WO2004083901A3 - Detection de macro-defauts a l'aide d'entrees de micro-inspection - Google Patents

Detection de macro-defauts a l'aide d'entrees de micro-inspection Download PDF

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Publication number
WO2004083901A3
WO2004083901A3 PCT/IL2004/000253 IL2004000253W WO2004083901A3 WO 2004083901 A3 WO2004083901 A3 WO 2004083901A3 IL 2004000253 W IL2004000253 W IL 2004000253W WO 2004083901 A3 WO2004083901 A3 WO 2004083901A3
Authority
WO
WIPO (PCT)
Prior art keywords
repeating cells
macro
defects
micro
detection
Prior art date
Application number
PCT/IL2004/000253
Other languages
English (en)
Other versions
WO2004083901A2 (fr
Inventor
Yamamoto Shigeru
Ofer Saphier
Raanan Adin
Original Assignee
Orbotech Ltd
Yamamoto Shigeru
Ofer Saphier
Raanan Adin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orbotech Ltd, Yamamoto Shigeru, Ofer Saphier, Raanan Adin filed Critical Orbotech Ltd
Priority to KR1020057017277A priority Critical patent/KR101146081B1/ko
Priority to CN2004800123171A priority patent/CN1839306B/zh
Publication of WO2004083901A2 publication Critical patent/WO2004083901A2/fr
Publication of WO2004083901A3 publication Critical patent/WO2004083901A3/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Biochemistry (AREA)
  • Power Engineering (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Analysis (AREA)

Abstract

L'invention concerne un appareil d'inspection comprenant une fonctionnalité d'inspection optique (28) permettant de fournir au moins une sortie d'inspection optique représentative d'un motif de cellules de répétition sur un substrat. La fonctionnalité d'analyse (32) permet de recevoir la ou les sorties d'inspection optique et d'isoler des caractéristiques présélectionnées des cellules de répétition. La fonctionnalité de rapport d'analyse agit sur les caractéristiques présélectionnées isolées des cellules de répétition pour fournir une indication de sortie (34) de variations d'au moins une des caractéristiques présélectionnées isolées, lesquelles variations surviennent sur plusieurs des cellules de répétition.
PCT/IL2004/000253 2003-03-17 2004-03-17 Detection de macro-defauts a l'aide d'entrees de micro-inspection WO2004083901A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020057017277A KR101146081B1 (ko) 2003-03-17 2004-03-17 마이크로-검사 입력을 이용한 매크로 결함 검출 방법 및시스템
CN2004800123171A CN1839306B (zh) 2003-03-17 2004-03-17 使用微检查输入的宏缺陷检测

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003071791A JP3948728B2 (ja) 2003-03-17 2003-03-17 パターン検査装置
JP2003-071791 2003-03-17

Publications (2)

Publication Number Publication Date
WO2004083901A2 WO2004083901A2 (fr) 2004-09-30
WO2004083901A3 true WO2004083901A3 (fr) 2006-04-06

Family

ID=33027706

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IL2004/000253 WO2004083901A2 (fr) 2003-03-17 2004-03-17 Detection de macro-defauts a l'aide d'entrees de micro-inspection

Country Status (5)

Country Link
JP (1) JP3948728B2 (fr)
KR (1) KR101146081B1 (fr)
CN (1) CN1839306B (fr)
TW (1) TWI318680B (fr)
WO (1) WO2004083901A2 (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5069904B2 (ja) * 2006-03-28 2012-11-07 株式会社日立ハイテクノロジーズ 指定位置特定方法及び指定位置測定装置
JP4740825B2 (ja) * 2006-11-13 2011-08-03 オリンパス株式会社 小型洗浄装置
JP2010117185A (ja) * 2008-11-11 2010-05-27 Olympus Corp 欠陥検査装置および欠陥検査方法
JP5534715B2 (ja) 2009-05-27 2014-07-02 株式会社ジャパンディスプレイ 電子回路パターンの欠陥修正方法およびその装置
CN103021899B (zh) * 2012-12-21 2015-07-15 日月光半导体（昆山）有限公司 半导体产品检测机及其检测方法
CN103558229B (zh) * 2013-11-25 2016-03-30 苏州富鑫林光电科技有限公司 一种tft-lcd制程的mura视觉自动检测方法及装置
TWI521476B (zh) * 2015-04-17 2016-02-11 銘傳大學 週期性圖案之自動光學檢測方法
CN105428279B (zh) * 2015-12-14 2018-06-26 重庆远创光电科技有限公司 适用于获取芯片图像的控制方法
CN105448782B (zh) * 2015-12-14 2018-11-20 重庆远创光电科技有限公司 一种芯片视觉检测系统
CN105489539B (zh) * 2015-12-14 2018-11-20 重庆远创光电科技有限公司 一种带光源的芯片载架机构
DE102016107900B4 (de) * 2016-04-28 2020-10-08 Carl Zeiss Industrielle Messtechnik Gmbh Verfahren und Vorrichtung zur Kantenermittlung eines Messobjekts in der optischen Messtechnik
CN106097376B (zh) * 2016-06-27 2020-06-23 昆山国显光电有限公司 面板修补方法及装置
WO2018006180A1 (fr) * 2016-07-08 2018-01-11 Ats Automation Tooling Systems Inc. Système et procédé d'inspection automatique et manuelle combinée
JP6984130B2 (ja) * 2017-01-17 2021-12-17 オムロン株式会社 画像処理装置、制御システム、画像処理装置の制御方法、制御プログラム、および記録媒体
CN109470713A (zh) * 2017-09-07 2019-03-15 鸿骐新技股份有限公司 红外线晶圆检测机台及芯片深层定位检测方法
WO2019239226A1 (fr) * 2018-06-12 2019-12-19 King Abdullah University Of Science And Technology Système et procédé de suivi de particules à caméra unique
CN110346381B (zh) * 2019-08-12 2022-03-08 衡阳师范学院 一种光学元件损伤测试方法及装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4692943A (en) * 1983-12-30 1987-09-08 Dr. Ludwig Pietzsch Gmbh Method of and system for opto-electronic inspection of a two-dimensional pattern on an object
US6539106B1 (en) * 1999-01-08 2003-03-25 Applied Materials, Inc. Feature-based defect detection
US6654115B2 (en) * 2001-01-18 2003-11-25 Orbotech Ltd. System and method for multi-dimensional optical inspection

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10260139A (ja) 1997-03-17 1998-09-29 Olympus Optical Co Ltd 基板自動検査装置
JPH11201863A (ja) 1998-01-07 1999-07-30 Alps Electric Co Ltd パターン検査装置
JP2000121570A (ja) * 1998-10-20 2000-04-28 Hitachi Electronics Eng Co Ltd 欠陥検査装置
IL126866A (en) * 1998-11-02 2003-02-12 Orbotech Ltd Apparatus and method for fabricating flat workpieces
JP2001319223A (ja) * 2000-05-12 2001-11-16 Matsushita Electric Ind Co Ltd パターン周期測定方法及び装置
KR20040061590A (ko) * 2002-12-31 2004-07-07 엘지.필립스 엘시디 주식회사 액정표시장치의 패턴 검사방법
KR100503530B1 (ko) * 2003-01-02 2005-07-22 삼성전자주식회사 웨이퍼의 불량검출 장치 및 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4692943A (en) * 1983-12-30 1987-09-08 Dr. Ludwig Pietzsch Gmbh Method of and system for opto-electronic inspection of a two-dimensional pattern on an object
US6539106B1 (en) * 1999-01-08 2003-03-25 Applied Materials, Inc. Feature-based defect detection
US6654115B2 (en) * 2001-01-18 2003-11-25 Orbotech Ltd. System and method for multi-dimensional optical inspection

Also Published As

Publication number Publication date
TW200504328A (en) 2005-02-01
WO2004083901A2 (fr) 2004-09-30
KR20050110005A (ko) 2005-11-22
JP2004279244A (ja) 2004-10-07
CN1839306B (zh) 2012-06-20
JP3948728B2 (ja) 2007-07-25
TWI318680B (en) 2009-12-21
KR101146081B1 (ko) 2012-05-15
CN1839306A (zh) 2006-09-27

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