary is just to use the circuit board in which the metal foil part which closes the hole 2 is not formed.
In the case of this multilayer circuit board, it is not a structure in which interlayer connection is made by through-hole plating as in the prior art. Therefore, conventional manufacturing processes such as wet plating and the accompanying pretreatment and cleaning are not required during manufacturing. This makes it possible to significantly reduce the cost for manufacturing the multilayer circuit board.

Moreover, since this multilayer circuit board can be disassembled into individual circuit boards by removing the linear conductors, a defective circuit board can be replaced with a non-defective product.
Next, the connector structure of the present invention will be described.
As shown in FIG. 19, for example, a flexible cable 6 manufactured using a copper-clad polyimide film is prepared. A male connector portion in which linear connection terminals 6 a are arranged in a predetermined pattern is formed at the distal end portion of the cable 6. Then, the metal foil portions 3a already described are arranged in predetermined positions on the circuit board A (or B) in an arrangement pattern corresponding to the arrangement pattern of the connection terminals 6a to form a female connector portion. Yes.

  Then, the male connector portion is pressed against the female connector portion, and the connection terminal 6a is inserted into the through hole through the metal foil portion 3a, whereby the connection terminal 6a and the conductor circuit 3 on the circuit board A are electrically connected. A structure is formed, where a connector structure is realized.

  According to the present invention, by using the circuit board A (or B), the mounting component can be surface-mounted without using solder. Also, even if wet plating is not applied, the metal foil portions of a plurality of circuit boards A are mechanically connected by linear conductors, so that the interlayer connection between the layers can be taken and the circuit boards can be disassembled into individual circuit boards. Multilayer circuit boards that can be assembled can be assembled at low cost. In addition, the connector structure can be assembled by causing the circuit board A (or B) to function as a female connector portion.

It is sectional drawing which shows one example of the circuit board A of this invention. It is sectional drawing which shows the state which has arrange | positioned the linear conductor to the circuit board A and used for actual use. FIG. 3 is a partially cutaway perspective view of a circuit board A in the state of FIG. 2. It is sectional drawing which shows the state by which the upper opening part of the through-hole was completely sealed and the metal foil part was formed. It is sectional drawing which shows the state which formed the slit hole in the metal foil part. It is a top view which shows an example of a slit hole. It is a perspective view which shows the state which the linear conductor penetrated the metal foil part of FIG. It is a perspective view which shows the state which the linear conductor penetrated the metal foil part which has a slit hole. It is a top view which shows another example of a slit hole. It is a top view which shows another slit hole. Is a sectional view showing an intermediate A _1. Is a sectional view showing an intermediate A _2. It is sectional drawing which shows the circuit board A which formed the slit hole in the metal foil part. It is sectional drawing which shows the circuit board B of this invention. It is a perspective view for demonstrating the module of this invention. It is sectional drawing which shows the state which accumulated the circuit board A. FIG. It is sectional drawing which shows the multilayer circuit board of this invention assembled. It is sectional drawing which shows another multilayer circuit board. It is a perspective view for demonstrating the connector structure of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Insulating base material 1a One surface 1b of insulating base material 1b The other surface of insulating base material 2 Through-hole 3 Conductor circuit 3A Metal foil 3a Metal foil part 3b Rupture piece 3c Slit hole 3d Tongue piece part 4 Linear conductor 4a Abdominal part 4b of linear conductor 4 Tip part of linear conductor 4 5 Mounting parts 5a Connection terminal 6 Tape cable 6a Connection terminal

Claims (11)

An insulating substrate;
At least one through-hole formed in the thickness direction of the desired position of the insulating substrate;
A conductive circuit formed by processing a metal foil having electrical conductivity and spring elasticity bonded to one surface of the insulating base material with at least an opening of the through hole being closed is provided. Circuit board. An insulating substrate;
At least one through-hole formed in the thickness direction of the desired position of the insulating substrate;
A conductor circuit formed by processing a metal foil having electrical conductivity and spring elasticity bonded to both surfaces of the insulating substrate in a state where both openings of the through hole are closed;
A circuit board comprising a linear conductor that is inserted into the through-hole through a metal foil portion that closes both openings of the through-hole and is in pressure contact with the metal foil portion.   The circuit board according to claim 1, wherein a slit hole is formed in a metal foil portion that closes the opening of the through hole. The metal foil is an alloy foil having a thickness of 50 μm or less and a value of 350 N / mm ² or more when a spring limit value specified by JIS H3130 is measured in a state of a foil having a thickness of 0.1 mm or more. The circuit board according to claim 1.   The circuit board according to claim 4, wherein the alloy is a copper alloy.   The copper alloy is C2600 (brass), C7701 (white), C7025 (Corson alloy), C5212 (phosphor bronze), C1700 (beryllium copper), C18040, C64770, C19400, C64710, C42500, C64725, C64740, C44250, The circuit board according to claim 4, wherein the circuit board is either C19020 or C19025.   7. The circuit board according to claim 5, wherein at least one surface of the copper alloy foil is plated with copper or silver. The metal foil is a rolled copper foil or an electrolytic copper foil, and at least a portion of the copper foil where the opening of the through hole is to be closed is a spring limit specified by JIS H3130 in a state of a foil having a thickness of 0.1 mm or more. The circuit board according to any one of claims 1 to 3, wherein a metal or alloy showing a value of 350 N / mm ² or more when measured is plated, and the total thickness is 50 µm or less.   The mounting terminal of a mounting component having a linear or spherical connecting terminal projecting from the bottom is pressed into a metal foil portion that closes the opening of the through hole in the circuit board according to claim 1 or 2, and the mounting is performed. A module in which a conduction structure is formed between a component and a conductor circuit of the circuit board. A multilayer structure formed by laminating a plurality of circuit boards according to claim 1 by coaxially aligning desired through holes in each circuit board,
A linear conductor is inserted into the common through hole in the multilayer structure in a state of detachably penetrating a metal foil portion that closes the through hole in each circuit board,
An electrical interlayer connection structure between circuit boards is formed through the linear conductor.   The male connection terminal of a tape cable having a male connection terminal projecting on one side closes the through hole in the circuit board according to claim 1 or 2, or the uppermost circuit board of the multilayer circuit board according to claim 10. A connector structure that is press-fitted into a metal foil portion.

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