WO2003105465A1 - Module optique et systeme optique - Google Patents

Module optique et systeme optique Download PDF

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Publication number
WO2003105465A1
WO2003105465A1 PCT/DE2003/001866 DE0301866W WO03105465A1 WO 2003105465 A1 WO2003105465 A1 WO 2003105465A1 DE 0301866 W DE0301866 W DE 0301866W WO 03105465 A1 WO03105465 A1 WO 03105465A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical module
module according
lens
lens holder
optical
Prior art date
Application number
PCT/DE2003/001866
Other languages
German (de)
English (en)
Inventor
Josef Dirmeyer
Harald Schmidt
Stephan Voltz
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2003105465A1 publication Critical patent/WO2003105465A1/fr

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof

Definitions

  • the invention relates to an optical module with a circuit carrier, a semiconductor element arranged on the circuit carrier by means of flip-chip technology and a lens unit for projecting electromagnetic radiation onto the semiconductor element, the lens unit comprising a lens holder and a lens arrangement.
  • the invention further relates to an optical system with an optical module with a circuit carrier, a semiconductor element arranged on the circuit carrier by means of flip-chip technology and a lens unit for projecting electromagnetic radiation onto the semiconductor element, the lens unit comprising a lens holder and a Includes lens assembly.
  • the typical lifespan for systems in the vehicle is 10 to 15 years, whereby only extremely low failure rates are tolerated, so that the components of an optical system of the type mentioned at the outset may only show very slow aging.
  • Another problem area with the modules and systems in question is related to the fact that the modules generally work with a fixed focal length. Therefore, the distance between the camera chip and the optics must be set and fixed during production. This leads to a considerable manufacturing effort. This also poses a quality risk.
  • lens surfaces in optical systems tend to fog up, particularly in the case of changing temperatures and high air humidity.
  • optical modules In poor lighting conditions, optical modules quickly reach their functional limits.
  • EP 1 081 944 A2 discloses a module and a system which correspond to the genera mentioned at the outset. According to the categories, it is provided that the semiconductor element is arranged on the circuit carrier using flip-chip technology and that the circuit carrier is implemented as a flexible printed circuit board. In this way, the optical module can be sealed comparatively easily, since it is no longer necessary to arrange a system board next to the optics within a hermetically sealed housing. Rather, it can be provided outside the optical module.
  • the flip-chip technology allows the optical module to be designed to be particularly small, which is particularly desirable in the motor vehicle sector and is associated with great advantages.
  • the flip-chip technology is also easy to automate.
  • the invention is therefore based on the object of providing an optical module and an optical system, so that a reliable optical quality can be made available with simple and inexpensive installation without adjustment and, in particular, focusing, and in particular Measures against fogging and poor lighting conditions can be implemented in a simple manner.
  • the invention builds on the generic optical module in that the lens holder is a MID ("molded interconnected device") with integrated conductor tracks and that the lens holder forms the circuit carrier for the semiconductor element.
  • MID molded interconnected device
  • MID technology is essentially based on the use of high-temperature thermoplastics, which are metallized in a structured manner.
  • MIDs i.e. spatial (3-dimensional) injection molded circuit carriers, are molded parts with an integrated circuit pattern structure.
  • MIDs can be produced in various ways, for example by producing the circuit carrier by single injection molding and then by
  • Hot stamping a metallization takes place, which is then structured by stamping. Also after the electro-metallization. Following the metallization, be it by hot stamping or galvanically, structuring can also be created using a 3D mask or an imaging laser process.
  • the circuit carrier can also be produced by other plastic processing methods, for example by double injection molding.
  • the metallization and the structuring of the MID can also be carried out in an integrated manner by means of a conductor foil.
  • the aforementioned methods for producing MIDs are only to be understood as examples of a large number of known methods from the prior art, it being possible to use MIDs produced in any way within the scope of the present invention.
  • MIDs specifically related to the present invention offer the possibility of using a manufacturing technology with particularly low tolerances between the semiconductor element and the lens unit.
  • the semiconductor element can be soldered or glued directly onto the lens holder. This makes the construction and assembly particularly easy. Furthermore, practically no additional uncertainty with regard to the optical structure is generated by such a method.
  • Tolerance chain which is expanded in conventional structures by the thickness of an additional circuit carrier and the thickness of any stabilizing elements that may be provided, has been reduced to a measure within the scope of the present invention.
  • a lens arrangement with at least one lens is advantageously provided.
  • the lens arrangement comprises a plurality of lenses in the form of a package.
  • the optical quality can be improved by a lens with a plurality of lenses, which is also possible within the scope of the present invention, in particular since it is possible to work with small tolerances.
  • the lenses are in direct contact with one another.
  • fluctuations in the lens arrangement in the Z direction that is to say in the direction in which the lenses follow one another, are practically excluded.
  • the tolerances only depend on the lenses themselves.
  • the relative positions of the lenses to one another are determined by the geometry of the lenses themselves.
  • the arrangement of the lenses can also be determined in the XY direction by the lenses themselves, namely by designing contact surfaces of the lenses accordingly.
  • the exactly one lens is connected to the lens holder in a watertight and dustproof manner.
  • the foremost lens is advantageously selected as the lens which interacts with the lens holder for sealing. This can be done, for example, in such a way that exactly one lens is connected to the lens holder by ultrasound, laser welding and / or adhesive methods.
  • the lens arrangement is snapped into the lens holder. This also ensures exact positioning. It should also be emphasized that in this way a possibility of separation between the lenses and the expensive semiconductor element can be ensured. Furthermore, it can be prevented in this way that temperature expansions of the various components have a negative effect on the adjustment and in particular the focusing.
  • the sealing effect is provided in a particularly advantageous manner, in particular in connection with a snap assembly, in that the lenses have a hard and a soft component, the soft component being arranged on the circumference of the lenses for sealing.
  • the soft component also supports the general requirement that the
  • the optical module according to the invention can be developed in a particularly advantageous manner in that a ventilation duct is provided. In this way, the sealed module can "breathe". If the optical module is to be used for larger temperature fluctuations, it can be used as prove sensible to stick a DAE film (pressure compensation element) over an opening.
  • a DAE film pressure compensation element
  • the semiconductor element is covered with a globtop.
  • LEDs light-emitting diodes
  • the light-emitting diodes are arranged in a ring around the lens arrangement and that the axes of the light-emitting diodes alternately form different angles with the axis of the module.
  • Such a mutual arrangement of the light-emitting diodes serves to achieve diffuse illumination, which leads to a uniform illumination of the objects to be optically detected.
  • the light-emitting diodes contact the lens holder implemented as MID directly. In this way, no additional components are required to supply the LEDs with voltage.
  • the light-emitting diodes can be contacted on the lens holder by means of SMD technology. This is a common contacting technique that can also be used in the context of this preferred embodiment.
  • the light-emitting diodes it is also possible for the light-emitting diodes to be contacted on the lens holder by means of bonding technology.
  • the module can be heated. In this way, fogging of the lenses in the event of temperature fluctuations can be counteracted. This is supported by the lens holder implemented as a MID, since in this way electrical current can be distributed variably without additional components.
  • thermally conductive plastics are provided for heating the module. This enables controlled heating of the entire module.
  • the module can be connected to a rigid circuit board via a flat cable. This is a particularly cost-effective solution for connecting the module to a controller.
  • connection of the module with a rigid circuit board is integrated with the lens holder implemented as MID. In this way, the number of components required is reduced again.
  • the invention also consists in an optical system with an optical module of the type mentioned above. In this way, the advantages of the optical module also come into play in the context of an overall system.
  • This optical system is developed in a particularly useful manner in that the module can be connected to a rigid circuit board via a flat cable.
  • optical system can also be developed in a particularly advantageous manner in that a connection of the module with a rigid circuit board is integrated with the lens holder realized as an MID.
  • the invention is based on the finding that it is possible to have a compact, highly integrated module solution with a low level To provide dimensions that are easy to assemble and therefore particularly inexpensive. It is possible to provide various functionalities with small dimensions at the same time.
  • the optical module and the optical system are practically maintenance-free. Particularly in the sense of saving costs, it is also not necessary to optically adjust the optical module, since this is already present due to the geometrical design of the components and because the tolerance chain is shortened to one dimension.
  • the module is stable and of high quality, and an integrated solution of sensor and optics in a modular design is provided.
  • the modular design means that the number of variants is reduced, which is in the sense of the common parts concept that is always sought.
  • the modules can be easily removed from the overall system.
  • the lenses can also be removed from the optical module in the advantageous snap-in assembly and thus separated from the expensive semiconductor.
  • an integrated solution with sensor, optics, lighting and heating device is provided, which uses a particularly inexpensive connection between the optics module and the main board.
  • the invention can be used particularly useful in the implementation of video systems and in the combination of video systems with radar systems in the automotive field.
  • FIG. 1 shows a first perspective view of an optical module according to the invention
  • FIG. 2 shows a second perspective illustration of an optical module according to the invention
  • FIG. 3 shows a perspective, partially sectioned illustration of an optical module according to the invention
  • Figure 4 is an exploded perspective view of an optical module according to the invention.
  • FIG. 5 shows a sectional view of an optical module according to the invention.
  • Figure 6 is a side view of another embodiment of an optical module according to the invention.
  • Figure 1 shows a perspective view of an optical module according to the invention.
  • a lens holder 14 and a flat cable 36 can be seen.
  • a (not visible) light-sensitive semiconductor element is arranged under the globtop 26, which can also be recognized.
  • the flat cable 36 At the opposite end of the flat cable 36, the latter is provided with soldering pads 28, so that contact between the optical module and a circuit board, for example by iron soldering using the soldering pads 28, can be established without any further electrical connection.
  • Recesses and light-emitting diodes 38 arranged therein can be recognized on the side of the optical module opposite the globtop 26.
  • FIG. 2 shows a second perspective view of an optical module according to the invention.
  • the special alternating arrangement of the light-emitting diodes 38 around a lens 20 provided for the radiation entry can be seen here.
  • FIG. 3 shows a perspective, partially sectioned illustration of an optical module according to the invention.
  • the interior of the lens holder 14 can be seen here.
  • FIG. 4 shows an exploded view of the optical module according to the invention
  • FIG. 5 which shows the optical module in a sectional view.
  • Three lenses 16, 18, 20 are inserted into the lens holder 14. The lenses are shaped such that they assume a defined position within the lens holder 14 relative to one another.
  • At least one of the lenses is designed such that it interacts with the lens holder 14 and thus also assumes a defined position with respect to the lens holder 14 and ultimately with respect to the semiconductor element 12. In this way, all lenses 16, 18, 20 are adjusted with respect to the semiconductor element 12. This adjustment is not influenced by further measures, since the semiconductor element 12 is arranged directly on the lens holder 14, which acts as a substrate.
  • the lens holder 14 is implemented as a MID (“molded inter-connected device”) with integrated conductor tracks.
  • the connection between the semiconductor element 12 and the lens holder 14 takes place by means of flip-chip technology in that a solder connection is made via solder bumps 30. The connection can then be reinforced with an underfill.
  • the light-emitting diodes 38 can also be seen in FIGS. 3, 4 and 5, the mutual arrangement being clearly shown in FIG.
  • the semiconductor element 12 may be configured as a CMOS or CCD '.
  • an adhesive connection can also be provided.
  • An underfill can be applied for reinforcement.
  • a globtop 26 is provided.
  • an opening for ventilation can be provided. Just- if it is possible to place an adhesive DAE (adhesive pressure compensation element) on an opening.
  • the lens holder 14 is designed as a MID enables not only the power supply of the light-emitting diodes 38 via integrated conductor tracks but also heating of the entire module, which can be supported in particular by the use of heat-conducting plastic.
  • FIG. 6 shows a further embodiment of an optical module according to the invention.
  • molded metalized pins with an integrated possibility for length expansion are provided here, so that there is a further possibility of connecting the optical module to further system components, for example with a circuit board.
  • An optical module has a lens holder 14, in which a lens arrangement comprising, for example, three lenses 16, 18, 20 is inserted.
  • the lenses 16, 18, 20 are preferably clearly aligned with one another and with respect to the lens holder 14 due to their geometric design, so that no further optical adjustment of the system is required.
  • the lens holder 14 is designed as a MID (“molded interconnected device”) with integrated conductor tracks and serves as a circuit carrier for a semiconductor element (12) applied using flip-chip technology.

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Led Device Packages (AREA)
  • Lens Barrels (AREA)

Abstract

L'invention concerne un module optique qui présente un porte-lentille (14) dans lequel on utilise un système de lentilles comportant, par exemple, trois lentilles (16, 18, 20). De préférence, les lentilles (16, 18, 20) sont orientées clairement entre elles et par rapport au porte-lentille (14) par leur conception géométrique de telle manière rendre superflu tout autre ajustement optique du système. Le porte-lentille (14) est conçu comme un dispositif interconnecté moulé MID ayant des pistes conductives intégrées et sert de support de circuit destiné à un élément semi-conducteur (12) appliqué selon la technique puce à bosse.
PCT/DE2003/001866 2002-06-11 2003-06-05 Module optique et systeme optique WO2003105465A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10225919.4 2002-06-11
DE10225919A DE10225919B3 (de) 2002-06-11 2002-06-11 Optisches Modul und optisches System

Publications (1)

Publication Number Publication Date
WO2003105465A1 true WO2003105465A1 (fr) 2003-12-18

Family

ID=29723126

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2003/001866 WO2003105465A1 (fr) 2002-06-11 2003-06-05 Module optique et systeme optique

Country Status (2)

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DE (1) DE10225919B3 (fr)
WO (1) WO2003105465A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005031421A1 (fr) * 2003-09-26 2005-04-07 Siemens Aktiengesellschaft Module optique comportant un capteur d'image et un ensemble objectif reposant sur la surface sensible de ce capteur d'image
WO2006040216A1 (fr) * 2004-10-13 2006-04-20 Robert Bosch Gmbh Lentilles empilees etanches aux gaz, pour boitier de camera
WO2006117346A2 (fr) * 2005-04-29 2006-11-09 Siemens Vdo Automotive Ag Module optique a source lumineuse integree
WO2014090466A1 (fr) * 2012-12-12 2014-06-19 Robert Bosch Gmbh Système de caméra et procédé pour le fabriquer
EP2884736A1 (fr) * 2013-12-11 2015-06-17 MEKRA LANG GmbH & Co. KG Caméra dotée d'un élément chauffant

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012019647B4 (de) 2012-10-06 2021-08-19 Volkswagen Aktiengesellschaft Kamera für einen digitalen Rückspiegel, digitaler Rückspiegel und dessen Verwendung in einem Kraftfahrzeug
DE102019208858A1 (de) 2019-06-18 2020-12-24 Carl Zeiss Microscopy Gmbh Beleuchtungseinheit für Mikroskope

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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005031421A1 (fr) * 2003-09-26 2005-04-07 Siemens Aktiengesellschaft Module optique comportant un capteur d'image et un ensemble objectif reposant sur la surface sensible de ce capteur d'image
US8123420B2 (en) 2004-10-13 2012-02-28 Robert Bosch Gmbh Lens stack, mounted in a gas-tight manner, for a camera housing
WO2006040216A1 (fr) * 2004-10-13 2006-04-20 Robert Bosch Gmbh Lentilles empilees etanches aux gaz, pour boitier de camera
DE102004049871B4 (de) * 2004-10-13 2017-05-24 Robert Bosch Gmbh Verfahren zur Herstellung einer Objektivaufnahme für ein Objektiv einer Kamera und Kamera für Kraftfahrzeuganwendungen
WO2006117346A3 (fr) * 2005-04-29 2006-12-28 Siemens Ag Module optique a source lumineuse integree
US7612332B2 (en) 2005-04-29 2009-11-03 Siemens Vdo Automotive Ag Optical module with integrated source of light
DE102005020138B4 (de) * 2005-04-29 2007-03-08 Siemens Ag Optisches Modul mit integrierter Lichtquelle
WO2006117346A2 (fr) * 2005-04-29 2006-11-09 Siemens Vdo Automotive Ag Module optique a source lumineuse integree
WO2014090466A1 (fr) * 2012-12-12 2014-06-19 Robert Bosch Gmbh Système de caméra et procédé pour le fabriquer
CN105052121A (zh) * 2012-12-12 2015-11-11 罗伯特·博世有限公司 摄像机装置及其制造方法
US9544487B2 (en) 2012-12-12 2017-01-10 Robert Bosch Gmbh Camera system with image sensor contacting metallic housing via heat conducting element
CN105052121B (zh) * 2012-12-12 2019-02-19 罗伯特·博世有限公司 摄像机装置及其制造方法
EP2884736A1 (fr) * 2013-12-11 2015-06-17 MEKRA LANG GmbH & Co. KG Caméra dotée d'un élément chauffant
JP2015113118A (ja) * 2013-12-11 2015-06-22 メクラ・ラング・ゲーエムベーハー・ウント・コー・カーゲーＭＥＫＲＡ Ｌａｎｇ ＧｍｂＨ ＆ Ｃｏ． ＫＧ 発熱素子を有するカメラ
US9618828B2 (en) 2013-12-11 2017-04-11 Mekra Lang Gmbh & Co. Kg Camera with heating element

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