WO2004010746A1 - プラズマ処理装置及びその制御方法 - Google Patents
プラズマ処理装置及びその制御方法 Download PDFInfo
- Publication number
- WO2004010746A1 WO2004010746A1 PCT/JP2003/009404 JP0309404W WO2004010746A1 WO 2004010746 A1 WO2004010746 A1 WO 2004010746A1 JP 0309404 W JP0309404 W JP 0309404W WO 2004010746 A1 WO2004010746 A1 WO 2004010746A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- plasma
- impedance
- adjustment
- load matching
- adjustment amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
- H01J37/32311—Circuits specially adapted for controlling the microwave discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
- H05H1/461—Microwave discharges
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H2242/00—Auxiliary systems
- H05H2242/20—Power circuits
- H05H2242/26—Matching networks
Definitions
- the reactance of each of the stubs 121, 112, 112 can be calculated, so that the impedance on the load side can be calculated.
- control unit 51 includes a calculation unit 5110 and three position control units 511, 512, and 513.
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Electromagnetism (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Plasma Technology (AREA)
Abstract
Description
Claims
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/519,775 US20060042546A1 (en) | 2002-07-24 | 2003-07-24 | Plasma processing apparatus and controlling method therefor |
| JP2004522790A JPWO2004010746A1 (ja) | 2002-07-24 | 2003-07-24 | プラズマ処理装置及びその制御方法 |
| AU2003252258A AU2003252258A1 (en) | 2002-07-24 | 2003-07-24 | Plasma processing device and controlling method therefor |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002215503 | 2002-07-24 | ||
| JP2002-215503 | 2002-07-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2004010746A1 true WO2004010746A1 (ja) | 2004-01-29 |
Family
ID=30767926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2003/009404 Ceased WO2004010746A1 (ja) | 2002-07-24 | 2003-07-24 | プラズマ処理装置及びその制御方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20060042546A1 (ja) |
| JP (1) | JPWO2004010746A1 (ja) |
| KR (1) | KR100775881B1 (ja) |
| AU (1) | AU2003252258A1 (ja) |
| TW (1) | TWI236701B (ja) |
| WO (1) | WO2004010746A1 (ja) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007220499A (ja) * | 2006-02-17 | 2007-08-30 | Noritsu Koki Co Ltd | プラズマ発生装置およびそれを用いるワーク処理装置 |
| WO2008013112A1 (en) * | 2006-07-28 | 2008-01-31 | Tokyo Electron Limited | Microwave plasma source and plasma processing apparatus |
| JP2008059838A (ja) * | 2006-08-30 | 2008-03-13 | Noritsu Koki Co Ltd | プラズマ発生装置およびそれを用いるワーク処理装置 |
| JP2008059839A (ja) * | 2006-08-30 | 2008-03-13 | Noritsu Koki Co Ltd | プラズマ発生装置およびそれを用いるワーク処理装置 |
| JP2008071520A (ja) * | 2006-09-12 | 2008-03-27 | Noritsu Koki Co Ltd | プラズマ発生装置及びワーク処理装置 |
| JP2010500702A (ja) * | 2006-09-13 | 2010-01-07 | ノーリツ鋼機株式会社 | プラズマ発生装置およびこれを用いたワーク処理装置 |
| US7976672B2 (en) | 2006-02-17 | 2011-07-12 | Saian Corporation | Plasma generation apparatus and work processing apparatus |
| JP2016018657A (ja) * | 2014-07-08 | 2016-02-01 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置およびプラズマ処理方法 |
| JP2016096091A (ja) * | 2014-11-17 | 2016-05-26 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
| JPWO2016104205A1 (ja) * | 2014-12-26 | 2017-11-02 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
| JP2023044543A (ja) * | 2021-09-17 | 2023-03-30 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
| JP2024017093A (ja) * | 2022-07-27 | 2024-02-08 | 株式会社日立ハイテク | プラズマ処理装置 |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7164095B2 (en) * | 2004-07-07 | 2007-01-16 | Noritsu Koki Co., Ltd. | Microwave plasma nozzle with enhanced plume stability and heating efficiency |
| US20060052883A1 (en) * | 2004-09-08 | 2006-03-09 | Lee Sang H | System and method for optimizing data acquisition of plasma using a feedback control module |
| US20080003702A1 (en) * | 2006-06-28 | 2008-01-03 | Cruse James P | Low Power RF Tuning Using Optical and Non-Reflected Power Methods |
| TW200816881A (en) * | 2006-08-30 | 2008-04-01 | Noritsu Koki Co Ltd | Plasma generation apparatus and workpiece processing apparatus using the same |
| US20100074810A1 (en) * | 2008-09-23 | 2010-03-25 | Sang Hun Lee | Plasma generating system having tunable plasma nozzle |
| US7921804B2 (en) * | 2008-12-08 | 2011-04-12 | Amarante Technologies, Inc. | Plasma generating nozzle having impedance control mechanism |
| US20100201272A1 (en) * | 2009-02-09 | 2010-08-12 | Sang Hun Lee | Plasma generating system having nozzle with electrical biasing |
| US20100254853A1 (en) * | 2009-04-06 | 2010-10-07 | Sang Hun Lee | Method of sterilization using plasma generated sterilant gas |
| US9111727B2 (en) * | 2011-09-30 | 2015-08-18 | Tokyo Electron Limited | Plasma tuning rods in microwave resonator plasma sources |
| US9728416B2 (en) | 2011-09-30 | 2017-08-08 | Tokyo Electron Limited | Plasma tuning rods in microwave resonator plasma sources |
| JP2014154421A (ja) * | 2013-02-12 | 2014-08-25 | Tokyo Electron Ltd | プラズマ処理装置、プラズマ処理方法、および高周波発生器 |
| KR101730755B1 (ko) * | 2013-03-15 | 2017-04-26 | 도쿄엘렉트론가부시키가이샤 | 마이크로파 공진기 플라즈마 소스에서의 플라즈마 튜닝 로드 |
| KR102262109B1 (ko) * | 2014-08-01 | 2021-06-10 | 세메스 주식회사 | 플라즈마 발생 장치, 그를 포함하는 기판 처리 장치, 및 기판 처리 균일도 조절 방법 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0765993A (ja) * | 1993-08-20 | 1995-03-10 | Anelva Corp | 有磁場マイクロ波放電反応装置 |
| JPH09190900A (ja) * | 1996-11-20 | 1997-07-22 | Tokyo Electron Ltd | プラズマ処理装置 |
| JPH10335095A (ja) * | 1997-05-30 | 1998-12-18 | Hitachi Ltd | マイクロ波応用装置 |
| JPH1140396A (ja) * | 1997-05-22 | 1999-02-12 | Canon Inc | プラズマ処理方法及びプラズマ処理装置 |
| JP2000195698A (ja) * | 1998-12-24 | 2000-07-14 | Nihon Koshuha Co Ltd | プラズマ処理用インピーダンス測定装置 |
| JP2001068458A (ja) * | 1999-08-31 | 2001-03-16 | Sumitomo Metal Ind Ltd | プラズマ処理装置及びプラズマ処理方法 |
| JP2001320227A (ja) * | 2000-05-11 | 2001-11-16 | Tokyo Electron Ltd | マイクロ波アンテナ及びマイクロ波プラズマ処理装置 |
| JP2003204237A (ja) * | 2001-11-05 | 2003-07-18 | Daihen Corp | インピーダンス整合装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2986166B2 (ja) * | 1989-01-30 | 1999-12-06 | 株式会社ダイヘン | マイクロ波回路のインピーダンス自動調整装置及びインピーダンス自動調整方法 |
| JP3287041B2 (ja) * | 1992-12-28 | 2002-05-27 | 株式会社ダイヘン | プラズマ処理装置の制御方法 |
| US5621331A (en) * | 1995-07-10 | 1997-04-15 | Applied Science And Technology, Inc. | Automatic impedance matching apparatus and method |
| JP2000299198A (ja) * | 1999-02-10 | 2000-10-24 | Tokyo Electron Ltd | プラズマ処理装置 |
-
2003
- 2003-07-22 TW TW092119984A patent/TWI236701B/zh not_active IP Right Cessation
- 2003-07-24 KR KR1020057001179A patent/KR100775881B1/ko not_active Expired - Fee Related
- 2003-07-24 WO PCT/JP2003/009404 patent/WO2004010746A1/ja not_active Ceased
- 2003-07-24 JP JP2004522790A patent/JPWO2004010746A1/ja active Pending
- 2003-07-24 AU AU2003252258A patent/AU2003252258A1/en not_active Abandoned
- 2003-07-24 US US10/519,775 patent/US20060042546A1/en not_active Abandoned
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0765993A (ja) * | 1993-08-20 | 1995-03-10 | Anelva Corp | 有磁場マイクロ波放電反応装置 |
| JPH09190900A (ja) * | 1996-11-20 | 1997-07-22 | Tokyo Electron Ltd | プラズマ処理装置 |
| JPH1140396A (ja) * | 1997-05-22 | 1999-02-12 | Canon Inc | プラズマ処理方法及びプラズマ処理装置 |
| JPH10335095A (ja) * | 1997-05-30 | 1998-12-18 | Hitachi Ltd | マイクロ波応用装置 |
| JP2000195698A (ja) * | 1998-12-24 | 2000-07-14 | Nihon Koshuha Co Ltd | プラズマ処理用インピーダンス測定装置 |
| JP2001068458A (ja) * | 1999-08-31 | 2001-03-16 | Sumitomo Metal Ind Ltd | プラズマ処理装置及びプラズマ処理方法 |
| JP2001320227A (ja) * | 2000-05-11 | 2001-11-16 | Tokyo Electron Ltd | マイクロ波アンテナ及びマイクロ波プラズマ処理装置 |
| JP2003204237A (ja) * | 2001-11-05 | 2003-07-18 | Daihen Corp | インピーダンス整合装置 |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7976672B2 (en) | 2006-02-17 | 2011-07-12 | Saian Corporation | Plasma generation apparatus and work processing apparatus |
| JP2007220499A (ja) * | 2006-02-17 | 2007-08-30 | Noritsu Koki Co Ltd | プラズマ発生装置およびそれを用いるワーク処理装置 |
| WO2008013112A1 (en) * | 2006-07-28 | 2008-01-31 | Tokyo Electron Limited | Microwave plasma source and plasma processing apparatus |
| JP5161086B2 (ja) * | 2006-07-28 | 2013-03-13 | 東京エレクトロン株式会社 | マイクロ波プラズマ源およびプラズマ処理装置 |
| JP2008059839A (ja) * | 2006-08-30 | 2008-03-13 | Noritsu Koki Co Ltd | プラズマ発生装置およびそれを用いるワーク処理装置 |
| JP2008059838A (ja) * | 2006-08-30 | 2008-03-13 | Noritsu Koki Co Ltd | プラズマ発生装置およびそれを用いるワーク処理装置 |
| JP2008071520A (ja) * | 2006-09-12 | 2008-03-27 | Noritsu Koki Co Ltd | プラズマ発生装置及びワーク処理装置 |
| JP2010500702A (ja) * | 2006-09-13 | 2010-01-07 | ノーリツ鋼機株式会社 | プラズマ発生装置およびこれを用いたワーク処理装置 |
| US8128783B2 (en) | 2006-09-13 | 2012-03-06 | Amarante Technologies, Inc. | Plasma generator and work processing apparatus provided with the same |
| JP2016018657A (ja) * | 2014-07-08 | 2016-02-01 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置およびプラズマ処理方法 |
| JP2016096091A (ja) * | 2014-11-17 | 2016-05-26 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
| JPWO2016104205A1 (ja) * | 2014-12-26 | 2017-11-02 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
| JP2023044543A (ja) * | 2021-09-17 | 2023-03-30 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
| JP7632975B2 (ja) | 2021-09-17 | 2025-02-19 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
| JP2024017093A (ja) * | 2022-07-27 | 2024-02-08 | 株式会社日立ハイテク | プラズマ処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI236701B (en) | 2005-07-21 |
| TW200415695A (en) | 2004-08-16 |
| US20060042546A1 (en) | 2006-03-02 |
| KR100775881B1 (ko) | 2007-11-13 |
| AU2003252258A1 (en) | 2004-02-09 |
| JPWO2004010746A1 (ja) | 2005-11-17 |
| AU2003252258A8 (en) | 2004-02-09 |
| KR20050031457A (ko) | 2005-04-06 |
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