WO2003060940A1 - Systeme micro-electromecanique et procede de fabrication - Google Patents

Systeme micro-electromecanique et procede de fabrication Download PDF

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Publication number
WO2003060940A1
WO2003060940A1 PCT/CH2002/000722 CH0200722W WO03060940A1 WO 2003060940 A1 WO2003060940 A1 WO 2003060940A1 CH 0200722 W CH0200722 W CH 0200722W WO 03060940 A1 WO03060940 A1 WO 03060940A1
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WO
WIPO (PCT)
Prior art keywords
micro
substrate
electromechanical system
switch
movable part
Prior art date
Application number
PCT/CH2002/000722
Other languages
German (de)
English (en)
Inventor
Ralf Strümpler
Original Assignee
Abb Research Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/US2002/001662 external-priority patent/WO2002058089A1/fr
Application filed by Abb Research Ltd filed Critical Abb Research Ltd
Priority to AT02796487T priority Critical patent/ATE304736T1/de
Priority to DE50204300T priority patent/DE50204300D1/de
Priority to EP02796487A priority patent/EP1468436B1/fr
Priority to US10/501,979 priority patent/US7109560B2/en
Priority to AU2002361920A priority patent/AU2002361920A1/en
Publication of WO2003060940A1 publication Critical patent/WO2003060940A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/12—Contacts characterised by the manner in which co-operating contacts engage
    • H01H1/14—Contacts characterised by the manner in which co-operating contacts engage by abutting
    • H01H1/20—Bridging contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/50—Means for increasing contact pressure, preventing vibration of contacts, holding contacts together after engagement, or biasing contacts to the open position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H01H2001/0042—Bistable switches, i.e. having two stable positions requiring only actuating energy for switching between them, e.g. with snap membrane or by permanent magnet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H01H2001/0078—Switches making use of microelectromechanical systems [MEMS] with parallel movement of the movable contact relative to the substrate

Definitions

  • the invention relates to the field of micro-electromechanical systems, in particular
  • micro-electromechanical system forming the preamble of claims 1 and 21 and a corresponding method are known for example from DE 198 00 189 AI.
  • MEMS micro electro-mechanical system
  • a micromechanical switch which comprises a flat carrier substrate, a contact piece fixed on the carrier substrate, a movable electrode and a counter electrode fixedly connected to the carrier substrate.
  • the mobile electrical i & has a free end and a fixed end connected to the carrier substrate.
  • the movable electrode and the counter electrode have surfaces facing one another.
  • the movable electrode By electrostatic attractive forces between these mutually facing surfaces, the movable electrode can be bent, that is to say elastically deformed, in such a way that the free end of the movable electrode approaches the counterelectrode and thereby also the contact piece until there is contact between the free end of the movable electrode and the contact piece comes.
  • the movement of the free end of the movable electrode takes place laterally, that is to say parallel to the flat carrier substrate.
  • the electrostatic attractive forces between the facing surfaces of the movable electrode and the counter electrode are generated by the application of a voltage between the movable electrode and the counter electrode.
  • stoppers are introduced into the counter electrode which protrude beyond the surface of the counter electrode facing the movable electrode and are not at the same potential as the counter electrode.
  • springs can also be provided, which are attached to the side of the movable electrode facing away from the counter electrode and restrict the movement of the movable electrode in the direction of the counter electrode.
  • the surface of the movable electrode facing the counter electrode can also be provided with an electrically insulating layer for the same purpose.
  • the electrostatic attraction force F between two parallel surfaces of the surface A at a distance d when a switching voltage U is applied between the two surfaces is given by The force increases linearly with the surface, quadratically with the tension and inversely proportional to the square of the distance.
  • the microsystem disclosed in the aforementioned DE 198 00 189 AI was generated from the carrier substrate using a deep silicon etching process. After a mask has been applied to the carrier substrate, material is etched out of the carrier substrate at the locations at which the mask is opened. This creates trenches or etching channels that have at least one minimum width that is characteristic of the etching process.
  • a sacrificial layer process is used which separates the free end of the movable electrode from the carrier substrate.
  • a sacrificial layer arranged in the carrier substrate below the movable parts of the micromechanical switch is selectively removed by an etching process, the sacrificial layer at locations where a connection to the substrate is desired, such as at the counter electrode, the fixed contact piece and the fixed end of the movable electrode , persists.
  • DE 42 05 029 CI shows an electrostatically operated micro-electro-mechanical relay that works horizontally. That means the switching movement of this relay is essentially perpendicular to a carrier substrate. A tongue-shaped electrode with a contact piece is etched free from a silicon substrate. The substrate is then applied to a counter substrate with a counter electrode and a counter contact in such a way that the electrode includes a wedge-shaped gap with the counter electrode. By applying a switching voltage between the electrode and the counter electrode, these can be moved towards one another, whereby an electrically conductive connection between the contact and counter contact can be achieved. Large contact forces can be achieved using relatively wide electrodes.
  • DE 197 36 674 CI also discloses a micro-electromechanical relay and a method for its production, which operates horizontally.
  • a movable contact is attached to an anchor tongue which is attached to a substrate on one side and which is bent away from the substrate in the idle state.
  • this contact interacts with a fixed contact, which is attached to a spring tongue that is also curved away from the substrate.
  • the curvature of the contacts is achieved by applying a tension layer on both contacts. Achieving a high reproducibility of a curvature of the contacts produced in this way and thus the contact spacings in the idle state (open) is not easy in terms of production technology.
  • the 3 mm long spring tongues are only 10 ⁇ m to 20 ⁇ m wide, but 480 ⁇ m high.
  • US Pat. No. 5,677,823 discloses an electrostatically switchable bistable storage element which operates horizontally.
  • a bridge-like movable contact aligned essentially parallel to a carrier substrate is arranged above a fixed contact which is fixedly connected to the carrier substrate.
  • the movable contact is fixed to the carrier substrate, while it bulges away from the carrier substrate in the middle (first stable position) or bulges in the direction of the carrier substrate (second stable position).
  • the switch In the second stable position, the movable contact and the fixed contact touch: the switch is closed.
  • the switch is open in the first stable position.
  • the bistability of the switch results from mechanical stresses which are introduced into the movable contact during manufacture of the switch.
  • two electrodes are arranged on the side next to the fixed contact.
  • the contact and electrodes can be electrically charged, so that electrostatic attraction or repulsion forces result between them, by means of which the switch can be switched back and forth between the two stable positions.
  • Another horizontally operating bistable MEMS mechanism is described in Sun et al., "A Bistable Microrelay Based on Two-Segment Multimorph Cantilever Actuators", IEEE Catalog No. 98CH36176.
  • MEMS micro-electro-mechanical system
  • New functionalities can mean, for example, the realization of voltage-free closed connections or of micro-relays with voltage-free opened as well as voltage-free closed connections.
  • the MEMS according to the invention comprises a substrate and a first micro-element and a second micro-element, wherein
  • the first micro-element and the second micro-element are connected to the substrate
  • the first micro-element having a first surface and the second micro ⁇ element has a second surface, which surfaces face each other and are generated by a patterning process
  • the first micro-element contains a switching part by which it can be switched bistably between an initial position and a working position
  • the distance between the first surface and the second surface in the working position of the first micro-element is smaller than a minimum distance between the first surface and the second surface that can be generated by the structuring method.
  • a first micro-element which can be switched between the two stable positions initial position and working position, is used in connection with a second micro-element in such a way that the first micro-element, after switching from the initial position to the working position, has a smaller distance from the second micro - Element has as in the initial position.
  • Both micro-elements are connected to the substrate and produced using a structuring process. According to the invention, the aforementioned smaller distance in the working position is smaller than a minimum distance, which is characteristic of the structuring method, between the two micro-elements.
  • micro-actuators can be realized in a new or simpler way or in an improved form.
  • the second micro-element is a firmly connected to the substrate first fe ⁇ Stes end and a movable part, whereby in the working position of the first micro-element, the movable part of the second micro-element by electrostatic forces between the first micro-element and the second micro-element can be moved from a switch-off position to a switch-on position, and the two micro-elements in the area of the point which has the aforementioned smaller distance between the two micro-elements, has contact points and is electrically non-conductive.
  • the fact that there are points of contact means that the smaller distance mentioned is zero.
  • electrostatically operating actuators whose electrostatically switchable electrodes (electrode and counter electrode) touch each other.
  • the small or vanishing electrode spacings achieved as a result have improved switchability. Switching the actuator with very low switching voltages is possible.
  • the first micro-element is additionally designed in such a way that it contains an adapted counter-electrode which is adapted to the shape of the second micro-element:
  • the adapted counter-electrode is shaped in such a way that in the switch-on position of the second micro-element overlap the adapted counterelectrode and the second micro-element over a large area in the area of the mentioned contact points.
  • the matched counter electrode and the second micro element nestle against one another. This maximizes the areas between which the electrostatic attractive forces act, which results in greater electrostatic attractive forces and thus improved switchability. Switching the actuator at very low switching voltages is made possible.
  • the adapted counter-electrode additionally comprises a second section, which is set back in a step-like manner with respect to the section of the counter-electrode that clings to the second micro-element.
  • this second section of the connected fit counter electrode and the second micro-element a gap.
  • the force that can be selected in this way can be, for example, a contact force of the second micro-element on one or two electrical contacts, which contacts the second micro-element in its switched-on position, thereby making a reliable electrical contact.
  • a changeover switching relay is implemented.
  • relays or changeover relays are implemented with voltage-free closed connections.
  • the movable part of the second micro-element can be elastically deformed by switching the first micro-element from the initial position into the working position. This makes it possible to implement closed connections without voltage.
  • the method according to the invention includes switching the bistable switchable micro-element. This enables new or improved MEMS such as those mentioned above to be manufactured.
  • Figure 1 is a schematic representation of a MEMS according to the invention with a cosine-shaped bistable element, in supervision.
  • FIG. 2 shows a schematic illustration of a MEMS according to the invention with a bistable element in the form of an antinode, in supervision;
  • FIG. 3 shows a schematic illustration of a MEMS according to the invention with a cosine-shaped bistable element and a matched counter electrode, in supervision;
  • FIG. 4 shows a schematic illustration of a micro-relay according to the invention with a cosine-shaped bistable element and a matched counter electrode, in supervision;
  • FIG. 5 shows a schematic illustration of a micro changeover switching relay according to the invention with two cosine-shaped bistable elements and an adapted counter electrode, in supervision;
  • FIG. 6 shows a schematic representation of a micro-relay according to the invention with a cosine-shaped bistable element and a stepped counter electrode, in supervision;
  • Figure 7 is a schematic representation of an inventive micro-relay with kosinusförmigem bistable element and gestuf ⁇ ter counter electrode and two-movable part of the second micro-element, in a plan view.
  • Fig. 8 is a schematic representation of an inventive
  • Fig. 9 is a schematic representation of an inventive
  • 10a shows a schematic representation of a micro relay according to the invention with an NC connection, state: first micro element in initial position; under supervision;
  • 10b shows a schematic representation of a micro relay according to the invention with an NC connection, state: first micro element in the working position, second micro element in the off position; under supervision;
  • 10c shows a schematic representation of a micro-relay according to the invention with an NC connection, state: first micro-element in the working position, second micro-element in the switch-on position; under supervision;
  • Figure 1 1 a is a schematic representation of a horizontally operating micro-relay according to the invention with NC connection, sectional side view;
  • Fig. 1 1 b is a schematic representation of a horizontally operating micro-relay according to the invention with NC connection, in supervision;
  • MEMS micro-electromechanical system
  • the substrate s is a wafer made of single-crystal silicon, in which one of the two largest surfaces forms a main surface of the substrate. In Fig. 1, this main surface lies in the paper plane.
  • the first micro-element 1 and the second micro-element 2 were formed from the substrate S using ion deep etching (DRIE, dry reactive ion etching) and sacrificial layer technology.
  • DRIE ion deep etching
  • sacrificial layer technology ion deep etching
  • the structuring process DRIE has the property of being a material-removing process; it is an etching process. It also has the property of being well suited for producing narrow yet deep channels, columns or trenches, as a result of which the DRIE can be given a preferred direction which indicates the direction of the preferred material removal and is therefore perpendicular to the main surface of the substrate. Again perpendicular to this preferred direction, the width of a trench created by DRIE is limited downwards, that is to say narrow trenches. This means that there is a minimum trench width that can be generated by the structuring method (for example DRIE). There is therefore a minimum distance for the two surfaces which form the lateral boundaries of such a trench.
  • micro-elements 1, 2 can be formed from the substrate by means of ion etching and sacrificial cutting technology are known to the person skilled in the art and can also be found, for example, in the aforementioned publication DE 198 00 189 AI, which hereby includes the entire disclosure content in the Description is included.
  • Micro-elements produced by DRIE typically have side surfaces that are aligned almost perpendicular to the main surface of the substrate S, or in other words: (Local) surface normal vectors of the side surfaces run practically parallel to the main surface of the substrate S.
  • Such micro-elements thus essentially have the shape of a straight (right-angled) prism, the base of which is aligned parallel to the main surface of the substrate S.
  • the height of such a micro-element (perpendicular to the main surface) is typically very large compared to the (narrowest) width of such a micro-element.
  • the first micro element and the second micro element are of this type.
  • the first micro-element 1 is designed as a bistable elastic MEMS mechanism, as described in the publication J. Qiu et al., "A Centrally-Clamped Parallel-Beam Bistable MEMS Mechanism", Proc. of MEMS 2001, Interlaken, Switzerland, Jan. 20-22, 2001. Details on design forms, properties and on the production of such a micro-element can be found in this publication, which hereby includes the entire disclosure content in the description.
  • the first micro-element 1 is fixed on the substrate S at a first end 6 and a second end 7. In between, the first micro-element 1 has two parallel, cosine-shaped spring tongues which are connected to one another in the middle 8 between the two ends 6, 7. In view of their small width and large height (perpendicular to the main substrate surface), these spring tongues can also be regarded as a parallel membrane.
  • the first micro-element 1 can be switched bistably between an initial position A and a working position B (the latter shown in dashed lines in FIG. 1). That is, the micro-element 1 has two mechanically stable states or positions A and B between which it by applying a la ⁇ eral, so power substrate parallel movable to and fro; the movement takes place essentially laterally. Possible intermediate positions NENs are not stable, but instead lead independently to a rapid transition to one of the two stable states A or B. The transition takes place by preferably elastic deformation of the first micro-element 1.
  • the first micro-element 1 here therefore consists only of a switching part 5 through which it can be switched bistably.
  • the first micro-element 1 has on the side facing the second micro-element 2 a side surface shaped by DRIE, which is referred to as the first surface 3a.
  • This first surface 3a has a first coating 3b, which is electrically insulating and whose outer surface, that is to say facing away from the first surface 3a, forms the first surface 3 of the first micro-element 1.
  • the first coating 3b is typically produced by oxidation of the silicon.
  • the second micro-element 2 comprises a first fixed end 10, at which it is fixed on the substrate s, and a movable part 11; it is arranged adjacent to the first micro element 1.
  • the second micro-element 2 On that side of the second micro-element which faces the first micro-element 1, the second micro-element 2 has a side surface shaped by DRIE, which is referred to as the second surface 4a.
  • This second surface 4a has a second coating 4b which is electrically insulating and whose outer surface, that is to say facing away from the second surface 4a, forms the second surface 4 of the second micro-element 2.
  • the first upper ⁇ surface 3 and the second surface 4 are facing surfaces, as well as the first surface 3a and the second surface 4a facing each other.
  • the second coating 4b is also typically Oxida ⁇ tion of the silicon produced.
  • the first micro-element 1 After shaping the first surface 3a and the second surface 4a by means of DRIE, the first micro-element 1 is in the initial position A and that second micro-element 2 in an off position A '. Since the surfaces 3a and 4a are formed in the middle of DRIE, they are at a distance from one another which is at least as large as a minimum distance given by DRIE.
  • the spacing of the surfaces from one another means the distance between the two points closest to one another, the one point lying on the first surface 3a and the other point lying on the second surface 4a. The distance is therefore the width of the trench between the first surface 3a and the second surface 4a at its narrowest point. In Fig. 1, this point is at a corner of the first fixed end 10 of the second micro-element 2 and near the first end 6 of the first micro-element 1 on the membrane of the first micro-element 1, which has the first surface 3a.
  • the initial position A of the first micro-element 1 is a production-related starting position.
  • the arrangement of the first micro-element 1 and the second micro-element 2 is selected such that after the first micro-element 1 has been switched from the initial position A to the working position B, the distance between the first surface 3a and the second surface 4a is smaller than the minimum distance given by the manufacturing process (e.g. DRIE).
  • the distance is even zero, that is, in the working position A, the first micro-element 1 and the second micro-element 2 touch.
  • the working position A the intended interaction of the first micro-element 1 with the second micro element 2 take place within the MEMS.
  • the MEMS in FIG. 1 represents a micro-actuator, which is formed by the first micro-element 1 and the second micro-element 2, together with the substrate S.
  • the second micro element 2 acts as a movable, electrostatically switchable electrode and the bistable switchable first micro ⁇ element 1 as an associated electrostatic counter electrode.
  • the first micro-element 1 is in the working position A.
  • the mode of operation of the micro-actuator when it is in working position B is essentially known from the prior art: there is a contacting electrode C at the first fixed end 6 of the first micro-element 1 and at the first fixed end 10 of the second micro-element 2, a contacting electrode C is provided.
  • These contacting electrodes C, C serve to apply switching voltages to the micro-elements 1, 2, by means of which the micro-elements become electrostatically charged, so that electrostatic forces act between the micro-elements 1 and 2.
  • the material from which the micro-elements are made must be sufficiently conductive, which is achieved, for example, by appropriate doping of the silicon. Due to the electrostatic forces between the micro-elements (more precisely: between the first surface 3 and the second surface 4), the movable part 11 of the second micro-element 2 can be moved from the switch-off position A 'to a switch-on position B 1 of the second micro-element 2.
  • the switch-on position B 1 is shown in dashed lines in FIG. 1. In the MEMS in Fig.
  • the electrostatic force decreases inversely proportional to the distance.
  • the MEMS according to the invention from FIG. 1 thus has the great advantage of being able to be switched with even lower switching voltages than would be required for a MEMS whose distance between the electrode and counterelectrode is greater than or equal to the minimum distance given by the structuring method.
  • the micro-actuator in FIG. 1 can be used, for example, as an optical micro-switch, in that a light beam to be switched is transmitted or is interrupted by the movable part 11 of the second micro-element 2, depending on whether the second micro-element is 2 is in the switch-off position A 'or in the switch-on position B 1 .
  • the switch-on position B 1 is by definition present when there are suitable switching voltages; otherwise the switch-off position A 'is present.
  • the bistable switchable first micro-element 1 is used as an electrostatic electrode or counter electrode.
  • FIG. 2 shows a MEMS which largely corresponds to the MEMS from FIG. 1; al ⁇ lerdings is the first micro-element 1 structured differently.
  • the first micro-element 1 is here designed as another lateral, bistable and preferably elastically switchable mechanism.
  • the first micro-element 1 is also fixed here on the substrate s at a first end 6 and a second end 7. Therebetween, the first micro-element 1 but a ge ⁇ curved spring tongue, which has the shape of an antinode. In view of its small width and great height (perpendicular to the The main surface of the substrate) can also be called this spring tongue as a membrane.
  • the first micro-element 1 In the initial position A, that is, in the state in which the first micro-element 1 is structured, the first micro-element 1 describes a symmetrical antinode, in the working position B an asymmetrical antinode (the latter shown in dashed lines in FIG. 2).
  • the asymmetrical antinode represents the second stable position of the first micro-element 1 and comes about because a stop firmly connected to the substrate S touches the first micro-element 1 in the working position B and leads to the corresponding deformation of the first micro-element 1 leads.
  • This stop is formed here by an appropriately designed and arranged first fixed end 10 of the second micro-element 2.
  • the corresponding point of contact is expediently to the right of a connecting section which runs from the second end 7 to the first end 6 of the first micro-element 1 if the symmetrical antinode is arranged in the initial position A to the left of this connecting section.
  • the value of a position coordinate of the point of contact parallel to this connection path is not 0.5 (no asymmetrical antinode) and is preferably between 0.52 and 0.92 of the length of the connection path; here it is about 0.84.
  • the stop can also be formed by a correspondingly shaped first end 6 or second end 7 of the first micro-element 1 or as a stop which is fixed separately on the substrate S (which is then to be regarded as belonging to the first micro-element 1).
  • the bistable micro-element 1 is generated (structured) in the initial position A, the distance between the first micro-element 1 and the second micro-element 2 being at least as great as that given by the structuring method Minimalab- stood (between these micro-elements 1, 2).
  • the first micro-element 1 is switched from the initial position A to the working position B, the distance between the two micro-elements 1, 2 being smaller in the working position B. the specified minimum distance.
  • two micro elements are therefore realized with a small distance from one another that cannot be produced by the structuring method (by utilizing the bistable switchability of one of the micro elements).
  • FIG. 3 shows a MEMS according to the invention, which largely corresponds to the exemplary embodiment shown in FIG. 1;
  • the first micro-element 1 does not only consist of a switching part 5, but additionally comprises an electrode 9.
  • the electrode 9 has an elongated part, which has the first surface 3a, the first coating 3b and the first surface 3 of the first Micro-element 1 includes. This part is connected by means of another elongated member that is approximately perpendicular to said tet be rich ⁇ to the switching portion 5 in the middle 8 between the ends 6,7 of the first micro-element. 1
  • the electrode 9 Since the electrode 9 is attached to the switching part 5, it moves with the switching part 5 when switching from the initial position A to the working position B (and possibly back again). Are electrostatic by applying appropriate switching voltages attractive forces between the first micro-element 1 is generated (of course, in the working position A) and the second Mi ⁇ kro element 2, the movable member 1 1 ⁇ of the second micro-element 2 is elastically deformed and approaches the electrode 9: It is switched from the switch-off position A 'to the switch-on position B'.
  • the shape of the electrode 9, and in particular the shape of the first surface 3, is preferably shaped in such a way that the first surface 3 and the second surface 4 are in full contact in the switch-on position.
  • the first surface 3 is therefore adapted to the shape of the second surface 4 in the switch-on position.
  • the two surfaces 3, 4 are nestled together in the switch-on position B '.
  • Such an electrode 9 can be referred to as an adapted electrode 9.
  • the adapted electrode 9 maximizes the area effective for the electrostatic forces and minimizes the effective distances. As a result, switching can take place even at low switching voltages.
  • FIG. 4 shows a MEMS, which is a micro-relay.
  • the exemplary embodiment largely corresponds to that of FIG. 3. It likewise comprises an (adapted) electrode 9 and a bistable, elastically switchable micro-element 1 which is configured in a cosine shape.
  • the second micro-element 2 or more precisely: the movable part 11 of the second Micro-element 2, a contact area 16, which is electrically conductive.
  • the contact region 16 is preferably arranged in the region of that end of the movable part 11 of the second micro-element 2 which does not adjoin the first fixed end 10 of the second micro-element 2.
  • the contact area 16 forms part of a side surface of the second micro-element 2 and is preferably designed as a coating which is applied to the second micro-element 2 by means of vapor deposition or sputtering techniques.
  • the MEMS comprises two fixed on the substrate S, elec trically conductive ⁇ Fixessore 1 7.18.
  • the arrangement of the fixed contacts 17, 18 and the contact area 16 is selected in such a way that it is more suitable in the event of concerns Switching voltages on the first micro-element 1 and the second micro-element 2 (that is, in the switch-on position B 'of the second micro-element 2), the contact area 16 generates an electrically conductive connection between the fixed contact 17 and the fixed contact 18. In the switch-off state A 1 , this is not the case. There is therefore an electrostatic micro-relay through which a connection formed by the fixed contacts 1, 7.1, 8 can be switched by means of the switching voltages.
  • the distance in the open state between the contact area 16 of the second micro-element 2 and the fixed contacts 1, 7.1, 8 can be selected and can be reproduced very well in terms of production technology.
  • the contact area 16 is arranged on the side of the second micro-element 2 which faces the first micro-element 1, that is to say on the side which also contains the surface 4. Attractive electrostatic forces between the first micro-element 1 and the second micro-element 2 can cause electrical contact between the fixed contacts 1, 7.1, 8.
  • the fixed contacts 17, 18 are located in that area of the substrate S which lies on the side of the second micro-element 2 facing away from the first micro-element 1.
  • the contact region 16 is then correspondingly arranged on that side of the movable part 11 of the second micro-element 2 which faces away from the first micro-element 1.
  • the relay can be switched by repulsive electrostatic forces.
  • 5 shows a micro changeover relay according to the invention. It contains all the features of such a MEMS, as was described in connection with FIG. 4.
  • the MEMS also comprises a third micro-element T and two further fixed contacts 17 ', 18'; and the second micro-element 2 has a further electrically conductive contact area 6 ', which is arranged on a side of the movable part 11 of the second micro-element 2 which is opposite the side which has the contact area 16.
  • the arrangement does not have to be a mirror image; it suffices if the third micro-element T is connected to the substrate in a region of the substrate S which lies on the side of the second micro-element (2) facing away from the first micro-element 1 and the further fixed contacts 17 ', 18' are connected to the substrate in a region of the substrate S which is on the side of the second micro-element 2 facing away from the fixed contacts 1 7, 18.
  • the structure of the third micro element T corresponds to the structure of the first micro element 1.
  • the further fixed contacts 17 ', 18' are of the same design as the fixed contacts 17, 18.
  • the interaction between the third micro-element T and the second micro-element (2) and the further fixed contacts (1 7 ', 18') corresponds to the above-described interaction between the first micro-element 1 and the second micro-element 2 and the fixed contacts 1 7.1 8.
  • an electrically conductive connection between the further fixed contacts 17 ', 18' can be created by the further contact area 16 '.
  • Three-position switch or a changeover relay in front that has three defined states: (1st) contacts between the two fixed contact pairs 17, 18; 1 7 ', 18' open, (2nd) contacts between the other fixed contacts 17 ', 18' open and contacts between the fixed contacts 1 7.1 8 closed and (3.) contacts between the fixed contacts 1 7.18 open and contacts between the further fixed contacts 1 7 ', 18' closed.
  • FIG. 6 shows a further MEMS according to the invention, which largely corresponds to the MEMS from FIG. 4. It contains the features of the MEMS from FIG. 4, for which reference is made to the corresponding part of the description.
  • the electrode 9 of the first micro-element 1 is specially designed here.
  • the electrode 9 has an (optionally step-shaped) recess.
  • the electrode 9 comprises a gap-forming surface 12, which is set back in a step-like manner with respect to the first surface 3 of the first micro-element 1.
  • This electrode 9 can be referred to as a stepped electrode 9.
  • This MEMS uses attractive electrostatic forces to switch from the switch-off position A 'to the switch-on position B'.
  • the gap-forming surface 12 and the second micro-element 2 or more precisely: the movable part 11 of the second micro, close -Elementes 2, a gap 13 a.
  • the size of a contact force that is exerted by the second micro-element 2 on the fixed contacts 1, 7.18 can be selected.
  • a very good, reliable contact and a large contact force can be achieved.
  • the choice of the geometry of the gap allows a targeted predetermination and choice of the contact force.
  • the length of the gap and the width of the gap ie the distance between the movable part 11 of the second micro-element 2 and the gap-forming surface 12
  • the course of the width of the gap can be selected for this purpose.
  • the length of the gap about an order of magnitude, preferably about two orders of magnitude larger than the width of the gap.
  • a (roughly) uniformly wide gap is advantageously chosen, and the first surface 3 contacts the second surface 4 over the entire surface.
  • the relative arrangement of the micro-elements 1, 2 and the fixed contacts 17, 18 on the substrate has to be done carefully.
  • such a MEMS has the advantage that any problems that occur when switching from the switch-on position B 'to the switch-off position A', which are caused by a slow or poor detachment of the movable part 11 of the second micro-element 2 from the electrode 9 (that is more precisely: can occur from the first surface 3), for example due to surface effects, can be reduced.
  • the (air) gap 13 allows a rapid detachment of the movable part 11 of the second micro-element 2 from the electrode 9 when switching from the switch-on position B 'to the switch-off position A', while in the switch-on position B 'large electrostatic attractive forces between the first micro-element 1 and the second micro-element 2 act if the gap width has been chosen to be correspondingly small.
  • the movable part 11 of the second micro element 2 is specially designed here. It has a first region 14 and a second region 15, the first region 14 being less rigid, that is to say more easily deformable, than the second region 15 and the first region is between the fixed first end 10 of the second micro Element 2 and the second region 1 5 arranged.
  • the contact ⁇ region 16 is advantageously arranged in the second region 1 5, in particular in the area of the first region 1 5 opposite end of the second portion 16.
  • the second region 15 at least nevertheless that area of the movable part 1 1 in which the movable part 1 1 and the second micro-element 2 do not face each other.
  • the second region 15 advantageously also comprises at least that region of the movable part 11 in which the movable part 11 and the gap-forming surface 12 face each other.
  • the second region 15 also also has a (slight) overlap with the first surface 3.
  • the switched-on state B ' there is advantageously full-area contact between the first surface 3 and a part of the second surface 4, this part of the second surface 4 lying completely in the first region 14.
  • the greater stiffness of the second area 15 compared to the first area 14 is achieved in the exemplary embodiment from FIG. 7 in that the second area 15 is made thicker or wider than the first area 14. It is also possible for the second area 15 to be more difficult to bend to do, for example by applying a coating there; for example on a base of the straight prismatic body that forms the second region 15, or on at least one of the side surfaces. This could be achieved by means of a correspondingly (large, long) contact area which is designed as a coating.
  • the two differently stiff regions 14, 15 enable the second micro-element 2 to be switched from the switch-off position A 'to the switch-on position B' even at low switching voltages and attractive forces between the two micro ⁇ elements 1, 2; the movable part 1 1 (more precisely: the first region 14) of the second micro element 2 clings to the electrode 9, rolling, even with low attractive forces.
  • NO connection means that the connection is open when a suitable switching voltage is not applied (open when de-energized), as is the case in the exemplary embodiments listed above (FIGS. 4 to 7).
  • NC terminals which are closed when not concern a suitable switching voltage (energized closed), however, are difficult to realize and are realized but in the ⁇ ser embodiment.
  • an NC connection is implemented here in a MEMS structured using DRIE.
  • the MEMS in FIG. 8 is constructed in mirror image and includes a first Mi ⁇ kro element 1, a third micro-element T, a fourth micro-element 19 and a fifth micro-element 20, all of which are capable of bistable switching and ei ⁇ ne stable initial position a (drawn-through line) and have a stable Ar ⁇ beitsposition B (shown in phantom). They are designed here as bistable micro-elements of the type described in more detail in connection with FIG. 1 (two parallel, cosine-shaped, bound spring tongues). The position in which these micro-elements are structured by means of DRIE is the initial position A.
  • the first micro-element 1 and the third micro-element T largely correspond to one another in their function.
  • the fourth micro-element 19 and the fifth micro-element 20 likewise largely correspond to one another in their function. They each have a contacting electrode D, D '(for applying a signal to be switched, for example an electrical current) and an electrically conductive contact electrode 21, 22.
  • the conductivity of the contact electrodes 21, 22 is preferably generated by a metallic coating.
  • the contact electrodes 21, 22 are elongated, finger-shaped and fastened to the respective micro-element 19, 20 approximately in the middle 8 between the two ends of the respective micro-element 19, 20.
  • the MEMS also has two fixed electrodes 17, 18 fixedly connected to the substrate S (for applying a further electrical current to be switched).
  • the MEMS in FIG. 8 further comprises a second micro-element 2.
  • the second micro-element 2 is a monostable switchable micro-element; so it only has a stable position. It comprises a first fixed end 10 and a second fixed end 10 ', which ends 10, 10' are fixed on the substrate s, and a movable part 11 arranged between these two fixed ends 10, 10 '.
  • the movable part 11 is formed as a, preferably ⁇ vibration-bellied, curved structure which is fastened to the two fixed ends 10, 10 'of the second micro-element 2 and has an electrically conductive contact area 16.
  • the movable part 1 1 further comprises a second surface 4 which is formed by an optional second coating 4b, and which second Oberflä ⁇ surface 4 of a first surface 3 of the first micro-element 1 faces.
  • the situation is similar with a fourth surface 4 'of the second micro-element 2 and a third surface 3' of the third micro-element V.
  • the second surface 4 is arranged between the first fixed end 10 and the contact region 16.
  • the fourth surface 4 ' is arranged between the second fixed end 10' and the contact area 16.
  • the bistable micro-elements 1, 1 ', 19, 20 are spaced from the second micro-element 2 with at least one such minimum distance.
  • the bistable micro-elements 1, 1 ', 19, 20 switched from the initial position A to the working position B.
  • the distance between the micro-elements or surfaces becomes smaller than the minimum distance mentioned; in Fig. 8 the micro-elements even touch.
  • both contact electrodes 21, 22 touch the contact area 16.
  • the contact area 16 of the second micro element 2 is only electrically conductive on one side.
  • micro-elements 1, 1 ' can be provided with (adapted, optionally: stepped) electrodes 9 (see FIGS. 3 to 7).
  • the contacting electrodes 21, 22 can be designed differently; or do without them entirely and then contact the contact part 16 of the second micro-element 2 by means of the preferably electrically conductive coated switching part.
  • micro-elements 1, 1 'on the other side of the second micro-element 2 that is to say in the region of the substrate S which is on the side of the second micro-element 2 facing away from the fixed contacts 1, 7.1, 8 , Then the micro relay can be switched by electrostatic repulsive forces.
  • first micro-element 1 in a different area (of the substrate S, with respect to the second micro-element 2) than the third micro-element 1 '.
  • the features mentioned can be advantageous together or individually or in any combination.
  • FIG. 9 shows a two-way switching relay which, in addition to a normally open connection (NO connection), also additionally comprises a normally closed connection (NC connection).
  • the MEMS has a very similar structure to that described in FIG. 8; for corresponding features, reference is made to the text above.
  • the second micro-element 2 is not monostable here, but rather bistable. In particular, it has a structure with two parallel, cosine-shaped spring tongues connected in the middle, as described in detail in connection with FIG. 1.
  • the two stable positions of the second micro-element 2 are the switch-off position A 'and the switch-on position B'.
  • a major advantage of the bistability of the second micro-element 2 is that no switching voltage is required to hold the second micro-element 2 in the switch-off position A 'or the switch-on position B'. After a suitable switching voltage has been applied and the switching operation caused thereby into the other state A ', B', the second micro-element 2 automatically remains in this state A ', B'.
  • each of the two contact pairs on which a signal to be switched is present (fixed electrodes 17, 18 or micro elements 19, 20) can be an NO connection or an NC connection.
  • the MEMS in FIG. 9 has two further bistably switchable micro ⁇ elements: the sixth micro element 23 and the seventh micro ⁇ element 24.
  • These are also constructed here with two parallel, cosine-shaped spring tongues connected in the middle and each have an (adapted) electrode 9. They are arranged in the area of the substrate S. net, which is on the side of the second micro-element 2 which faces away from the micro-elements 1, 1 '.
  • the micro elements 23, 24 interact in an analogous manner with the second micro element 2 like the micro elements 1, 1 '.
  • the second micro-element 2 has a sixth surface 26a and an eighth surface 26a ', which have a fifth surface 25a (the sixth micro-element 23) and a seventh surface 25a' (the seventh micro-element 24). interact.
  • the second micro-element 2 can the switch-on state B 'are switched to the switch-off state A'.
  • the contact area 16 of the second micro-element 2 is only electrically conductive on one side.
  • micro-elements 1, 1 ' can be provided with (adapted, optionally: stepped) electrodes 9 (see FIGS. 3 to 7).
  • micro elements 23, 24 can be used without adapted electrodes 9.
  • the contacting electrodes of the micro elements 19, 20 can be designed differently; or dispense with them entirely and then contact the contact part 16 of the second micro-element 2 by means of the preferably electrically conductive coated switching part. - It is possible to switch the micro relay by electrostatic repulsive forces; or to switch it by means of electrostatic repulsive forces and electrostatic attractive forces.
  • micro-elements 1, 1 ', 23, 24 can be omitted; in particular to the diagonally opposite micro-elements 1, 24 or the micro-elements 1 ', 23.
  • a switching process is generated by the interaction of at least two micro-elements 1, T, 23, 24 with the second micro-element 2, it is particularly advantageous if at least one of the corresponding switching voltages with a time delay relative to at least one of the other switching voltages is created.
  • the movement which the movable part 11 of the second micro-element 2 makes during the switching process can be supported.
  • the asymmetrical movement of the two parallel, cosine-shaped spring tongues of the second micro-element 2 can be carried out.
  • Correspondingly adapted switching voltage profiles over time can also be used.
  • the fixed contacts 1, 7, 8 or the fourth and / or fifth micro-element 19, 20 are advantageously arranged such that at least one of them is used for the asymmetrical design of the antinode.
  • 10a to 10c show a further advantageous embodiment of the invention in different positions.
  • This MEMS is a micro relay with an NC connection, which is generally difficult to implement.
  • the MEMS is starting from the Darge in Fig. 4 ⁇ presented embodiment described, since it is the same ingredients having.
  • 10 a shows the MEMS, in the state it has after structuring by means of DRIE: the first micro element 1 is in the initial position A.
  • FIG. 10 b shows the MEMS in a state in which the first micro Element 1 is in the working position B, and the second micro-element 2 is in the off state A '.
  • 10c shows the MEMS in a state in which the first micro-element 1 is in the working position B and the second micro-element 2 is in the switched-on state B '.
  • the first micro-element 1 after switching from the initial position A to the working position B does not simply come closer to the second micro-element 2 than the minimum distance given by DRIE and the second micro -Element 2 only touches (lightly). Rather, the arrangement of the micro-elements 1, 2 on the substrate s and the configuration of the micro-elements 1, 2 is selected such that the first micro-element 1 in the working position B exerts a force on the movable part 11 of the second MicroElementes 2, which leads to a (clear) elastic deformation of the movable part 1 1 of the second micro-element 2 (see Fig. 10b).
  • the movable part 11 of the second micro-element 2 is deformed in such a way that the electrically conductive contact area 16 of the second micro-element 2 conductively connects the fixed contacts 17, 18: the NC connection is closed.
  • a voltage-free closed but detachable contact is realized; in a MEMS structured using DRIE.
  • a switching operation of the second micro ⁇ element 2 is caused. Since no switching voltage is required for this, the second micro-element 2 is in the switch-off position A ⁇ after this switching operation.
  • a suitable switching voltage must be between the first micro-element 1 and the second micro-element 2 can be created.
  • the NC connection is opened by means of electrostatic attractive forces, and the second microelement 2 goes into the switch-on state B '(see FIG. 10c).
  • the electrode 9 can be omitted.
  • the electrode 9 can be designed differently.
  • a low mechanical load on the first micro-element 1 can be achieved, and at the same time large contact forces can be exerted on the fixed contacts 1, 7.18 (secure contacts).
  • Fig. 1 1 a and Fig. 1 1 b show a possible embodiment in which the moving parts of the MEMS are essentially horizontally movable.
  • Fig. 1 1 a is a sectional side view of the MEMS shown in supervision in Fig. 1 1 b.
  • Fig. 1 1 b with XIa-Xla the line of the section of Fig. 1 l a is shown.
  • the MEMS is a micro relay with an NC connection.
  • the first micro-element 1 is designed here as a bistable, elastically switchable micro-element in the form of an antinode, analogous to the first micro-element 1 shown in FIG. 2.
  • the symmetrical antinode is arched away from the substrate S.
  • the second end 7 of the first micro-element 1 is designed here as a bridge.
  • the second micro-element 2 arranged below the antinode can extend to outside the area between the first end 6 and the second end 7 of the first micro-element 1.
  • the first fixed end 10 of the second micro-element 2 serves here as a stop for the formation of the asymmetrical antinode of the first micro-element 1 in the working position B.
  • the movable part 11 of the second micro-element 2 initially runs (after the structuring) essentially parallel to the main surface of the Substrates S. After switching the first micro-element 1 from the initial position A to the working position B, the first micro-element 1 exerts a compressive force on the movable part 11 of the second micro-element 2.
  • the second micro-element 2 is elastically deformed. It reaches its switch-off position A ', in which a movable contact electrode E fixedly attached to the movable part 11 contacts a fixed electrode 17 fixed on the substrate S. This creates an NC connection between the movable contact electrode E and the fixed electrode 17. This generation of an NC connection is quite analogous to the method described in connection with FIGS. 10a to 10c.
  • the second micro-element 2 changes to the switch-on state B ', in which the movable part 11 of the second micro-element 2 is bent away from the substrate and the NC connection is open .
  • the contacting electrodes C, C are used to apply switching voltages.
  • Contacting electrodes D, D ' are used to apply a signal to be switched.
  • the contacting electrode D which is electrically connected to the movable contact electrode E, is arranged here on the first fixed end 10 of the second micro-element 2.
  • the contacting electrode D ′ which is electrically connected to the fixed contact 17, is arranged on the substrate S.
  • MEMS according to the invention such as the MEMS described above, can also be implemented as horizontally operating MEMS.
  • a MEMS according to the invention can not only be implemented as a switch or relay, as in the examples above.
  • a wide variety of micro-actuators can be implemented.
  • MEMS according to the invention can represent or actuate micro-valves or micro-pumps.
  • the substrate S used to produce a MEMS according to the invention is preferably flat. It typically has a main surface that is structured to produce the MEMS, the movement of the moving parts of the MEMS being movable essentially parallel or perpendicular to this main surface.
  • the substrate S from a semiconductor material, especially silicon is the preferred way of monocrystalline ⁇ and particularly advantageous (for a sufficient electrical conductivity) also doped.
  • single-crystal silicon in under mechanical stress bistable switchable micro is ⁇ elements 1, 1 ', 2 1 9, 20, 23, 24 advantageously no or only very slowly SUC ⁇ constricting relaxation expected.
  • an SOI wafer silicon-on-insulator
  • the structuring method mentioned is typically a material-removing method, preferably an etching method.
  • the LIGA technique or in particular the reactive ion etching and particularly advantageously the ion deep etching (DRIE) come into question here.
  • the DRIE method has the advantage of being very well suited for the production of surfaces which are closely spaced (relative to their height perpendicular to the substrate) and are practically perpendicular to the main surface of the substrate S.
  • DRIE is well suited for the production of laterally operating MEMS.
  • methods which apply material are also conceivable, for example if surfaces facing one another in this way have a minimum distance as a result of the method. For example, rapid prototyping processes using photopolymerization.
  • actuators that can be actuated electrostatically In addition to actuators that can be actuated electromagnetically or piezo-electrically can also be implemented according to the invention.
  • the actuating forces can be repulsive or attractive.
  • a bistable micro-element according to the invention can also be tri-stable or otherwise multi-stable. It is for some appli ⁇ also not necessary applications that the micro-elements 1, 1, 19,20,23,24 are also 'after the first switch from the initial position A to working position B again réelleschalbar in the initial position A.
  • the micro-elements 1, 1 ', 1 9, 20, 23, 24 but are preferably bistable ela ⁇ cally switchable and again constructiveschaltbar in the initial position A.
  • bistable micro-elements 1, 1 ', 2, 19, 20, 23, 24 as the described cosine-shaped or as the described oscillatory to form bulbous micro-elements, which can also be implemented in a modified form and combined within a MEMS.
  • the micro elements can optionally be coated in an electrically conductive or electrically non-conductive manner.
  • a non-conductive coating is preferably used to prevent discharges between electrostatic electrodes touching one another.
  • stoppers or springs can be used, as are known from DE 198 00 189 AI already cited.
  • the contacting electrodes CC'.D.D ' can be produced in a known manner (for example by sputtering) and can be contacted for example by bonding.
  • the first switching of the first micro-element 1 and also of the other bistable switchable micro-elements 1 ', 1 9, 20, 23, 24 from the initial position A to the working position B is still belongs to the manufacturing process of the MEMS.
  • This initial switching process can take place mechanically.
  • this switching operation is preferably carried out as part of a quality or functional test (burn-in) of the MEMS, it being possible for other units connected to the substrate to be tested or initialized in the process.
  • the initial switching process can then preferably take place by generating an attractive force between the bistable micro-element 1, 1 ', 19, 20, 23, 24 and the second micro-element 2, this force advantageously being achieved by applying a switching voltage.
  • Such a switching voltage is typically higher than a switching voltage that is used to switch the second micro-element 2 between the switch-off position A 'and the switch-on position B'.
  • the linear expansion of the MEMS described is typically between 0.2 mm and 5 mm, preferably 0.8 mm to 2 mm.
  • the minimum distance mentioned (minimum trench width) is approximately 5 ⁇ m to 15 ⁇ m; it shows little dependence on the depth of the structured trench.
  • the depth of the structured trench is typically 300 ⁇ m to 550 ⁇ m.
  • Layer thicknesses of the electrically non-conductive coatings 3b, 3b ', 4b, 4b' are typically 50 nm to 500 nm
  • the switching voltages for the MEMS described are typically 10 V to 80 V, preferably 25 V to 50 V.
  • switching voltages between 70 V and 300 V are typically used for this.

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Abstract

L'invention concerne un système micro-électromécanique comportant un substrat (S) et au moins deux micro-élémens (1, 2) dont un premier élément peut être commuté de façon bistable. Lesdits micro-éléments présentent des faces (3a, 4a) orientées l'une vers l'autre, produites au moyen d'un procédé de structuration, et au moins séparées par un écart minimal caractéristique du procédé de structuration. Ensuite, le premier micro-élément (1) est commuté dans l'autre état bistable (B) de manière que l'écart séparant les faces (3a, 4a) orientées l'une vers l'autre soit inférieur à l'écart minimal caractéristique du procédé de structuration. Ledit système micro-électromécanique peut être conçu sous forme de micro-commutateur à commande électrostatique présentant une commutabilité améliorée. Selon l'invention, il est possible de mettre en oeuvre des systèmes micro-électromécaniques fonctionnant de façon latérale et horizontale, présentant de nouvelles fonctions, ainsi que des relais fermés sans courant.
PCT/CH2002/000722 2002-01-18 2002-12-23 Systeme micro-electromecanique et procede de fabrication WO2003060940A1 (fr)

Priority Applications (5)

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AT02796487T ATE304736T1 (de) 2002-01-18 2002-12-23 Mikro-elektromechanisches system und verfahren zu dessen herstellung
DE50204300T DE50204300D1 (de) 2002-01-18 2002-12-23 Mikro-elektromechanisches system und verfahren zu dessen herstellung
EP02796487A EP1468436B1 (fr) 2002-01-18 2002-12-23 Systeme micro-electromecanique et procede de fabrication
US10/501,979 US7109560B2 (en) 2002-01-18 2002-12-23 Micro-electromechanical system and method for production thereof
AU2002361920A AU2002361920A1 (en) 2002-01-18 2002-12-23 Micro-electromechanical system and method for production thereof

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USPCT/US02/01662 2002-01-18
PCT/US2002/001662 WO2002058089A1 (fr) 2001-01-19 2002-01-18 Techniques, mecanismes et applications d'actionnement bistables
EP02405334.0 2002-04-24
EP02405334A EP1357571A1 (fr) 2002-04-24 2002-04-24 Système microélectromécanique et son procédé de fabrication

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WO2006036560A2 (fr) * 2004-09-27 2006-04-06 Idc, Llc Micro-commutateurs electromecaniques a membranes deformables
US7724417B2 (en) 2006-12-19 2010-05-25 Qualcomm Mems Technologies, Inc. MEMS switches with deforming membranes
US7745747B2 (en) 2006-04-26 2010-06-29 Seiko Epson Corporation Microswitch with a first actuated portion and a second contact portion
US7911677B2 (en) 2004-09-27 2011-03-22 Qualcomm Mems Technologies, Inc. MEMS switch with set and latch electrodes
US8022896B2 (en) 2007-08-08 2011-09-20 Qualcomm Mems Technologies, Inc. ESD protection for MEMS display panels
US8878771B2 (en) 2004-09-27 2014-11-04 Qualcomm Mems Technologies, Inc. Method and system for reducing power consumption in a display
US8928967B2 (en) 1998-04-08 2015-01-06 Qualcomm Mems Technologies, Inc. Method and device for modulating light
US8971675B2 (en) 2006-01-13 2015-03-03 Qualcomm Mems Technologies, Inc. Interconnect structure for MEMS device
US9110289B2 (en) 1998-04-08 2015-08-18 Qualcomm Mems Technologies, Inc. Device for modulating light with multiple electrodes

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US5677823A (en) * 1993-05-06 1997-10-14 Cavendish Kinetics Ltd. Bi-stable memory element
US6168395B1 (en) * 1996-02-10 2001-01-02 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Bistable microactuator with coupled membranes

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Publication number Priority date Publication date Assignee Title
US5677823A (en) * 1993-05-06 1997-10-14 Cavendish Kinetics Ltd. Bi-stable memory element
US6168395B1 (en) * 1996-02-10 2001-01-02 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Bistable microactuator with coupled membranes

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8928967B2 (en) 1998-04-08 2015-01-06 Qualcomm Mems Technologies, Inc. Method and device for modulating light
US9110289B2 (en) 1998-04-08 2015-08-18 Qualcomm Mems Technologies, Inc. Device for modulating light with multiple electrodes
WO2006036560A2 (fr) * 2004-09-27 2006-04-06 Idc, Llc Micro-commutateurs electromecaniques a membranes deformables
WO2006036560A3 (fr) * 2004-09-27 2006-05-04 Idc Llc Micro-commutateurs electromecaniques a membranes deformables
US7911677B2 (en) 2004-09-27 2011-03-22 Qualcomm Mems Technologies, Inc. MEMS switch with set and latch electrodes
US8878771B2 (en) 2004-09-27 2014-11-04 Qualcomm Mems Technologies, Inc. Method and system for reducing power consumption in a display
US8971675B2 (en) 2006-01-13 2015-03-03 Qualcomm Mems Technologies, Inc. Interconnect structure for MEMS device
US7745747B2 (en) 2006-04-26 2010-06-29 Seiko Epson Corporation Microswitch with a first actuated portion and a second contact portion
US7724417B2 (en) 2006-12-19 2010-05-25 Qualcomm Mems Technologies, Inc. MEMS switches with deforming membranes
US8022896B2 (en) 2007-08-08 2011-09-20 Qualcomm Mems Technologies, Inc. ESD protection for MEMS display panels

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AU2002361920A1 (en) 2003-07-30
EP1468436B1 (fr) 2005-09-14
EP1468436A1 (fr) 2004-10-20
ATE304736T1 (de) 2005-09-15
EP1357571A1 (fr) 2003-10-29

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