EP1615735A2 - Systeme de nettoyage des porte-plaquettes - Google Patents

Systeme de nettoyage des porte-plaquettes

Info

Publication number
EP1615735A2
EP1615735A2 EP04749998A EP04749998A EP1615735A2 EP 1615735 A2 EP1615735 A2 EP 1615735A2 EP 04749998 A EP04749998 A EP 04749998A EP 04749998 A EP04749998 A EP 04749998A EP 1615735 A2 EP1615735 A2 EP 1615735A2
Authority
EP
European Patent Office
Prior art keywords
carrier
door
washing
robot
hand
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04749998A
Other languages
German (de)
English (en)
Inventor
Yasukatsu Nishikata
Kenji Ishii
Kazufumi Otsuki
Katsuhiro Kurusu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Entegris Inc
Original Assignee
Entegris Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc filed Critical Entegris Inc
Publication of EP1615735A2 publication Critical patent/EP1615735A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Definitions

  • the present invention relates to a system for automatically washing substrate carriers that are used for containing, transporting and storing a plurality of substrates, such as semiconductor wafers, glass substrates, metallic substrates and the like (hereinafter generically referred to as "substrates").
  • substrates such as semiconductor wafers, glass substrates, metallic substrates and the like
  • the wafers are often stored in wafer carriers as the wafers are transported for carrying out sequential processes.
  • the type of wafer carrier utilized in fabrication facilities has evolved from an open cassette type to a sealable enclosure or pod, which separates the wafers from the outside atmosphere.
  • One currently favored pod design is known as a front opening unified pod (FOUP).
  • FOUP front opening unified pod
  • U.S. Patent No. 5,621,982 to Yamashita et al. discloses the use of a robot to manipulate bottom opening pods in a wafer washing apparatus.
  • the robot is not adaptable to various washing devices.
  • Yamashita is only able to grasp the pod and cannot manipulate any other carrier component, thereby being unable to individually place a door and a container in cleaning equipment, which necessitates manual intervention. There is therefore a continuing need to provide a wafer carrier washing system and apparatus to address the aforementioned automation and adaptability needs.
  • the system comprises disposing a robot between a loading and unloading section, and the washing apparatus.
  • the robot preferably includes a hand that may comprise a first engaging component for operably grasping the carrier body and a second engaging component for operably engaging the carrier door.
  • the robot removes the carrier door from the carrier body and grasps the body while maintaining possession of the door.
  • the carrier door and carrier body are then placed in respective positions within the washing apparatus. This procedure is reversed for retrieval of the clean wafer container components.
  • FIG. 1(a) is a top plan view of an automated wafer carrier washing system according to an embodiment of the present invention.
  • FIG. 1(b) is a side view of an automated wafer carrier washing system according to an embodiment of the present invention.
  • FIG. 2(a) is a side view of a robot hand for an automated wafer carrier washing system according to an embodiment of the present invention.
  • FIG. 2(b) is a first side view of a robot hand for an automated wafer carrier washing system according to an embodiment of the present invention.
  • FIG. 2(c) is a second side view of a robot hand for an automated wafer carrier washing system according to an embodiment of the present invention.
  • FIG. 3(a) is a side view of the robot hand engaging a carrier door and a carrier body according to an embodiment of the present invention.
  • FIG. 3(b) is a top plan view of the carrier engaging member of a robot hand engaging a carrier body according to an embodiment of the present invention.
  • FIG. 4(a) is a front view of the carrier door engaging member of a robot hand according to an embodiment of the present invention.
  • FIG. 4(b) is a front view of the carrier door engaging member of a robot hand according to an embodiment of the present invention.
  • FIG. 4(c) is schematic for a carrier door engaging member actuator for a robot hand according to an embodiment of the present invention.
  • FIG. 4(d) is a schematic for a door engaging member actuator for a robot hand according to an embodiment of the present invention.
  • FIGS. 5(a), 5(b), 5(c) and 5(d) are plan view diagrams of the rotation of a wafer carrier upon a loading and unloading station for operable engagement by a robot arm according to an embodiment of the present invention.
  • FIG. 5(e) is a side view of a robot hand simultaneously grasping a carrier door and a carrier body according to an embodiment of the present invention.
  • FIG. 5(f) is a plan view of a robot hand presenting a carrier door and a carrier body to automated washing equipment according to an embodiment of the present invention.
  • FIGS. 6(a), 6(b), 6(c) and 6(d) are plan view diagrams of the rotation of a wafer carrier upon a loading and unloading station for operable engagement by a robot arm according to an embodiment of the present invention.
  • FIG. 6(e) is a side view of a robot hand simultaneously grasping a carrier door and a carrier body according to an embodiment of the present invention.
  • FIG. 6(f) is a plan view of a robot hand presenting a carrier door and a carrier body to automated washing equipment according to an embodiment of the present invention.
  • FIG. 7(a) is a front view of an automated wafer container washing device with wafer carrier doors and bodies placed therein.
  • FIG. 7(b) is a side view showing the respective placement of a carrier body and carrier door within an automated wafer container washing device.
  • the FOUP 1 may comprise a container or carrier body 2 for storing a plurality of wafers, and a carrier door 3 detachably mounted to the opening of the front side of the container 2 via a latching system.
  • the carrier body 2 has a holding portion 4 mounted above the carrier 2, and can be automatically transported by grasping the holding portion 4 with the door 3 sealed in place.
  • the carrier door 3 has latch holes 5 and latch bars 3a which constitute the latch system.
  • the carrier door 3 is latched and unlatched via the latch bars 3 a by inserting keys into the latch holes 5 and rotating the keys.
  • a carrier washing device 6 is used to wash the wafer carrier 1.
  • the washing operation is set in a clean room where the door 3 is separated from the wafer container 2 prior to engagement with the washing device 6.
  • One suitable washing device is disclosed in co-pending U.S. Patent Application Serial No. 10/282,924, which is hereby incorporated by reference as part of this specification. Those having skill in the art will recognize that other types of washing devices may be used without departing from the spirit or scope of the present invention.
  • the wafer carrier components are placed in the washing apparatus at predetermined positions.
  • left and right sides of the inside of washer 6 include two container washing portions 8a and 8b, and door washing portions 9a and 9b.
  • the carrier portions are then washed.
  • the body 2 and doors 3, respectively, are taken out of the washing device 6 after lifting the upper cover 7.
  • the doors 3 are securably attached to their respective carrier bodies 2. Then the clean sealed wafer containers are transported to a use or storage location.
  • An automated wafer carrier washing system is disposed within a clean room C-R, as shown in FIGS. 1(a) and 1(b).
  • a loading and unloading section 10 and a washer 6 are positioned to oppose each other, and the robot 20 is positioned between the loading and unloading section 10 and the washer 6.
  • the loading and unloading section 10 has three holding tables 11 A, IB and 11C disposed on the lower side and a holding table 11D disposed on the upper side.
  • the loading and unloading section 10 may serve to appropriately position and hold wafer carriers 1 at suitably located holding tables when the wafer carriers 1 are fed to the unloading and loading section 10 by an automatic feeding machine (not shown), hi addition, the loading and unloading section 10 may serve to hold the wafer carriers 1 (each having the container 2 and the respective door 3 attached thereto) and to feed them to the outside of the clean room via a loading port (not shown).
  • the holding tables 11A, 11B and 11C are capable of positioning and holding the containers 2, and are rotatable through a suitable angle by a rotating system. In this embodiment, the holding table 11D is positioned at a level higher than the holding tables 11 A, 11B and 11C in order to minimize the square footage of the footprint for the automated washing system.
  • Reference numeral 13 designates an air conditioning device mounted at a ceiling 14 in the clean room.
  • the washer 6 in the illustrated embodiment is capable of washing two wafer carriers 1 (specifically, two carrier bodies 2 and two carrier doors 3) simultaneously.
  • the inside of washing apparatus 6 is divided into washing parts 6a and 6b disposed at the left side and the right side, respectively.
  • container holding parts 8a and 8b position and hold the bodies 2
  • door holding parts 9a and 9b position and hold the doors 3.
  • the door holding parts 9a and 9b are configured to mount and remove the doors 3 via latch systems that are similar to latch systems for mounting and removing the doors 3 with respect to the carrier bodies 2.
  • the washer 6 may be constructed to automatically wash a single or a plurality of wafer carriers 1.
  • the robot 20 is set in the middle of the clean room C-R, wherein a container component grasping portion or a robot hand 21 has a first hand engaging component 23 and a second hand engaging component 30.
  • a suitable robotic body for use with the present invention is model YR-CR20-A00 from Yasukawa Electric Corporation. However, those having skill in the art will recognize that other robots suitable for use in a clean room may be used without departing from the spirit or scope of the present invention. In the illustrated embodiment, six robotic segments T, B, R, U, L and S are used to minimize the consumption of space.
  • S shaft rotates (at plus and minus 180 degrees), L shaft rotates (at +120 degrees and -90 degrees), U shaft rotates (at +90 degrees and -80 degrees), R shaft rotates (at +165 degrees and -165 degrees), B shaft swings (at +230 degrees and -50 degrees), and T shaft rotates (at +360 degrees and -360 degrees).
  • the first engaging component 23 and second engaging component 30 of robot hand 21 are operably provided to shaft T on robot 20.
  • the first engaging component 23 comprises a clamp system where the holding portion 4, termed a robotic flange, mounted on the upper side of the carrier body 2 is clamped and undamped, as is shown in FIGS. 2(a), 2(b), 2(c), 3(a) and 3(b). More specifically, in this configuration, a pair of grasping members 24 are operably coupled to base 22, which is connected to shaft T by pivot pin 25. Grasping members 24 are controllably movable by actuation of a linear actuator 26.1, for example a pneumatic or hydraulic cylinder comprising a piston 26 in a cylinder housing 27. The grasping members 24 oppose each other and present grasping portions 24a.
  • a linear actuator 26.1 for example a pneumatic or hydraulic cylinder comprising a piston 26 in a cylinder housing 27.
  • the piston 26 is positioned at or near the pivot pins and on the grasping members 24 so that cylinder housing 27 is pivotally fastened to a first grasping member 24 via pivot member 29a and rod 28 is pivotally fastened to a second grasping member 24 via a pivot member 29b.
  • the first engaging component 23 is positioned opposite the second engaging component 30, as shown in FIG. 2(a).
  • both grasping members 24 are brought down toward the carrier body
  • the container engaging portion 4 is engaged by the grasping portions 24a at both sides by moving horizontally via retraction of the rod 28 into piston housing 27.
  • the carrier body 2 is releasably held by the first engaging component 23.
  • the second engaging component 30 is shown in FIGS. 2(a), 2(b), 2(c), 4(a), 4(b), 4(c) and 4(d).
  • the second engaging component 30 engages and disengages the door with the carrier body 2 (and with door holding parts 9a and 9b of the washing device).
  • the second engaging component 30 is provided with a door holding system for holding the door 3 via a holding board 31.
  • the holding board 31 is connected to the shaft T of the robot 20 via base member 32.
  • the holding board 31 is in the form of a hollow, flat board and is somewhat smaller than the door 3.
  • Four suction cups 33 are provided to the board 31 for enabling the holding of the door 3.
  • Two key members 35 are provided to the board relative to the locus of the latch holes 5 of the container 1.
  • the suction cups are provided with a central suction and discharge port 34 to which a gas suction and discharge hose is coupled for selectively retaining the door.
  • the suction cups 33 are disposed on the board 31 in one configuration so that two cups are always engaging the door even if the carrier 1 is positioned a different direction.
  • Key members 35 function to latch and unlatch the door from the carrier body 2.
  • the key members 35 are actuated by the linkage shown in FIGS. 4(a), 4(b), 4(c) and 4(d).
  • the linkage comprises a pivotally mounted actuator 36 and crank member 40.
  • the cylinder housing 37 is pivotally fastened to the board 31 via pin member 39.
  • Jig 38a is connected to the top end of the expandable and retractable rod 38, and one end of the crank member 40 is rotatably connected to jig 38a via connection pin 41.
  • the key member 35 extends through hole 31b formed in holding board 31 and supplementary base 31a.
  • cylinder 37 moves crank member 40 by rotating so that the key member 35 is switched from the unlatch position shown in FIG. 4(c) to the latch position shown in FIG. 4(d).
  • the expandable and retractable rod 38 of cylinder 37 is selectively retracted, key member 35 is switched from the latch position to the unlatch position by the movement of the expandable and retractable rod 38 and crank member 40.
  • the wafer carriers 1 are placed on the holding table 11 at two locations by an automatic carrier transporting machine (not shown in the drawings).
  • FIGS. 5(a) to 5(f) illustrate a first handling operation.
  • the holding table 11 is rotated from the initial position shown in FIG. 5(a) to a position shown in FIG. 5(b) at 90 degrees in a clockwise direction.
  • the robot 20 is driven so that the second engaging component 30 of the robot hand 21 is positioned adjacent to the door 3.
  • each key member 35 is inserted into the corresponding key hole 5.
  • the door 3 is attracted and held by the holding board 31 via the above-mentioned suction cups 34 and the piston 36 is actuated to cause the switching of the key member 35 from the latch position to the unlatch position.
  • the robot hand 21 is rotated in the direction of the arrow shown in FIG. 5(b) by 90 degrees to be horizontal with the door 3 on top of the hand.
  • the first and second engaging components 23 and 30 are positioned horizontally, and the holding table 11 is rotated by 180 degrees from the position shown in FIG. 5(b) to the position shown in FIG. 5(c).
  • the first engaging component 23 is moved towards the engaging portion 4 of the container 2 until both grasping members 24 are in position to grasp the engaging portion 4 via actuation of the cylinder 26, as shown in FIG. 5(d).
  • the door 3 is held by the second engaging component 30 and the carrier body 2 is held by the first engaging component 23.
  • the robot hand 21 is rotated by 90 degrees in the direction of the arrow in FIG. 5(d), causing the orientation of the components to be switched to the position shown in FIG. 5(e). Then, the robot hand 21 is turned to move to the door 3 and carrier body 2 into alignment with respective container holding part 8a and door holding part 9a. The container is disposed by placing it on the container holding portion 8a. The door 3 is disposed in the door holding part 9a by switching the above mentioned key members 35 to the latch position. Upon latching, holding by the suction cups 33 of the door holding system is released, and the key member 35 is pulled out from the key hole 5 by the movement of the robot hand 21.
  • FIGS. 6(a) to 6(f) The handling operation shown in FIGS. 6(a) to 6(f) is similar to that described for FIGS. 5(a) to 5(f).
  • the holding table 11 is rotated by 90 degrees from the initial position shown in FIG. 6(a) to a position shown in FIG. 6(b), which is opposite to the direction in the above handling operation (rotation in the counterclockwise direction).
  • the robot 20 is driven, so that the second engaging component 30 of the robot hand 21 is positioned to oppose to the door 3.
  • the key member 35 is inserted into each key hole 5 of the door 3 and switched from the latch position to the unlatch position, similar to the above mentioned example.
  • the second engaging component 30 is rotated by 90 degrees in the direction of arrow shown in FIG. 6(b). Then, the first engaging component 23 is brought engagement position with the engaging portion 4 of the carrier body 2 for engagement as described previously.
  • the robot hand 21 is rotated by 90 degrees in the direction of the arrow shown in FIG. 6(d) (in the counterclockwise direction), so that the situation is switched to the position shown in FIG. 6(e) where the front opening of the carrier body 2 is oriented downward and the side surface of the door 3 is oriented upward.
  • the robot hand 21 is turned to move toward the washing apparatus 6 wherein the carrier body 2 is disposed on the holding part 8b, and the door 3 is disposed in the door holding part 9b. In this way, after the carrier body 2 and door 3 are set at the washing parts 6a and 6b respectively, upper cover 7 of the washer 6 is closed and a washing operation is performed on the carrier components.
  • the door 3 is held by the second engaging component 30 and the carrier body 2 is held by the first engaging component 23 in the order that is reverse to the order for the previously described handling operation.
  • the carrier body 2 is held on the holding table 11, and then the door 3 is latched in the carrier body 2.
  • each wafer container 1 is transported from the loading and unloading section 10 to a desired position by the automatic transporting machine.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

La présente invention concerne un système et u procédé permettant d'automatiser la manipulation des porte-plaquettes en vue d'opérations de lavage. Pour un mode de réalisation, le système nécessite de disposer, d'une part d'un robot entre un poste de chargement et un poste de déchargement, et d'autre part d'un appareil de lavage. Le robot est équipé d'une main qui peut comporter un premier élément préhenseur capable de saisir le corps du porte-plaquettes et un second élément préhenseur capable d'agir sur la portière du porte-plaquettes. Pour un mode de réalisation, le robot retire du corps du porte-plaquettes la portière et saisit le corps tout en gardant la maîtrise de la portière. Cette portière du porte-plaquettes, ainsi que le corps du porte-plaquettes, sont alors placés dans leurs positions respectives à l'intérieur de l'appareil de lavage. Ce processus se déroule en sens inverse pour la récupération des composants propres du conteneur de plaquettes.
EP04749998A 2003-04-10 2004-04-12 Systeme de nettoyage des porte-plaquettes Withdrawn EP1615735A2 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US46242803P 2003-04-10 2003-04-10
US82064604A 2004-04-08 2004-04-08
PCT/US2004/011159 WO2004093147A2 (fr) 2003-04-10 2004-04-12 Systeme de nettoyage des porte-plaquettes

Publications (1)

Publication Number Publication Date
EP1615735A2 true EP1615735A2 (fr) 2006-01-18

Family

ID=33303086

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04749998A Withdrawn EP1615735A2 (fr) 2003-04-10 2004-04-12 Systeme de nettoyage des porte-plaquettes

Country Status (2)

Country Link
EP (1) EP1615735A2 (fr)
WO (1) WO2004093147A2 (fr)

Families Citing this family (8)

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Publication number Priority date Publication date Assignee Title
US7520286B2 (en) * 2005-12-05 2009-04-21 Semitool, Inc. Apparatus and method for cleaning and drying a container for semiconductor workpieces
US8591664B2 (en) * 2009-06-17 2013-11-26 Dynamic Micro System Integrated cleaner and dryer system
EP2724365B8 (fr) 2011-06-23 2020-04-08 Brooks Automation (Germany) GmbH Systèmes et procédés de nettoyage de semi-conducteurs
US10714364B2 (en) * 2017-08-31 2020-07-14 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for inspecting wafer carriers
CN110369400A (zh) * 2018-04-12 2019-10-25 津伦（天津）精密机械股份有限公司 一种全自动等离子清洗设备
US11813649B2 (en) * 2020-05-29 2023-11-14 Taiwan Semiconductor Manufacturing Company Limited Semiconductor arrangement and method for making
TWI762273B (zh) 2021-04-16 2022-04-21 科嶠工業股份有限公司 物料傳送盒的清潔方法及其設備
CN114194776B (zh) * 2021-12-15 2023-04-21 上海世禹精密设备股份有限公司 转送晶圆输送盒的设备

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US4627785A (en) * 1984-05-14 1986-12-09 Monforte Robotics, Inc. Exchangeable multi-function end effector tools
US6704998B1 (en) * 1997-12-24 2004-03-16 Asyst Technologies, Inc. Port door removal and wafer handling robotic system
JPH11274282A (ja) * 1998-03-23 1999-10-08 Toshiba Corp 基板収納容器、基板収納容器清浄化装置、基板収納容器清浄化方法および基板処理装置
US6412502B1 (en) * 1999-07-28 2002-07-02 Semitool, Inc. Wafer container cleaning system

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Also Published As

Publication number Publication date
WO2004093147A3 (fr) 2005-01-27
WO2004093147A2 (fr) 2004-10-28
WO2004093147B1 (fr) 2005-03-17

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