WO2003096158A2 - Procede et appareil d'assemblage de cartes de circuits imprimes - Google Patents

Procede et appareil d'assemblage de cartes de circuits imprimes Download PDF

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Publication number
WO2003096158A2
WO2003096158A2 PCT/US2003/014714 US0314714W WO03096158A2 WO 2003096158 A2 WO2003096158 A2 WO 2003096158A2 US 0314714 W US0314714 W US 0314714W WO 03096158 A2 WO03096158 A2 WO 03096158A2
Authority
WO
WIPO (PCT)
Prior art keywords
ped
testing
programming
programmed
assembly
Prior art date
Application number
PCT/US2003/014714
Other languages
English (en)
Other versions
WO2003096158A3 (fr
Inventor
Eldad Giberman
Steven R. Rogers
Original Assignee
Return On Investment Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Return On Investment Ltd. filed Critical Return On Investment Ltd.
Publication of WO2003096158A2 publication Critical patent/WO2003096158A2/fr
Publication of WO2003096158A3 publication Critical patent/WO2003096158A3/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318516—Test of programmable logic devices [PLDs]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards

Definitions

  • circuit board test connectors, fixtures, and protocols can be divided into two basic classes.
  • the first class includes parallel testers, i.e. test apparatus having an adapter in which all circuit board test points are contacted simultaneously by means of an adapter using 'Bed-Of- Nails' technology.
  • the second class is composed of apparatus that sequentially scan the individual circuit board test points by two or more test contacts known as 'Flying Probes.
  • the current dominant solution for testing an assembled PCB is the In-Circuit-Test (ICT) approach, using Bed-Of-Nails or Flying Probes that make contact with appropriate points on the electronic devices or on the board, and transmit electrical signals between the test system and the device under test.
  • ICT In-Circuit-Test
  • ICT In-Circuit-Test
  • Figure 26 depicts a Test-Feeder as an alternative tester to the pre-assembly Test-Tray, wherein the Test-Feeder is externally attached to the Pick and Place machine;
  • Figure 27 depicts a test-feeder cycle of the embodiment of Figure 21 ;
  • Figure 28 depicts a testing and programming cycle of the embodiment of Figure 21 ;
  • Figure 29 depicts the repetition of the cycles of Figures 22 and 23 and the completion of the assembly cycle;
  • Figure 30 depicts the test-feeder alternative of Figure 21 in schematic form.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

L'invention concerne des procédés et un appareil de programmation et de contrôle de dispositifs électroniques programmables tels que les circuits intégrés, ainsi que l'assemblage, la programmation, le contrôle et la vérification automatiques de cartes de circuits imprimées dans un seul et unique appareil.
PCT/US2003/014714 2002-05-10 2003-05-09 Procede et appareil d'assemblage de cartes de circuits imprimes WO2003096158A2 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US37930802P 2002-05-10 2002-05-10
US60/379,308 2002-05-10
US37983302P 2002-05-11 2002-05-11
US60/379,833 2002-05-11
US45231903P 2003-03-05 2003-03-05
US60/452,319 2003-03-05

Publications (2)

Publication Number Publication Date
WO2003096158A2 true WO2003096158A2 (fr) 2003-11-20
WO2003096158A3 WO2003096158A3 (fr) 2004-02-12

Family

ID=29424522

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/014714 WO2003096158A2 (fr) 2002-05-10 2003-05-09 Procede et appareil d'assemblage de cartes de circuits imprimes

Country Status (1)

Country Link
WO (1) WO2003096158A2 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007001722A1 (de) * 2007-01-11 2008-07-17 Hubertus Heigl Transportvorrichtung, Zuführungsvorrichtung, Entnahmevorrichtung und Vorrichtung zum Aufnehmen, Transportieren und Sortieren von elektronischen Bauelementen
US10048312B1 (en) 2017-05-12 2018-08-14 International Business Machines Corporation Testing printed circuit board assembly
CN112485565A (zh) * 2020-11-17 2021-03-12 乐凯特科技铜陵有限公司 一种pcb板功能测试装置
CN113010982A (zh) * 2021-03-30 2021-06-22 晟通科技集团有限公司 零件精益化生产方法、电子设备及存储介质
CN116604769A (zh) * 2023-06-02 2023-08-18 中山市东润智能装备有限公司 注塑件下料和检测设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6230067B1 (en) * 1999-01-29 2001-05-08 Bp Microsystems In-line programming system and method
US6532395B1 (en) * 1999-10-15 2003-03-11 Data I/O Corporation Manufacturing system with feeder/programming/buffer system

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6230067B1 (en) * 1999-01-29 2001-05-08 Bp Microsystems In-line programming system and method
US6532395B1 (en) * 1999-10-15 2003-03-11 Data I/O Corporation Manufacturing system with feeder/programming/buffer system

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007001722A1 (de) * 2007-01-11 2008-07-17 Hubertus Heigl Transportvorrichtung, Zuführungsvorrichtung, Entnahmevorrichtung und Vorrichtung zum Aufnehmen, Transportieren und Sortieren von elektronischen Bauelementen
DE102007001722B4 (de) * 2007-01-11 2009-03-12 Hubertus Heigl Vorrichtung zum Aufnehmen, Transportieren und Sortieren von elektronischen Bauelementen
US8584830B2 (en) 2007-01-11 2013-11-19 Hubertus Heigl Transport assembly
US10048312B1 (en) 2017-05-12 2018-08-14 International Business Machines Corporation Testing printed circuit board assembly
US10168383B2 (en) 2017-05-12 2019-01-01 International Business Machines Corporation Testing printed circuit board assembly
CN112485565A (zh) * 2020-11-17 2021-03-12 乐凯特科技铜陵有限公司 一种pcb板功能测试装置
CN112485565B (zh) * 2020-11-17 2022-05-03 乐凯特科技铜陵有限公司 一种pcb板功能测试装置
CN113010982A (zh) * 2021-03-30 2021-06-22 晟通科技集团有限公司 零件精益化生产方法、电子设备及存储介质
CN116604769A (zh) * 2023-06-02 2023-08-18 中山市东润智能装备有限公司 注塑件下料和检测设备
CN116604769B (zh) * 2023-06-02 2023-11-07 中山市东润智能装备有限公司 注塑件下料和检测设备

Also Published As

Publication number Publication date
WO2003096158A3 (fr) 2004-02-12

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