Classifications

• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
  • H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
  • H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
  • H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
  • H03B5/36—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator active element in amplifier being semiconductor device
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
  • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
  • H03H9/02—Details
  • H03H9/05—Holders or supports
  • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
  • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
  • H03H9/0552—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement the device and the other elements being mounted on opposite sides of a common substrate
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
  • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
  • H03H9/02—Details
  • H03H9/05—Holders or supports
  • H03H9/10—Mounting in enclosures
  • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
  • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
  • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type

Definitions

• the present invention relates to an improvement of a surface mount type piezoelectric oscillator having a double seal structure in which IC components are arranged outside a piezoelectric vibrator and integrated with each other, and in particular, a surface mount type piezoelectric oscillator which can be reduced in height and cost.
• a surface mount type piezoelectric oscillator having a double seal structure in which IC components are arranged outside a piezoelectric vibrator and integrated with each other, and in particular, a surface mount type piezoelectric oscillator which can be reduced in height and cost.
• the piezoelectric oscillator 100 is composed of a piezoelectric vibrator 101 having a structure in which a piezoelectric vibrating element is sealed in a ceramic container 102, and a ceramic container 1 fixed to the bottom surface of the piezoelectric vibrator 101. And an IC component (semiconductor integrated circuit component) 106 as a chip component disposed in the recess of the ceramic container 105.
• IC component semiconductor integrated circuit component
• the present invention has been made in view of the above, and provides a surface-mounted piezoelectric oscillator having a configuration in which chipped IC components are arranged outside a piezoelectric vibrator and integrated therewith. It is an object of the present invention to provide a surface mount type piezoelectric oscillator that can solve the problem of high cost and large size caused by combining a ceramic container for mounting components. Disclosure of the invention
• a surface mount type piezoelectric oscillator includes a container made of an insulating material having a bottom electrode and a connection pad for mounting an IC component on an outer bottom surface, and a gas inside the container.
• a piezoelectric vibrator having a hermetically sealed piezoelectric vibrating element, an IC component constituting an oscillation circuit connected to the connection pad of the container, and an outer surface of the container including the IC component disposed so as to cover the outer bottom surface of the container. And a mounting terminal exposed on the bottom surface of the resin mold layer.
• a surface-mounted piezoelectric oscillator is constructed by integrating a piezoelectric vibrator, in which a piezoelectric vibrating element is hermetically sealed in an insulating container such as a ceramic container, with IC components that make up an oscillation circuit, etc.
• an insulating container such as a ceramic container
• IC components that make up an oscillation circuit, etc.
• the proportion of the ceramic container in the product cost will increase and the cost will increase. Inviting.
• the two containers were stacked in two stages, which resulted in a reduction in height.
• the IC component is directly mounted on the connection pad provided on the outer bottom surface of the crystal oscillator without using a high-cost insulating container such as a ceramic as a means for protecting the IC component.
• the bottom surface of the container including the parts is covered with a resin mold layer. Since it is inverted, a compact and inexpensive piezoelectric oscillator can be obtained. Also, since the mounting terminals are located on the lower surface of the resin mold layer, surface mounting can be performed.
• the invention according to claim 2 is characterized in that in claim 1, the mounting terminal is constituted by a lead frame connected to the connection pad.
• a terminal member is used to ensure conduction between the bottom electrode provided on the outer bottom surface of the crystal unit and the external terminal exposed on the bottom surface of the resin mold layer, use a lead frame to which a plurality of these terminal members are connected. As a result, the work of connecting external terminals to a plurality of crystal units can be performed collectively and efficiently, thereby improving productivity.
• a surface mount type piezoelectric oscillator comprises a container body made of an insulating material having a recess on a lower surface and a mounting terminal for surface mounting on a lower end surface of a peripheral wall surrounding the recess.
• a piezoelectric vibrating element connected to an internal pad provided on the ceiling surface of the recess of the container body; and a metal that is fixed to the inner wall of the peripheral wall of the recess so as not to protrude below the lower end surface of the peripheral wall.
• a piezoelectric vibrator having a lid, an IC component constituting an oscillation circuit connected to a connection pad provided on the upper surface of the container body, and a cover arranged to cover the upper surface of the container including the IC component. And a resin mold layer.
• a typical surface-mount type piezoelectric vibrator has a recess on the top side of the ceramic container and mounting terminals on the bottom side, and has a configuration in which the piezoelectric vibrating element is hermetically sealed in the recess.
• a recess is provided on the lower surface side of the ceramic container, mounting terminals are arranged on the lower surface of a peripheral wall surrounding the recess, and a metal lid is fixed so as to be buried in the recess.
• the IC components constituting the oscillation circuit are mounted, and the upper surface of the ceramic container including the IC components is also formed.
• the surface mount type piezoelectric oscillator according to the invention of claim 4 has a recess on the lower surface and surrounds the recess.
• a container body made of an insulating material having a mounting terminal for surface mounting on the lower end surface of the peripheral wall to be connected, a connection pad provided on the upper surface of the container body, and a ceiling surface provided in a recess of the container body.
• a piezoelectric vibrator comprising: a piezoelectric vibrating element connected to the internal pad; and a metal lid fixed to the inner wall of the peripheral wall of the recess so as not to protrude below the lower end surface of the peripheral wall.
• an Ic component constituting an oscillation circuit connected to the connection pad provided on the upper surface of the container.
• a surface-mount type piezoelectric vibrator includes a container body made of an insulating material having a concave portion on a lower surface and a mounting terminal for surface mounting on a lower end surface of a peripheral wall surrounding the concave portion.
• a piezoelectric vibrating element connected to an internal pad provided on the ceiling surface of the recess of the container body, and which does not protrude below the lower end surface of the peripheral wall by being fixed to the inner wall of the peripheral wall of the recess.
• a metal lid is a metal lid.
• the entire height of the piezoelectric vibrator can be reduced by the amount that the metal lid does not protrude from the container body.
• FIG. 1A, 1B, and 1C are a perspective view, a vertical sectional view, and a perspective view of a crystal resonator of a surface mount type crystal oscillator according to an embodiment of the present invention, and FIG. It is explanatory drawing of embodiment.
• FIG. 2 is a schematic cross-sectional view illustrating a manufacturing procedure (resin molding method) of the crystal oscillator of the present invention.
• FIG. 3A and 3B are a front view showing a configuration of a crystal oscillator according to a second embodiment of the present invention, and a perspective cross-sectional view of the crystal oscillator, and FIG. 3C is a front vertical cross-section of a crystal resonator portion.
• FIG. 3A and 3B are a front view showing a configuration of a crystal oscillator according to a second embodiment of the present invention, and a perspective cross-sectional view of the crystal oscillator
• FIG. 3C is a front vertical cross-section of a crystal resonator portion.
• FIG. 4 is an explanatory diagram of a conventional example. BEST MODE FOR CARRYING OUT THE INVENTION
• a surface-mounted crystal oscillator will be described as an example of a surface-mounted piezoelectric oscillator.
• FIGS. 1 (a), 1 (b) and 1 (c) are an external perspective view, a longitudinal sectional view, and a perspective view when viewed from the bottom surface of a crystal oscillator according to an embodiment of the present invention. .
• a resin mold layer 25 covering the outer bottom is formed with the IC component 20 mounted on the outer bottom of the crystal unit 10, and further mounted on the outer bottom of the resin mold layer 25. It has a configuration in which terminals 30 are exposed.
• the crystal oscillator 1 is composed of a crystal resonator 10 having a configuration in which a crystal resonator 11 is hermetically sealed in a container 2 made of an insulating material such as a ceramic provided with a bottom electrode 3 on an outer bottom surface 2a.
• the oscillation circuit mounted on the outer bottom surface 2a of the container 2
• the crystal resonator 10 is formed by a metal cover 13 with the crystal resonator 11 connected to an internal pad provided on the inner bottom surface of the recess provided on the upper surface of the ceramic container body 12. It has a hermetically sealed configuration.
• the crystal resonator 11 has a configuration in which an excitation electrode is formed on a crystal substrate surface by vapor deposition or the like.
• the metal lid 13 is connected to the ground-side bottom electrode 3 via a conductor (not shown).
• the lower surface of the container body 12 is provided with a bottom electrode 3 electrically connected to the internal pad, a connection pad 4 for mounting the IC, and other wiring patterns.
• the IC component 20 is fixed on the connection pad 4 by a hang or the like, and the electrical connection between the IC component 20 and the mounting terminal 30 is secured by a bonding wire 21. That is, after fixing the IC component 20 on the bottom surface of the container 2 so that the terminal forming surface side of the IC component 20 faces downward, the terminal 20 a on the bottom surface of the IC component 20 and each mounting terminal 30 are connected. Are connected by wire 21. Further, in this example, conduction between the bottom electrode 3 and the terminal 20 a of the IC component 20 is also ensured by the bonding wire 21.
• a lead frame 31 in which a plurality of mounting terminals 30 are connected is prepared, and each mounting terminal is placed at a predetermined position of the container body 12 with solder, conductive adhesive, or the like.
• One end of 30 is fixed at 30a. That is, a plurality of crystal units 10 are arranged at a predetermined interval, and each of the lead frames 31 is formed with respect to the bottom surface (the outer bottom surface 2 a between the bottom electrodes 3) of each crystal unit 10.
• the IC component 20 mounted on the bottom surface of the crystal unit 10 is covered and integrated with a low-priced resin material. Since the mounting terminals 30 are exposed on the bottom surface, it is not necessary to use an expensive ceramic container or the like, and cost can be reduced.
• the thickness of the resin mold layer 25 may be set to a minimum necessary thickness that can cover the IC component 20 and sufficiently protect the IC component 20 from external stress, moisture, and the like. The height can be significantly reduced compared to the conventional type in which ceramic containers are stacked in two stages.
• the mounting terminal 30 is fixed by soldering or the like on the connection pad 4 previously formed on the outer bottom surface 2 a of the container 2 without using a bonding wire.
• each terminal of the IC component 20 is connected to each connection pad 4 with its terminal forming surface facing the outer bottom surface 2a.
• FIG. 2 is a schematic cross-sectional view showing a manufacturing procedure (resin molding method) of the crystal oscillator of the present invention.
• an IC component 20 and a lead frame 31 (mounting terminal 30) are provided on the outer bottom surface as shown.
• the connected crystal unit 10 is housed upside down in each recess 41 of the mold 40, and the sprue (not shown) is closed with each recess 41 closed by the lid 42. From the liquid resin. After the resin has hardened, the lid 42 is opened and the completed crystal oscillator 1 is taken out from each recess 41. At this time, if the unnecessary portion 32 of the lead frame 31 is not cut, it may be cut after being taken out of the mold.
• the individual quartz oscillators can be housed in the recesses 41 of the mold and then can be collectively resin-molded. Compared to a case where a ceramic package is manufactured and assembled with a crystal unit, the total man-hour is reduced, and as a result, the manufacturing cost is also significantly reduced.
• FIGS. 3A and 3B are a front view showing a configuration of a crystal oscillator according to a second embodiment of the present invention, a perspective sectional view of the crystal oscillator, and FIG. It is a front vertical sectional view of a part.
• the crystal oscillator 50 shown in FIG. 3 (a) is obtained by mounting an IC component 52 constituting an oscillation circuit on the upper surface of a crystal oscillator 51, and then mounting the upper surface of the crystal oscillator including the IC component 52. Is integrated with a resin mold layer 53. As will be described later, the crystal unit 51 and the crystal oscillator without resin molding each have new features.
• the crystal unit 51 has a recess 56 on the lower surface and a mounting terminal 59 for surface mounting on the lower end surface of the peripheral wall 58 surrounding the recess 56.
• the container body 55 made of insulating material provided, the piezoelectric vibration element 57 mounted on the inner pad 56 a provided on the ceiling surface of the recess 56 of the container body 55, and the peripheral wall of the recess 56
• a metal lid 60 fixed to the lower surface of the step 58a formed on the inner wall of the 58 so as not to protrude below the lower end surface of the peripheral wall.
• the crystal unit 51 itself has a novel feature.
• the crystal unit 51 is provided with a metal lid on the lower surface (seam ring for grounding) of the step 58 a provided on the inner wall of the concave of the ceramic container body 55 having a concave 56 on the lower surface. Since 60 is fixed, the height of the crystal unit 51 can be reduced by the thickness of the metal cover 60. Furthermore, as a result of the structure in which the metal lid 60 does not protrude, the mounting terminal 59 can be arranged on the side where the recess 56 is formed, that is, on the lower surface side of the container body 55. is there.
• FIG. 3 (b) shows a wiring pattern (contact) formed in advance on the upper surface of the container body 55 of the crystal unit 51 having a novel package structure as shown in FIG. 3 (C).
• a single surface-mounted crystal oscillator 50 completed by connecting IC components 52 that constitute an oscillation circuit is shown in Fig. 5 (continued pad).
• the crystal oscillator 50 with the IC component 52 exposed on the upper surface can be mounted on a motherboard (not shown) for use.
• the upper surface of the container including the IC component 52 is covered. Since the IC component 52 is protected by the resin mold layer 53, the crystal oscillator 50 hardened after covering the resin mold layer 53 can have improved durability.
• the product name is displayed using the outer surface of the resin mold layer 53, or the flat outer surface of the resin mold layer 53 is suctioned and transferred by the suction pad, so that it can be automatically mounted on the motherboard. It can be installed.
• a protection structure for IC parts without using an expensive ceramic container
• a surface mount type piezoelectric oscillator and a piezoelectric vibrator which can also achieve a reduction in height at the same time.
• the surface mount type piezoelectric oscillator according to the invention of claim 1 is a connection pad provided on the outer bottom surface of the crystal resonator without using a high-cost insulating container such as a ceramic as a means for protecting IC components. Since the IC components are directly mounted on top and the outer bottom surface of the container including the IC components is covered with a resin mold layer for protection, a compact and inexpensive surface-mounted piezoelectric oscillator can be obtained.
• the mounting terminals are constituted by the lead frames connected to the connection pads, it is possible to collectively and efficiently connect the external terminals to a plurality of piezoelectric vibrators, Increases productivity You.
• the surface-mount type piezoelectric oscillator according to the invention of claim 3 is such that a recess is provided on the lower surface side of the ceramic container, mounting terminals are arranged on the lower surface of a peripheral wall surrounding the recess, and further buried in the recess. Since the metal lid is fixed, it is possible to reduce costs, reduce the number of manufacturing steps, improve productivity, and reduce height.
• a piezoelectric oscillator in which IC components are mounted on a crystal oscillator container can be constructed without forming a resin mold layer. , Cost can be reduced. According to the invention of claim 5, the entire height of the piezoelectric vibrator can be reduced by the amount that the metal lid does not protrude from the container body.

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• Physics & Mathematics (AREA)
• Acoustics & Sound (AREA)
• Oscillators With Electromechanical Resonators (AREA)
• Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Applications Claiming Priority (2)

Publications (1)

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ID=32708998

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Citations (5)

• 2003
  • 2003-01-10 JP JP2003005081A patent/JP2004221791A/ja not_active Withdrawn
  • 2003-10-31 WO PCT/JP2003/014056 patent/WO2004064245A1/ja unknown

Patent Citations (5)

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