JPH02166788A - Socket for chip component - Google Patents

Abstract

PURPOSE:To replace and select a chip component and to mount it by composing to solder a dummy to the connecting land of a printed board in a state that the dummy is detachably inserted. CONSTITUTION:In a square-shaped chip component 1, opposite side end faces are used as the terminals 2 of conductors. In a socket 5 for the chip component, a dummy 1 having the same shape and size as those of the chip component 1 is engaged elastically with U-shaped electrode 4 at the corresponding part to the terminal 2, disposed at a predetermined position of a printed board 6, and the electrode 4 of the printed board 6 side can be soldered to a connecting land 7. When the opposed electrodes 4 are soldered fixedly, the elastically engaged dummy 3 can be removed, the chip component 1 of the same shape can be detachably inserted instead, the electrodes 4 are elastically narrowed to be electrically connected. Accordingly, a temporary connection is conducted without temporary soldering, the replacement and insertion of the chip component 1 of the same shape are freely conducted. Selection for regulation is facilitated, and the density of mounting and reliability of connection can be enhanced.

Description

[Detailed Description of the Invention] [Summary] Regarding sockets for chip components, the purpose is to provide a method for replacing and selecting chip components and attaching them, and the socket is the same shape and size as a rectangular chip component having terminals on opposite sides. It consists of a dummy made of heat-resistant insulating material and a U-shaped metal electrode that fits elastically into the terminal equivalent part of the dummy, and is soldered to the connection land of the printed board with the dummy inserted and removed freely. Configure.

[Industrial application field]

The present invention relates to a socket for chip components.

When configuring a circuit using multiple components of various types, the circuit characteristics may vary due to variations in the component constants.If the variations are within the specifications, there is no problem, but if the specifications are high performance, it may not be within the specifications. If it is clear that there is no
Absorbs and converges variations in characteristics.

As a method for varying the constant, from the viewpoint of high reliability, fixed constant components are often selected and replaced and installed.

In this case, it is required that replacement and installation can be done easily and without damaging the connecting lands of the connecting portions.

[Conventional technology]

A conventional example of selecting and installing fixed constant components to change the component constants of a specific part of a circuit is as follows:
Instead of using rectangular chip parts such as resistors, capacitors, inductors, etc., conventional lead terminal parts were used and replaced by temporary soldering to the connection terminals provided on the printed board.

If this is done with square chip parts, ■ In order to replace the part, the terminals at both ends must be heated and removed at the same time, and a dedicated soldering iron with a two-pronged iron tip and skilled soldering techniques will be required. I need.

■ The parts and connecting lands are small, and soldering requires time to heat up and is not durable against repeated soldering.

■ During soldering, there is a risk of poor connections due to movement of parts or lifting due to surface mounting.

■ Soldering is not easy when there are many chip components nearby.

Due to such difficulties, it was not implemented.

[Problems to be Solved by the Invention] However, using lead terminal components as replacement components impedes high-density mounting on printed boards.

■ Surface-mounted components such as chip components are generally flow soldered. For lead terminal parts and insertion type parts of connection terminals, flow soldering is the connection, and the soldering method is different.

■ Therefore, the soldering process for mounting and assembling printed circuit boards increases, as well as additional processes such as frank cleaning and inspection.

■ When standardizing on flow soldering, there were problems such as the need to strengthen the heat resistance of surface-mounted components and the temporary fixing method.

The present invention has been made in view of these problems, and aims to provide a method for selectively replacing and attaching chip components.

[Means to solve the problem]

The above problem is caused by a dummy 3 made of a heat-resistant insulating material having the same shape and dimensions as a square chip component l having a terminal 2 on the opposite side, and a portion of the dummy 3 corresponding to the terminal 2 that is elastically fitted. This problem is solved by the chip component socket of the present invention, which is composed of a circular metal electrode 4 and is soldered to a connection land 7 of a printed board 6 with a dummy (3) inserted and removably inserted therein.

[For production]

In other words, this socket can be treated in the same way as a chip component, and after soldering to a printed circuit board, by removing the dummy, a chip component of the same shape can be inserted in its place and connected to the electrode as is, so it can be replaced without soldering. Adjustments can be made, and by fixing the soldering after making a decision, the purpose can be achieved.

FIG. 1 shows a diagram of the basic configuration of the present invention.

A rectangular chip component 1 has a conductive terminal 2 on the opposing side end surface.
It's Toshide.

The chip component socket 5 includes a dummy 3 having the same shape and size as the chip component 1, and a U-shaped electrode 4 that is elastically fitted into a portion of the dummy 3 corresponding to the terminal 2. It has an external shape that protrudes by the thickness of the plate, and can be handled in the same way as the chip component 1.

Therefore, the socket 5 is arranged at a predetermined position on the printed board 6,
The printed board 6 side of the electrode 4 can be soldered to the connection land 7.

Once the opposing electrodes 4 are fixed by soldering, the elastically fitted dummy 3 can be pulled out, and a chip component 1 of the same shape can be inserted and removed in its place. , the electrodes 4 elastically sandwich the terminals 2 to establish an electrical connection.

Therefore, temporary connection can be made without temporary soldering as in the conventional example, and chip components 1 of the same shape can be freely inserted and removed, and selection for adjustment can be easily made.

Finally, the selected chip component 1 is inserted and the terminal 2 is inserted.
By soldering the electrodes 4 and 4, a firm fixation and reliable connection can be achieved.

This soldering only needs to be done at the end and will not damage the connecting lands or components.

In this way, it is possible to provide a method for selectively replacing and attaching chip components.

〔Example〕

The gist of the present invention will be specifically explained below with reference to embodiments shown in the drawings. The same reference numerals indicate the same objects throughout the drawings, and FIG. 2 shows an embodiment of the present invention.

A dummy 3 having the same shape and dimensions as the square chip component 1 is an epoxy resin molded product.

The electrode 4 to be fitted into this is an ultra-thin plate of phosphor bronze plated with tin and molded into a U-shaped cross section. After fixing the socket 5 with the electrode 4 fitted to the dummy 3 to the printed board 6 by soldering, the dummy 3
are elastically clamped so that they can be freely inserted and removed, and a curved portion 9 curved upward is provided at the end of the upper edge so that a chip component 1 of the same shape can be easily inserted.

Thus, the socket 5 can be handled in the same way as the rectangular chip component 1, and automatically attached to the pudding I/board 6 and automatically soldered.During the test and adjustment stage, the dummy 3 is picked up with tweezers and moved sideways. For example, a chip part 1 for replacement selection that can be easily extracted from the electrode 4 and has the same shape is picked up with tweezers and inserted between the contact electrodes 4 from the warped portion 9 side.

Just by inserting and inserting it, it becomes electrically connected, and you can perform a characteristic test. Dummy 3
It can be replaced as many times as needed without soldering by removing it in the same way as when removing it and inserting another chip component l.

After inserting one RI'''M chip component 1 in this way, its terminal 2 and electrode 4 are soldered to firmly fix and connect with high reliability.

The above embodiment shows an example, and the shape and material of each part are not limited to those listed in -.Instead of the curved part 9 of the electrode 4, the corners may be dropped and the curved part may be formed, or the curved part 9 may be formed on both sides. Various modifications can be made, such as providing a connector and inserting and removing it from both directions.

〔Effect of the invention〕

As described above, by using the chip component socket of the present invention, conventional equipment can be used as is, and chip components for adjustment can be replaced and mounted without damaging printed board connection lands or components. This greatly contributes to higher density packaging and higher reliability connections.

[Brief explanation of the drawing]

FIG. 1 is a diagram of the principle configuration of the present invention. FIG. 2 shows an embodiment of the present invention. In the figure, l is a chip component, 2 3 is dummy 4 5 is socket, 6 7 is the connection land, 9 is terminal 1, is the electrode, is a printed board, is the warped part. Today's HC Rio Punishment eλ Isei Cri 1st mouth Hoshu 5e Tsukiichiki 5 color example Part 2■

Claims (1)

[Claims] Square chip component (1) having terminals (2) on opposite sides
It consists of a dummy (3) made of a heat-resistant insulating material of the same shape and size as the dummy (3), and a U-shaped metal electrode (4) that elastically fits into the portion of the dummy (3) corresponding to the terminal (2). 3) is soldered to a connecting land (7) of a printed circuit board (6) in a state in which it is removably inserted.