WO2004057378A1 - Element optique revetu ayant une action correctrice obtenue par la production de variations d'epaisseur de couche ou de variations d'indice de refraction dans le revetement - Google Patents

Element optique revetu ayant une action correctrice obtenue par la production de variations d'epaisseur de couche ou de variations d'indice de refraction dans le revetement Download PDF

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Publication number
WO2004057378A1
WO2004057378A1 PCT/EP2003/014543 EP0314543W WO2004057378A1 WO 2004057378 A1 WO2004057378 A1 WO 2004057378A1 EP 0314543 W EP0314543 W EP 0314543W WO 2004057378 A1 WO2004057378 A1 WO 2004057378A1
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WO
WIPO (PCT)
Prior art keywords
coating
layer
optical element
intermediate layer
layer thickness
Prior art date
Application number
PCT/EP2003/014543
Other languages
German (de)
English (en)
Inventor
Gerd Reisinger
Alexandra Pazidis
Aksel GÖHNERMEIER
Alexander Dinger
Thomas Petasch
Thure Böhm
Rainer BÖRRET
Original Assignee
Carl Zeiss Smt Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carl Zeiss Smt Ag filed Critical Carl Zeiss Smt Ag
Priority to AU2003290093A priority Critical patent/AU2003290093A1/en
Publication of WO2004057378A1 publication Critical patent/WO2004057378A1/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/18—Coatings for keeping optical surfaces clean, e.g. hydrophobic or photo-catalytic films
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/5873—Removal of material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
    • G03F7/70958—Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties

Definitions

  • the invention relates to coated lenses and other optical elements with an optical correction effect.
  • the invention relates in particular to those optical elements which are intended for use in microlithographic projection objectives.
  • the invention relates to a method for manufacturing and a method for surface processing of such an optical element.
  • Microlithographic projection exposure systems such as those used in the manufacture of highly integrated electrical circuits, have an illumination device which is used to generate a projection light beam.
  • the projection light beam is directed onto a reticle, which contains the structures to be imaged by the projection illumination system and is arranged in an object plane of a projection objective.
  • the projection lens reduces the structures of the reticle onto a light-sensitive layer that is located in an image plane of the projection lens and e.g. can be applied to a wafer.
  • aberrations that occur are assigned to the following two categories.
  • Manufacturing errors include, for example, so-called pass errors, which are understood to mean deviations from the area fidelity in optical surfaces.
  • Material defects on the other hand, generally do not affect the properties of the optically effective surfaces, ie those penetrated by projection light, but instead lead to inhomogeneous refractive index profiles within the optical element.
  • disturbances which are locally limited but can also extend over a larger area of the optical element in question.
  • the optical element is preferably a plane-parallel plate which is arranged between the reticle and the projection lens of the projection exposure system.
  • lenses are also suitable as carriers for correction structures.
  • the lens bodies are first inserted into a frame, built into the projection lens or another optical system, and adjusted there.
  • the shape of the correction structures on the lens body is now determined on the basis of measurements of the imaging properties of the projection objective.
  • the lens body is then removed again in order to produce the correction structure on the selected lens surface.
  • the surfaces of the lens body penetrated by projection light are provided with an anti-reflective coating.
  • Such coatings known per se, generally have n layers with different refractive indices, n being between 1 and about 12, typically between 2 and 10. The larger the angular range with which projection light strikes the coating, the greater the number n of layers in general.
  • correction structures can be damaged by the coating.
  • coatings which are applied to lens bodies provided with correction structures are generally mechanically relatively unstable and their action can easily be impaired by contamination. This applies in particular to coatings with a particularly large number of layers, such as those e.g. on high-angle lenses in high-aperture projection lenses.
  • lenses are selected as carriers of the correction structures which are less stressed at an angle and can therefore be provided with thinner coatings.
  • Another disadvantage is that it is difficult or even impossible to corrective structures by ablative methods. to generate on a very small area or with steep gradients.
  • the object of the invention is to provide an overall improved coated optical element with an optical correction effect.
  • the object of the invention is also to specify a method for producing such an optical element.
  • a method for processing the surface of an optical element is to be specified by that a surface correction that has been carried out is retained as far as possible without change.
  • this object is achieved by an optical element with an element body and a coating applied to the element body, the coating containing at least one correction structure by means of which the optical path length for light passing through is changed locally.
  • the invention is based on the knowledge that the mechanical instability and susceptibility to contamination of thick coatings which are applied to lenses with correction structures are a consequence of the production process.
  • the lens bodies must first be inserted into a holder before the correction structures are applied by removing material, since they can only be installed and adjusted in the optical system for the purpose of measurement.
  • the lens bodies inserted into the frame only allow a relatively slight heating during the subsequent coating.
  • the comparatively cold applied coating shows the undesirable properties mentioned, such as mechanical instability and susceptibility to contamination.
  • the lens body must be inserted into one
  • Lens holder only after applying several layers required. The further away the layer containing correction structures is from the element body, the more layers can be applied to the underlying layer or the element body at a higher temperature. These layers applied at a higher temperature are mechanically stable and resistant to contamination.
  • the coating in the second step can be locally irradiated with high-energy radiation of such a high intensity that the refractive index of the coating at the irradiated point is corrected for image field optimization.
  • the change in the coating can e.g. in the first-mentioned embodiment of the invention by a removal process, such as a reactive ion etching process or an ion beam ablation process.
  • the coating in a targeted manner, it can also be subjected to a doping process, wherein due to the material introduced, eg atoms, the refractive index of the coating is changed so that image errors can be corrected.
  • a doping process wherein due to the material introduced, eg atoms, the refractive index of the coating is changed so that image errors can be corrected.
  • masks, screens or similar parts can be used to cover the areas not to be processed. It is also possible to use local light beams or particle beams that are guided over the surface.
  • the refractive index of the layer and also its thickness can be changed by means of high-intensity light. For example, by local light rays change the density of the material and thus locally the refractive index. This can e.g. done by applied masks or selectively by a guided light beam, the thickness of the
  • the method according to the invention can also be used to carry out small-area structures, steep gradients and similar aspherizations that are not possible with the previously known methods.
  • a magnesium fluoride, aluminum oxide or zirconium oxide layer can be used as a coating on a silicon oxide basis as the lens material or can be integrated into the coating. Then this loading Layering can be irradiated with high-intensity i-line light (light of 365 nm wavelength), with aging of the coating and compaction occurring. This changes the layer thickness and / or the refractive index and consequently the optical path length.
  • the thickness of the coating is thicker than the maximum layer thickness to be removed in order to achieve the desired image field optimization.
  • the coating e.g. in the case of several layers, if the outermost layer is reworked to correct the yoke in order to optimize the image field, the previously known method is reversed. This avoids subsequent processing steps, as was the case with the known methods and which can lead to changes in the yoke.
  • the yoke is now corrected on the previously applied coating, for example vapor deposition, and no longer - as was previously the case - on the surface of the optical element itself.
  • the coating has an outwardly facing end layer and one or more intermediate layers arranged between the end layer and the element body, at least one of the intermediate layers containing the preferably non-rotationally symmetrical correction structure.
  • An optical element according to this configuration can be produced in the following steps:
  • such an optical element Compared to optical elements in which the final layer contains a correction structure in the form of fluctuations in thickness or refractive index, such an optical element has the advantage of a more uniform reflectivity.
  • there are intermediate layers within the coating in which such fluctuations have a significantly less effect on the reflectivity than is the case with the outermost layer.
  • not only lenses and other refractive optical elements, but also reflective optical elements come into consideration as optical elements.
  • the coating then does not serve to reduce the reflectivity, but rather to increase it. Even with such reflective coatings, there is the problem that the outermost layer is detuned by applying correction structures. If an intermediate layer is instead provided with a correction structure, the influence of this correction structure on the reflectivity is considerably less.
  • the layer thickness is constant or at least distributed rotationally symmetrically. This also applies in particular to the finishing layer, since there fluctuations in thickness have a particularly unfavorable effect on the reflective properties of the coating.
  • the intermediate layer When determining the intermediate layer that is most suitable for the application of a correction structure, it must be taken into account that the intermediate layers are generally of different thicknesses, which limits the maximum thickness fluctuations from the outset. In addition, fluctuations in thickness do not have the same effects on the reflective properties of the layer system in all intermediate layers.
  • the following steps can be carried out, for example:
  • the outermost intermediate layer adjacent to the final layer contains a correction structure. If further intermediate layers with a constant layer thickness are applied to the element body underneath, this can be provided with a frame after the application of all layers with the exception of the final layer. Only at this stage of manufacture is the optical element installed and measured in the optical system. This allows all the intermediate layers, including the intermediate layer containing the correction structure, to be applied to the element body at high temperature, which has a favorable effect on the mechanical stability and resistance to contamination of the coating. Only the final layer is applied at a lower temperature, which does not significantly affect the stability and resistance to contamination of the entire coating. If only the second outermost intermediate layer contains a correction structure, the intermediate layer arranged above it must be applied at a lower temperature. Often, however, this second outermost intermediate layer has the property of being comparatively insensitive to fluctuations in the thickness or refractive index, so that fluctuations have only a relatively minor effect on the reflective properties of the layer system.
  • the layer thicknesses of the coating can be designed, for example, such that the average layer thickness of the intermediate layer containing the correction structure is between 2 nm and 100 n, preferably between 10 nm and 50 nm.
  • the layer thickness fluctuations of the correction layer are then preferably between 0.1 nm and 50 nm and more preferably between 0.5 nm and 30 nm.
  • a locally varying layer thickness in an intermediate layer is preferably produced, as already mentioned above, by first applying the layer with a constant thickness and then removing material locally from the relevant intermediate layer.
  • the known methods for material removal already mentioned above come into consideration.
  • the element body is introduced into a coating system with an outlet opening for dispensing a coating vapor.
  • a relative movement is generated between the element body and the outlet opening.
  • the coating steam can be spatially directed over the surface to be coated.
  • a locally higher layer thickness can be produced, for example, by the corresponding area being moved past the outlet opening several times.
  • the layer thickness of the intermediate layer containing the correction structure is varied by controlling the speed of the relative movement. The faster the outlet opening moves relative to the surface to be coated, the less the layer thickness with a constant steam flow.
  • FIG. 1 shows a basic illustration of a projection exposure system for microlithography, which can be used for the exposure of structures on wafers coated with photosensitive materials;
  • FIG. 2 shows a section through a lens provided with a coating
  • Figure 3 is a plan view of a diaphragm shown in principle for targeted aspherization of the surface
  • FIG. 4 shows a meridional section through a lens provided with a coating according to another exemplary embodiment
  • FIG. 5 shows an enlarged detail from the lens shown in FIG. 4;
  • Figure 6 shows a longitudinal section through a coating system in a schematic and not to scale.
  • FIG. 1 shows a projection exposure system 1 for microlithography. This serves to define structures by exposing a substrate coated with a photosensitive material. This generally consists predominantly of silicon and is referred to as wafer 2.
  • the projection exposure system 1 can be used e.g. for the production of semiconductor components such as computer chips.
  • the projection exposure system 1 essentially consists of an illumination device 3, one
  • Device 4 for receiving and exact positioning of a mask provided with a lattice-like structure, a so-called reticle 5, by which the later structures on the wafer 2 are determined, a device 6 for holding, moving and exact positioning of the wafer 2 and an imaging device , namely a projection lens 7.
  • the structures introduced into the reticle 5 are imaged on the wafer 2, in particular with a reduction in the structures a third or less of the original size.
  • the requirements to be imposed on the projection exposure system 1, in particular on the projection objective 7, are in the range of a few nanometers.
  • the wafer 2 After exposure has taken place, the wafer 2 is moved on, so that a large number of individual fields are each exposed on the same wafer 2 with the structure specified by the reticle 5.
  • the entire surface of the wafer 2 When the entire surface of the wafer 2 is exposed, it is removed from the projection exposure apparatus 1 and subjected to a number of chemical treatment steps, including a material removal which is generally carried out by etching. If necessary, several of these exposure and treatment steps are carried out in succession until a large number of computer chips have arisen on the wafer 2. Due to the gradual feed movement of the wafer 2 in the projection exposure system 1, this is often also referred to as a "stepper".
  • the illumination device 3 provides a projection beam 8, for example light or a similar electromagnetic radiation, required for imaging the reticle 5 on the wafer 2.
  • a laser for example, can be used as the source for this radiation.
  • the radiation is shaped in the illumination device 3 via optical elements so that the projection beam 8 has the desired properties when it hits the reticle 5. Shafts, for example with regard to diameter, polarization and shape of the wavefront.
  • the projection lens 7 consists of a large number of individual refractive and / or diffractive optical elements, such as e.g. Lenses, mirrors, prisms and end plates.
  • FIG. 2 shows a section through a lens 10 provided with a coating 9, which is installed together with other lenses in the projection objective 7 via a mount 11.
  • the coating 9 can be applied to a surface 10a of the lens 10 before the lens 10 is installed in the mount or afterwards.
  • the coating 9 can e.g. be formed as a vapor-deposited anti-reflective layer.
  • the coating 9 can be designed as a highly reflective surface.
  • the projection exposure system 1 is measured for image field accuracy. If it turns out that changes are required to optimize the image field the fit of one or more optical elements in the projection lens 7 can be corrected accordingly. It is also possible to correct the sum of all deformations of one or all of the lenses 10 on a lens surface 10a in whole or in part , This can be done, for example, by a local removal process on the surface 9a of the coating. For example, an ion beam ablation process can be used for this. Reactive ion etching is also possible.
  • the thickness or thickness of the coating 9 is greater than the maximum removal.
  • the maximum thickness to be removed is shown by dashed lines in FIG. 2 and is designated by reference number 9b. As can be seen, there is still sufficient thickness in this case for the coating 9 to be effective, e.g. as an anti-reflective coating.
  • the coating process and also the correction process can also be used for standard lenses.
  • a material for the lenses 10 can, for example . , Calcium fluoride or quartz glass can be used.
  • the removal of the coating 9 can take place, for example, in a range from 1 nm to 10 nm.
  • FIG. 3 shows a mask 15 which is placed on the coating 9a to be processed. As can be seen, only two openings, namely an elliptical opening 13a and a circular opening 13b, are kept free. At these points there is a targeted removal or an order for local aspherization.
  • a change in the layer thickness and the refractive index can also be achieved by irradiation with high-intensity radiation of high intensity (e.g. i-line of a sodium vapor lamp at 365 nm). This results in a corresponding change in the optical path length and a corresponding image error correction of the projection lens.
  • high-intensity radiation of high intensity e.g. i-line of a sodium vapor lamp at 365 nm.
  • FIG. 4 Another lens suitable for installation in the projection objective 7 is shown in simplified form in FIG. 4 and is designated overall by 10 '.
  • the lens 10 ' has a plano-convex lens body 12 which is inserted into a lens frame 14.
  • the lens frame 14 has fastening elements, not shown, with which the lens 10 'can be fastened and adjusted in the projection objective 7 or in another optical system.
  • the convexly curved surface 16 of the lens body 12 carries a layer system, designated overall by 18, which forms an anti-reflective coating.
  • a similar layer system 19 is also applied to the opposite surface 17 of the lens body 12.
  • FIG. 5 shows an excerpt from the lens 10 ′, designated by 20 in FIG. 4, in the region of the convex surface 16 of the lens body 12 in an enlarged representation.
  • the layer system 18 comprises a total of six layers 181 to 186 with different refractive indices.
  • the five lower layers 181 to 185 are referred to below as intermediate layers and the outermost layer 186 as an end layer. Since such layer systems are known per se in the prior art, further details are not shown.
  • the layer thicknesses of the layers 181 to 186 to be measured perpendicular to the convex surface 16 are determined in such a way that the light incident on the coating 18 is reflected only to a very small extent. This applies not only to parallel light rays close to the axis, but also to those light rays that have greater incidence angle strike the lens 10 '. Such light rays are indicated at 21 in FIG. Large angles of incidence occur, for example, with lenses in high-aperture projection objectives of microlithographic projection exposure systems.
  • the four lower intermediate layers 181 to 184 have different, but constant layer thicknesses within one layer.
  • the same also applies to the end layer 186.
  • the different layer thicknesses within the area 22 are generated by a location-dependent material removal of the thickness ⁇ from the intermediate layer 185, which otherwise has the layer thickness d 0 .
  • the thickness fluctuations within the area 22 represent a correction structure 23 with which imaging errors that are not rotationally symmetrical can also be compensated.
  • the layer thickness of the end layer 186 is constant over the entire extent of the end layer 186 and thus also in the vicinity of the area 22, a recess 28 is formed above the area 22 on an outside 26 of the coating 18, the waviness of which is the material removal in the outermost region Intermediate layer 185 corresponds.
  • the coating 18 prevents significant amounts of light from being reflected when entering the optically denser lens body 12 and from being lost to the optical system in which the lens 10 'is installed.
  • the lens body 12 is manufactured and polished in a manner known per se. Then the five lower intermediate layers 181 to 185 are applied in succession, each with a constant layer thickness, the lens body 12 being heated to a temperature of approximately 200 ° C. Because of this comparatively high temperature, these five lower intermediate layers 181 to 185 are mechanically very stable and resistant to contamination.
  • the lens body 12 with the five intermediate layers 181 to 185 applied thereon is inserted into the lens mount 14 and inserted and adjusted in the optical system, the lens 10 'of which is to be a component.
  • the imaging errors of the optical system then become known in a manner known per se determined and a need for correction determined. This results in the shape and arrangement of the correction structure 23.
  • the final layer 186 is finally applied to the outermost intermediate layer 185 in a further step.
  • the lens body 12 with the intermediate layers 181 to 185 carried by it is only heated up to a temperature of below 60 ° C. since the lens body 12 is already accommodated in the lens frame 14. At a significantly higher temperature there would be a risk that the lens body 12 would permanently deform due to its greater thermal expansion than the lens frame 14.
  • the different layer thicknesses of the outermost intermediate layer 185 can also be produced by a locally varying amount of material being applied to the intermediate layer during the coating process.
  • layer 184 is applied.
  • the need for correction is then to be determined beforehand, for which purpose the lens 10 ′ is to be inserted into the lens frame 14 and measured. In this case, therefore, not only the end layer 186 but also the correction layer 185 must be applied even at a comparatively low temperature.
  • FIG. 6 shows a highly simplified and not to scale sectional view of a coating system 30 with a vacuum chamber 32, in which an outlet 34 for a coating steam is arranged.
  • the lens body 12 already encased in the lens frame 14 is arranged on an X-Y displacement table 26 on which the lens body 12 can be moved in the X and Y directions.
  • Layer thickness can be varied locally by changing the travel speeds in the X and Y directions with the help of a control program. This leads to different lengths of stay, which individual areas of the surface to be coated do
  • a further possibility for generating a correction structure consists in a fluctuation in the refractive index in the instead of a local layer thickness fluctuation Insert intermediate layer 185.
  • the intermediate layer 185 can be exposed to locally high-energy electromagnetic radiation or particle radiation before the application of the closing layer 186. This leads to a local change in the material structure and thus the refractive index of the intermediate layer 185.

Abstract

Selon l'invention, un élément optique (10; 10') présente un corps (12) et un revêtement (9; 18) appliqué sur le corps (12) et destiné à modifier le pouvoir réfléchissant. Dans le revêtement sont formées des structures correctrices (23) destinées à corriger des erreurs de représentation, par ex. par enlèvement local de matière ou par modification locale de l'indice de réfraction. Lorsque le revêtement (18) présente une couche supérieure (186) dirigée vers l'extérieur et une ou plusieurs couches intermédiaires (181 à 185) disposées entre la couche supérieure (186) et le corps (12), les structures correctrices ne se trouvent de préférence pas dans la couche supérieure (186), mais dans l'une des couches intermédiaires (185). L'élément optique (10; 10') est plus stable d'un point de vue mécanique et résiste mieux à la contamination que des éléments optiques dans lesquels un enlèvement de matière est réalisé directement sur le corps de l'élément pour obtenir une action correctrice.
PCT/EP2003/014543 2002-12-19 2003-12-18 Element optique revetu ayant une action correctrice obtenue par la production de variations d'epaisseur de couche ou de variations d'indice de refraction dans le revetement WO2004057378A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003290093A AU2003290093A1 (en) 2002-12-19 2003-12-18 Coated optical element for corrective action obtained by producing layer thickness variations or by refraction factor variations in said coating

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10259536 2002-12-19
DE10259536.4 2002-12-19

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WO2004057378A1 true WO2004057378A1 (fr) 2004-07-08

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1906253A1 (fr) * 2006-09-28 2008-04-02 Carl Zeiss SMT AG Objectif de projection d'un appareil d'exposition par projection microlithographique
DE102008041144A1 (de) 2007-08-21 2009-03-05 Carl Zeiss Smt Ag Optische Anordnung und optisches Abbildungssystem damit, Verfahren zu deren Optimierung und Verfahren zum Herstellen eines optischen Elements
US7800849B2 (en) 2004-12-28 2010-09-21 Carl Zeiss Smt Ag Apparatus for mounting two or more elements and method for processing the surface of an optical element
DE102015207153A1 (de) * 2015-04-20 2016-10-20 Carl Zeiss Smt Gmbh Wellenfrontkorrekturelement zur Verwendung in einem optischen System
DE102005040324B4 (de) * 2004-08-31 2020-03-19 Corning Incorporated Verbesserte Oberflächenbehandlung von Metallfluorid-Excimer-Optik-Vorrichtungen
US10809630B2 (en) 2017-02-28 2020-10-20 Carl Zeiss Smt Gmbh Method for correcting a reflective optical element for the wavelength range between 5 nm and 20 nm

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0824721B1 (fr) * 1996-03-07 2000-07-26 Koninklijke Philips Electronics N.V. Systeme et dispositif d'imagerie pour lithographie par rayons ultraviolets
US6147809A (en) * 1996-05-21 2000-11-14 Angenieux S.A. Method for correcting a lens optical aberration
EP1150139A2 (fr) * 2000-03-31 2001-10-31 Carl Zeiss Système multicouche avec couche protectrice et procédé de fabrication
US20020135778A1 (en) * 2001-03-21 2002-09-26 The Regents Of The University Of California Fabrication of precision optics using an imbedded reference surface
WO2002077692A1 (fr) * 2001-03-27 2002-10-03 Nikon Corporation Procede de fabrication de systeme optique et dispositif d'exposition presentant un systeme optique fabrique selon le procede de fabrication

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0824721B1 (fr) * 1996-03-07 2000-07-26 Koninklijke Philips Electronics N.V. Systeme et dispositif d'imagerie pour lithographie par rayons ultraviolets
US6147809A (en) * 1996-05-21 2000-11-14 Angenieux S.A. Method for correcting a lens optical aberration
EP1150139A2 (fr) * 2000-03-31 2001-10-31 Carl Zeiss Système multicouche avec couche protectrice et procédé de fabrication
US20020135778A1 (en) * 2001-03-21 2002-09-26 The Regents Of The University Of California Fabrication of precision optics using an imbedded reference surface
WO2002077692A1 (fr) * 2001-03-27 2002-10-03 Nikon Corporation Procede de fabrication de systeme optique et dispositif d'exposition presentant un systeme optique fabrique selon le procede de fabrication

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005040324B4 (de) * 2004-08-31 2020-03-19 Corning Incorporated Verbesserte Oberflächenbehandlung von Metallfluorid-Excimer-Optik-Vorrichtungen
US7800849B2 (en) 2004-12-28 2010-09-21 Carl Zeiss Smt Ag Apparatus for mounting two or more elements and method for processing the surface of an optical element
EP1906253A1 (fr) * 2006-09-28 2008-04-02 Carl Zeiss SMT AG Objectif de projection d'un appareil d'exposition par projection microlithographique
DE102008041144A1 (de) 2007-08-21 2009-03-05 Carl Zeiss Smt Ag Optische Anordnung und optisches Abbildungssystem damit, Verfahren zu deren Optimierung und Verfahren zum Herstellen eines optischen Elements
DE102015207153A1 (de) * 2015-04-20 2016-10-20 Carl Zeiss Smt Gmbh Wellenfrontkorrekturelement zur Verwendung in einem optischen System
US10151922B2 (en) 2015-04-20 2018-12-11 Carl Zeiss Smt Gmbh Wavefront correction element for use in an optical system
US10809630B2 (en) 2017-02-28 2020-10-20 Carl Zeiss Smt Gmbh Method for correcting a reflective optical element for the wavelength range between 5 nm and 20 nm

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