WO2004009708A1

WO2004009708A1 - Curable resin composition

Info

Publication number: WO2004009708A1
Application number: PCT/JP2002/007360
Authority: WO
Inventors: Nobuyuki Furukawa
Original assignee: Nippon Steel Chemical Co., Ltd.
Priority date: 2002-07-19
Filing date: 2002-07-19
Publication date: 2004-01-29
Also published as: AU2002318602A1; JPWO2004009708A1

Abstract

A curable resin composition which is excellent in heat resistance, mechanical properties, and adhesion and is capable of forming a film having improved flame retardancy. The curable resin composition comprises a thermosetting resin having dihydrobenzoxazine rings and a polyimide resin in a weight ratio of from 5/95 to 95/5.

Description

TECHNICAL FIELD The present invention relates to a dihydroxazine resin having a dihydroxazine ring (hereinafter also referred to as a DHX resin) and a polyimide resin, which give a cured product having excellent heat resistance and curing properties. Curable resin composition. BACKGROUND ART Thermosetting resins such as epoxy resins, phenolic resins, polyimide resins, melamine resins, polyimide resins, etc. have been developed and applied to fields suited to their respective resin characteristics. Recently, curable resins used in copper-clad laminates for printed wiring boards, adhesives for multilayer wiring boards, sealing materials for semiconductors, adhesives for semiconductor mounting, modules for mounting semiconductors, automobiles and aircraft As for curable resins used for building components, etc., resin materials having excellent stability and reliability under high temperature and high humidity are required. Further, a resin material having halogen-free flame retardancy is strongly desired.

In recent years, it has been reported that DHX resin is a resin having better heat resistance and moisture resistance than cured phenolic resin (H. Ishida, et al., J. Polym. Sci., Vol. 32, p921 (1994), H. Ishida, et al., J. Appl. Polym. Sci., Vol. 61, 1595 (1996)). This resin has high ring-opening polymerization reactivity. Therefore, it has also been shown that the cured product after ring-opening reaction has various characteristics, such as low thermal expansion, because it has low curing shrinkage (H. I shi da, et. al., J. Polym. Sci., Vol. 34, 1019 (1994),)). Further, it has also been shown that it shows reactivity with epoxy resins and is effective as a curing agent (Japanese Patent Application Laid-Open No. 4-227922).

On the other hand, various polyimide resins were developed and used as heat-resistant films, insulating varnishes, heat-resistant adhesives, molding materials, copper-clad laminates for flexible printed circuit boards, adhesive films for multilayer printed circuit boards, It is used as a cover film for circuit boards, a semiconductor coating agent, an underfill agent, a sealing material for TAB, and a member in the aerospace field. Recently, thermoplastic and moldable polyimide resins and polyimide resins soluble in organic solvents have been developed, and their application fields are expanding. In particular, in the field of semiconductors and printed circuit boards, high reliability as well as heat resistance are required, and polyimide materials having excellent mechanical and electrical properties have been used.

However, in general, when polyimide resin alone is used as an adhesive or an adhesive film, there has been a problem that sufficient adhesive strength cannot be obtained. Also, from the viewpoint of environmental problems, lead-free solder materials are being used, and the development of a material having a high solder heat resistance temperature has been desired. Furthermore, recently, halogen-free flame retardancy is also required. However, these resins have insufficient properties in terms of heat resistance and flame retardancy, and require the blending of halogen-based flame retardants and various modifiers.

JP-B-49-47378, JP-A-2-69567, JP-A-4-227922, and JP-A-9-216994 disclose a compound having a dihydrobenzoxazine ring and a compound having the same. Thermosetting resin compositions have been reported. But this All are made of low molecular weight resins and cannot be used as films / sheets or fibers, or have insufficient heat resistance, electrical properties or mechanical properties. DISCLOSURE OF THE INVENTION An object of the present invention is to provide a curable resin composition having excellent heat resistance and flame retardancy, and also having excellent properties in adhesion to metals such as copper and stainless steel. Another object of the present invention is to provide a curable resin composition having both characteristics of a polyimide resin and a DHX resin.

The curable resin composition of the present invention is selected from a thermosetting resin having at least one dihydroxy pyridine ring condensed with an aromatic hydrocarbon ring, a polyimide resin, a polyimide precursor, and a mixture thereof. The curable resin composition is characterized in that it contains the polyimide resin used in a weight ratio of 5 to 9'5: 95 to 5. The curable resin composition of the present invention essentially comprises a thermosetting resin (DHX resin) having at least one dihydroxazine ring, and a polyimide resin selected from a polyimide resin, a precursor thereof, or a mixture thereof. Contains as an ingredient. The content of the DHX resin in the resin composition is 5 to 95% by weight based on the total amount of the resin components. /. It is preferably in the range of 20-80% by weight. The content of the polyimide resin is in the range of 5 to 95% by weight, preferably 20 to 80% by weight, based on the total amount of the resin components. If the content of DHX resin is too small, the cured product will not be effective in heat resistance, flame retardancy, adhesion, etc. In addition, the flexibility of the polyimide resin is impaired, the brittleness of the cured product becomes apparent, and the superiority of the material is lost.

The DHX resin is not particularly limited as long as it has at least one dihydroxazine ring condensed with an aromatic hydrocarbon ring, and is a resin that is cured by a ring-opening polymerization reaction of the dihydroxazine ring. DHX resin and the like can also be used. The aromatic hydrocarbon ring condensed with the dihydroxazine ring is preferably a benzene ring or a naphthalene ring, and these aromatic hydrocarbon rings are alkyl groups having 3 or less carbon atoms such as a methyl group. And the like, but those having no substituent are preferred.

The dihydroxazine ring condensed with a benzene ring is called dihydrobenzoxazine 1 and is called a dihydrobenzoxazine ring resin (hereinafter referred to as DHB resin). A dihydroxazine ring condensed with a naphthalene ring is Since it is called a dronaphthoxazine ring, it is called a dihydronaphthoxazine ring resin (hereinafter, DNH resin). However, each is a type of DHX resin.

The DHX resin is a DHB resin represented by the following general formula (3) or a DHB resin represented by the following general formula (4) in that it is easily mixed with the polyimide resin and suppresses a decrease in heat resistance after curing. Preferably, it is a D HN resin.

(3) (Wherein, R9 and R10 are organic radicals 0 1 1 carbon atoms, R11 is a hydrogen atom or a hydrocarbon group with carbon number 1_ ~ 6, or not Y is _{_{present, - C (CH 3) 2}} -, - CO -, - 0-, - S-, - S0 2 - - CH 2 - (- indicates a group represented by or formula (5) CFJ _2), _C

(Wherein, R15 represents hydrogen or an alkyl group having 1-6 carbon atoms, and R16 represents an alkyl group having 1-6 carbon atoms, cyclohexyl group, phenyl group, substituted phenyl group, naphthyl group or substituted naphthyl group Here, the group represented by the formula (5) is a group derived from a specific phenol resin, and is represented by the following formula (5).

( Five )

(Wherein, R 12 represents an organic group having 1 to 10 carbon atoms, R 13 represents a hydrogen atom or a hydrocarbon group having 1 to 6 carbon atoms, R 14 represents a methylene group or a P-xylylene group, and n represents 1 to Indicates an integer of 10). In the general formulas (3) to (5), R9 and R10 are organic groups having 1 to 10 carbon atoms, but are preferably an alkyl group, a phenyl group or an alkylphenyl group. Rll is a hydrogen atom, and is preferably a hydrocarbon group having 1 to 6 carbon atoms, but is preferably a hydrogen atom or an alkyl group. Or Y is _{_{absent, - C (CH 3) 2}} -, - CO -, - 0-, - S -, - S0 2 _, - CH 2 -, _C (CF 3) 2 - or the formula (5) The group represented is represented, preferably _C (CH ₃ ) _2- . R15 represents hydrogen or an alkyl group having 1 to 6 carbon atoms; R16 represents an alkyl group having 1 to 6 carbon atoms, cyclohexyl group, phenyl group, substituted phenyl group, naphthyl group or substituted naphthyl group. R12 represents an organic group having 1 to 10 carbon atoms, preferably an alkyl group, a phenyl group, or an alkylphenyl group. R 13 is a hydrogen atom or a hydrocarbon group having 1 to 6 carbon atoms, but is a hydrogen atom or an alkyl group, R 14 represents a methylene group or a p-xylylene group, and n is an integer of 1 to 10 Is shown. Here, the p-xylylene group is represented by the following formula.

Desirable DHX resin used in the present invention may be composed of only the resin represented by the general formula (3) or the general formula (4) ′, and is a resin containing a small amount of a partial polymer thereof. Or a mixture thereof. In addition, it may contain a small amount of impurities by-produced during the production of DHX resin, partially ring-opened products, unreacted products, and the like. The DHB resin used in the present invention can be produced by a known method. Examples of preferable reaction raw materials include a phenol compound, a primary amine and an aldehyde represented by the following general formula.

a) Phenol compound: H O -Ar3 or H 0- Ar4-OH

b) Primary amine: R-NH ₂ c) Aldehyde: R'-CHO

Here, Ar3 is a monovalent aromatic group, and Ar4 is a divalent aromatic group, and is preferably a polycyclic aromatic group having two or more rings, and a substituent such as a halogen or an alkyl group. But has at least one hydrogen that can be substituted ortho to the OH group.

R is a monovalent aliphatic or aromatic organic group, preferably an aromatic group, and may have a substituent such as halogen. It is also preferable that the compound is a polycyclic aromatic group having two or more rings. Preferably, it is an alkyl group having 1 to 10 carbon atoms, a cyclohexyl group, a phenyl group or a substituted phenyl group.

R ′ is hydrogen or an organic group such as a monovalent aliphatic or aromatic group, and is preferably hydrogen, a low-fiber or alkynole group.

An example of a reaction for obtaining a DHB resin from a phenol compound, a primary amine and an aldehyde is shown below.

From the above reaction formula, it can be understood that various DHB resins can be obtained by changing the phenol compound, primary amine or aldehyde. For example, when obtaining the DHB resin represented by the above general formula (3), phenol conversion The following compounds are used as raw materials as compounds, primary amines and aldehydes. In the following formula, Φ represents p-phenylene, and R9 and R10 may be the same.

a) Phenosole compound: H O— φ— Υ_φ _Ο Η

b) 1 grade § Mi emissions: R9- NH ₂ or RIO- NH ₂

c) Aldehyde: Rll—CHO

'To synthesize the DHB resin used in the present invention, when the number of hydroxyl groups contained in the phenol compound is y, the primary amine is preferably (0.8 to 1.2) X y mol, preferably. Or (0.9 to: L.1) Xy mole, and the aldehyde is (1.6 to 2.4) Xy mole, preferably (1.8 to 2.2) Xy mole. It is desirable to carry out the reaction using.

The phenolic compounds used as raw materials for DHB resin include phenols having at least one ortho-bonded with hydrogen, polyfunctional phenols, bisphenols, 1,1,1-tris (4- And trisphenols such as hydroxyphenyl) ethane. Preferably, it is a compound having two or more phenolic hydroxyl groups in one molecule from the viewpoint of thermosetting properties. Specific examples include polyfunctional phenols such as catechol, resorcinol, and hydroquinone, and bisphenols such as bisphenol ^ / A, bisphenolphenol S, bisphenol and hexafluorobisphenol A. Examples of the phenol resin include a phenol novolak resin, a resole resin, a phenol-modified xylene resin, an alkyl phenol resin, a melamine phenol resin, and a polybutadiene-modified phenol resin. One or more of these can be used.

First-class amines include methylamine, butylamine, and cyclohexylamine. Aliphatic amines such as mine, aromatic amines such as aniline, toluidine, and fusidine can be used, and one or more of these can be used.

As the aldehyde, the above-mentioned aldehyde can be used, but when formaldehyde is used, it can be used in any form as a formalin aqueous solution or as a paraformaldehyde.

Specific examples of the DHB resin include the following DHB resins. However, the present invention is not limited to these, and one or more of them may be used.

(i)

(iii)

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09 £ L00 / Z00Zd £ / ∑Jd 80 600 contract OAV (vi)

(x)

(xi)

The DHX resin used in the present invention is a dihydronaphthoxazine ring. A thermosetting resin (also referred to as DHN resin) having the following can also be used advantageously. This DHN resin can be used alone as a DHX resin, or can be used in combination with the DHB resin as described above. A specific method for producing the DHN resin is, as in the case of the DHB resin described above, a reaction in which a primary amine is gradually added to formaldehyde, and then a naphthol hydroxyl group is formed. The compound is added and kept at 70-120 ° C. for 20 minutes to 24 hours. At this time, an organic solvent can be used if necessary. After the reaction, the product is isolated and purified by a synthetic chemical method such as extraction, and then purified and dried to remove volatile components such as condensed water to obtain the desired DHN resin.

As the DHN resin, specifically, the following resins are preferably exemplified. The power is not limited to these.

Ο)

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The DHX resin causes a ring-opening polymerization reaction upon heating, and forms a crosslinked structure having excellent properties while generating a phenolic hydroxyl group without generating volatile components. This cured product has low moisture absorption, high glass transition temperature, high strength-high elasticity, low curing shrinkage, and excellent flame retardancy. Note that D H

The X resin may be a single compound before curing, may be a mixture containing a small amount of by-products, or may be a partially polymerized oligomer in the present invention. When referring to D Η X resin in both cases, No.

Examples of the polyimide resin used as another essential component of the curable resin composition of the present invention include a component composed of a repeating unit containing an imido group or an amic acid or both. There is no limitation as long as it is the main resin, and known polyimide resins and precursors thereof can also be used. The polyimide resin is preferably a resin obtained from a tetracarboxylic acid compound and a diamine compound, and more preferably contains a repeating unit structure represented by the following general formula (1) or (2). It is a polyimide resin or a precursor thereof. In terms of the physical properties of the resin composition, a polyimide resin or a precursor resin containing 50% by weight or more of one or both of the structural units represented by the general formula (2) or (3) above (Polyamic acid) is preferred.

(伹to the general formula (1) in及Pi (2), tetravalent organic group having one aromatic ring at least the Arl and Ar @ 2, R1 and _{R2 - 0H, - NH 2,} - SH, - C0Nh ₂ or an organic group with carbon number. 1 to 6, i and j represents an integer of 0 to 4, R3及Pi R4 represents a divalent organic group of from 1 to 1 0 carbon atoms, R5 to R8 Is hydrogen or C 1-6 X represents a divalent group, m represents a number of 1 to 10) In the above general formulas (1) and (2), Arl and Ar2 have at least one aromatic ring It is a tetravalent organic group, and can be said to be a residue of a tetracarboxylic acid compound. Therefore, preferred Arl and Ar2 are understood from the preferred tetracarboxylic acid compounds described below. Further, the divalent group bonded to two Ns can be said to be a residue of a diammine compound. Therefore, in the general formula (1), preferred R1 and R2, i and j, and X are understood from the preferred diamine compounds described below. For example, R1 and _{R2 - 0H, - NH 2,} - SH, - C0NH 2 or carbon atoms 1 shows a 6 organic group, preferably a lower alkyl group. i and j each represent an integer of 0 to 4, preferably 0 to 2. In the above general formula (2), R3 and R4 represent a divalent organic group having 1 to 10 carbon atoms, preferably an alkylene group or a phenylene group having 1 to 6 carbon atoms. R5 to R8 represent hydrogen or an organic group having 1 to 6 carbon atoms, preferably an alkylene group or a phenylene group having 1 to 6 carbon atoms. m represents a number of 1 to 10, preferably 2 to 8.

As the tetracarboxylic acid compound used as a raw material of the polyimide resin, an acid dianhydride is preferable. Specific examples include pyromellitic dianhydride (PMDA), 3,3 ', 4,4'-diphenylsulfonetetracarboxylic dianhydride

(DSDA), 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride (BPDA), 2,3', 3,4'-biphenyltetracarboxylic dianhydride (a-BPDA), 3 ', 4,4'-Benzophenonetetracarboxylic dianhydride (BTDA), 2,2'-bis (3,4-dicarboxyphenyl) ether dianhydride (0DPA), 2,2'-bis (2 , 3-Dicarboxyphenyl) ether dianhydride (a-0DPA), 2,2, -bis (3,4-dicarboxyphenyl) propane dianhydride (BDCP), 2,2'-bis (3,4-dicanolepoxif) Enyl) hexafluoropropane dianhydride (BDCF), 1,4,5,8-naphthalenetetracarboxylic dianhydride (NTCA), cyclopentane-1,2,3,4-tetrahydropropane Dianhydride (CPTA), pyrrolidine-2,3,4,5-tetracarboxylic dianhydride (PTCA), 1,2,3,4-butanetetracarboxylic dianhydride (BTCA) Although not limited thereto, various tetracarboxylic dianhydrides can be used. In addition, one or more of these can be used. +

The diamine compound can be used without limitation as long as it is a compound having two or more amino groups in the molecule, but from the viewpoint of improving heat resistance, aromatic diamine is preferred. Desirably, it is a compound. Preferred specific examples of the diamino compound include the following diamines. However, the present invention is not limited to these, and one or more kinds can be used. In addition, m-phenylenediamine, p-phenylenediamine and the like can also be used.

61

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(o)

(q)

In addition, a siloxane-based diamine providing a repeating unit represented by the general formula (2) Examples of the amine include bis (3-aminopropyl) 1-1,1,3,3-tetramethyldisiloxane and bis (4-aminophenyl) 1-1,1,3,3 —Tetramethyldisiloxane, bis (3-methinolay 4-aminophenol) 1,1,1,3,3-tetramethyldisiloxane, or the following general formula (6)

(6)

(Wherein, R3 to R4 and n are the same as those in the general formula (2)). In the general formula (2), R3 and R4 are preferably a trimethylene group, and R5 to R8 are each a methyl group, a Bier group or a phenyl group.

The polyimide resin can be synthesized by reacting tetracarboxylic dianhydride with a diamino compound in substantially equimolar amounts. Known reaction conditions can be employed. The polyimide resin is represented by the general formula (1) or

The polyimide resin unit represented by (2) or a precursor unit thereof may be contained as a repeating unit in an amount of 50% by weight or more, preferably 80% by weight or more. It contains both the polyimide resin units represented by the general formulas (1) and (2) or the precursor unit thereof, and the weight ratio of the units represented by the general formulas (1) and (2) is 20 to 8 0: 80 to 20 is also advantageous. The curable resin composition of the present invention is obtained by adding a DHX resin to a polyimide resin and a DHX resin by a conventional blending method or a polyimide resin or a polyimide acid solution which is a polyimide precursor. Add, mix and dry if necessary It can be manufactured more. The weight ratio of Porii Mi de resin and DHX resin is 5-95: A 95-5 ₀

In the cured resin composition of the present invention, an epoxy resin may be used as one component of the resin composition. Examples of the epoxy resin used as one component of the curable resin composition of the present invention include bisphenol II epoxy resin, bisphenol F epoxy resin, phenol nopol epoxy resin, and Examples include, but are not limited to, resole nopolak type epoxy resin, hydrogenated bisphenol A type epoxy resin, various alicyclic epoxy resins, various epoxy resins having a naphthalene structure, and brominated epoxy resins. It can be used without. Further, one or more of these can be used.

Further, if necessary, a compound having a phenolic hydroxyl group which has an effect of opening the dihydroxazine ring, for example, a compound having a bisphenol A, a nopolak resin, a resole resin, or an amino group may be used. You can also.

Further, as a curing reaction catalyst, for example, an imidazole compound, a dicyandiamide compound, and a phosphorus compound can be used.

The thermosetting resin composition of the present invention may contain various phenolic resins, melamine resins, polyamide resins, and the like, if necessary, in addition to the components described above.

Further, it may contain a filler, a reinforcing material, a release agent, a coupling agent, a plasticizer, a flame retardant, a curing aid, a coloring agent, a coupling agent, or carbon black. In order to further improve the flame retardancy of the resin, phosphines such as triphenyl phosphine, phosphites, ester phosphites, ester phosphites, phosphine oxides, etc. Various organic phosphorus compounds Can also be used.

The curable resin composition of the present invention contains a DHX resin and a polyimide resin as essential components. When it is composed of two components, a DHX resin and a polyimide resin, the amounts thereof are as described above, but more preferably 100 to 100 parts by weight of the polyimide resin, and more preferably 5 to 50 parts by weight of the DHX resin. It is. When other resin components as described above are added as necessary, the other resin components should be 40% by weight or less, preferably 20% by weight or less of the total resin component. In addition, all resin components in the curable resin composition refer to components excluding components other than resin such as filler.

The curable resin composition of the present invention is not only used as a molding material and a varnish, but also has excellent moldability, so that it can be used in the form of a film, a sheet, a fiber or the like.

The curable resin composition of the present invention can form a crosslinked structure by a thermal reaction and can be thermoset. The cured product obtained in this way is a cured resin having excellent heat resistance and flame retardancy, and also having excellent adhesion to metal. BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described specifically with reference to examples, but the present invention is not limited to these examples. The abbreviations of the resin raw materials in the examples correspond to the abbreviations described in the description of the acid dianhydride, the diamine compound, the DHB resin and the DHN resin. Other abbreviations mean the following. BAPD: Bis (3-aminopropyl)-1, -1,3,3-tetramethyldisiloxane PSX750: bis (3-aminopropyl) dimethylpolysiloxane with an average molecular weight of 750

PSX1000: bis (3-aminopropyl) dimethylpolysiloxane with an average molecular weight of 1000

(la): D H B resin represented by the following formula synthesized from phenol nopolak (OH equivalent = 200)

Synthesis example 1

In a 1 L separable flask equipped with a Dean-Stark type dehydrating and cooling device and stirring blades, add 200 ml of N-methyl-2-pyrrolidinone (NMP) and 100 ml of toluene and cool with ice. ° C or below to maintain the temperature, under a nitrogen stream, was dissolved diamines (1) ⁴ 0.1 g, was a small amount Dzu' put DSM35.4g form of powder. After reacting for 2 hours to allow the polymerization of the polyamic acid to proceed sufficiently, the temperature was gradually raised until the reflux of toluene occurred, and the water generated by the imidization dehydration reaction was removed out of the polymerization reaction system. . After the dehydration imidization reaction was completed, the reaction was further stirred at 150 ° C for 1 hour to terminate the reaction. NMP was added to the obtained polyimide solution to adjust the solid content to 20% by weight.

Example 1

Thermosetting with dihydrobenzoxazine ring in the above polyimide solution After mixing the resin lOg, it was cast on a glass substrate and cast using a doctor blade. Furthermore, this is placed in an inert oven under a stream of nitrogen,

After drying at 100 ° C for 60 minutes and at 150 ° C for 60 minutes, the resin layer was separated from the glass substrate and fixed to a stainless steel metal frame. This was dried at 180 ° C. for 10 minutes to obtain a curable resin composition film. Using this film, the adhesive strength with copper and stainless steel was measured. The film was further heat-treated at 180 ° C. for 60 minutes, and then its physical properties were measured.

The glass transition temperature (Tg) was measured using a dynamic viscoelasticity analyzer (DMA), the thermal expansion coefficient was measured using a thermomechanical analyzer (TMA), and the thermal decomposition onset temperature (5% weight loss temperature) Flexural strength and flexural modulus were measured using a gravimetric analyzer (TGA) according to JIS K6911.

After preparing a cured product with a thickness of 3 mra, the cured product was treated under PCT (121 ° C, 2 atm) treatment time of 20 hours, and the change in weight before and after PCT treatment was measured to determine the water absorption. Was. Furthermore, the flame retardancy of the 1.6 mm thick cured product was evaluated according to the UL standard method.

The adhesive strength was evaluated according to JIS K 6850 using a pressure press at a compression temperature (glass transition temperature + 50 ° C) and a compression pressure (19.6 MPa). Note that the adhesive strength (1) indicates copper, and the adhesive strength (2) indicates stainless steel. Table 1 shows the raw material composition of the polyimide resin and the compounding composition of the resin composition, and Table 2 shows the physical properties of the obtained cured product.

Examples 2 to 8

The evaluation was performed in the same manner as described in Example 1 except that the raw material composition of the polyimide resin and the composition of the curable resin composition were as shown in Table 1. W

Comparative Examples 1-2

The description of Example 1 was repeated except that the epoxy resin (Epicoat 828) was used instead of the DHX resin, and the raw material composition of polyimide 'resin and the composition of the curable resin composition were as shown in Table 1. The evaluation was performed in the same manner as described above. A phenol nopolak resin was used as a curing agent for the epoxy resin, and triphenyl phosphine was used as a curing accelerator. Table 1 shows the raw material composition of the polyimide resin and the composition of the resin composition. Table 2 shows the physical properties of the obtained cured product. .

Examples Polyimide resin raw material Polyimide DH X resin dianhydride; diamine resin (parts by weight) (mol%) (parts by weight)

1 DSDA / 100 (D / 100 100 (ii) / 10

2 0DPA / 100 (a) / 100 100 (ii) / 10

3 BTDA / 100 (s) / 100 100 (i) / 20

4 ODPA / 100 (i) 100 100 (iv) / 20

5 BPDA / 100; (1) / 90, BADP / 10 100 (i) 30

6 DSDA / 100; (1) / 70, PSX750 100 (i) / 30

7 ODPA / 90, PMDA / 10; (i) / 100 100 (i) / 10

8 DSDA / 90, 0DPA / 10; (i) / 70, 100 (ix) / 10

(a) / 20, PSX1000 / 10

9 0DPA / 100; (a) / 100 100 (la) / 10

100 DPA / 100; (a) / 100 100 (C) / 10 Comparative Example Eho. Xy resin

1 DSDA / 100; (D / 100 100 100

2 DSDA / 90, 0DPA / 10; (i) / 70, 100 100

(a) / 20, PSX1000 / 10 Table 2

INDUSTRIAL APPLICABILITY The curable resin composition of the present invention has excellent heat resistance and flame retardancy because of having a crosslinked structure by a thermal reaction, and also has excellent adhesion to metals such as copper and stainless steel. Since the cured product produced from the curable resin composition of the present invention also has good electrical and mechanical properties, it can be used as a laminate for a printed wiring board, a printed wiring board, a semiconductor sealing material, a semiconductor mounting module, It is also useful as a peripheral component for various electronic components. In addition, carbon fiber and carbon electrodes, such as automobiles, aircraft components, and building components, It can be used as a binder for various composite materials and as a matrix resin. Further, the curable resin composition of the present invention is not only used as a varnish, but also has excellent moldability, so that it can be used in the form of a film, a sheet, a fiber or the like.

Claims

The scope of the claims

(1) A thermosetting resin having a dihydroxazine ring condensed with an aromatic hydrocarbon ring and a polyimide resin and / or a polyimide precursor in a weight ratio of 5 to 95: 95 to 5 A curable resin composition which is contained in a proportion.

(2) A polyimide resin or a polyimide precursor containing 50% by weight or more of the repeating unit represented by the following general formula (II) and / or the following general formula (2) or a polyimide resin thereof. 2. The curable resin composition according to claim 1, which is a mid precursor.

(However, in the general formula (1) and (2), tetravalent organic group having one aromatic ring at least the Arl and Ar @ 2, R1 and _{R2 - OH, -NH 2, -} SH, - C0NH ₂ or an organic group having 1 to 6 carbon atoms, i and j each represent an integer of 0 to 4, R3 and R4 each represent a divalent organic group having 1 to 10 carbon atoms, and R5 to R8 represent hydrogen or With 1 to 6 carbon atoms X represents a divalent group, and m represents a number from 1 to 10)

(3) The thermosetting resin having a dihydroxazine ring has the following general formula (3)

(In the formula, R9 and R10 are an organic group having 1 to 10 carbon atoms, R11 is a hydrogen atom or a carbon hydride group having 1 to 6 carbon atoms, Y is a non-existent reductive force, 1 C (CH ₃ ) ₂ —, — CO—, 1 0—, 1 S—, 1 S0 ₂ —, —CH ₂ —, —C (CF ₃ ) ₂ — or heat represented by the formula (5)) The curable resin composition according to claim 1, which is a curable resin.

(Wherein, R 12 represents an organic group having 1 to 1 ° carbon atoms, R 13 represents a hydrogen atom or a hydrocarbon group having 1 to 6 carbon atoms, R 14 represents a methylene group or a p-xylylene group, and n represents 1 ~: Indicates an integer of L 0)

(4) The thermosetting resin having a dihydroxazine ring has the following general formula (4)

(In the formula, R15 represents hydrogen or an alkyl group having 1 to 6 carbon atoms, and R16 represents an alkyl group having 1 to 6 carbon atoms, a cyclohexyl group, a phenyl group, a substituted phenyl group, a 'naphthyl group or The curable resin composition according to claim 1, which is a thermosetting resin represented by the following formula:

(5) A cured product obtained by curing the curable resin composition according to any one of claims 4 to 4.