WO2004015463A1 - Miroirs de guides d'ondes polymeriques - Google Patents

Miroirs de guides d'ondes polymeriques Download PDF

Info

Publication number
WO2004015463A1
WO2004015463A1 PCT/SE2003/001252 SE0301252W WO2004015463A1 WO 2004015463 A1 WO2004015463 A1 WO 2004015463A1 SE 0301252 W SE0301252 W SE 0301252W WO 2004015463 A1 WO2004015463 A1 WO 2004015463A1
Authority
WO
WIPO (PCT)
Prior art keywords
plate
reflective
light
large surface
mirror structure
Prior art date
Application number
PCT/SE2003/001252
Other languages
English (en)
Inventor
Mats Robertsson
Original Assignee
Acreo Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acreo Ab filed Critical Acreo Ab
Priority to AU2003248585A priority Critical patent/AU2003248585A1/en
Publication of WO2004015463A1 publication Critical patent/WO2004015463A1/fr

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12002—Three-dimensional structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/125—Bends, branchings or intersections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12083—Constructional arrangements
    • G02B2006/12104—Mirror; Reflectors or the like
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections

Definitions

  • the present invention relates to mirrors for deflecting light propagating in waveguides at a surface of a substrate, such as polymer waveguides, and to methods of producing such mirrors.
  • optical devices having optical waveguides integrated in a substrate or applied to the surface of a substrate there is a need for devices for deflecting light between optical waveguides and between optical waveguides and transmitter and receiver elements.
  • deflecting devices comprise mirrors that can for example be formed by oblique end surfaces of the optical waveguides.
  • VCSEL surface emitting laser
  • the cost of each mirror produced is relatively high.
  • the metalization step is not simple and it is not easy to fill the whole recess with a reflecting material. If no metal material is used, the mirror surfaces produced are dielectric, i.e. light is reflected in the interface between materials of different refractive indices, and it is difficult to produce such reflecting surfaces having a high reflecting capability.
  • Photo-patternable polymer materials suitable for producing optical waveguides on top of various carriers are e.g. described in M. Robertsson, A. Dabek, G. Gustafsson, O.-J. Hagel, M. Popall, "New Pattemable Dielectric and Optical Materials for MCM-L/D- and o/e-MCM- packaging", First IEEE Int. Symp. on Polymeric Electronics packaging, Oct. 26 - 30, 1997, Norr- k ⁇ ping, Sweden, M.E. Robertsson et al.: “O/e-MCM Packaging with New, Pattemable Dielectric and Optical Materials", at 48th Electronic Components and Technology Conference (ECTC'98),
  • a mirror structure that includes a reflective surface and is directly attached to a plate.
  • the mirror structure projects from the plate, from a large surface thereof, preferably from an inner portion of the large surface, and is intended to be placed in a recess in a substrate surface containing at least one optical waveguide.
  • the mirror structure can e.g. have a rectangular shape, in some case including an oblique free, reflecting surface.
  • the reflective surface is the surface opposite the surface at which the mirror structure is attached to the surface of the substrate, also called a carrier, and it can consist of one or more portions, each portion located in an oblique angle to the large surface of the plate and thus to the substrate surface.
  • the plate that preferably is a silicon chip or a semiconductor chip can be mounted to the surface of the substrate using some surface mounting method for mounting electronic devices, such as the flip- chip method.
  • the plate has solder pads cooperating with solder bumps and such mounting can give the plate a very accurate position at the substrate surface.
  • solder pads or solder bumps are advantageously located in pattern surrounding the mirror structure or recess respectively, for instance in a rectangular pattern or at the comers of a rectangle.
  • other mounting methods can be used allowing an accurate positioning, for example in the same way utilizing the surface tension of liquid solder.
  • the plate can be a semiconductor chip containing a device for issuing light from a large surface, such as a surface emitting laser structure or a light emitting diode or containing a device for receiving or detecting light.
  • the plate can be completely passive acting only as a carrier of the mirror structure that then can contain a plurality of reflecting surfaces placed on top of each other.
  • a mirror structure can be used for deflecting light from one level of optical waveguides to another level and thus acts as an optical via.
  • the plate including the mirror structure can be produced from a large plate on which, in a sequence of processing steps, a large number of individual mirror structures are formed. The large plate is then split such as by sawing into small plates, each one having one or a few mirror structures attached to it.
  • the processing steps can include coating the plate with a curable material, shaping the surface of this material and then curing it.
  • the shaping can be made in a replication process bringing a tool having a shaped surface in contact with curable layer and then curing the layer.
  • the tool can be transparent to the energetic light allowing the curing to be made when the tool is still in contact with the curable material.
  • the tool can have non-transparent portions allowing the material to be cured only in selected regions.
  • Fig. 1 is a cross-sectional partial view of an optical waveguide assembly including a mirror structure attached to a semiconductor chip that includes a light emitting or light receiving element,
  • - Fig. 2 is a plan view of the portion of an optical waveguide assembly of Fig. 1
  • - Fig. 3 is a cross-sectional view of a mirror structure attached to a semiconductor chip having a reflective surface including two flat segments,
  • Figs. 4a - 4c are plan views illustrating various cases of deflecting light using a mirror structure having a reflective surface including two or four flat segments,
  • - Fig. 5 is a cross-sectional view of a mirror structure attached to a semiconductor chip having a filtering reflective surface
  • FIG. 6 is a cross-sectional view of a rnirror structure attached to a semiconductor chip having a curved reflective surface for providing collimation or focusing,
  • Fig. 7 is a view similar to Fig. 1 showing a rnirror structure having a semi-reflecting surface
  • - Fig. 8a is a cross-sectional part view of an optical waveguide assembly including a mirror structure attached to a semiconductor or dummy chip and acting as an optical via,
  • - Fig. 8a is a cross-sectional part view of an optical waveguide assembly including a mirror structure attached to a semiconductor chip that includes a light emitting or light receiving element, the mirror structure both acting as a mirror for deflecting to or from the chip and acting as an optical via,
  • - Fig. 9a is a plan view of the portion of an optical waveguide assembly of Fig. 8a
  • - Figs. 9b - 9c are plan views illustrating cases of deflecting light using a mirror structure similar to that of Fig. 8 but having a lower reflective surface configured in other ways,
  • FIG. 10a - 1 Of are cross-sectional part views illustrating steps in a process for manufacturing a mirror structure
  • FIGS. 11a - l ie are cross-sectional part views illustrating steps in an alternative process for manufacturing a mirror structure
  • Figs. 1 la - 1 le are cross-sectional part views illustrating modifications of steps in the manufacturing process of Figs. 1 la - 1 le,
  • Figs. 12a - 12c are cross-sectional part views illustrating steps in a further alternative process for manufacturing a mirror structure.
  • a cross-section of e.g. a surface emitting semiconductor laser (VCSEL) 1 coupled to an optical waveguide 3 is shown.
  • the waveguide 3 is formed in the surface structure of an optical board or plate 5 by patterned layers forming lower and upper claddings 7 and 9 and a waveguide core 11 located therebetween.
  • the waveguide is thus parallel to the surface of the board and a recess
  • the laser 1 is a semiconductor chip generally having the shape of a small rectangular plate comprising two opposite large surfaces and emits the laser light out of one of its large surfaces, the bottom surface in the figure.
  • a mirror structure 17 is attached to this large surface of the laser chip 1 and has the shape of a rectangular body standing out from the large surface so that the laser light passes downwards into the mirror structure from its top surface, perpendicularly to the large surface of the laser.
  • the laser chip 1 is mounted to the surface of the board 5 so that the mirror structure projects down into the recess 13. Furthermore, the laser is mounted in such a way that it obtains an accurately defined position at the surface of the board and in particular in relation to the recess 13.
  • An accurate mounting can be achieved by e.g. using flip-chip mounting comprising solder bumps 19 electrically and mechanically coupled to connection pads 21, 23 at the large bottom surface of the laser chip and at the board surface respectively.
  • the mirror structure 17 contains a mirror surface 25 and is made from mainly a material that is optically transparent to the light emitted from the laser 1.
  • the mirror surface 25 is flat and is located in an oblique angle to deflect the light emitted by the laser in a vertical downward direction to an approximately horizontal direction, i.e. in a direction parallel to the surface of the board, so that the light from the laser enters the waveguide 3 and so that the center of the light beam hits the core 11 of the waveguide.
  • the mirror surface can be located in an angle of about 45° in relation to the large bottom surface of the laser chip 1 and thereby also in the same angle in relation to the surface of the board.
  • the mirror surface 25 can be formed as a surface separating two materials having different refractive indices, e.g. between a polymer and air, or be a metal surface, e.g. obtained by metalizing a sloping surface of a polymer material, such as by sputtering or CVD. In these cases the mirror structure can have the shape of a rectangular body cut off by the oblique reflecting surface.
  • the space between the mirror structure 17 and the walls of the recess 13 can be filled with a suitable material 26 that is transparent to the light emitted by the laser and generally to the light intended to travel in the waveguide.
  • the material has suitably a refractive index selected to minimize losses of light passing the walls of the space, i.e.
  • Such a material can be called an optical underfill and can be a polymer material such as a transparent silicon rubber, an ORMOCER® inorganic-organic polymer or an acrylate-, epoxy- or other suitable polymer. It can be a material that hardens or can be cured to become solid or at least is stiff enough to also maintain the mirror structure 17 in the intended position given to it in mounting the laser chip 1 to the board.
  • the rnirror structure 17 described above can obviously be used together with other optical components such as all components emitting light from the large surface of the component chip, for example light emitting diodes, and also all components such as photo diodes (PDs) or photo transistors capable of receiving or detecting light at their large surfaces.
  • optical components such as all components emitting light from the large surface of the component chip, for example light emitting diodes, and also all components such as photo diodes (PDs) or photo transistors capable of receiving or detecting light at their large surfaces.
  • PDs photo diodes
  • the mirror surface can be composed of a plurality of flat mirror segments, each of which located in an angle of about 45° to the horizontal and vertical directions.
  • two mirror segments 27 reflect light from the laser in two opposite directions, to two collinear waveguides, compare Fig. 1, being e.g. portions of a continuous straight waveguide that is interrupted by the recess 13.
  • Figs. 4a, 4b and 4c some different cases of transmitting light via the mirror structure 17 into waveguides can be seen.
  • mirror surfaces having two flat surface portions are used to deflect light in two opposite directions.
  • the mirror surface comprises four flat surface portions reflecting light in four perpendicular directions.
  • the mirror surface 25 can have a surface structure that acts in a filtering way so that when it is hit by light only light within a wavelength band is reflected, see the sectional view of Fig. 5.
  • the rnirror surface can be curved to act focusing on incoming parallel light that is reflecting or making incoming light formed to a parallel beam, see the sectional view of Fig. 6.
  • a fully reflecting mirror surface 25 is used in the mirror structure 17 described above.
  • this mirror surface can be made to be only semireflecting, see Fig. 7, so that one share of the issued light is reflected to the waveguide 3 whereas the remaining share continues straightly through the mirror surface 29.
  • This light then hits and is fully reflected by a lower mirror surface 31 to continue to propagate in a lower waveguide 3' having a core IT, a lower cladding 7 and a top cladding 9'.
  • the mirror structure described above comprising one fully reflecting mirror surface can be extended to comprise a plurality of fully reflecting flat, mirror surfaces located on top of each other and can then be used to redirect light from one optical waveguide to another optical waveguide located at a different level in the surface structure of a substrate, see Fig. 8a and the plan view of Fig. 9a.
  • the extended mirror structure 17' is attached to one of the large surfaces, the bottom surface in the figure, of a plate 33.
  • the plate can have same shape as the semiconductor chip 1 and be made e.g. of silicon.
  • the plate can be purely passive and acting only as a support of the mirror structure 17'.
  • soldering pads 21' like the laser or photodetector chip of Fig. 1 allowing it to be accurately positioned in a surface mounting method using soldering bumps 19' connecting to soldering pads 23' on the board surface.
  • the extended mirror structure 17' projects down into a recess 13' of the board 5.
  • the waveguides being interrupted or ending at the recess exposing the cores 11, 11' and claddings 9, 11 and 9', 11' of the waveguides.
  • the sidewalls of the recess at which the waveguides are exposed are flat and located in angles substantially perpendicular to the longitudinal directions of the waveguides, at least at the waveguide ends which will receive from or emit light into the waveguides.
  • the mirror surfaces 25, 25' are as above arranged in oblique angles, e.g. of about 45°, to the vertical and horizontal directions. Other angles of the mirror surfaces can be used as long as the two mirrors form substantially the same angle to the horizontal or vertical directions, for example angles in the range of 30° to 60°, in particular for the case shown comprising two parallel mirror surfaces.
  • the mirror surfaces are located so that e.g.
  • the dummy chip 33 can be etched away provided that the transparent material 26 filling the space between the recess and the mirror structure sufficiently fixes the mirror structure in the correct position in the recess.
  • the mirror structure of Fig. 1 for reflecting light from or to the plate 1 can be combined with the structure of Fig. 8a to provide a rnirror structure as illustrated in Fig. 8b.
  • the top side of upper reflecting surface 25 here reflects the light coming from or destined for the plate 1 and its bottom side is part of the via structure for deflecting light travelling at different levels.
  • the individual rnirror surfaces can be composed of more than one flat surface such as having the shape illustrated in Fig. 3. They can be curved as in Fig. 5 if required and also be provided with a grating structure as in Fig. 4. More than two mirror surfaces can be arranged on top of each other.
  • the basic material of the mirror structure can be a suitable polymer material that is applied to the surface of e.g. a silicon wafer that can have already been processed to comprise a multitude of optical components such as lasers or light emitting diodes in the surface.
  • the application of the material can be made using different mechanical methods such as by spinning, spraying or using a 5 doctor blade to form a layer on top of the wafer, the thickness of the layer being appropriately selected.
  • the layer is then processed to form the individual mirror structures and finally the wafer is split into the individual semiconductor chips with attached mirror structures.
  • a layer 41 of a UV-curable polymer material such as an Ormocer® is applied to the surface of a wafer 43 comprising a plurality of individual devices or plates 45 to be
  • the device or plates including the soldering pads 21 The free surface of the layer is then deformed by pressing a tool 47 against the surface, the tool having recesses 49 that have one flat side 51 located in an angle of 45° in relation to the surface of the wafer 43. The tool is pressed to a position in which the lowermost parts thereof are in contact with the wafer surface. The tool is transparent to UV-light that is then used to cure the material of the layer 41, as seen in Fig.
  • a suitable metal such as a suitable metal that is applied by e.g. sputtering, see Fig. 10c.
  • Another polymer layer 55 that suitable also is a Ormocer® material is then applied and cured, see Fig. lOd, the surface is covered with a mask layer 57 as seen in Fig. lOe, and the surface is etched in the windows of the mask to remove material
  • the uncured polymer layer can be again given a shaped surface structure by being moved in contact with a tool as in Figs. 10a and 10b to then form another mirror surface.
  • a tool as illustrated in Fig. 11a can be used having projections 59 with flat surfaces 61, the projections standing out from an otherwise flat bottom surface of the tool.
  • the tool is then pressed against the non-cured polymer layer 41 that in this case has to be thicker. The pressing is stopped at a predetermined distance of the wafer surface in a position where the lowermost portions of the tool have not come into contact with
  • the reflecting surface 62 can be patterned directly after being applied. Then as seen in Fig. 1 Id a mask 63 can be applied covering only the oblique flat surfaces 65 of the cured polymer layer and the reflecting material in the windows of the mask is then etched away to give the structure seen in Fig. lie.
  • the recesses 67 of the cured polymer layer formed by the tool have surfaces perpendicular to the wafer surfaces there may be a difficulty of applying the mask to have windows at a small distance of these vertical surfaces for etching away the reflecting material on these surfaces. Then instead the polymer layer can be formed to have tilted surfaces between the flat oblique surface as seen in Fig. 1 lg. The corresponding tool will then have the shape seen in Fig. 1 If.
  • the tool 47 can have portions of its pressing surface that are not transparent to the UV-light used for curing it.
  • a non-transparent layer 69 such as a metal layer. Then only the portions of the uncured polymer layer located beneath the transparent portions of the tool will be cured.
  • a selective coating process can be obtained by using a shadow mask 71 placed at a small distance of the surface of the cured layer as seen in Fig. 12c.
  • the mask has windows 73 placed at the oblique surfaces to be coated and for an appropriate position of these windows and for a sufficiently small distance of the polymer layer substantially only the oblique surfaces will obtain a reflective coating.
  • the wafer can in this stage if desired be split into individual chips carrying mirror structures having free oblique surfaces formed at the layer producing the reflections. The chips need no further processing and can be used as is illustrated in Fig. 1.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

L'invention concerne un substrat (15) tel qu'une carte de circuit imprimé ayant des guides d'ondes optiques (11, 7, 9). Dans sa couche superficielle, une structure miroir (17) est directement attachée à une plaque (1) et a une surface inclinée réfléchissante (25). La structure miroir fait saillie d'une partie interne de la surface de la plaque dans un évidement (13) de la surface substrat, l'évidement étant réalisé dans le guide d'onde optique. Ainsi la surface réfléchissante dévie le trajet lumineux dans le guide d'onde. Elle peut dévier la lumière émanant de la plaque, dans le cas où la plaque est notamment une puce laser à injecter dans le guide d'onde. La surface réfléchissante peut également dévier le trajet lumineux dans le guide d'onde pour être reçu par la plaque dans le cas où la plaque a une capacité de photodétection. La plaque, notamment une puce semi-conductrice, peut être montée en surface sur le substrat. A cet effet, la plaque a des plages de brasure (21) coopérant avec des bosses de brasure (19) et un tel montage peut conférer à la plaque une position très précise sur la surface de substrat. La plaque peut également être une plaque fictive seulement comme un support de la structure miroir qui ensuite peut contenir une pluralité de surfaces réfléchissantes superposées pour dévier la lumière d'un niveau du guide d'onde vers un autre niveau et ainsi agir de via optique.
PCT/SE2003/001252 2002-08-09 2003-08-06 Miroirs de guides d'ondes polymeriques WO2004015463A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003248585A AU2003248585A1 (en) 2002-08-09 2003-08-06 Mirrors for polymer waveguides

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE0202392-7 2002-08-09
SE0202392A SE525405C2 (sv) 2002-08-09 2002-08-09 Speglar för polymera vägledare, förfarande för deras framställning, samt optisk vågledaranordning

Publications (1)

Publication Number Publication Date
WO2004015463A1 true WO2004015463A1 (fr) 2004-02-19

Family

ID=20288698

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SE2003/001252 WO2004015463A1 (fr) 2002-08-09 2003-08-06 Miroirs de guides d'ondes polymeriques

Country Status (3)

Country Link
AU (1) AU2003248585A1 (fr)
SE (1) SE525405C2 (fr)
WO (1) WO2004015463A1 (fr)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004043001B3 (de) * 2004-09-02 2006-02-16 Siemens Ag Substratbauteil mit eingebettetem Lichtwellenleiter und Strahlumlenkung und Verfahren zu dessen Herstellung
DE102006001429A1 (de) * 2006-01-10 2007-03-22 Infineon Technologies Ag Nutzen und Halbleiterbauteil aus einer Verbundplatte mit Halbleiterchips und Kunststoffgehäusemasse sowie Verfahren zur Herstellung desselben
DE102006041378A1 (de) * 2006-08-29 2008-03-13 Siemens Ag Leiterplatte mit einer optischen Lage und einer Aufnahme für ein optisches Bauelement und Verfahren zu deren Herstellung
CN101988975A (zh) * 2009-08-03 2011-03-23 日东电工株式会社 光传感器模块的制造方法和用该方法得到的光传感器模块
US8428403B2 (en) 2010-07-27 2013-04-23 Nitto Denko Corporation Optical sensor module
US8452138B2 (en) 2011-02-03 2013-05-28 Nitto Denko Corporation Optical sensor module
US8467640B2 (en) 2010-08-31 2013-06-18 Nitto Denko Corporation Optical sensor module
US20130177697A1 (en) * 2012-01-11 2013-07-11 International Business Machines Corporation Implementing enhanced optical mirror coupling and alignment utilizing two-photon resist
CN103676039A (zh) * 2012-08-29 2014-03-26 华通电脑股份有限公司 可使光源准确对位的光电电路板
JP2015230481A (ja) * 2014-06-09 2015-12-21 新光電気工業株式会社 光導波路装置及びその製造方法
JP2016206377A (ja) * 2015-04-21 2016-12-08 新光電気工業株式会社 光導波路装置及びその製造方法
JPWO2016175124A1 (ja) * 2015-04-27 2017-11-30 京セラ株式会社 光伝送基板および光伝送モジュール
JP2019007996A (ja) * 2017-06-20 2019-01-17 日本電信電話株式会社 平面光回路積層デバイス
CN111913163A (zh) * 2019-05-07 2020-11-10 苏州旭创科技有限公司 一种光信号传输器及激光雷达

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2276492A (en) * 1993-03-26 1994-09-28 Nec Corp Mounting structure of optical element
US5479426A (en) * 1994-03-04 1995-12-26 Matsushita Electronics Corporation Semiconductor laser device with integrated reflector on a (511) tilted lattice plane silicon substrate
US5793785A (en) * 1994-03-04 1998-08-11 Matsushita Electronics Corporation Semiconductor laser device
US6236788B1 (en) * 1998-10-01 2001-05-22 Daimlerchrysler Ag Arrangement for aligning optical components
US20020071642A1 (en) * 1999-09-09 2002-06-13 Fujitsu Limited Installation structure and method for optical parts and electric parts

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2276492A (en) * 1993-03-26 1994-09-28 Nec Corp Mounting structure of optical element
US5479426A (en) * 1994-03-04 1995-12-26 Matsushita Electronics Corporation Semiconductor laser device with integrated reflector on a (511) tilted lattice plane silicon substrate
US5793785A (en) * 1994-03-04 1998-08-11 Matsushita Electronics Corporation Semiconductor laser device
US6236788B1 (en) * 1998-10-01 2001-05-22 Daimlerchrysler Ag Arrangement for aligning optical components
US20020071642A1 (en) * 1999-09-09 2002-06-13 Fujitsu Limited Installation structure and method for optical parts and electric parts

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004043001B3 (de) * 2004-09-02 2006-02-16 Siemens Ag Substratbauteil mit eingebettetem Lichtwellenleiter und Strahlumlenkung und Verfahren zu dessen Herstellung
DE102006001429A1 (de) * 2006-01-10 2007-03-22 Infineon Technologies Ag Nutzen und Halbleiterbauteil aus einer Verbundplatte mit Halbleiterchips und Kunststoffgehäusemasse sowie Verfahren zur Herstellung desselben
DE102006041378A1 (de) * 2006-08-29 2008-03-13 Siemens Ag Leiterplatte mit einer optischen Lage und einer Aufnahme für ein optisches Bauelement und Verfahren zu deren Herstellung
US8548285B2 (en) 2009-08-03 2013-10-01 Nitto Denko Corporation Manufacturing method of optical sensor module and optical sensor module obtained thereby
CN101988975A (zh) * 2009-08-03 2011-03-23 日东电工株式会社 光传感器模块的制造方法和用该方法得到的光传感器模块
CN101988975B (zh) * 2009-08-03 2014-04-16 日东电工株式会社 光传感器模块的制造方法和用该方法得到的光传感器模块
US8428403B2 (en) 2010-07-27 2013-04-23 Nitto Denko Corporation Optical sensor module
US8467640B2 (en) 2010-08-31 2013-06-18 Nitto Denko Corporation Optical sensor module
US8452138B2 (en) 2011-02-03 2013-05-28 Nitto Denko Corporation Optical sensor module
US20130177697A1 (en) * 2012-01-11 2013-07-11 International Business Machines Corporation Implementing enhanced optical mirror coupling and alignment utilizing two-photon resist
US8968987B2 (en) * 2012-01-11 2015-03-03 International Business Machines Corporation Implementing enhanced optical mirror coupling and alignment utilizing two-photon resist
CN103676039A (zh) * 2012-08-29 2014-03-26 华通电脑股份有限公司 可使光源准确对位的光电电路板
JP2015230481A (ja) * 2014-06-09 2015-12-21 新光電気工業株式会社 光導波路装置及びその製造方法
JP2016206377A (ja) * 2015-04-21 2016-12-08 新光電気工業株式会社 光導波路装置及びその製造方法
JPWO2016175124A1 (ja) * 2015-04-27 2017-11-30 京セラ株式会社 光伝送基板および光伝送モジュール
JP2019007996A (ja) * 2017-06-20 2019-01-17 日本電信電話株式会社 平面光回路積層デバイス
CN111913163A (zh) * 2019-05-07 2020-11-10 苏州旭创科技有限公司 一种光信号传输器及激光雷达

Also Published As

Publication number Publication date
SE0202392L (sv) 2004-04-13
AU2003248585A1 (en) 2004-02-25
SE525405C2 (sv) 2005-02-15
SE0202392D0 (sv) 2002-08-09

Similar Documents

Publication Publication Date Title
KR100720854B1 (ko) 광·전기배선기판, 실장기판 및 광전기배선기판의 제조방법
US7421858B2 (en) Optical transmission substrate, method for manufacturing optical transmission substrate and optoelectronic integrated circuit
EP1522882B1 (fr) Guide d'onde optique avec surface miroir formée par usinage à l'aide d'un faisceau laser
US7433554B2 (en) Optical wiring board and method for manufacturing optical wiring board
US6907173B2 (en) Optical path changing device
JP5089643B2 (ja) 光接続要素の製造方法、光伝送基板、光接続部品、接続方法および光伝送システム
US7627210B2 (en) Manufacturing method of optical-electrical substrate and optical-electrical substrate
US20120189245A1 (en) Optical interposer for waveguides
KR20090010100A (ko) 광전자 구성요소 및 광학 도파관을 포함하는 인쇄회로기판 엘리먼트
US20050069253A1 (en) Device for introducing light into a waveguide, device for emitting light from a waveguide and method for manufacturing such devices
WO2004015463A1 (fr) Miroirs de guides d'ondes polymeriques
US7925130B2 (en) Optical waveguide, optical module, method of producing optical module, and method of producing optical waveguide
EP1060429B1 (fr) Procede de fabrication de miroirs dans des guides d'ondes polymeres
US7218804B2 (en) Method and device for establishing an optical connection between an optoelectronic component and an optical waveguide
JP2002169042A (ja) 光導波路結合構造、光導波路及びその製造方法、並びに光導波路付き光素子部品及びその製造方法
CN103443675A (zh) 光学中介件
WO2005017592A1 (fr) Dispositif a element optique, dispositif guide d'ondes optique bidimensionnel et carte de circuits optoelectroniques mettant en oeuvre ces dispositifs
US20090304323A1 (en) Optical coupling structure and substrate with built-in optical transmission function, and method of manufacturing the same
JP2004054003A (ja) 光電子基板
US7218825B2 (en) Optical waveguide having curved reflecting mirror surface and method of manufacturing the same
JP2008102283A (ja) 光導波路、光モジュール及び光導波路の製造方法
US6819840B2 (en) Optical transmitting/receiving module and method for manufacturing the same
JP2001272565A (ja) 光導波路の形成方法および光送受信装置の製造方法
JP2007178950A (ja) 光配線基板および光配線モジュール
JP2004233687A (ja) 光導波路基板および光モジュール

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP