WO2004053988A1 - Einphasiges stromrichtermodul - Google Patents
Einphasiges stromrichtermodul Download PDFInfo
- Publication number
- WO2004053988A1 WO2004053988A1 PCT/DE2003/001963 DE0301963W WO2004053988A1 WO 2004053988 A1 WO2004053988 A1 WO 2004053988A1 DE 0301963 W DE0301963 W DE 0301963W WO 2004053988 A1 WO2004053988 A1 WO 2004053988A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- connection
- converter module
- phase
- plus
- rod
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/074—Stacked arrangements of non-apertured devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention relates to a converter module with a stack-like component contact structure according to the preamble of claim 1, and to a method for producing such a converter module according to the preamble of claim 8.
- Power converters are used to convert electrical energy using so-called power converter valves, e.g. Diodes, thyristors, transistors, etc. Depending on the application, they are built as rectifiers, inverters or converters. In the motor vehicle sector, converters are used in particular as rectifiers which convert an AC voltage supplied by a vehicle generator into a
- FIG. 1 shows a rectifier bridge circuit for a three-phase generator, which converts the three phases U, V, W of the three-phase generator into a direct voltage.
- the rectifier comprises for each phase U, V, W a pair of series-connected Zener diodes 8a, 8b, between which the phase connection U, V, W ⁇ is located.
- the direct current is tapped at terminals B + and B-.
- the circuit shown in FIG. 1 is usually implemented from individual discrete components 8a, 8b.
- From DE10009171A1 converter modules are known in which the converter valves (diodes) and the contacts are arranged one above the other in a stack.
- the Converter valves are in J-shape of unhoused
- the main idea of the invention is to produce a single-phase converter module with a plurality of connections and at least two semiconductor chips, which are arranged one above the other in a stack, wherein at least one of the connections consists of a contact plate with a rod-shaped connecting tab located thereon, which is asymmetrical (i.e., its longitudinal axis is towards a parallel axis running through the center of gravity of the contact plate is arranged offset) on the contact plate and at the end of which an auxiliary element is provided which prevents the connection from tilting about the longitudinal axis of the connection tab.
- the auxiliary element can be separated after the stack arrangement has been assembled.
- the auxiliary element has an opening with which the associated connection in a jointing device can be positioned.
- a joining device according to the invention has, for example, a plurality of guide and retaining pins on which the connections are aligned and held in order to facilitate the construction of the stack arrangement.
- the opening provided in the auxiliary element is preferably engaged with a guide and holding pin.
- the phase connection is constructed identically to the plus or Mmus connection, i.e. the plus or Mmus connection and the phase connection are identical parts. In this way, the converter module can be significantly simplified and made cheaper.
- the auxiliary elements provided at the connections are preferably separated after the converter module has been joined together.
- connection lugs are preferably arranged offset with respect to an area spanned by the contact plate. If the offset between connection lugs and contact plates is approximately half the height of a stack of a contact plate, a semiconductor chip and two electrical connection layers on both sides of the semiconductor chip, the connection lugs can be led out of the converter module at the same height, if for the plus or minus -Connection and the phase connection identical connections are used. This brings advantages in terms of production technology if the converter module is packaged in a standard plastic housing.
- the converter module is preferably packaged in a standard plastic housing which is injection molded (Molding process) is produced. This type of packaging is particularly inexpensive.
- FIG. 3 shows a preferred embodiment of a stacked single-phase converter module according to the invention
- Fig. 5 shows a strand of several packaged converter modules.
- Fig. 2 shows a section of a single-phase
- Converter module 1 in which the converter valves (in the present example, Zener diodes) in the form of semiconductor chips 9 are arranged one above the other in a stack.
- the converter module comprises a plus connection 2 (B +), a minus connection 4 (B-) and the two semiconductor chips 9 with a phase connection 3 arranged between them.
- the semiconductor chips 9 have no housing ,
- the minus connection 4 also serves as an electrical connection, as a thermal capacitance Buffering of peak power and as a cooling connection to dissipate the heat loss generated by the circuit.
- a multi-phase converter according to the present invention consists of several individual single-phase converter modules. This has the advantage that the power loss of a multiphase converter circuit is not concentrated in such a small space and can be better distributed.
- the converter module 1 comprises an Mmus connection 4 in the form of a metallic base (B-), which is used for mechanical stabilization and for fastening the converter module 1 on a heat sink.
- the M us connection 4 comprises an opening 10 for attaching the module 1 to the heat sink, e.g. by screwing, riveting etc.
- the converter module 1 is preferably m one
- the joining device constructed, the individual elements of the module 1 can be arranged and positioned precisely.
- the joining device can e.g. also serve as a solder form for soldering the component-contact stack.
- the electrical connection of the elements 2-4,9 is made by means of solder foils 8, which are arranged on both sides of a semiconductor chip 9. Other standard connection techniques, such as the application of conductive adhesive, solder paste, etc., can also be used.
- the positive connection 2 and the phase connection 3 consist of a contact plate 5 with a rod-shaped connecting tab 6 and an auxiliary element 7.
- the rod-shaped connecting rod 6 is arranged asymmetrically on the contact plate 5 (ie, the longitudinal axis of the rod-shaped connecting tab 6 is offset from a parallel one , arranged through the center of gravity of the contact plate 5 extending axis).
- the auxiliary element 7 provided at the other end of the rod-shaped connecting lug 6 is designed such that the connection 2, 3 does not tip over the longitudinal axis of the rod-shaped connecting lug if the contact is supported, for example, at a point along the rod-shaped connecting lug 6. This has the advantage that the contact plates 5 of the connections 2, 3 can be placed flat on the semiconductor chips 9 without the connections 2, 3 then jamming.
- connections 2, 3 also have a positioning opening 11, which is preferably arranged in the auxiliary element 7, in order to be able to exactly align the connections 2, 3 on a stop of the joining device.
- the positioning openings 11 shown are brought into engagement during the assembly of the converter module, for example with a positioning pin of the joining device.
- the auxiliary elements 7 can, if necessary, be separated.
- connections 2 and 3 are of identical design, the plus 2 and the phase connection 3 being 180 ° with respect to the longitudinal axis of the
- Terminal lugs 6 are arranged rotated. In this way, the converter module 1 can be manufactured particularly simply and inexpensively.
- the rod-shaped connection lugs of the positive connection 2 and the phase connection 3 are also offset from that by Contact plates o -spanned --- open arranged.
- the rod-shaped connecting lugs 6 are preferably offset from one another by half the height of a stack of the contact plate 5 of the positive connection 2, a semiconductor chip 9 and two solder layers 8 in relation to the contact plate 5. This shape makes it possible to lead the connection lugs 6 of the positive connection 2 and the phase connection 3 out of the module 1 on the same level. In addition, it becomes possible to use identical parts for the positive connection 2 and the phase connection 3.
- FIG. 4 shows the packaged converter module 1 in a transistor-like design.
- the housing 12 shown is produced using a standard molding process (injection molding process).
- injection molding process injection molding process
- the converter module 1 is packaged only in the area of the chip contact stack.
- the auxiliary elements 7 have already been disconnected
- FIG. 5 shows a number of packaged converter modules 1 corresponding to FIG. 4, which are connected to one another by a separable, in particular manually operable (z. B. by twisting) connection.
- Single-phase modules can, for example, be weakened (by perforation). During the final assembly of a converter, the desired number of single-phase converter modules 1 can thus simply be removed.
- the housings 12 of the converter modules 1 are connected to one another by plastic webs 13, which are likewise produced in an injection molding process, preferably in one step together with the housings 12.
- the converter modules 1 can, for example, also be arranged and packaged on a common carrier film.
- the individual converter modules 1 of a module string are preferably those modules which are either prior to packaging a complete electrical one
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Rectifiers (AREA)
- Inverter Devices (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03809656A EP1590830A1 (de) | 2002-12-12 | 2003-06-12 | Einphasiges stromrichtermodul |
AU2003246534A AU2003246534B2 (en) | 2002-12-12 | 2003-06-12 | Single-phase power converter module |
US10/538,269 US20060124957A1 (en) | 2002-12-12 | 2003-06-12 | Single-phase converter module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10258035A DE10258035A1 (de) | 2002-12-12 | 2002-12-12 | Einphasiges Stromrichtermodul |
DE10258035.9 | 2002-12-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004053988A1 true WO2004053988A1 (de) | 2004-06-24 |
Family
ID=32336225
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2003/001963 WO2004053988A1 (de) | 2002-12-12 | 2003-06-12 | Einphasiges stromrichtermodul |
Country Status (5)
Country | Link |
---|---|
US (1) | US20060124957A1 (de) |
EP (1) | EP1590830A1 (de) |
AU (1) | AU2003246534B2 (de) |
DE (1) | DE10258035A1 (de) |
WO (1) | WO2004053988A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2181461A1 (de) * | 2007-08-23 | 2010-05-05 | Siemens Aktiengesellschaft | Aufbau- und verbindungstechnik von modulen mittels aus einer ebene heraus gebogenen metallischen stanzgitter oder stanzbiegeteilen |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB936735A (en) * | 1959-02-27 | 1963-09-11 | Siemens Ag | Improvements in or relating to dry rectifier assemblies |
DE1564826A1 (de) * | 1966-12-23 | 1970-03-05 | Standard Elek K Lorenz Ag | Verfahren zum Herstellen von Trockengleichrichter-Anordnungen |
DE2536711A1 (de) * | 1975-08-18 | 1977-02-24 | Siemens Ag | Hochspannungsgleichrichter |
WO1979000814A1 (en) * | 1978-03-23 | 1979-10-18 | Bbc Brown Boveri & Cie | Semiconductor device comprising two semiconductor elements |
JPS59191360A (ja) * | 1983-04-15 | 1984-10-30 | Internatl Rectifier Corp Japan Ltd | 半導体装置用リードフレーム |
JPS60101958A (ja) * | 1983-11-08 | 1985-06-06 | Rohm Co Ltd | ダイオ−ド装置の製造方法 |
US5337216A (en) * | 1992-05-18 | 1994-08-09 | Square D Company | Multichip semiconductor small outline integrated circuit package structure |
US5625223A (en) * | 1992-10-09 | 1997-04-29 | Rohm Co., Ltd. | Surface mounting type diode |
US6317327B1 (en) * | 2001-01-04 | 2001-11-13 | Chin-Feng Lin | Diode cooling arrangement |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3978513A (en) * | 1971-05-21 | 1976-08-31 | Hitachi, Ltd. | Semiconductor controlled rectifying device |
EP0100626A3 (de) * | 1982-07-29 | 1985-11-06 | LUCAS INDUSTRIES public limited company | Halbleiterzusammenbau |
EP0253170B1 (de) * | 1986-06-28 | 1992-12-16 | Licentia Patent-Verwaltungs-GmbH | Kontaktanordnung für einschiebbare Leistungsschalter |
US6538878B1 (en) * | 1999-02-22 | 2003-03-25 | World Properties, Inc. | Bus bar assembly |
DE10009171B4 (de) * | 2000-02-26 | 2005-08-11 | Robert Bosch Gmbh | Stromrichter und sein Herstellverfahren |
US20070165376A1 (en) * | 2006-01-17 | 2007-07-19 | Norbert Bones | Three phase inverter power stage and assembly |
-
2002
- 2002-12-12 DE DE10258035A patent/DE10258035A1/de not_active Withdrawn
-
2003
- 2003-06-12 AU AU2003246534A patent/AU2003246534B2/en not_active Ceased
- 2003-06-12 US US10/538,269 patent/US20060124957A1/en not_active Abandoned
- 2003-06-12 EP EP03809656A patent/EP1590830A1/de not_active Withdrawn
- 2003-06-12 WO PCT/DE2003/001963 patent/WO2004053988A1/de active Application Filing
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB936735A (en) * | 1959-02-27 | 1963-09-11 | Siemens Ag | Improvements in or relating to dry rectifier assemblies |
DE1564826A1 (de) * | 1966-12-23 | 1970-03-05 | Standard Elek K Lorenz Ag | Verfahren zum Herstellen von Trockengleichrichter-Anordnungen |
DE2536711A1 (de) * | 1975-08-18 | 1977-02-24 | Siemens Ag | Hochspannungsgleichrichter |
WO1979000814A1 (en) * | 1978-03-23 | 1979-10-18 | Bbc Brown Boveri & Cie | Semiconductor device comprising two semiconductor elements |
JPS59191360A (ja) * | 1983-04-15 | 1984-10-30 | Internatl Rectifier Corp Japan Ltd | 半導体装置用リードフレーム |
JPS60101958A (ja) * | 1983-11-08 | 1985-06-06 | Rohm Co Ltd | ダイオ−ド装置の製造方法 |
US5337216A (en) * | 1992-05-18 | 1994-08-09 | Square D Company | Multichip semiconductor small outline integrated circuit package structure |
US5625223A (en) * | 1992-10-09 | 1997-04-29 | Rohm Co., Ltd. | Surface mounting type diode |
US6317327B1 (en) * | 2001-01-04 | 2001-11-13 | Chin-Feng Lin | Diode cooling arrangement |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 009, no. 053 (E - 301) 7 March 1985 (1985-03-07) * |
PATENT ABSTRACTS OF JAPAN vol. 0098, no. 251 (E - 348) 8 October 1985 (1985-10-08) * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2181461A1 (de) * | 2007-08-23 | 2010-05-05 | Siemens Aktiengesellschaft | Aufbau- und verbindungstechnik von modulen mittels aus einer ebene heraus gebogenen metallischen stanzgitter oder stanzbiegeteilen |
Also Published As
Publication number | Publication date |
---|---|
AU2003246534B2 (en) | 2009-12-17 |
AU2003246534A1 (en) | 2004-06-30 |
EP1590830A1 (de) | 2005-11-02 |
US20060124957A1 (en) | 2006-06-15 |
DE10258035A1 (de) | 2004-06-24 |
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