WO2004088738A1 - Lamine - Google Patents

Lamine Download PDF

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Publication number
WO2004088738A1
WO2004088738A1 PCT/JP2004/004396 JP2004004396W WO2004088738A1 WO 2004088738 A1 WO2004088738 A1 WO 2004088738A1 JP 2004004396 W JP2004004396 W JP 2004004396W WO 2004088738 A1 WO2004088738 A1 WO 2004088738A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
insulating layer
laminate
function
copper foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2004/004396
Other languages
English (en)
Japanese (ja)
Inventor
Yuichi Tokuda
Katsuya Kishida
Yuji Matsushita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Steel Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co Ltd filed Critical Nippon Steel Chemical Co Ltd
Publication of WO2004088738A1 publication Critical patent/WO2004088738A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints

Definitions

  • the present invention is designed to mount electronic components such as ICs or LSIs.
  • the present invention relates to a copper-clad laminate for a board.
  • TAB tape, automated bonding
  • LCD liquid crystal display devices
  • the flexible printed circuit board (FPC) used for this COF does not have the device holes used in the TAB method, so when measuring the relative position when mounting the chip, it passes through the insulating layer and passes through the driver IC chip. It is necessary to recognize the wiring of.
  • a laminate used for such an FPC for COF there is a laminate in which an adhesion film such as a nickel film is sputtered on an insulating film such as a polyimide film and then copper plating is applied.
  • the polyimide film is relatively transparent, so alignment is easy when mounting the IC, but the adhesive force between the conductor and the insulator is low. There is a problem that it is inferior.
  • a laminate without such problems there are a casting type in which a polyimide film is laminated on a copper foil by a coating method, and a thermocompression bonding type in which an insulated film is thermocompressed on a copper foil through a thermoplastic resin or thermosetting resin.
  • a laminate there is a laminate.
  • the surface of the insulating layer exposed when the copper foil is removed by etching reflects light irregularly, and penetrates the insulating layer to recognize the wiring of the driver IC chip. There was a problem that could not be done.
  • JP-A-2002-73188 discloses a method for polishing an electrolytic deposition surface.
  • Japanese Patent Application Laid-Open No. 2002-021394 discloses a method for producing a roughened layer of copper foil.
  • Japanese Patent Application Laid-Open No. 09-143785 discloses a low-roughness copper foil having a small Rz by using a mercapto compound.
  • Japanese Patent Application Laid-Open No. 2003-23046 discloses an insulator having a prescribed light transmittance.
  • the method for specifying the roughness of the copper foil surface is calculated by a stylus-type roughness meter, etc.
  • Rz specified in the definition of roughness (Rz) is often used.
  • this Rz was incomplete to define the correlation with optical characteristics such as optical scattering, and in some cases it was impossible to actually recognize the wiring of the driver IC chip.
  • DISCLOSURE OF THE INVENTION The present invention is capable of recognizing the wiring of a driver IC chip through an insulating layer, has a high adhesive force between a conductor and an insulator, and has an excellent electrification port migration resistance.
  • the present invention provides a laminate in which a conductor layer and an insulating layer are laminated, and measures the surface of the conductor layer on the insulating layer side as three-dimensional shape data including height values at respective points, and obtains the following formula (1)
  • the power spectrum which is a function of frequency, is calculated by performing the two-dimensional Fourier transform shown in ()), and the intensity of the frequency equivalent to 60 O nm is less than the intensity equivalent to the surface height value of 1.6 m before conversion. It is characterized by being.
  • the conductor layer is a copper foil, and the insulation layer is formed by applying a polyimide precursor resin solution, followed by drying and curing.4) The heat of the insulation layer being thermocompressed to the conductor layer. 5) The fact that the insulating layer is formed of a thermosetting resin layer and an insulating film that is thermocompression-bonded to the conductor layer must be formed by a plastic resin layer and an insulating film. This is a preferred embodiment of the present invention.
  • the present invention is a COF film carrier tape characterized by using the above-mentioned laminate. Further, the present invention measures the surface of the conductor layer on the insulating layer side as a three-dimensional shape composed of height values at each point, and performs a two-dimensional Fourier transform represented by the above equation (1) to obtain a frequency. Calculate the power spectrum, which is a function of the above, and select a conductor layer whose strength at a specific frequency in the range of 500 to 70'0 ⁇ is less than the strength corresponding to the surface height value of 1.6 Am before conversion. And a method of manufacturing a laminate having a structure in which a conductor layer and an insulation layer are laminated, wherein an insulation layer is laminated on the conductor layer.
  • the present invention will be described in detail.
  • the laminate of the present invention includes a conductor layer and an insulating layer.
  • a copper foil layer is preferable, and the conductor layer may be represented by a copper foil layer in the following description.
  • the conductor layer may be provided on only one side of the insulating layer, or may be provided on both sides.
  • Examples of the conductive layer constituting the laminate include various conductive metal foils. In the case of a copper foil, a rolled copper foil or an electrolytic copper foil may be used.
  • a method of defining the conductor surface shape three-dimensional shape data consisting of height values at each point on the insulating layer side surface of the conductor layer is measured.
  • a stylus method a laser microscope, an atomic force microscope (AF ⁇ ), or the like can be used. Of these, the method using AFM is most suitable for this purpose.
  • a two-dimensional Fourier transform represented by the equation (1) is performed to calculate a frequency spectrum, which is a function of frequency.
  • the power spectrum obtained by this conversion is obtained by decomposing the periodicity of the three-dimensional shape as a sine wave component and obtaining a two-dimensional image showing its wave number and directionality.
  • the distance from the center of the image is a sine wave Indicates the wave number, and the direction from the center of the image corresponds to the direction of the sine wave.
  • Equation (1) The function ⁇ , y) defined in the xy plane coordinate system, that is, the two-dimensional Fourier transform of the three-dimensional shape data is defined by equation (1).
  • u and V indicate the wave numbers in the X and y directions, respectively.
  • F (u, V) indicates the spatial frequency component of f (x, y) corresponding to the wave vector (u, V), that is, the Fourier component.
  • the two-dimensional Fourier transform can be performed with commercially available software.
  • the image is not a continuous function such as ⁇ . Y), but a digital data of NXN pixels (pixels) with finite resolution, and a finite sum is used instead of integration using a continuous function.
  • the digital data used in this case can be obtained by a digital camera, CCD camera, scanner, optical microscope, metallographic microscope, laser microscope, scanning electron microscope, atomic force microscope, or the like.
  • the center of the image is the origin of the uv coordinate system.
  • the intensity at each point in the image corresponds to the magnitude of the Fourier component-components closer to the origin correspond to lower-frequency components, and components farther from the origin correspond to higher-frequency components.
  • the wave number h (1 / m) at the corner farthest from the origin is given by the following equation (2).
  • N Number of pixels of image before conversion (1)
  • the four corner positions are at a wave number of 7.24 ⁇ 106, wavelength 0.14 Hit.
  • the intensity of the sinusoidal component from 38 O nm to about 78 O nm corresponding to the wavelength of visible light can be specified, but especially the wavelength included in the light source of the alignment device.
  • low absorption of high polymers such as polyimide relatively long wavelength that is difficult to disperse, and good sensitivity of CCD camera. It has been found that practical transparency can be defined by defining the intensity of the periodic component corresponding to 7700 nm, preferably 60 O nm.
  • the intensity of the periodic component equivalent to 600 nm corresponds to the surface height value before conversion of 1.6 / m Strength Not more than. Further, it is more preferably 1.5 or less.
  • the intensity equivalent to a surface height value of 1.6 before conversion is 80% of the intensity after conversion and 80% of the intensity after conversion when the two-dimensional shape data before conversion is measured at a full scale of 2 m. When the scale is measured at 4 zm, the converted intensity is 40%, and when the full scale is measured at 6m, the converted intensity is 27%.
  • the insulating layer constituting the laminate is formed by applying a polyimide precursor resin solution and then drying and curing, a thermoplastic resin layer and an insulating film, and a thermosetting resin layer. Any of those formed by using an insulating film may be used.
  • insulating layers constituting these laminates those formed by applying a polyimide precursor resin solution, followed by drying and curing are most suitable, but the present invention is not limited thereto.
  • the polyimide precursor resin solution can be produced by polymerizing a known diamine and an acid anhydride in the presence of a solvent.
  • diamines used include 4,4'-diaminodiphenyl ether, 2'-methoxy4,4'-diaminobenzanilide, 1,4-bis (4-aminophenoxy) benzene, 1,3-bis (4-aminophenoxy) benzene, 2,2'-bis [4- (4-aminophenoxy) phenyl] propane, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3 '-Dihydroxy-4,4, -diaminobiphenyl, 4,4' diaminobenzanilide and the like.
  • acid anhydride examples include pyromellitic anhydride, 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride, 3,3', 4,4'-diphenylsulfonetetracarboxylic acid Acid dianhydride; 4,4'-oxydiphthalic anhydride;
  • Each of diamine and acid anhydride may be used alone or in combination of two or more.
  • the solvent examples include dimethylacetamide, n-methylpyrrolidinone, 2-butanone, diglyme, xylene and the like, and one or more of them can be used in combination.
  • the polyimide-based resin layer is preferably formed by directly applying it on the copper foil layer in a precursor state, and the viscosity of the polymerized resin is preferably in the range of 500 cps to 35,000 O cps. I like it.
  • the applied resin solution is heat-treated, but heat-treated at 100 to 15 Ot for 2 to 4 minutes in the air, and then vacuum-heated to room temperature-340 ° C-room temperature treatment for about 9 hours It is better to do it.
  • the polyimide resin layer may be formed of only a single layer, or may be formed of a plurality of layers. When a plurality of polyimide-based resin layers are used, they can be formed by sequentially applying another polyimide resin on a polyimide-based resin layer composed of different components. When the polyimide resin layer is composed of three or more layers, the same configuration of the polyimide resin may be used twice or more.
  • a copper-clad laminate which is a typical example of the laminate of the present invention, can be manufactured by applying a polyimide resin on a copper foil as described above. It can also be manufactured by lamination.
  • the copper-clad laminate thus manufactured may be a single-sided copper-clad laminate having a copper foil layer on only one side, or a double-sided copper-clad laminate having a copper foil layer on both sides.
  • a double-sided copper-clad laminate is formed by forming a single-sided copper-clad laminate and then pressing the copper foil layer by hot pressing. A method in which a film is sandwiched and pressure-bonded by a hot press may be used.
  • Copper foil 1 Electrolytic copper foil, Rz 1. O m
  • Copper foil 2 Electrolytic copper foil, RzO.
  • Copper foil 3 Rolled copper foil, Rz2. O im
  • Copper foil 4 Copper foil 3 immersed in 5% hydrochloric acid aqueous solution for 1 minute, Rz2. O m Synthesis example 1
  • n-methylpyrrolidinone in a thermocouple, stirrer, or reaction vessel into which nitrogen can be introduced.
  • PMDA pyromellitic anhydride
  • MABA 2, -methoxy Introduced 4,4'-diaminobenzanilide
  • DSDA 3,3'4,4'-diphenylsulfonetetracarboxylic dianhydride
  • PMM 3,3'4,4'-diphenylsulfonetetracarboxylic dianhydride
  • TPE-I 1,3- Bis (4-aminophenoxy) benzene
  • Copper foil 1 was used as the copper foil.
  • the surface of this copper foil was shape-measured with an atomic force microscope (NanoScope, a scanning probe microscope manufactured by Digital Instruments) in a range of 50 / im square at a full scale of 4 mm and 256 gradations. One gradation corresponds to 0.0156 m.
  • the obtained image was subjected to two-dimensional Fourier transform using commercially available general-purpose image processing software to obtain a power spectrum. From this power spectrum, the intensity F (U.V) at a position corresponding to a wavelength of 600 nm was measured. Out of 256 gradations, which corresponded to 93 gradations, and the intensity was 36%. This is equivalent to 1.45 xm because the full scale of the shape data before conversion is 4 mm.
  • the polyamic acid solution of Synthesis Examples 1 to 3 was applied and dried repeatedly on the electrolytic copper foil to obtain a laminate in which a polyimide precursor resin layer was formed on the copper foil layer.
  • Heat treatment was performed for 8 hours to obtain a single-sided copper foil laminate having a polyimide thickness of 40 / zm.
  • This laminate has a polyimide layer 3 m generated from the polyamic acid of Synthesis Example 1, a polyimide layer 34 generated from the polyamic acid of Synthesis Example 2, and a polyimide layer generated from the polyamic acid of Synthesis Example 2 on the electrolytic copper foil.
  • the laminate was etched with an aqueous ferric chloride solution to obtain a 40 m insulating film.
  • This film was held on the driver IC chip prepared for the test while maintaining a distance of lOO ⁇ m.
  • the film was mounted on the ponder machine using a commercially available ponder machine (Shinkawa ILT-110). When a 200 m inspection pattern on the IC chip was observed through the film using a CCD camera for alignment, a good image was obtained.
  • Example 2 Using this electrolytic copper foil, a laminate was manufactured in the same manner as in Example 1, and an insulating layer film was obtained by etching. When the IC chip was observed through this film, no image could be recognized.
  • the intensity corresponding to a wavelength of 600 nm was equivalent to 119 out of 256 gradations, and the intensity was 46%. It was hot. This is equivalent to 1.86 m because the full scale of the shape data before conversion is 4 m.
  • Example 2 Using this electrolytic copper foil, a laminate was manufactured in the same manner as in Example 1, and an insulating layer film was obtained by etching. When the IC chip was observed through this film, no image could be recognized.
  • the copper foil 4 was used as the copper foil, and the surface shape was measured in the same manner as in Example 1.
  • the intensity corresponding to the wavelength of 600 im was equivalent to 90 of 256 gradations, and the intensity was 35%. there were. Also, this corresponds to 1.41, ⁇ since the full scale of the shape data before conversion is 4. "m.
  • the laminated body was manufactured and etched to obtain an insulated layer film.When the IC chip was observed through this film, a good image was obtained.
  • Copper foil 1 Copper foil 2 Copper foil 3 Copper foil 4
  • the wiring of the driver IC chip can be recognized through the insulating layer, and the adhesion between the conductor and the insulator is high, and a laminate having excellent electromigration resistance can be manufactured.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Wire Bonding (AREA)

Abstract

L'invention concerne un laminé comprenant une couche conductrice et une couche isolante, et présentant une excellente résistance à la migration des électrons. La couche conductrice et la couche isolante adhérent fortement l'une à l'autre. Lorsqu'une puce de circuit intégré de commande est montée sur ledit laminé, le câblage de la puce du circuit intégré de commande peut être reconnu grâce à la couche isolante. Le laminé se caractérise en ce que les hauteurs de la surface du côté de la couche isolante de la couche conductrice sont mesurées en tant que données tridimensionnelles. Les données sont soumises à une transformée de Fourier bidimensionnelle exprimée par l'équation (1) pour obtenir le spectre de puissance en fonction de la fréquence, et l'intensité de la fréquence correspondant à 600 nm est la valeur ou une valeur inférieure correspondant à la hauteur 1,6 νm avant la transformée. Dans ladite équation (1), F (u, v) est la fonction (spectre de puissance ) créée par la transformée, u et v sont respectivement les nombres d'ondes dans les directions x et y, f(x, y) est la fonction (données tridimensionnelles) destinée à être transformée, et (x, y) sont les coordonnées du plan.
PCT/JP2004/004396 2003-03-31 2004-03-29 Lamine Ceased WO2004088738A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003-096474 2003-03-31
JP2003096474A JP4219721B2 (ja) 2003-03-31 2003-03-31 積層体の製造方法

Publications (1)

Publication Number Publication Date
WO2004088738A1 true WO2004088738A1 (fr) 2004-10-14

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PCT/JP2004/004396 Ceased WO2004088738A1 (fr) 2003-03-31 2004-03-29 Lamine

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JP (1) JP4219721B2 (fr)
KR (1) KR20050113173A (fr)
WO (1) WO2004088738A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4804806B2 (ja) * 2005-06-13 2011-11-02 新日鐵化学株式会社 銅張積層板及びその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003023046A (ja) * 2001-07-11 2003-01-24 Mitsui Mining & Smelting Co Ltd Ｃｏｆ用積層フィルム及びｃｏｆフィルムキャリアテープ

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003023046A (ja) * 2001-07-11 2003-01-24 Mitsui Mining & Smelting Co Ltd Ｃｏｆ用積層フィルム及びｃｏｆフィルムキャリアテープ

Also Published As

Publication number Publication date
JP4219721B2 (ja) 2009-02-04
KR20050113173A (ko) 2005-12-01
JP2004299305A (ja) 2004-10-28

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