WO2004093147B1 - Systeme de nettoyage des porte-plaquettes - Google Patents

Systeme de nettoyage des porte-plaquettes

Info

Publication number
WO2004093147B1
WO2004093147B1 PCT/US2004/011159 US2004011159W WO2004093147B1 WO 2004093147 B1 WO2004093147 B1 WO 2004093147B1 US 2004011159 W US2004011159 W US 2004011159W WO 2004093147 B1 WO2004093147 B1 WO 2004093147B1
Authority
WO
WIPO (PCT)
Prior art keywords
carrier
door
hand
carrier body
robot
Prior art date
Application number
PCT/US2004/011159
Other languages
English (en)
Other versions
WO2004093147A2 (fr
WO2004093147A3 (fr
Inventor
Yasukatsu Nishikata
Kenji Ishii
Kazufumi Otsuki
Katsuhiro Kurusu
Original Assignee
Entegris Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc filed Critical Entegris Inc
Priority to EP04749998A priority Critical patent/EP1615735A2/fr
Publication of WO2004093147A2 publication Critical patent/WO2004093147A2/fr
Publication of WO2004093147A3 publication Critical patent/WO2004093147A3/fr
Publication of WO2004093147B1 publication Critical patent/WO2004093147B1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

La présente invention concerne un système et u procédé permettant d'automatiser la manipulation des porte-plaquettes en vue d'opérations de lavage. Pour un mode de réalisation, le système nécessite de disposer, d'une part d'un robot entre un poste de chargement et un poste de déchargement, et d'autre part d'un appareil de lavage. Le robot est équipé d'une main qui peut comporter un premier élément préhenseur capable de saisir le corps du porte-plaquettes et un second élément préhenseur capable d'agir sur la portière du porte-plaquettes. Pour un mode de réalisation, le robot retire du corps du porte-plaquettes la portière et saisit le corps tout en gardant la maîtrise de la portière. Cette portière du porte-plaquettes, ainsi que le corps du porte-plaquettes, sont alors placés dans leurs positions respectives à l'intérieur de l'appareil de lavage. Ce processus se déroule en sens inverse pour la récupération des composants propres du conteneur de plaquettes.
PCT/US2004/011159 2003-04-10 2004-04-12 Systeme de nettoyage des porte-plaquettes WO2004093147A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP04749998A EP1615735A2 (fr) 2003-04-10 2004-04-12 Systeme de nettoyage des porte-plaquettes

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US46242803P 2003-04-10 2003-04-10
US60/462,428 2003-04-10
US82064604A 2004-04-08 2004-04-08
US10/820,646 2004-04-08

Publications (3)

Publication Number Publication Date
WO2004093147A2 WO2004093147A2 (fr) 2004-10-28
WO2004093147A3 WO2004093147A3 (fr) 2005-01-27
WO2004093147B1 true WO2004093147B1 (fr) 2005-03-17

Family

ID=33303086

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/011159 WO2004093147A2 (fr) 2003-04-10 2004-04-12 Systeme de nettoyage des porte-plaquettes

Country Status (2)

Country Link
EP (1) EP1615735A2 (fr)
WO (1) WO2004093147A2 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7520286B2 (en) * 2005-12-05 2009-04-21 Semitool, Inc. Apparatus and method for cleaning and drying a container for semiconductor workpieces
WO2010146561A1 (fr) * 2009-06-17 2010-12-23 Dynamic Micro Systems Appareil de nettoyage et de séchage intégré
EP3693990B1 (fr) 2011-06-23 2023-06-07 Brooks Automation (Germany) GmbH Systèmes et procédés de nettoyage de semi-conducteurs
US10714364B2 (en) * 2017-08-31 2020-07-14 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for inspecting wafer carriers
CN110369400A (zh) * 2018-04-12 2019-10-25 津伦（天津）精密机械股份有限公司 一种全自动等离子清洗设备
US11813649B2 (en) * 2020-05-29 2023-11-14 Taiwan Semiconductor Manufacturing Company Limited Semiconductor arrangement and method for making
TWI762273B (zh) 2021-04-16 2022-04-21 科嶠工業股份有限公司 物料傳送盒的清潔方法及其設備
CN114194776B (zh) * 2021-12-15 2023-04-21 上海世禹精密设备股份有限公司 转送晶圆输送盒的设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4627785A (en) * 1984-05-14 1986-12-09 Monforte Robotics, Inc. Exchangeable multi-function end effector tools
US6704998B1 (en) * 1997-12-24 2004-03-16 Asyst Technologies, Inc. Port door removal and wafer handling robotic system
JPH11274282A (ja) * 1998-03-23 1999-10-08 Toshiba Corp 基板収納容器、基板収納容器清浄化装置、基板収納容器清浄化方法および基板処理装置
US6412502B1 (en) * 1999-07-28 2002-07-02 Semitool, Inc. Wafer container cleaning system

Also Published As

Publication number Publication date
WO2004093147A2 (fr) 2004-10-28
WO2004093147A3 (fr) 2005-01-27
EP1615735A2 (fr) 2006-01-18

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