WO2003086036A1 - Printed circuit board with a coil recessed in a void - Google Patents
Printed circuit board with a coil recessed in a void Download PDFInfo
- Publication number
- WO2003086036A1 WO2003086036A1 PCT/IB2003/001163 IB0301163W WO03086036A1 WO 2003086036 A1 WO2003086036 A1 WO 2003086036A1 IB 0301163 W IB0301163 W IB 0301163W WO 03086036 A1 WO03086036 A1 WO 03086036A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- printed circuit
- circuit board
- coil
- void
- winding
- Prior art date
Links
- 239000011800 void material Substances 0.000 title claims abstract description 16
- 238000004804 winding Methods 0.000 claims abstract description 22
- 238000005476 soldering Methods 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000004020 conductor Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/02—Fixed inductances of the signal type without magnetic core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Definitions
- the invention relates to a printed circuit board, an electrical appliance with said printed circuit board, and a method of manufacturing the printed circuit board.
- SMD components Surface Mounted Devices
- SMD components are components mounted on a surface of the printed circuit board.
- a soldering paste is provided on the printed circuit board in a given pattern by means of a silk- screen printing method.
- the SMD components are laid on the printed circuit board and are fixed to the surface thereof, possibly by means of a non-conductive adhesive, such that the connection terminals of the components come into contact with the soldering paste pattern printed on the printed circuit board in given locations.
- the components themselves and their connection terminals will then be on one and the same side of the printed circuit board.
- a so-called reflow soldering process is carried out. During this, the solder provided on the printed circuit board is melted through heat supply in a suitable oven such that fixed soldered electrical connections are created between the SMD components and the printed circuit board.
- the document DE 100 16 974 Al describes a coil with a plurality of turns which comprise a magnetic material. The coil is mounted on a printed circuit board in that winding ends of the coil are inserted into two bores of a printed circuit board.
- the document further discloses a coil which is fastened on an upper side of the printed circuit board without bores by the SMD technology. Its winding ends are for this purpose horizontally aligned and are subsequently mounted to the surface of the printed circuit board. Since the coils are aligned after being fastened to the printed circuit board so as to achieve a desired inductance of the coils, distances between the turns are mechanically changed in that they are widened. This strongly loads the previously created soldered joints of the coil mechanically, so that the alignment of the coil often results in a destruction of the soldered joint.
- the invention has for its object to provide a printed circuit board which has coils whose mounting is as cost-effective as possible.
- the printed circuit board comprises a coil which is surface-mounted on a first side of the printed circuit board and whose winding projects from the second side of the printed circuit board opposed to the first side and lies at least partly in a void of the printed circuit board.
- the mounting of the coil which is present in a void of the printed circuit board may be integrated into a single soldering process of the entire printed circuit board. Additional soldering processes which only served to contact the coil on the printed circuit board become redundant. The mounting cost for the coils can thus be reduced.
- the positioning of the winding of the coil in the void of the printed circuit board stabilizes the coil in its position thanks to the inner edges of the void in the printed circuit board, so that tilting during alignment of the coil is not possible, and a mechanical load exerted on the soldered joints can be reduced. Given a size of the void which corresponds to the diameter of the winding, i.e.
- the invention also relates to an electrical appliance comprising a printed circuit board according to the invention.
- the printed circuit board may be used in electrical appliances in the field of consumer electronics which are mass-manufactured.
- the invention further relates to a method of manufacturing a printed circuit board, in which method components are electrically contacted with the printed circuit board by means of a soldering process.
- a coil is arranged after the provision of the soldering paste used for the soldering process such that it can be surface-mounted to a first side of the printed circuit board, while its winding projects from a second side of the printed circuit board.
- the coil is contacted with the printed circuit board by means of the soldering process, for which preferably a reflow soldering process is chosen.
- Fig. 1 shows a coil fastened to a printed circuit board in a conventional manner
- Fig. 2 shows the coil mounted in SMD technology
- Fig. 3 shows a printed circuit board according to the invention with coil in side elevation
- Fig. 4 shows a void in the printed circuit board fitting the coil
- Fig. 5 shows the printed circuit board and coil according to the invention in plan view
- Fig. 6 shows the printed circuit board and coil according to the invention in a further side elevation
- Figs. 7 to 9 show the printed circuit board and coil according to the invention after an alignment of the coil.
- Fig. 1 shows a coil 1 with winding ends 2 and 3 fastened to a printed circuit board 4 in a conventional manner.
- Conventionally mounted coils 1 with a plurality of turns involve the problem that winding ends 2 and 3 of the coil 1 are to be inserted into two comparatively small holes of the printed circuit board 4. While being inserted, the winding ends 2 and 3 press the soldering paste provided on the lower side of the printed circuit board aside, so that no electrical connections can be created in the soldering process.
- the coil 1 shown in Fig. 2 is mounted in a known manner to the printed circuit board 4 in SMD technology.
- the coil 1 and its winding ends 2 and 3 are present on the upper side of the printed circuit board 4.
- the winding ends 2 and 3 are fastened in planar manner, which renders holes through the printed circuit board 4 redundant and do away with an additional soldering process on the lower side of the printed circuit board.
- the latter is mechanically corrected in that the distances between the turns are widened. It is in particular coils with a small number of turns that become unstable owing to the mechanical load on the soldered joint and tend to tilt over. The electrical connection with a conductor track on the printed circuit board 4 is destroyed thereby.
- Fig. 3 is a side elevation of the printed circuit board 4 according to the invention with a coil 1.
- the printed circuit board 4 has a void 5 of sufficient size for the coil 1 to be inserted with its turns into the void.
- the winding ends 2 and 3 of the coil 1 are fastened to the lower side of the conductor track 4 and are electrically connected to a conductor track.
- the coil 1 is stabilized by the printed circuit board 4, and the soldered joints of the winding ends 2 and 3 are mechanically loaded to a much lesser degree.
- Figs. 4 and 5 each show a plan view of the printed circuit board 4.
- Fig. 4 there is no coil 1 in the void 5 of the printed circuit board 4
- Fig. 5 shows the printed circuit board 4 with coil 1.
- a side elevation of the printed circuit board 4 according to the invention with the coil 1 is shown in Fig. 6. The side elevation makes it clear that the turns project for a major portion beyond the upper side of the printed circuit board, while the winding ends 2 and 3 are fastened to the lower side of the printed circuit board 4 in a planar arrangement.
- Figs. 7 to 9 are further side elevations showing the alignment of the coil 1 achieved by means of changes in the turns without an instability of the coil 1 arising therefrom.
Abstract
The invention relates to a printed circuit board (4) comprising a coil (1) which is surface-mounted on a first side of the printed circuit board (4) and whose winding projects from the second side of the printed circuit board (4) opposed to the first side and lies at least partly in a void (5) of the printed circuit board.
Description
Printed circuit board with a coil recessed in a void
The invention relates to a printed circuit board, an electrical appliance with said printed circuit board, and a method of manufacturing the printed circuit board.
Printed circuit boards with SMD components are used in modem electrical appliances. SMD components ("Surface Mounted Devices") are components mounted on a surface of the printed circuit board. During mounting of the printed circuit board, first a soldering paste is provided on the printed circuit board in a given pattern by means of a silk- screen printing method. Then the SMD components are laid on the printed circuit board and are fixed to the surface thereof, possibly by means of a non-conductive adhesive, such that the connection terminals of the components come into contact with the soldering paste pattern printed on the printed circuit board in given locations. The components themselves and their connection terminals will then be on one and the same side of the printed circuit board. Then a so-called reflow soldering process is carried out. During this, the solder provided on the printed circuit board is melted through heat supply in a suitable oven such that fixed soldered electrical connections are created between the SMD components and the printed circuit board.
Electrical appliances often require coils which are mounted on the printed circuit boards mentioned above of the respective electrical appliances. The mounting of the coils is problematic in that the coils must be provided manually to the printed circuit board. For this purpose, the two winding ends of each coil are inserted into respective bores of the printed circuit board, during which they press away the soldering paste provided on the bores and at the lower side of the printed circuit board. No fixed soldered electrical connections can be made between the coils and the printed circuit board in the ensuing soldering process. The document DE 100 16 974 Al describes a coil with a plurality of turns which comprise a magnetic material. The coil is mounted on a printed circuit board in that winding ends of the coil are inserted into two bores of a printed circuit board. The document further discloses a coil which is fastened on an upper side of the printed circuit board without bores by the SMD technology. Its winding ends are for this purpose horizontally aligned and are subsequently mounted to the surface of the printed circuit board.
Since the coils are aligned after being fastened to the printed circuit board so as to achieve a desired inductance of the coils, distances between the turns are mechanically changed in that they are widened. This strongly loads the previously created soldered joints of the coil mechanically, so that the alignment of the coil often results in a destruction of the soldered joint.
The invention has for its object to provide a printed circuit board which has coils whose mounting is as cost-effective as possible.
The object is achieved in that the printed circuit board comprises a coil which is surface-mounted on a first side of the printed circuit board and whose winding projects from the second side of the printed circuit board opposed to the first side and lies at least partly in a void of the printed circuit board.
The mounting of the coil which is present in a void of the printed circuit board may be integrated into a single soldering process of the entire printed circuit board. Additional soldering processes which only served to contact the coil on the printed circuit board become redundant. The mounting cost for the coils can thus be reduced. The positioning of the winding of the coil in the void of the printed circuit board stabilizes the coil in its position thanks to the inner edges of the void in the printed circuit board, so that tilting during alignment of the coil is not possible, and a mechanical load exerted on the soldered joints can be reduced. Given a size of the void which corresponds to the diameter of the winding, i.e. the void is large enough for accommodating the winding fully, the coil will be particularly well supported by the printed circuit board, and the winding ends of the coil can be electrically contacted with a conductor track on a surface of the printed circuit board by means of a soldering process without problems. The invention also relates to an electrical appliance comprising a printed circuit board according to the invention. For example, the printed circuit board may be used in electrical appliances in the field of consumer electronics which are mass-manufactured. The invention further relates to a method of manufacturing a printed circuit board, in which method components are electrically contacted with the printed circuit board by means of a soldering process. For this purpose, a coil is arranged after the provision of the soldering paste used for the soldering process such that it can be surface-mounted to a first side of the printed circuit board, while its winding projects from a second side of the printed circuit board. The coil is contacted with the printed circuit board by means of the soldering process, for which preferably a reflow soldering process is chosen.
An embodiment of the present invention will be explained in more detail below with reference to several Figures, of which:
Fig. 1 shows a coil fastened to a printed circuit board in a conventional manner,
Fig. 2 shows the coil mounted in SMD technology,
Fig. 3 shows a printed circuit board according to the invention with coil in side elevation,
Fig. 4 shows a void in the printed circuit board fitting the coil,
Fig. 5 shows the printed circuit board and coil according to the invention in plan view,
Fig. 6 shows the printed circuit board and coil according to the invention in a further side elevation, and
Figs. 7 to 9 show the printed circuit board and coil according to the invention after an alignment of the coil. Fig. 1 shows a coil 1 with winding ends 2 and 3 fastened to a printed circuit board 4 in a conventional manner. Conventionally mounted coils 1 with a plurality of turns involve the problem that winding ends 2 and 3 of the coil 1 are to be inserted into two comparatively small holes of the printed circuit board 4. While being inserted, the winding ends 2 and 3 press the soldering paste provided on the lower side of the printed circuit board aside, so that no electrical connections can be created in the soldering process.
The coil 1 shown in Fig. 2 is mounted in a known manner to the printed circuit board 4 in SMD technology. The coil 1 and its winding ends 2 and 3 are present on the upper side of the printed circuit board 4. The winding ends 2 and 3 are fastened in planar manner, which renders holes through the printed circuit board 4 redundant and do away with an additional soldering process on the lower side of the printed circuit board.
To achieve a certain inductance of the coil 1, the latter is mechanically corrected in that the distances between the turns are widened. It is in particular coils with a small number of turns that become unstable owing to the mechanical load on the soldered joint and tend to tilt over. The electrical connection with a conductor track on the printed circuit board 4 is destroyed thereby.
Fig. 3 is a side elevation of the printed circuit board 4 according to the invention with a coil 1. The printed circuit board 4 has a void 5 of sufficient size for the coil 1 to be inserted with its turns into the void. The winding ends 2 and 3 of the coil 1 are fastened to the lower side of the conductor track 4 and are electrically connected to a
conductor track. During the alignment of the turns, the coil 1 is stabilized by the printed circuit board 4, and the soldered joints of the winding ends 2 and 3 are mechanically loaded to a much lesser degree.
Figs. 4 and 5 each show a plan view of the printed circuit board 4. In Fig. 4, there is no coil 1 in the void 5 of the printed circuit board 4, whereas Fig. 5 shows the printed circuit board 4 with coil 1. A side elevation of the printed circuit board 4 according to the invention with the coil 1 is shown in Fig. 6. The side elevation makes it clear that the turns project for a major portion beyond the upper side of the printed circuit board, while the winding ends 2 and 3 are fastened to the lower side of the printed circuit board 4 in a planar arrangement.
Figs. 7 to 9 are further side elevations showing the alignment of the coil 1 achieved by means of changes in the turns without an instability of the coil 1 arising therefrom.
Claims
1. A printed circuit board (4) comprising a coil (1) which is surface-mounted on a first side of the printed circuit board (4) and whose winding projects from the second side of the printed circuit board (4) opposed to the first side and lies at least partly in a void (5) of the printed circuit board.
2. A printed circuit board as claimed in claim 1, characterized in that the size of the void (5) corresponds to the diameter of the winding.
3. A printed circuit board as claimed in claim 1 , characterized in that the coil (1) is electrically contacted by its winding ends.
4. An electrical appliance with a printed circuit board (4) as claimed in any one of the claims 1 to 3.
5. A method of manufacturing a printed circuit board (4), characterized in that, after the provision of a soldering paste used for a soldering process, a coil (1) is positioned such that it can be surface-mounted to a first side of the printed circuit board (4) while its winding projects beyond the second side of the printed circuit board opposed to the first side and is at least partly arranged in a void (5) of the printed circuit board (4), and in that the coil (1) is contacted with the printed circuit board (4) by means of the soldering process.
6. A method as claimed in claim 5, characterized in that the coil (1) is electrically contacted with the printed circuit board (4) by means of a reflow soldering process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU2003212597A AU2003212597A1 (en) | 2002-04-04 | 2003-03-31 | Printed circuit board with a coil recessed in a void |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10214853.8 | 2002-04-04 | ||
| DE2002114853 DE10214853A1 (en) | 2002-04-04 | 2002-04-04 | Printed circuit board with a coil recessed in a recess |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2003086036A1 true WO2003086036A1 (en) | 2003-10-16 |
Family
ID=28458571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/IB2003/001163 WO2003086036A1 (en) | 2002-04-04 | 2003-03-31 | Printed circuit board with a coil recessed in a void |
Country Status (3)
| Country | Link |
|---|---|
| AU (1) | AU2003212597A1 (en) |
| DE (1) | DE10214853A1 (en) |
| WO (1) | WO2003086036A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004031886A1 (en) * | 2004-06-30 | 2006-01-19 | Robert Bosch Gmbh | Substrate, has coil arrangement two back-to-back partial windings arranged on core, where arrangement is fixed on substrate at its ends and between its ends by respective wire ends, and partial windings have same winding count |
| DE102021201099A1 (en) | 2021-02-05 | 2022-08-11 | Brose Fahrzeugteile SE & Co. Kommanditgesellschaft, Würzburg | Mounting arrangement of a printed circuit board mounted component |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03181105A (en) * | 1989-12-11 | 1991-08-07 | Mitsubishi Electric Corp | Hybrid integrated circuit device |
| JPH06275999A (en) * | 1993-03-19 | 1994-09-30 | Sony Corp | Densely mounting method of coil part and guide plate used therefor |
| JP2000030942A (en) * | 1998-07-08 | 2000-01-28 | Sharp Corp | Air-core coil and structure for fixing air-core coil |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3708742A1 (en) * | 1987-03-18 | 1988-10-06 | Bosch Gmbh Robert | FERRITE CORE COILS WITH MORE THAN TWO COIL CONNECTORS FOR REFLOW SOLUTION ON A CIRCUIT BOARD |
-
2002
- 2002-04-04 DE DE2002114853 patent/DE10214853A1/en not_active Ceased
-
2003
- 2003-03-31 AU AU2003212597A patent/AU2003212597A1/en not_active Abandoned
- 2003-03-31 WO PCT/IB2003/001163 patent/WO2003086036A1/en not_active Application Discontinuation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03181105A (en) * | 1989-12-11 | 1991-08-07 | Mitsubishi Electric Corp | Hybrid integrated circuit device |
| JPH06275999A (en) * | 1993-03-19 | 1994-09-30 | Sony Corp | Densely mounting method of coil part and guide plate used therefor |
| JP2000030942A (en) * | 1998-07-08 | 2000-01-28 | Sharp Corp | Air-core coil and structure for fixing air-core coil |
Non-Patent Citations (3)
| Title |
|---|
| PATENT ABSTRACTS OF JAPAN vol. 015, no. 434 (E - 1129) 6 November 1991 (1991-11-06) * |
| PATENT ABSTRACTS OF JAPAN vol. 018, no. 687 (E - 1651) 26 December 1994 (1994-12-26) * |
| PATENT ABSTRACTS OF JAPAN vol. 2000, no. 04 31 August 2000 (2000-08-31) * |
Also Published As
| Publication number | Publication date |
|---|---|
| AU2003212597A1 (en) | 2003-10-20 |
| DE10214853A1 (en) | 2003-10-23 |
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