JPH0718136Y2 - Chip component mounting terminal - Google Patents

Chip component mounting terminal

Info

Publication number
JPH0718136Y2
JPH0718136Y2 JP1990048787U JP4878790U JPH0718136Y2 JP H0718136 Y2 JPH0718136 Y2 JP H0718136Y2 JP 1990048787 U JP1990048787 U JP 1990048787U JP 4878790 U JP4878790 U JP 4878790U JP H0718136 Y2 JPH0718136 Y2 JP H0718136Y2
Authority
JP
Japan
Prior art keywords
chip component
circuit board
printed circuit
mounting
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990048787U
Other languages
Japanese (ja)
Other versions
JPH048373U (en
Inventor
和則 大村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1990048787U priority Critical patent/JPH0718136Y2/en
Publication of JPH048373U publication Critical patent/JPH048373U/ja
Application granted granted Critical
Publication of JPH0718136Y2 publication Critical patent/JPH0718136Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【考案の詳細な説明】 〔概要〕 プリント基板のチップ部品実装用端子に関し、 プリント基板の部品実装完了後に、小形のチップ部品を
追加取付け可能とすることを目的とし、チップ部品の接
続電極を載せて接続する平面部と、平面部の一縁部に突
出し直角に折り曲げて設けられ、プリント基板に穿けた
無接続の貫通孔に挿込み固定され、配線材の先端が挿入
半田付接続される、割り入り筒状の接続片とから構成す
る。
[Detailed Description of the Invention] [Overview] Regarding a terminal for mounting a chip component on a printed circuit board, a connection electrode for the chip component is mounted for the purpose of enabling additional mounting of a small chip component after the mounting of the component on the printed circuit board is completed. A flat surface portion to be connected with the flat surface portion, protruding from one edge portion of the flat surface portion and bent and provided at a right angle, inserted and fixed in an unconnected through hole formed in a printed circuit board, and a tip of a wiring member is connected by insertion soldering, It is composed of a split tubular connecting piece.

〔産業上の利用分野〕[Industrial application field]

本考案は、プリント基板のチップ部品実装用端子に関す
る。
The present invention relates to a chip component mounting terminal of a printed circuit board.

現在の電子装置はプリント板実装方式の回路構成が殆ど
であり、このプリント板実装方式は製造作業による特性
のばらつきが少なく、作業の自動化も行い易く、量産的
或いは多種少量生産の何れにも適した実装方式であり、
広く使用されている。
Most current electronic devices have a printed circuit board mounting circuit configuration, and this printed circuit board mounting method has little variation in characteristics due to manufacturing work, and it is easy to automate the work, and is suitable for both mass production and various types of small-quantity production. It is a mounting method
Widely used.

部品の小形化、高性能化と共に、益々高密度実装化が促
進されている。
Higher density packaging is being promoted along with miniaturization and higher performance of parts.

しかし、製造初期段階や部品の切替え段階においては、
実装完了後に回路変更を行う必要が生じる場合があり、
この変更に対処出来ることが要求される。
However, in the initial stage of manufacturing and the stage of switching parts,
It may be necessary to change the circuit after mounting is completed,
It is required to be able to deal with this change.

〔従来の技術〕[Conventional technology]

第2図(a)〜(c)に従来のプリント板変更例を示
す。
FIGS. 2 (a) to 2 (c) show an example of changing a conventional printed board.

高密度実装化、高性能化に伴い、プリント基板への実装
部品は、以前からのリード端子付部品の他、表面実装型
の端子付部品や、端子の無いチップ部品等を多用する傾
向にある。
Due to high-density mounting and high performance, the components mounted on the printed circuit board tend to use surface mounted type terminal mounted components and chip components without terminals in addition to the conventional lead terminal mounted components. .

しかし、実装完了後の回路変更に対しては、人手で変更
作業を行うので、小形なチップ部品は取扱が難しく、リ
ード端子付部品を使用するのが主であった。
However, since it is necessary to manually change the circuit after the mounting is completed, it is difficult to handle a small chip component, and a lead terminal-equipped component is mainly used.

この回路変更は、第2図(a)〜(c)に示す如く行わ
れていた。
This circuit modification has been performed as shown in FIGS. 2 (a) to (c).

同図(a)は、リード端子付の部品95を追加する場合
で、プリント基板8に設けた配線パターンとつながる接
続ランド83が、部品95のリード端子96に対応して配設し
てあり、各接続ランド83に明けられた接続孔81に、追加
部品95のリード端子96を挿入させ、接続ランド83と半田
付固定させる。
FIG. 9A shows a case where a component 95 with lead terminals is added, in which connection lands 83 connected to the wiring pattern provided on the printed circuit board 8 are arranged corresponding to the lead terminals 96 of the component 95. The lead terminal 96 of the additional component 95 is inserted into the connection hole 81 opened in each connection land 83, and fixed to the connection land 83 by soldering.

同図(b)は、プリント基板8の配線パターン84の一部
を切断除去して回路変更を行った場合である。
FIG. 7B shows a case where the circuit is changed by cutting and removing a part of the wiring pattern 84 of the printed circuit board 8.

同図(c)は、配線材7を用いて回路を追加する場合
で、配線材7の両端で絶縁被覆を剥ぎ、露出した芯線を
所定の回路につながった何れかの接続ランド83位置で、
そこに半田付されたリード端子96に絡めて半田付させ
る。
FIG. 7C shows a case where a circuit is added by using the wiring material 7, and the insulating coating is stripped at both ends of the wiring material 7, and the exposed core wire is connected to a predetermined circuit at any one of the connection land 83 positions.
The lead terminals 96 soldered there are entangled and soldered.

以上の図(a)〜(c)の組合せで回路変更が成され
る。
The circuit is changed by the combination of the above figures (a) to (c).

〔考案が解決しようとする課題〕[Problems to be solved by the device]

しかしながら、 部品95の追加は、高密度実装化に反し、このために
大きな実装スペースを割かねばならない。
However, the addition of the component 95 is against the high-density mounting, and therefore a large mounting space must be allocated.

予測し得ない回路への部品95の追加は、その実装に
苦慮している。
The addition of component 95 to the circuit that is unpredictable makes it difficult to mount.

等の問題点がある。There are problems such as.

本考案は、かかる問題点に鑑みて、プリント基板の部品
実装完了後に、小形のチップ部品を追加取付け可能とす
ることを目的とする。
In view of such a problem, the present invention has an object of enabling a small chip component to be additionally attached after the components have been mounted on a printed circuit board.

〔課題を解決するための手段〕[Means for Solving the Problems]

上記目的は、第1図に示す如く、 チップ部品9の接続電極91を載せて接続する平面部2
と、平面部2の一縁部に突出し直角に折り曲げて設けら
れ、プリント基板8に穿けた無接続の貫通孔82に挿込み
固定され、配線材7の先端が挿入半田付接続される、割
り入り筒状の接続片31とから成る、本考案のチップ部品
実装用端子11により達成される。
The above-mentioned purpose is, as shown in FIG. 1, a flat surface portion 2 for mounting and connecting the connection electrodes 91 of the chip component 9.
And the flat portion 2 is provided so as to project from one edge of the flat portion 2 and bent at a right angle, and is inserted and fixed in an unconnected through hole 82 formed in the printed circuit board 8, and the tip of the wiring member 7 is connected by insert soldering. This is achieved by the chip component mounting terminal 11 of the present invention, which comprises a connecting piece 31 having a cylindrical shape.

〔作用〕[Action]

即ち、接続片31を貫通孔82に挿着して、端子11をプリン
ト基板8に固定出来、この状態で平面部2もチップ部品
9の接続電極91に対応して配置されるので、チップ部品
9を搭載、接続することが出来る。
That is, the connection piece 31 can be inserted into the through hole 82 and the terminal 11 can be fixed to the printed circuit board 8. In this state, the flat surface portion 2 is also arranged corresponding to the connection electrode 91 of the chip component 9, so that the chip component 9 can be installed and connected.

端子11は、チップ部品9の追加が予測出来なかった場合
に用い、プリント基板8での作業に適した任意位置に穿
けた無接続の貫通孔82に、接続片31を挿着固定させ、配
線材7の一端を半田付接続し、他端を前述の従来例にお
ける第2図(c)の如く追加する回路の配線パターン84
に接続させ、平面部2にチップ部品9の接続電極91を接
続する。
The terminal 11 is used when the addition of the chip component 9 cannot be predicted, and the connection piece 31 is inserted and fixed in the unconnected through hole 82 formed at an arbitrary position suitable for the work on the printed circuit board 8. A wiring pattern 84 of a circuit in which one end of the material 7 is connected by soldering and the other end is added as shown in FIG.
And the connection electrode 91 of the chip component 9 is connected to the flat surface portion 2.

同一のチップ部品9に対する複数の端子11は、各平面部
2を同一平面に揃えることが肝要である。
For the plurality of terminals 11 for the same chip component 9, it is essential that the respective flat surface portions 2 be aligned on the same plane.

かくして、プリント基板の部品実装完了後に、小形のチ
ップ部品を追加取付けすることが可能となり、実装スペ
ースを大きく削減することが出来る。
Thus, it becomes possible to additionally mount a small chip component after the component mounting on the printed circuit board is completed, and the mounting space can be greatly reduced.

〔実施例〕〔Example〕

以下図面に示す実施例によって本考案を具体的に説明す
る。全図を通して同一符号は同一対象物を示す。第1図
は本考案の実施例の構成図である。
Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings. The same reference numerals denote the same objects throughout the drawings. FIG. 1 is a block diagram of an embodiment of the present invention.

本考案の実施例は、第1図に示す如くで、端子11は0.2m
m厚の黄銅板を成形したもので、平面部2は4mmで、一
縁部を延長方向に1.35φ×2.5mmの筒状に成形突出させ
直角に折り曲げた接続片31が一体に設けてある。
The embodiment of the present invention is as shown in FIG.
obtained by molding a brass plate of m thick, planar portion 2 is a 4 mm □, the connection piece 31 bent at a right angle to the molded protruding in the extending direction of one edge to the cylindrical 1.35φ × 2.5mm are formed integrally is there.

この接続片31は、プリント基板8に穿ける無接続の1.2m
mφの貫通孔82に押し込み、外径の1.35mmが1.2mmになる
収縮力を受けて固定されるように、割り入り筒としてあ
る。
This connecting piece 31 is a 1.2 m unconnected piece that can be attached to the printed circuit board 8.
It is a split tube so that it can be pushed into the through hole 82 of mφ and fixed by receiving a contracting force of 1.2 mm from the outer diameter of 1.35 mm.

同一チップ部品9に対する平面部2を同一面に揃えて各
端子11を固定させてから、一端を指定回路の配線パター
ンに接続した配線材7の他端の芯線を露出させて、所定
の接続片31の筒内に挿入し半田付接続する。
After fixing the terminals 11 by aligning the flat surface portions 2 for the same chip component 9 on the same surface, the core wire of the other end of the wiring material 7 whose one end is connected to the wiring pattern of the designated circuit is exposed, and a predetermined connecting piece is formed. Insert into the cylinder of 31 and connect with solder.

次に、指定のチップ部品9を載せ、各接続電極91と平面
部2とを夫々半田付して接続固定する。
Next, the designated chip component 9 is placed, and each connection electrode 91 and the flat surface portion 2 are soldered and fixed to each other.

上記各実施例は一例を示し、各部の形状、寸法、材料は
上記の物に限定するものではない。
The above-mentioned embodiments show examples, and the shape, size, and material of each part are not limited to those described above.

例えば、平面部2の形状は矩形や台形でも差支えなく、
その寸法も4mmに拘泥するものではない。又、接続片31
の形状も円筒でなく △形等、任意断面形の筒状で差支えない。
For example, the shape of the flat portion 2 may be rectangular or trapezoidal,
Its size is not limited to 4 mm. Also, the connection piece 31
The shape is not cylindrical There is no problem with a tubular shape having an arbitrary cross-section such as a Δ shape.

〔考案の効果〕[Effect of device]

以上の如く、本考案により、プリント基板の部品実装完
了後に、回路変更による小形のチップ部品の追加取付け
が可能となり、実装スペースの削減に大きく寄与するこ
とが出来、その実用的効果は著しい。
As described above, according to the present invention, after the mounting of the components on the printed circuit board is completed, it is possible to additionally mount a small chip component by changing the circuit, which can greatly contribute to the reduction of the mounting space, and its practical effect is remarkable.

【図面の簡単な説明】[Brief description of drawings]

第1図は本考案の実施例の構成図、 第2図は従来のプリント板変更例である。 図において、 2は平面部、7は配線材、8はプリント基板、9はチッ
プ部品、11は端子、31は接続片、82は貫通孔、83は接続
ランド、84は配線パターン、91は接続電極、95は部品、
96はリード端子である。
FIG. 1 is a block diagram of an embodiment of the present invention, and FIG. 2 is a modification of a conventional printed board. In the figure, 2 is a plane portion, 7 is a wiring member, 8 is a printed circuit board, 9 is a chip component, 11 is a terminal, 31 is a connecting piece, 82 is a through hole, 83 is a connection land, 84 is a wiring pattern, and 91 is a connection. Electrode, 95 is a part,
96 is a lead terminal.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】チップ部品(9)の接続電極(91)を載せ
て接続する平面部(2)と、 該平面部(2)の一縁部に突出し直角に折り曲げて設け
られ、プリント基板(8)に穿けた無接続の貫通孔(8
2)に挿込み固定され、配線材(7)の先端が挿入半田
付接続される、割り入り筒状の接続片(31)と、から成
ることを特徴とするチップ部品実装用端子。
1. A flat surface portion (2) on which a connection electrode (91) of a chip part (9) is placed and connected, and a printed circuit board (2) provided at one edge portion of the flat surface portion (2) and bent at a right angle. No connection through hole (8)
A terminal for mounting a chip component, comprising: a split tubular connection piece (31) which is inserted and fixed in 2) and the tip of a wiring material (7) is insert-soldered and connected.
JP1990048787U 1990-05-09 1990-05-09 Chip component mounting terminal Expired - Lifetime JPH0718136Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990048787U JPH0718136Y2 (en) 1990-05-09 1990-05-09 Chip component mounting terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990048787U JPH0718136Y2 (en) 1990-05-09 1990-05-09 Chip component mounting terminal

Publications (2)

Publication Number Publication Date
JPH048373U JPH048373U (en) 1992-01-24
JPH0718136Y2 true JPH0718136Y2 (en) 1995-04-26

Family

ID=31565912

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990048787U Expired - Lifetime JPH0718136Y2 (en) 1990-05-09 1990-05-09 Chip component mounting terminal

Country Status (1)

Country Link
JP (1) JPH0718136Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007053827A (en) * 2005-08-15 2007-03-01 Funai Electric Co Ltd Power supply

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52158861U (en) * 1976-05-27 1977-12-02
JPS55105277U (en) * 1979-01-19 1980-07-23

Also Published As

Publication number Publication date
JPH048373U (en) 1992-01-24

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