WO2004081607A1 - シンチレータ部材、シンチレータユニットおよびこれらを用いた放射線検出器 - Google Patents
シンチレータ部材、シンチレータユニットおよびこれらを用いた放射線検出器 Download PDFInfo
- Publication number
- WO2004081607A1 WO2004081607A1 PCT/JP2004/002895 JP2004002895W WO2004081607A1 WO 2004081607 A1 WO2004081607 A1 WO 2004081607A1 JP 2004002895 W JP2004002895 W JP 2004002895W WO 2004081607 A1 WO2004081607 A1 WO 2004081607A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- scintillator
- rod
- members
- shaped member
- unit
- Prior art date
Links
- 230000005855 radiation Effects 0.000 title claims abstract description 35
- 239000000463 material Substances 0.000 claims description 28
- 230000001681 protective effect Effects 0.000 claims description 18
- 239000011521 glass Substances 0.000 claims description 12
- 238000003384 imaging method Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 8
- 239000003575 carbonaceous material Substances 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 4
- 239000007787 solid Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 23
- 238000004519 manufacturing process Methods 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 229920000052 poly(p-xylylene) Polymers 0.000 description 5
- -1 polyparaxylylene Polymers 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910003481 amorphous carbon Inorganic materials 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14658—X-ray, gamma-ray or corpuscular radiation imagers
- H01L27/14663—Indirect radiation imagers, e.g. using luminescent members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02322—Optical elements or arrangements associated with the device comprising luminescent members, e.g. fluorescent sheets upon the device
Definitions
- the present invention relates to a scintillator member and a scintillator unit used for medical and industrial X-ray photography and the like, and a radiation detector using the same.
- a scintillator that converts radiation into visible light has been used as an energy discriminator that discriminates X-rays and ⁇ -rays and a radiation detector such as an image sensor that obtains a radiation image.
- a scintillator is used as a substrate made of amorphous carbon or the like as described in International Publication No. WO99 / 66645 pamphlet (hereinafter referred to as Document 1).
- Document 1 There is a scintillator panel with a scintillator formed on the surface.
- a scintillation fiber composed of a material of the same quality as that of a scintillator described in Japanese Patent Application Laid-Open No. H8-94757 (hereinafter referred to as Document 2) is also disclosed.
- Document 2 Japanese Patent Application Laid-Open No. H8-94757
- the scintillator panel disclosed in Reference 1 has a scintillator formed on a substrate, the shape of the scintillator panel is almost determined by the shape of the substrate. Therefore, when scintillator panels are used for radiation detectors of various shapes and sizes, it is necessary to prepare scintillator panels having different shapes according to the types. In particular, in the case of a scintillator panel used for a large product, the substrate needs to be very large, and the scintillator must be formed uniformly here, making the production very difficult. . Also, the thickness of the scintillator is limited in a normal scintillator panel, and high-energy radiation requiring a thick scintillator is required. It was not suitable for detection.
- the distributed detector disclosed in Reference 2 is simply a bundle of scintillation fibers. Therefore, the problem is that even if it is used for a radiation detector or the like, the function cannot be sufficiently performed.
- an object of the present invention is to provide a scintillator member and a scintillator member that can be applied to products of various shapes and sizes, particularly large products when used in products such as radiation detectors. And a radiation detector using the same.
- a scintillator member according to the present invention is formed by radially depositing a scintillator on a side surface of a rod-shaped member.
- the scintillator member according to the present invention has a scintillator formed on the side surface of the rod-shaped member.
- the support member forming the scintillator as a rod-shaped member and forming the scintillator on the side surface, the size of the scintillator member can be easily reduced. Therefore, by adjusting the number of the scintillator members to be used, the scintillator members can be suitably used for products such as image sensors of various shapes and sizes. In particular, when manufacturing a large product, a large product can be easily manufactured by using a large number of scintillator members.
- the length of the rod-shaped member can be freely set, if the length of the rod-shaped member is increased, the thickness of the scintillator will eventually be increased. -High-energy radiation that can not be absorbed by tapers can be absorbed.
- the rod-shaped member is a material that transmits light emitted from the scintillator.
- the rod-shaped member is made of a material that transmits light emitted from the scintillator, light emitted from the scintillator is guided through the rod-shaped member, for example, in the direction of a support plate supporting the rod-shaped member. . Therefore, light emitted from the scintillator can be reliably guided to a desired position.
- Glass is suitable as the light-transmitting material. By using glass, when the scintillator emits visible light, it is possible to reliably cover the converted visible light and to suitably support the scintillator.
- the rod-shaped member may be made of a metal material.
- a high strength scintillator member can be obtained.
- light emitted from the scintillator can be reflected on the surface of the rod-shaped member and guided in a desired direction such as a support plate.
- the rod-shaped member may be made of a carbon-based material.
- a carbon-based material By forming the rod-shaped member from a carbon-based material, it is possible to prevent the incidence of radiation such as X-rays.
- the rod-shaped member has a cylindrical shape. By making the rod-shaped member cylindrical, it becomes easy to arrange a plurality of scintillators evenly when a plurality of scintillator members are arranged on the same surface. Also, when forming the scintillator on the rod-shaped member, it becomes easy to form the scintillator evenly from the surface.
- an embodiment may be adopted in which a protective film is formed on the surface of the scintillator formed on the rod-shaped member.
- a protective film is formed on the surface of the scintillator formed on the rod-shaped member.
- the protective film has a moisture-proof property.
- Scintillators are generally highly deliquescent. If the deliquescence is high in this way, it deteriorates due to the adhesion of moisture. However, the contact between the scintillator and moisture can be suitably prevented by providing the protective film with moisture proofness. Therefore, deliquescence of the scintillator can be suitably prevented.
- the reflective film is formed on the surface of the scintillator formed on the rod-shaped member. As described above, since the reflecting film is formed on the surface of the scintillator, the light emitted from the scintillator does not leak out of the scintillation member due to the scintillation light emission due to the incidence of radiation. And the amount of detected light can be increased.
- a scintillator unit includes a scintillator bundle formed by bundling any of the above-mentioned scintillator members. Things. As described above, by forming any one of the above-mentioned scintillator members in a bundle, by adjusting the number of the scintillator members, etc., the scintillator members can be suitably used for products of various shapes and sizes. Can be.
- a scintillator array formed by preparing a plurality of any of the above-mentioned scintillator members, and disposing each rod-shaped member of the plurality of scintillator members coaxially is formed. It is also possible to adopt a mode including: In this manner, even when the plurality of scintillator members are arranged coaxially, the scintillator members can be used in a manner corresponding to the shape of the product.
- a mode may be adopted in which a fixing member is interposed between the plurality of scintillator members to fix the plurality of scintillator members.
- a radiation detector according to the present invention is one in which an imaging element is connected to a rod-shaped member in the scintillator unit. Further, a mode in which the photoelectric conversion element is connected to the rod-shaped member in the scintillator unit may be adopted.
- FIG. 1 is a side sectional view of an image sensor including a scintillator unit according to the present invention
- FIG. 2 is a plan sectional view thereof.
- FIG. 3 is a plan sectional view of the scintillator member of the apparatus of FIGS. 1 and 2, and FIG. 4 is a side sectional view thereof.
- FIG. 6A to 6C are process diagrams showing another manufacturing process of the scintillator member of FIG.
- FIG. 7 is a side sectional view showing a state in which the scintillator member manufactured according to FIGS. 6A to 6C is accommodated in a glass tube.
- FIG. 8 is a side sectional view of a scintillator base material manufactured using the scintillator member of FIG.
- FIG. 9 is a side sectional view of a scintillator unit formed by cutting the scintillator base material of FIG.
- FIG. 1 shows an image including a scintillator unit according to the present embodiment.
- FIG. 2 is a side sectional view of the disensor, and FIG.
- the image sensor (radiation detector) M according to the present embodiment includes a scintillator unit 1.
- the scintillator unit 1 includes a plurality of scintillator members 2. As shown in FIG. 2, the plurality of scintillator members 2 are arranged such that adjacent scintillator members 2 are substantially in close contact with each other.
- the scintillator member 2 includes a columnar base material 11 which is a rod-shaped member, and the side surface thereof includes radiation such as X-rays and ⁇ -rays.
- the scintillator 12 for converting the light into light of a predetermined wavelength is formed radially over the entire circumference.
- ⁇ 1 doped CsI is used, and CsI has a structure in which a large number of needle-like crystals (columnar crystals) stand.
- the scintillator 12 is formed on the surface around the substrate 11 by a vapor deposition method.
- the scintillator 12 according to the present embodiment emits visible light by X-ray incidence.
- the base material 11 is formed of glass, has radiation transmissivity, and allows light to propagate therein.
- the base material 11 can be formed of amorphous carbon or another material containing carbon as a main component, in addition to glass.
- FIG. 5A a substrate 11 is prepared, and the substrate 11 is rotated around its axis.
- the substrate 11 is rotated, and a scintillator component serving as a material for forming the scintillator is deposited on the side surface of the substrate 11.
- FIG. 5B when the scintillator component is deposited while rotating the substrate 11, the scintillator 12 on the surface of the substrate 11 gradually grows.
- FIG. 5C when the scintillator 12 has grown to a desired length, the rotation of the base material 11 is stopped, and the growth of the scintillator 12 is stopped, so that the scintillator member 2 is formed.
- FIG. 5C when the scintillator 12 has grown to a desired length, the rotation of the base material 11 is stopped, and the growth of the scintillator 12 is stopped, so that the scintillator member 2 is formed.
- the scintillator 12 formed on the scintillator member 2 A protective film 13 is formed on the surface, and the surface of the scintillator 12 is covered with the protective film 13.
- the protective film 13 is made of, for example, polyparaxylylene, and prevents physical and chemical damage to the scintillator 12.
- the use of polyparaxylylene demonstrates high moisture resistance.
- the scintillator 12 used here has a high deliquescent property, the deliquescent of the scintillator 12 is prevented by protecting polyparaxylylene with a high moisture-proof property.
- a xylene-based resin such as polyparaxyloxylene can be used as polyparaxyloxylene can be used.
- a metal reflection film 14 serving as a reflection film is formed via a protective film 13.
- the metal reflective film 14 is made of a metal such as aluminum, for example, and covers the surface of the scintillator 12 via the protective film 13. This prevents the visible light emitted by the scintillator 12 from leaking out of the scintillator 12.
- the metal reflective film 14 include the above-mentioned aluminum (A 1), and various types thereof. For example, Ag, Cr, Cu, Ni, Ti, Mg, Rh, Pt, and A A material containing a substance in the group consisting of u can be used.
- the plurality of scintillator members 2 are housed in a case 3 whose lower surface is open.
- the case 3 is formed of, for example, a resin having radiolucency, but may be formed of, for example, a glass tube, amorphous carbon, or another material mainly containing carbon.
- the plurality of scintillator members 2 are fixed and bundled inside the case 3 by a fixing member made of, for example, a transparent resin, and are arranged so as to fill the inside of the case 3 as much as possible.
- the fixing member is formed, for example, by solidifying the molten resin.
- the molten resin is poured into the case 3, and the molten resin is impregnated with a plurality of scintillator members 2, and the resin is cooled and solidified. By doing so, the plurality of scintillator members 2 can be fixed.
- a solid-state image sensor 20 serving as an image sensor is arranged on the open surface of the case 3 in the scintillator unit 1.
- the end of the substrate 11 of the scintillator member 2 is connected to the solid-state imaging device 20 serving as an imaging device, and the solid-state imaging device 20 is connected to the scintillator 12 via the substrate 11.
- the image sensor M In the image sensor M according to the present embodiment, radiation is incident from the incident surface at a position facing the open surface of the case 3. The radiation entering from the incident surface proceeds straight as it is, passes through the metal reflective film 14 and the protective film 13, and reaches the scintillator 12 of the scintillator member 2. When the radiation collides with the scintillator 12, the scintillator 12 emits scintillation light, and the scintillator 12 generates light of a predetermined wavelength (visible light in the present embodiment). The visible light generated by the scintillator 12 is emitted directly toward the substrate 11 or the metal reflection film 14.
- the visible light directly traveling to the substrate 11 directly enters the substrate 11, propagates through the substrate 11, and reaches the solid-state imaging device 20.
- the visible light directed to the metal reflection film 14 is reflected by the metal reflection film 14 and then enters the base material 11. The visible light thus incident on the substrate 11 propagates through the substrate 11 and reaches the solid-state imaging device 20.
- the radiation incident from the incident surface of the case 3 proceeds straight as it is, and is converted into visible light by the scintillator 12 of the scintillator member 2, and the solid-state imaging device passes through the base 11. Propagated to 20. Therefore, the radiation image incident from the incident surface is visualized as it is, reaches the solid-state imaging device 20 as a visible light image, and the visible light image is captured, so that it functions as an image sensor. Become.
- a plurality of scintillators The single member members 2 are bundled to form a scintillator bundle. For this reason, for example, even when manufacturing an image sensor having a different shape or size, the number of scintillator members forming the scintillator bundle and the manner in which the scintillator members are bundled are appropriately adjusted to manufacture the image sensor. It is possible to easily manufacture a scintillator bundle conforming to the shape and the like. Therefore, regardless of the shape and size of the image sensor, the scintillator member according to the present embodiment can be suitably used. Moreover, by using a large number of scintillator members, the scintillator portion (scintillator unit) used for the image sensor can be easily manufactured even when a large-sized image sensor is manufactured.
- the scintillator member can be manufactured as follows. 6A to 6C are process diagrams illustrating another manufacturing process of the scintillator member. In this manufacturing process, as shown in FIG. 6A, a suspending member 30 capable of suspending a plurality of base materials 11 is used. As the substrate 11 at this time, for example, a glass fiber having a diameter of 0.5 mm and a length of 10 O mm is used.
- the hanging member 30 has a rotating shaft 31 extending in the vertical direction, and a hanging bar 32 is attached to the rotating shaft 31.
- a plurality of, in this embodiment, five, substrates 11 are suspended from the hanging rods 32, and by rotating the rotating shaft 31, the hanging rods 32 become the rotating shafts 3.
- Rotate around 1 an evaporator 33 for evaporating the scintillator component is placed below the hanging member 30.
- the scintillator component composed of, for example, Csi: T1 is evaporated by the evaporator 33 while rotating the hanging rod 32. Then, as shown in FIG. 6B, the scintillator gradually grows around the substrate 11. By evaporating the scintillator component by the evaporator 33 while rotating the hanging rod 32 as it is, the scintillator 12 grows to a desired thickness, for example, 0.5 mm as shown in FIG. 6C. I do. The scintillator member 2 is completed. By manufacturing the scintillator member 2 by this manufacturing method, a large amount of the scintillator member 2 can be manufactured in a short time.
- the thus-produced scintillator members 2, 2,... Are each coated with a protective film 13 made of polyparaxylylene. Then, as shown in FIG. 7, a plurality of scintillator members 2, 2,... Are packed and housed in a glass tube 40 with as few gaps as possible. Subsequently, as shown in FIG. 8, a transparent resin is filled in the glass tube 40, and after being defoamed, solidified to form the fixing member 41, thereby producing the scintillator base material 42. After the scintillator base material 42 is manufactured, as shown in FIG. 9, the glass tube 40 and its contents are cut into a length of about 20 mm using a thin blade cutter.
- a protective film 43 for protecting the cut surface is formed by the same procedure as that for forming the protective film on the surface of the scintillator member 2, and a scintillator unit 5 ° is manufactured.
- Radiation is incident on one side 50a of the scintillator cut 50 that intersects the parallel direction of the scintillator members 2 in the parallel direction, and a solid-state image pickup device (not shown) By arranging them, a radiation detector can be obtained. Note that 50a and 50b can also be used in the opposite direction.
- a glass base material is used as the base material that is the rod-shaped member, but other light-transmitting materials can be used.
- a metal substrate can be used as the base material, and a carbon-based material should be used so as not to impede radiation. You can also.
- a scintillator member formed by vapor deposition on a base material is inserted into a translucent tubular member such as glass to form a translucent tubular member. Light can be guided using the member as a light guide.
- the base material as the rod-like member has a cylindrical shape.
- the shape is not limited to this, and for example, a prismatic shape or an elliptic shape can be used.
- the rod-shaped member is not limited to a columnar body.
- a rod-shaped member having a cone shape such as a cone or a pyramid, a shape having a truncated top portion, or a wavy shape having a constricted central portion in the height direction is used.
- the scintillator members when forming the scintillator unit, are arranged in a direction intersecting (orthogonal to) the axial direction to form a scintillator bundle. It is also possible to form a bundle.
- the scintillator bundle directly fixed by the fixing member is accommodated inside the case 3, but for example, a reflection film such as a metal reflection film or the like is provided inside the case. At least one of the protective films may be interposed. At this time, the reflective film and the protective film can be formed by attaching to the inner surface of the case 3 or the like.
- the scintillator bundle is formed by using the fixing member, but the scintillator bundle is formed by fixing the scintillator member to the case or the solid-state imaging device. You can also.
- a scintillator unit with a solid-state imaging device attached is used as the image sensor, but a photoelectric conversion element such as a photomultiplier tube may be used, for example.
- the photoelectric conversion element can be used as an image sensor by connecting it to a monitor via a predetermined image processing circuit.
- radiation detectors can also be used for energy discriminators.
- C s I (T 1) is used as the scintillator.
- the present invention is not limited to this.
- C si (N a), Na I (T l), L i I (E u), K i (T 1), etc. can also be used.
- the scintillator is not limited to a type that emits visible light, but may be a type that emits ultraviolet light or infrared light upon incidence of radiation. In this case, an image sensor having sensitivity to the converted light may be used, and a base material serving as a light guide is preferably one having transparency to the converted light.
- the scintillator member and the scintillator unit according to the present invention can be suitably used for producing detectors such as a large-area scintillator panel and a radiation image sensor, and various shapes of radiation.
- the image sensor can be suitably used for producing a radiation detector.
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Measurement Of Radiation (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/548,411 US7700924B2 (en) | 2003-03-10 | 2004-03-05 | Scintillator element, scintillator unit, and radiation detector using the same |
EP20040717778 EP1605278A4 (en) | 2003-03-10 | 2004-03-05 | SCINTILLATION ELEMENT, SCINTILLATION UNIT AND RADIATION DETECTOR COMPRISING THIS ELEMENT AND THIS UNIT |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003063931A JP4377596B2 (ja) | 2003-03-10 | 2003-03-10 | シンチレータ部材およびその製造方法、並びにシンチレータユニット |
JP2003-063931 | 2003-03-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004081607A1 true WO2004081607A1 (ja) | 2004-09-23 |
Family
ID=32984453
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/002895 WO2004081607A1 (ja) | 2003-03-10 | 2004-03-05 | シンチレータ部材、シンチレータユニットおよびこれらを用いた放射線検出器 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7700924B2 (ja) |
EP (1) | EP1605278A4 (ja) |
JP (1) | JP4377596B2 (ja) |
WO (1) | WO2004081607A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006147554A (ja) * | 2004-11-15 | 2006-06-08 | General Electric Co <Ge> | 放射線検出のための楕円形ガス封入式検出器 |
EP1921465B1 (en) * | 2006-11-13 | 2017-12-20 | Kabushiki Kaisha Toshiba | Survey meter |
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US4230510A (en) | 1977-11-21 | 1980-10-28 | General Electric Company | Distributed phosphor scintillator structures |
JPH01229995A (ja) * | 1988-03-10 | 1989-09-13 | Hamamatsu Photonics Kk | 放射線位置検出器 |
US5168540A (en) * | 1990-09-12 | 1992-12-01 | Advanced Technology Materials Inc. | Scintillating articles and method of making the same |
JPH0894758A (ja) | 1994-09-26 | 1996-04-12 | Mitsubishi Electric Corp | シンチレーションファイバを用いた分布型検出器 |
US6271510B1 (en) * | 1998-12-18 | 2001-08-07 | Izzie Boxen | Fiber optic gamma camera having scintillating fibers |
US7373197B2 (en) * | 2000-03-03 | 2008-05-13 | Intramedical Imaging, Llc | Methods and devices to expand applications of intraoperative radiation probes |
US6996209B2 (en) * | 2003-10-27 | 2006-02-07 | Ge Medical Systems Global Technology Company, Llc | Scintillator coatings having barrier protection, light transmission, and light reflection properties |
US6934453B2 (en) * | 2003-11-06 | 2005-08-23 | General Electric Company | Fiber optic brush light detector and method |
US7732788B2 (en) * | 2007-10-23 | 2010-06-08 | Hamamatsu Photonics K.K. | Radiation image converting panel, scintillator panel and radiation image sensor |
-
2003
- 2003-03-10 JP JP2003063931A patent/JP4377596B2/ja not_active Expired - Fee Related
-
2004
- 2004-03-05 WO PCT/JP2004/002895 patent/WO2004081607A1/ja active Application Filing
- 2004-03-05 EP EP20040717778 patent/EP1605278A4/en not_active Withdrawn
- 2004-03-05 US US10/548,411 patent/US7700924B2/en not_active Expired - Fee Related
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JPH07311269A (ja) * | 1994-03-23 | 1995-11-28 | Toshiba Corp | 放射線測定装置 |
JPH09236669A (ja) * | 1996-03-01 | 1997-09-09 | Tohoku Electric Power Co Inc | ファイバ型放射線検出器 |
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Publication number | Publication date |
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EP1605278A4 (en) | 2015-05-06 |
JP2004271392A (ja) | 2004-09-30 |
US20080217549A1 (en) | 2008-09-11 |
US7700924B2 (en) | 2010-04-20 |
JP4377596B2 (ja) | 2009-12-02 |
EP1605278A1 (en) | 2005-12-14 |
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