WO2006036560A2 - Micro-commutateurs electromecaniques a membranes deformables - Google Patents

Micro-commutateurs electromecaniques a membranes deformables Download PDF

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Publication number
WO2006036560A2
WO2006036560A2 PCT/US2005/032782 US2005032782W WO2006036560A2 WO 2006036560 A2 WO2006036560 A2 WO 2006036560A2 US 2005032782 W US2005032782 W US 2005032782W WO 2006036560 A2 WO2006036560 A2 WO 2006036560A2
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WO
WIPO (PCT)
Prior art keywords
switch
terminals
mems
electrode
terminal
Prior art date
Application number
PCT/US2005/032782
Other languages
English (en)
Other versions
WO2006036560A3 (fr
Inventor
Clarence Chui
Manish Kothari
Original Assignee
Idc, Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/144,546 external-priority patent/US8008736B2/en
Priority claimed from US11/150,407 external-priority patent/US7345805B2/en
Priority claimed from US11/198,925 external-priority patent/US7724993B2/en
Application filed by Idc, Llc filed Critical Idc, Llc
Priority to EP05798437A priority Critical patent/EP1809568A2/fr
Priority to MX2007003577A priority patent/MX2007003577A/es
Priority to JP2007533542A priority patent/JP2008515150A/ja
Publication of WO2006036560A2 publication Critical patent/WO2006036560A2/fr
Publication of WO2006036560A3 publication Critical patent/WO2006036560A3/fr

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Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/3433—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using light modulating elements actuated by an electric field and being other than liquid crystal devices and electrochromic devices
    • G09G3/3466—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using light modulating elements actuated by an electric field and being other than liquid crystal devices and electrochromic devices based on interferometric effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/001—Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H01H2001/0084—Switches making use of microelectromechanical systems [MEMS] with perpendicular movement of the movable contact relative to the substrate

Definitions

  • the field of the invention relates to microelectromechanical systems (MEMS).
  • MEMS microelectromechanical systems
  • Microelectromechanical systems include micro mechanical elements, actuators, and electronics. Micromechanical elements may be created using deposition, etching, and or other micromachining processes that etch away parts of substrates and/or deposited material layers or that add layers to form electrical and electromechanical devices.
  • One type of MEMS device is called an interferometric modulator.
  • interferometric modulator or interferometric light modulator refers to a device that selectively absorbs and/or reflects light using the principles of optical interference.
  • an interferometric modulator may comprise a pair of conductive plates, one or both of which may be transparent and/or reflective in whole or part and capable of relative motion upon application of an appropriate electrical signal.
  • one plate may comprise a stationary layer deposited on a substrate and the other plate may comprise a metallic membrane separated from the stationary layer by an air gap.
  • the position of one plate in relation to another can change the optical interference of light incident on the interferometric modulator.
  • Such devices have a wide range of applications, and it would be beneficial in the art to utilize and/or modify the characteristics of these types of devices so that their features can be exploited in improving existing products and creating new products that have not yet been developed.
  • the invention comprises a microelectromechanical systems (MEMS) switch including at least first and second terminals and a first electrode.
  • the switch further includes a moveable element having at least a portion thereof forming a second electrode and being moveable in response to applied electric potentials between the second electrode and the first electrode.
  • the first and second terminals are selectively connectable depending on the position of the moveable element, and a voltage below a threshold between the second and the first electrode causes the first and second terminals to be electrically connected.
  • Another embodiment includes a microelectromechanical systems (MEMS) switch device including at least first and second means for conducting current, movable means for selectively electrically connecting the first and second conducting means based on a position of the movable connecting means, and means for moving the movable means.
  • the movable connecting means is configured to move based on a voltage difference between the movable means and the moving means and to electrically connect the first and second conducting means when a voltage below a threshold is applied between the movable means and the moving means.
  • Another embodiment includes a method of operating a microelectromechanical systems (MEMS) switch device including first and second terminals and a movable element, the method including applying a first electrical potential difference above a first threshold to the device such that the movable element moves to a first position and an electrical connection between the first and second terminals is broken, and applying a second electrical potential difference below a second threshold to the device such that the movable element moves to a second position and an electrical connection between the first and second terminals is established.
  • MEMS microelectromechanical systems
  • Another embodiment includes a method of manufacturing a microelectromechanical systems (MEMS) switch, the method including forming at least first and second terminals, forming a first electrode, and forming a moveable element including at least a portion thereof forming a second electrode and being moveable in response to applied electric potentials between the second electrode and the first electrode, configuring the first and second terminals to be selectively electrically connectable depending on the position of the moveable element.
  • a voltage below a threshold between the second and the first electrode causes the first and second terminals to be electrically connected.
  • MEMS microelectromechanical systems
  • Another embodiment includes a microelectromechanical systems (MEMS) switch device including first means for conducting current, means for moving the first conducting means, means for deforming the moving means, the deforming means positioned on a first side of the moving means, second means for conducting current, the second conducting means positioned on a second side of the moving means.
  • MEMS microelectromechanical systems
  • Another embodiment includes a method of operating a microelectromechanical systems (MEMS) switch including first and second switch terminals and first and second electrodes, the method including maintaining electrical contact between the first and second switch terminals when the MEMS switch is in a mechanically relaxed state, and disconnecting the first and second switch terminals by creating an electric field greater than a threshold between the first and second electrodes.
  • MEMS microelectromechanical systems
  • Another embodiment includes a method of manufacturing a microelectromechanical systems (MEMS) switch device, the method including forming a deformable electrically conductive membrane having first and second major surfaces, forming an electrode opposite the first major surface of the membrane, forming a first switch terminal movable with the deformable membrane, and forming a second switch terminal opposite the second major surface of the membrane.
  • MEMS microelectromechanical systems
  • Another embodiment includes a method of opening a microelectromechanical systems (MEMS) switch including disconnecting a first switch terminal from an established electrical coupling to a second switch terminal with an electric field.
  • Another embodiment includes a microelectromechanical systems (MEMS) switch including a movable element including at least a first terminal and a first electrode on a first side of a gap, a second terminal, a second electrode on a second side of the gap configured to move the movable element based on a potential difference applied to the first and second electrodes to selectively connect the first and second terminals.
  • MEMS microelectromechanical systems
  • Another embodiment includes a microelectromechanical systems (MEMS) switch device including an element movable between first and second positions including first and second movable terminals. The first and second movable terminals cooperatively move with the movable element to connect the first and second movable terminals when the element is in the first position and to disconnect the first and second movable terminals when the element is in the second position.
  • Another embodiment includes a microelectromechanical systems (MEMS) switch device including means for moving first and second movable terminals between first and second positions.
  • the first and second movable terminals cooperatively move with the moving means to connect the first and second movable terminals when the moving means is in the first position and to disconnect the first and second movable terminals when the element is in the second position.
  • MEMS microelectromechanical systems
  • Another embodiment includes a method of operating a microelectromechanical systems (MEMS) switch including first and second movable terminals, the method including applying a first electrical potential to the switch such that the first and second movable terminals move to a first position. An electrical connection between the first and second movable terminals is established. The method also includes applying a second electrical potential to the switch such that the first and second movable terminals move to a second position, wherein an electrical connection between the first and second movable terminals is broken.
  • MEMS microelectromechanical systems
  • Another embodiment includes a method of manufacturing a microelectromechanical systems (MEMS) switch device, the method including forming an element movable between first and second positions, and forming first and second movable terminals on the movable element.
  • MEMS microelectromechanical systems
  • Another embodiment includes a microelectromechanical systems (MEMS) switch including first and second switch terminals, means for maintaining electrical contact between the first and second switch terminals when the MEMS switch is in a mechanically relaxed state, and means for disconnecting the first and second switch terminals by applying a voltage difference to the MEMS switch greater than a threshold.
  • MEMS microelectromechanical systems
  • Another embodiment includes a method of manufacturing a microelectromechanical systems (MEMS) switch including forming an electrode and an insulator on a substrate, forming a first sacrificial layer over the insulator, forming a flexible layer with in-plane tension, forming a first terminal over the flexible layer, forming a second sacrificial layer, forming a second terminal over the second sacrificial layer, forming an upper layer supporting the second terminal, and removing the first and second sacrificial layers.
  • MEMS microelectromechanical systems
  • Another embodiment includes a method of manufacturing a microelectromechanical systems (MEMS) switch.
  • the method includes forming an electrode, and an insulator on a substrate, forming a plate in a sacrificial layer over the insulator, forming a layer connected to the plate.
  • the layer or the plate, or both include one or more terminals.
  • the method also includes removing the sacrificial layer.
  • MEMS microelectromechanical systems
  • a microelectromechanical systems (MEMS) switch device including a moveable element on a first side of a gap, the moveable element including one or more contact conductors and a first electrode, first and second fixed terminals on the first side of the gap, and a second electrode on a second side of the gap.
  • the moveable element is configured to selectively connect the first and second terminals through the one or more contact conductors and to move based on a potential difference applied to the first and second electrodes.
  • the first and second terminals are connected when a potential difference less than a threshold is applied between the electrodes.
  • Another embodiment includes a microelectromechanical systems (MEMS) switch device including first and second fixed means for electrically conducting located on the first side of a gap, means for establishing an electrical connection between the first and second fixed means, and first means for deforming the establishing means.
  • the first and second fixed conducting means are connected when a potential difference less than a threshold is applied to the deforming means.
  • MEMS microelectromechanical systems
  • MEMS microelectromechanical systems
  • Another embodiment includes a microelectromechanical systems (MEMS) switch device including means for supporting, first means for actuating positioned on the supporting means, means for conducting current positioned over the supporting means, means for electrically connecting at least two current conducting means, second means for actuating, and flexible means for suspending the connecting means and the second actuating means over the first actuating means.
  • MEMS microelectromechanical systems
  • Another embodiment includes a method of manufacturing a microelectromechanical systems (MEMS) switch device. The method includes forming a substrate, depositing a first electrode on the substrate, forming a plurality of terminals over the substrate, and suspending a flexible plate including a contact conductor and a second electrode over the first electrode.
  • FIG. 1 is an isometric view depicting a portion of one embodiment of an interferometric modulator display in which a movable reflective layer of a first interferometric modulator is in a relaxed position and a movable reflective layer of a second interferometric modulator is in an actuated position.
  • FIG. 2 is a system block diagram illustrating one embodiment of an electronic device incorporating a 3x3 interferometric modulator display.
  • FIG. 3 is a diagram of movable mirror position versus applied voltage for one exemplary embodiment of an interferometric modulator of FIG. 1.
  • FIG. 4 is an illustration of a set of row and column voltages that may be used to drive an interferometric modulator display.
  • FIGS. 5A and 5B illustrate one exemplary timing diagram for row and column signals that may be used to write a frame of display data to the 3x3 interferometric modulator display of FIG. 2.
  • FIGS. 6A and 6B are system block diagrams illustrating an embodiment of a visual display device comprising a plurality of interferometric modulators.
  • FIG. 7A is a cross section of the device of FIG. 1.
  • FIG. 7B is a cross section of an alternative embodiment of an interferometric modulator.
  • FIG. 7C is a cross section of another alternative embodiment of an interferometric modulator.
  • FIG 7D is a cross section of yet another alternative embodiment of an interferometric modulator.
  • FIG. 7E is a cross section of an additional alternative embodiment of an interferometric modulator.
  • Figure 8 A and 8B show an embodiment of a flexing membrane type MEMS switch
  • Figure 9 shows another embodiment of a flexing membrane type MEMS switch.
  • Figures 1OA and 1OB are side cross-sectional views of a MEMS switch that opens contacts upon application of a potential difference.
  • Figures HA and HB are side cross-sectional views of another embodiment of a MEMS switch that opens contacts upon application of a potential difference.
  • Figure 12 is a side cross-sectional view of another embodiment of a MEMS switch that opens contacts upon application of a potential difference.
  • Figure 13 is a side cross-sectional view illustrating a MEMS device operable as a tri-state switch.
  • Figures 14A and 14B illustrate another embodiment of a flexing membrane type MEMS switch.
  • Figures 15A and 15B illustrate another embodiment of a flexing membrane type
  • MEMS switch that opens contacts upon application of a potential difference.
  • the embodiments may be implemented in or associated with a variety of electronic devices such as, but not limited to, mobile telephones, wireless devices, personal data assistants (PDAs), hand-held or portable computers, GPS receivers/navigators, cameras, MP3 players, camcorders, game consoles, wrist watches, clocks, calculators, television monitors, flat panel displays, computer monitors, auto displays (e.g., odometer display, etc.), cockpit controls and/or displays, display of camera views (e.g., display of a rear view camera in a vehicle), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., display of images on a piece of jewelry).
  • MEMS devices of similar structure to those described herein can also be used in non-display applications such as in electronic switching devices.
  • switches can be advantageously utilized in many applications due to overlap between switch fabrication steps and display fabrication steps.
  • MEMS switches built from the same basic structure as interferometric modulators ease the integration of logic and switching functions with interferometric modulator arrays. It is possible that other types of switches may be integrated, such as switches fabricated in a manner not similar to the fabrication of the interferometric elements, and more conventional electronic switches fabricated using thin silicon films deposited on the glass substrate.
  • interferometric modulator based MEMS switches may be performed using many of the same processing steps that are used in fabricating interferometric modulators, these MEMS switches may be inexpensively integrated onto the same substrate as an array of interferometric modulators used, for example, for a display.
  • the MEMS switches and interferometric modulators may be fabricated using the same process, although extra steps may be performed on the interferometric modulators and/or the MEMS switches during the manufacturing process. For example, deposition and etching steps to add terminals to the MEMS switches are unnecessary for the fabrication of interferometric modulators. In such an embodiment some common steps would be performed, such as those for forming the electrodes, etc. The MEMS switch terminals would then be formed. After these steps would follow more steps necessary for both the interferometric modulators and the MEMS switches, thus providing a combined interferometric modulator and MEMS switch array, hi yet another embodiment, the same process that is used for manufacturing interferometric modulators is used in manufacturing MEMS switches.
  • the interferometric modulators may first be fabricated on a substrate, followed by fabrication of MEMS switches on the substrate.
  • MEMS switches may first be fabricated on a substrate, followed by fabrication of interferometric modulators on the substrate. In either case, the manufacturing process does not require significant modification as the MEMS switches comprise many of the same structures as the interferometric modulators.
  • interferometric modulator display embodiment comprising an interferometric MEMS display element is illustrated in Figure 1.
  • the pixels are in either a bright or dark state.
  • the display element In the bright ("on" or “open") state, the display element reflects a large portion of incident visible light to a user.
  • the dark (“off or "closed”) state When in the dark (“off or "closed") state, the display element reflects little incident visible light to the user.
  • the light reflectance properties of the "on” and "off states may be reversed.
  • MEMS pixels can be configured to reflect predominantly at selected colors, allowing for a color display in addition to black and white.
  • Figure 1 is an isometric view depicting two adjacent pixels in a series of pixels of a visual display, wherein each pixel comprises a MEMS interferometric modulator, hi some embodiments, an interferometric modulator display comprises a row/column array of these interferometric modulators.
  • Each interferometric modulator includes a pair of reflective layers positioned at a variable and controllable distance from each other to form a resonant optical cavity with at least one variable dimension.
  • one of the reflective layers may be moved between two positions. In the first position, referred to herein as the relaxed position, the movable reflective layer is positioned at a relatively large distance from a fixed partially reflective layer.
  • the movable reflective layer In the second position, referred to herein as the actuated position, the movable reflective layer is positioned more closely adjacent to the partially reflective layer. Incident light that reflects from the two layers interferes constructively or destructively depending on the position of the movable reflective layer, producing either an overall reflective or non-reflective state for each pixel.
  • the depicted portion of the pixel array in Figure 1 includes two adjacent interferometric modulators 12a and 12b.
  • a movable reflective layer 14a is illustrated in a relaxed position at a predetermined distance from an optical stack 16a, which includes a partially reflective layer.
  • the movable reflective layer 14b is illustrated in an actuated position adjacent to the optical stack 16b.
  • the optical stacks 16a and 16b typically comprise of several fused layers, which can include an electrode layer, such as indium tin oxide (ITO), a partially reflective layer, such as chromium, and a transparent dielectric.
  • the optical stack 16 is thus electrically conductive, partially transparent and partially reflective, and may be fabricated, for example, by depositing one or more of the above layers onto a transparent substrate 20.
  • the layers are patterned into parallel strips, and may form row electrodes in a display device as described further below.
  • the movable reflective layers 14a, 14b may be formed as a series of parallel strips of a deposited metal layer or layers (orthogonal to the row electrodes of 16a, 16b) deposited on top of posts 18 and an intervening sacrificial material deposited between the posts 18. When the sacrificial material is etched away, the movable reflective layers 14a, 14b are separated from the optical stacks 16a, 16b by a defined gap 19.
  • a highly conductive and reflective material such as aluminum may be used for the reflective layers 14, and these strips may form column electrodes in a display device.
  • the cavity 19 remains between the movable reflective layer 14a and optical stack 16a, with the movable reflective layer 14a in a mechanically relaxed state, as illustrated by the pixel 12a in Figure 1.
  • a potential difference is applied to a selected row and column, the capacitor formed at the intersection of the row and column electrodes at the corresponding pixel becomes charged, and electrostatic forces pull the electrodes together.
  • the movable reflective layer 14 is deformed and is forced against the optical stack 16.
  • a dielectric layer (not illustrated in this Figure) within the optical stack 16 may prevent shorting and control the separation distance between layers 14 and 16, as illustrated by pixel 12b on the right in Figure 1. The behavior is the same regardless of the polarity of the applied potential difference. In this way, row/column actuation that can control the reflective vs. non-reflective pixel states is analogous in many ways to that used in conventional LCD and other display technologies.
  • Figures 2 through 5 illustrate one exemplary process and system for using an array of interferometric modulators in a display application.
  • FIG. 2 is a system block diagram illustrating one embodiment of an electronic device that may incorporate aspects of the invention
  • the electronic device includes a processor 21 which may be any general purpose single- or multi-chip microprocessor such as an ARM, Pentium ® , Pentium II ® , Pentium III ® , Pentium IV ® , Pentium ® Pro, an 8051, a MIPS ® , a Power PC ® , an ALPHA ® , or any special purpose microprocessor such as a digital signal processor, microcontroller, or a programmable gate array.
  • the processor 21 may be configured to execute one or more software modules.
  • the processor may be configured to execute one or more software applications, including a web browser, a telephone application, an email program, or any other software application.
  • the processor 2 T is also configured to communicate with an array driver 22.
  • the array driver 22 includes a row driver circuit 24 and a column driver circuit 26 that provide signals to a panel or display array (display) 30.
  • the cross section of the array illustrated in Figure 1 is shown by the lines 1-1 in Figure 2.
  • the row/column actuation protocol may take advantage of a hysteresis property of these devices illustrated in Figure 3. It may require, for example, a 10 volt potential difference to cause a movable layer to deform from the relaxed state to the actuated state. However, when the voltage is reduced from that value, the movable layer maintains its state as the voltage drops back below 10 volts.
  • the movable layer does not relax completely until the voltage drops below 2 volts.
  • the row/column actuation protocol can be designed such that during row strobing, pixels in the strobed row that are to be actuated are exposed to a voltage difference of about 10 volts, and pixels that are to be relaxed are exposed to a voltage difference of close to zero volts.
  • each pixel sees a potential difference within the "stability window" of 3-7 volts in this example.
  • This feature makes the pixel design illustrated in Figure 1 stable under the same applied voltage conditions in either an actuated or relaxed pre-existing state. Since each pixel of the interferometric modulator, whether in the actuated or relaxed state, is essentially a capacitor formed by the fixed and moving reflective layers, this stable state can be held at a voltage within the hysteresis window with almost no power dissipation. Essentially no current flows into the pixel if the applied potential is fixed.
  • a display frame may be created by asserting the set of column electrodes in accordance with the desired set of actuated pixels in the first row.
  • a row pulse is then applied to the row 1 electrode, actuating the pixels corresponding to the asserted column lines.
  • the asserted set of column electrodes is then changed to correspond to the desired set of actuated pixels in the second row.
  • a pulse is then applied to the row 2 electrode, actuating the appropriate pixels in row 2 in accordance with the asserted column electrodes.
  • the row 1 pixels are unaffected by the row 2 pulse, and remain in the state they were set to during the row 1 pulse. This may be repeated for the entire series of rows in a sequential fashion to produce the frame.
  • the frames are refreshed and/or updated with new display data by continually repeating this process at some desired number of frames per second.
  • a wide variety of protocols for driving row and column electrodes of pixel arrays to produce display frames are also well known and may be used in conjunction with the present invention.
  • Figures 4 and 5 illustrate one possible actuation protocol for creating a display frame on the 3x3 array of Figure 2.
  • Figure 4 illustrates a possible set of column and row voltage levels that may be used for pixels exhibiting the hysteresis curves of Figure 3.
  • actuating a pixel involves setting the appropriate column to - V b i as , and the appropriate row to + ⁇ V, which may correspond to -5 volts and +5 volts respectively Relaxing the pixel is accomplished by setting the appropriate column to +V b , as , and the appropriate row to the same + ⁇ V, producing a zero volt potential difference across the pixel.
  • the pixels are stable in whatever state they were originally in, regardless of whether the column is at +Vb,as, or -V b i as -
  • voltages of opposite polarity than those described above can be used, e.g., actuating a pixel can involve setting the appropriate column to +V b , aS , and the appropriate row to - ⁇ V.
  • releasing the pixel is accomplished by setting the appropriate column to - V b i as , and the appropriate row to the same - ⁇ V, producing a zero volt potential difference across the pixel.
  • Figure 5B is a timing diagram showing a series of row and column signals applied to the 3x3 array of Figure 2 which will result in the display arrangement illustrated in Figure 5A, where actuated pixels are non-reflective.
  • the pixels Prior to writing the frame illustrated in Figure 5A, the pixels can be in any state, and in this example, all the rows are at 0 volts, and all the columns are at +5 volts. With these applied voltages, all pixels are stable in their existing actuated or relaxed states.
  • pixels (1,1), (1,2), (2,2), (3,2) and (3,3) are actuated.
  • columns 1 and 2 are set to -5 volts, and column 3 is set to +5 volts. This does not change the state of any pixels, because all the pixels remain in the 3-7 volt stability window.
  • Row 1 is then strobed with a pulse that goes from 0, up to 5 volts, and back to zero. This actuates the (1,1) and (1,2) pixels and relaxes the (1,3) pixel. No other pixels in the array are affected.
  • column 2 is set to -5 volts, and columns 1 and 3 are set to +5 volts.
  • Row 3 is similarly set by setting columns 2 and 3 to -5 volts, and column 1 to +5 volts.
  • the row 3 strobe sets the row 3 pixels as shown in Figure 5A. After writing the frame, the row potentials are zero, and the column potentials can remain at either +5 or -5 volts, and the display is then stable in the arrangement of Figure 5 A. It will be appreciated that the same procedure can be employed for arrays of dozens or hundreds of rows and columns.
  • FIGS. 6 A and 6B are system block diagrams illustrating an embodiment of a display device 40.
  • the display device 40 can be, for example, a cellular or mobile telephone. However, the same components of display device 40 or slight variations thereof are also illustrative of various types of display devices such as televisions and portable media players.
  • the display device 40 includes a housing 41, a display 30, an antenna 43, a speaker
  • the housing 41 is generally formed from any of a variety of manufacturing processes as are well known to those of skill in the art, including injection molding, and vacuum forming.
  • the housing 41 may be made from any of a variety of materials, including but not limited to plastic, metal, glass, rubber, and ceramic, or a combination thereof.
  • the housing 41 includes removable portions (not shown) that may be interchanged with other removable portions of different color, or containing different logos, pictures, or symbols.
  • the display 30 of exemplary display device 40 may be any of a variety of displays, including a bi-stable display, as described herein.
  • the display 30 includes a flat-panel display, such as plasma, EL, OLED, STN LCD, or TFT LCD as described above, or a non-flat-panel display, such as a CRT or other tube device, as is well known to those of skill in the art.
  • the display 30 includes an interferometric modulator display, as described herein.
  • the components of one embodiment of exemplary display device 40 are schematically illustrated in Figure 6B.
  • the illustrated exemplary display device 40 includes a housing 41 and can include additional components at least partially enclosed therein.
  • the exemplary display device 40 includes a network interface 27 that includes an antenna 43 which is coupled to a transceiver 47.
  • the transceiver 47 is connected to the processor 21, which is connected to conditioning hardware 52.
  • the conditioning hardware 52 may be configured to condition a signal (e.g. filter a signal).
  • the conditioning hardware 52 is connected to a speaker 45 and a microphone 46.
  • the processor 21 is also connected to an input device 48 and a driver controller 29.
  • the driver controller 29 is coupled to a frame buffer 28 and to the array driver 22, which in turn is coupled to a display array 30.
  • a power supply 50 provides power to all components as required by the particular exemplary display device 40 design.
  • the network interface 27 includes the antenna 43 and the transceiver 47 so that the exemplary display device 40 can communicate with one ore more devices over a network. In one embodiment the network interface 27 may also have some processing capabilities to relieve requirements of the processor 21.
  • the antenna 43 is any antenna known to those of skill in the art for transmitting and receiving signals. In one embodiment, the antenna transmits and receives RF signals according to the IEEE 802.11 standard, including IEEE 802.11 (a), (b), or (g). hi another embodiment, the antenna transmits and receives RF signals according to the BLUETOOTH standard. In the case of a cellular telephone, the antenna is designed to receive CDMA, GSM, AMPS or other known signals that are used to communicate within a wireless cell phone network.
  • the transceiver 47 pre-processes the signals received from the antenna 43 so that they may be received by and further manipulated by the processor 21.
  • the transceiver 47 also processes signals received from the processor 21 so that they may be transmitted from the exemplary display device 40 via the antenna 43.
  • the transceiver 47 can be replaced by a receiver.
  • network interface 27 can be replaced by an image source, which can store or generate image data to be sent to the processor 21.
  • the image source can be a digital video disc (DVD) or a hard-disc drive that contains image data, or a software module that generates image data.
  • Processor 21 generally controls the overall operation of the exemplary display device 40.
  • the processor 21 receives data, such as compressed image data from the network interface 27 or an image source, and processes the data into raw image data or into a format that is readily processed into raw image data.
  • the processor 21 then sends the processed data to the driver controller 29 or to frame buffer 28 for storage.
  • Raw data typically refers to the information that identifies the image characteristics at each location within an image. For example, such image characteristics can include color, saturation, and gray-scale level.
  • the processor 21 includes a microcontroller, CPU, or logic unit to control operation of the exemplary display device 40.
  • Conditioning hardware 52 generally includes amplifiers and filters for transmitting signals to the speaker 45, and for receiving signals from the microphone 46. Conditioning hardware 52 may be discrete components within the exemplary display device 40, or may be incorporated within the processor 21 or other components.
  • the driver controller 29 takes the raw image data generated by the processor 21 either directly from the processor 21 or from the frame buffer 28 and reformats the raw image data appropriately for high speed transmission to the array driver 22. Specifically, the driver controller 29 reformats the raw image data into a data flow having a raster-like format, such that it has a time order suitable for scanning across the display array 30. Then the driver controller 29 sends the formatted information to the array driver 22.
  • a driver controller 29, such as a LCD controller is often associated with the system processor 21 as a stand-alone Integrated Circuit (IC), such controllers may be implemented in many ways. They may be embedded in the processor 21 as hardware, embedded in the processor 21 as software, or fully integrated in hardware with the array driver 22.
  • IC Integrated Circuit
  • the array driver 22 receives the formatted information from the driver controller 29 and reformats the video data into a parallel set of waveforms that are applied many times per second to the hundreds and sometimes thousands of leads coming from the display's x-y matrix of pixels.
  • driver controller 29 is a conventional display controller or a bi-stable display controller (e.g., an interferometric modulator controller).
  • array driver 22 is a conventional driver or a bi-stable display driver (e.g., an interferometric modulator display).
  • a driver controller 29 is integrated with the array driver 22.
  • display array 30 is a typical display array or a bi-stable display array (e.g., a display including an array of interferometric modulators).
  • the input device 48 allows a user to control the operation of the exemplary display device 40.
  • input device 48 includes a keypad, such as a QWERTY keyboard or a telephone keypad, a button, a switch, a touch-sensitive screen, a pressure- or heat-sensitive membrane.
  • the microphone 46 is an input device for the exemplary display device 40. When the microphone 46 is used to input data to the device, voice commands may be provided by a user for controlling operations of the exemplary display device 40.
  • Power supply 50 can include a variety of energy storage devices as are well known in the art.
  • power supply 50 is a rechargeable battery, such as a nickel-cadmium battery or a lithium ion battery.
  • power supply 50 is a renewable energy source, a capacitor, or a solar cell, including a plastic solar cell, and solar-cell paint.
  • power supply 50 is configured to receive power from a wall outlet.
  • control programmability resides, as described above, in a driver controller which can be located in several places in the electronic display system. In some cases control programmability resides in the array driver 22. Those of skill in the art will recognize that the above-described optimization may be implemented in any number of hardware and/or software components and in various configurations.
  • Figures 7A-7E illustrate five different embodiments of the movable reflective layer 14 and its supporting structures.
  • Figure 7A is a cross section of the embodiment of Figure 1, where a strip of metal material 14 is deposited on orthogonally extending supports 18.
  • the moveable reflective layer 14 is attached to supports at the corners only, on tethers 32.
  • the moveable reflective layer 14 is suspended from a deformable layer 34, which may comprise a flexible metal.
  • the deformable layer 34 connects, directly or indirectly, to the substrate 20 around the perimeter of the deformable layer 34. These connections are herein referred to as support posts.
  • the embodiment illustrated in Figure 7D has support post plugs 42 upon which the deformable layer 34 rests.
  • the movable reflective layer 14 remains suspended over the cavity, as in Figures 7A-7C, but the deformable layer 34 does not form the support posts by filling holes between the deformable layer 34 and the optical stack 16. Rather, the support posts are formed of a planarization material, which is used to form support post plugs 42.
  • the embodiment illustrated in Figure 7E is based on the embodiment shown in Figure 7D, but may also be adapted to work with any of the embodiments illustrated in Figures 7A-7C as well as additional embodiments not shown. In the embodiment shown in Figure 7E, an extra layer of metal or other conductive material has been used to form a bus structure 44. This allows signal routing along the back of the interferometric modulators, eliminating a number of electrodes that may otherwise have had to be formed on the substrate 20.
  • the interferometric modulators function as direct-view devices, in which images are viewed from the front side of the transparent substrate 20, the side opposite to that upon which the modulator is arranged.
  • the reflective layer 14 optically shields some portions of the interferometric modulator on the side of the reflective layer opposite the substrate 20, including the deformable layer 34 and the bus structure 44. This allows the shielded areas to be configured and operated upon without negatively affecting the image quality.
  • This separable modulator architecture allows the structural design and materials used for the electromechanical aspects and the optical aspects of the modulator to be selected and to function independently of each other.
  • Figures 7C-7E have additional benefits deriving from the decoupling of the optical properties of the reflective layer 14 from its mechanical properties, which are carried out by the deformable layer 34. This allows the structural design and materials used for the reflective layer 14 to be optimized with respect to the optical properties, and the structural design and materials used for the deformable layer 34 to be optimized with respect to desired mechanical properties.
  • FIG. 8A is a cross-sectional side view of a MEMS switch 700.
  • the MEMS switch 700 of Figure 8A has similar collapsible cavity features as the interferometric modulator of Figure 7A.
  • the MEMS switch 700 additionally includes two terminals 706, an insulating layer 710, and a conductive strip 708.
  • terminal of a switch is used to indicate a conductive element that provides a signal input or output to or from the switch. The switch itself provides selective electrical connections between its terminals.
  • a switch may include a conductive element that is not itself a signal input or output point, but that selectively bridges different terminals to provide the switch function. These conductive elements are referred to as contact conductors herein.
  • the MEMS switch 700 is a structure that provides selective electrical contact between the two terminals 706. More particularly, the MEMS switch 700 is closed when the terminals 706 are in electrical contact and the MEMS switch is open when the terminals 706 are not in electrical contact. In a mechanically relaxed state, terminals 706 are not in electrical contact and, thus, the MEMS switch 700 is open.
  • the MEMS switch 700 comprises a moveable material 714, a conductive strip 708, and an insulating layer 710 between the moveable material 714 and the conductive strip 708.
  • a substrate 720 supports an electrode 702, and an insulating layer 704 on the electrode 702.
  • Two terminals 706, separated by a distance, are deposited on and/or through the insulating layer 704.
  • the terminals 706 may connect to other circuitry using vias through insulating layer 704 and/or electrode 702. Insulating layer 704 and moveable material 714 are mechanically separated by supports 718 in order to define a cavity 707.
  • the moveable material 714 is deformable, such that the moveable material 714 may be deformed towards the substrate 720 when a voltage difference is applied across the moveable material 714 and the electrode 702.
  • This is analogous to the reflective material 14, substrate 20, and electrode 16 of Figure 7 A, and to the reflective layers 14a and 14b, the transparent substrate 20, and the reflective layers 16a and 16b of Figure 1.
  • the moveable material 714 may have on it an insulator 710, which has upon it the conductive strip 708.
  • the conductive strip 708 is aligned so that when the moveable material 714 is deflected towards the substrate 720 by an applied potential as described above, the conductive strip 708 contacts both of the terminals 706, causing the terminals 706 to be in electrical contact and the MEMS switch 700 to be closed.
  • the conductive strip thus acts as a contact conductor through which the terminals are electrically connected.
  • the conductive strip 708 is electrically isolated from the moveable material 714 by insulator 710 so that contact between the terminals 706 and the movable material 714 does not disturb the voltage difference applied across the moveable material 714 and the electrode 702.
  • the conductive strip 708 and the insulator 710 will not be needed, and the moveable material itself 714 can function as the contact conductor that bridges the two terminals 706.
  • the moveable material 714 returns to its mechanically relaxed state and the MEMS switch 700 is opened.
  • Figure 8B is a top view of MEMS switch 700. The supports 718, the conductive strip 708, and the terminals 706 are shown as seen looking through the moveable material 714. Conductive strip 708 may be significantly smaller than the moveable material 714.
  • a second insulator similar to insulator 710, may be formed over the moveable material 714 and a second conductive strip, similar to conductive strip 708 formed over the second insulator.
  • a second cavity, similar to cavity 707 would exist between the second conductive strip and a second insulating layer, similar to insulating layer 704.
  • the second insulating layer would be supported by structures similar to supports 718 and would also have a second electrode, similar to electrode 702 and a second set of terminals similar to terminals 706.
  • the structure over the moveable material 714 could have operation similar to that of the structure below the moveable layer discussed above.
  • the moveable material 714 is configured to be moveable in the direction towards the second electrode when a sufficient potential difference is applied across the moveable material 714 and the second electrode. When this occurs the second conductive strip can make contact with the second set of terminals. With appropriate voltages on the moveable material 714, the electrode 702 and the second electrode this switch can be operated to electrically connect the terminals 706, the second set of terminals, or neither so as to form a tri-state switch.
  • the structures over the moveable material may be similar in structure and in functionality. In other embodiments the structures over the moveable material may be similar only in functionality.
  • FIG 9 is a cross-sectional side view of a MEMS switch 800 of another embodiment.
  • MEMS switch 800 has similar constructional features as the interferometric modulator of Figure 7C. It also has MEMS switch functionality and features similar to those of MEMS switch 700 in Figure 8A. Such features are labeled with like reference numerals as those used with reference to Figure 8A.
  • a MEMS switch may have features as illustrated in Figures 1OA and 1OB, which show a cross-sectional side, three-dimensional view of a MEMS switch 900.
  • the MEMS switch 900 of Figures 1OA and 1OB have similar collapsible cavity features as the interferometric modulator of Figure 7A.
  • MEMS switch 900 has a structure that provides selective electrical contact between the two terminals 906A and 906B. More particularly, the MEMS switch 900 is closed when the terminals 906 A and 906B are in electrical contact (Figure 10A) and the MEMS switch is open when the terminals 906A and 906B are not in electrical contact (Figure 10B).
  • the MEMS switch 900 comprises a deformable layer 934, two terminals 906A and 906B, an insulating layer 910 between the deformable layer 934 and the terminal 906B, a substrate 920 supporting an electrode 902, and an insulating layer 904 on the electrode 902. Insulating layer 904 and deformable layer 934 are separated by supports 918 in order to define a cavity 907. The height of supports 918 is variable and in some embodiments the supports 918 are not needed. In a mechanically relaxed state ( Figure 10A), terminals 906 A and 906B are in electrical contact and, thus, the MEMS switch 900 is closed.
  • the deformable layer 934 when the voltage applied across the deformable layer 934 and the electrode 902 is reduced below a certain level, the deformable layer 934 returns to its mechanically relaxed state, the terminal 906B contacts the terminal 906A and the MEMS switch 900 is again closed.
  • leads and traces for the conductive elements shown in Figures 1OA and 1OB may be over the top layer 936. In some embodiments routing may also be below the electrode 902. In other embodiments there may be routing within or near the supports 918. In some embodiments routing may be within the structure shown, e.g. in the gap between the layer 934 and the substrate 920. Conductive traces into and out of the switch may be within, above or below the insulating layer 904, the deformable layer 934, and/or the top layer 936.
  • a 1- or 2-dimensional array of switches is formed.
  • the array may be configured such that terminals 906A and/or 906B are connected and shared amongst a plurality of adjacent or non-adjacent switches.
  • Terminals 906A and/or 906B may be configured to be bus lines running into and out of the plane of Figures 1OA and 1OB.
  • the deformable layer 934, and/or the top layer 936 may be shared amongst a plurality of adjacent or non-adjacent switches.
  • the deformable layer 934, and/or the top layer 936 may be configured to be bus lines running left and right within the plane of Figures 1OA and 1OB.
  • a significant difference between the embodiment of Figures 1OA and 1OB and many other MEMS switches is that when a voltage is applied across the deformable layer 934 and the electrode 902 the MEMS switch goes to an open state. We call this an assert open type of switch. Other types of MEMS switches go to a closed state when a voltage is applied across the moveable material. We call this an assert closed type of switch.
  • a benefit of an assert open switch over an assert closed switch has to do with the tendency of MEMS switches to stick in a closed position. When closed for extended periods of time, especially with current flowing through them, a mechanical bond tends to develop between the metal of the terminals and the metal contacting the terminals. If the mechanical bond becomes stronger than the force working to open the MEMS switch, it will be stuck in the closed position.
  • an assert open switch the electromotive force works to open the switch by pulling the deformable layer 934 toward the electrode 902. With realistic voltages the electromotive force working against a mechanical bond is easily made great enough to break such contact bonds.
  • the electromotive force working to open an assert open switch is typically stronger than the mechanical force working to open an assert closed switch. Thus, the assert open switch is less susceptible to sticking than the assert closed switch.
  • the deformable layer 934 buckles upward when in a mechanically relaxed state. This can be accomplished by depositing the deformable layer 934 such that it is under in-plane tension.
  • the deformable layer 934 may be patterned into a rectangular geometry such that it is fixed to supports 918 at a first pair of opposite edges, and free at the other pair of opposite edges.
  • the in-plane tension is therefore higher across the support 918 edges than across the free edges, causing an out-of-plane hump.
  • the direction of the hump is determined by a gradient in the tension through the thickness of the deformable layer 934.
  • the tension gradient may be realized in a single layer or as composite layers. Placing perforations or cuts in the terminal 906A side of the deformable layer 934 will amplify the buckling response.
  • Geometries other than rectangular, such as hexagonal or triangular, and other support placement configurations may also be used to manipulate the resulting membrane contours.
  • the insulator 904 may be formed on the substrate 920 around the electrode 902.
  • the supports 918 may then be formed on the substrate 920.
  • a first sacrificial layer may then be formed over the insulator and between the supports 918.
  • the deformable layer 934 with in- plane tension may then be formed on supports 918 and the first sacrificial layer.
  • the dielectric 910 the terminal 906B, and a second sacrificial layer may then be formed over the deformable layer 934.
  • terminal 906A and top layer 936 may be formed.
  • the sacrificial layers may be removed. Other methods and steps may be used, as well.
  • Another embodiment of an assert open MEMS switch is shown in Figures 1 IA and
  • Protrusions 1001 and 1003 are on the upper side of conductive layer 411. The shape, location and/or number of the protrusions may vary in different embodiments.
  • the upper layer 407 is electrically connected to the conductive plate 411 by the protrusions 1001 and 1003.
  • the flexible layer 407 and the plate 411 each form terminals of the switch, and the plate 411 also functions as an electrode wherein an electric field between the plate 411 and the other electrode 403 on the substrate causes the terminals 411, 407 to disconnect by pulling the plate 411 downward.
  • the upper layer 407 is electrically isolated from the conductive layer 411 by the dielectric 415 and a gap between the protrusions and the layer 407 created by pulling the conductive layer 411 toward the electrode 403.
  • the conductive layer 411 is selectively connected to and disconnected from the upper layer 407.
  • the buckling of upper layer 407 in the relaxed state is less than that shown in Figure HA.
  • the upper layer 407 is not buckled in the relaxed state but starts essentially flat. In these embodiment, downward motion can still pull the protrusions off the terminals to open the switch.
  • the insulator 405 may be formed on the substrate 401 around the electrode 403.
  • the supports may be formed on the substrate and a sacrificial layer may be formed between the supports and over the insulator.
  • Material forming the plate 411 may then be deposited and etched, with additional sacrificial material formed over it.
  • the flexible layer 407 may then be deposited.
  • the sacrificial layer may then be removed.
  • the protrusions 1001 and 1003 are connected to a common strip of conductive material 410 functioning as a contact conductor like the strip shown in Figures 8A and 8B which is electrically isolated from conductive layer 411 forming an electrode and extension 418.
  • Conductive layer 411 and extension 418 may be connected by one or more vias through the contact conductor 410 and insulator 419, or alternatively, the contact conductor 410 and insulator 419 may be routed around the central post formed by the extension 418.
  • Terminals 1220, 1222 extend through the flexing membrane 407 and are aligned with the protrusions 1001, 1003.
  • the position of the conductive layer 411 is controlled by applying a voltage difference between the conductive layer 411 and the electrode 403. In this embodiment when in an unasserted state as shown in Figure 12, the contact conductor 410 is electrically connected to one contact 1220 by the protrusion 1001 and electrically connected to the other contact 1222 by the protrusion 1003.
  • the contact conductor 410 is pulled down and away from contacts 1220 and 1222.
  • the contacts 1220 and 1222 are selectively connectable through contact conductor 410.
  • the contacts 1220 and 1222 are opened with the electric field induced forces, and are connected in the mechanically relaxed state.
  • the conductive elements of the embodiment shown in Figure 12 are electrically isolated from one another by the dielectric material 1200.
  • the MEMS device may be operated as a double pole single throw switch.
  • a first terminal 1320 is attached to the upper flexible layer 407, and a second terminal 1322 is deposited on the substrate 401.
  • a third terminal 1324 is configured to make electrical contact with the first terminal 1320 in the mechanically relaxed state, and configured to make contact with the second terminal 1322 in the fully actuated state.
  • This arrangement provides a double-pole single throw switch configuration.
  • the plate 411 if the voltages applied to the plate 411, the electrode 403, and the deformable layer 407 are controlled appropriately, the plate 411 can be made to be suspended between the first contact 1320 and the second contact 1322. This forms a tri-state switch.
  • the electrode 403 may comprise the second contact 1322.
  • the conductive elements of the embodiment shown in Figure 13 are electrically isolated from one another by the dielectric material 1300.
  • Various routing configurations may be employed to electrically connect the elements of the embodiment of Figure 13 as well as other embodiments. For example there may be routing below and/or beside the electrode 403. There may be conductive routing within, adjacent to, or nearby the support posts 1318. There may also be routing above the layers shown.
  • Figures 14A and 14B show an embodiment of a MEMS switch with different structure than those illustrated above.
  • the upper support structure 1410 that covers the gap of the device is not deformable, but is relatively rigid due either to the materials it is fabricated from, its thickness, etc.
  • the conductive plate 1411 however, is relatively flexible.
  • the term “rigid” when applied to a portion of these switches means substantially unaffected by the voltages applied to the electrodes in normal use.
  • the term “flexible” when applied to a portion of these switches means that its shape or configuration is significantly affected by the voltages applied to the electrodes in normal use.
  • the edges of the plate 411 are deformed downward until the contact conductor 1420 contacts the terminals 1424 and 1426 as illustrated in Figure 14B.
  • the conductive elements shown in Figures 14A and 14B are electrically isolated from one another by the dielectric material 1400.
  • the plate 1411 and the contact conductor 1420 are not electrically isolated, and may be formed as a single metal plate.
  • Figures 15A and 15B illustrate an assert open switch of this type.
  • the plate 1511 is manufactured with in plane tension so that it is curved upward in the mechanically relaxed state after the sacrificial material is removed to form the central gap.
  • the plate 1511 is substantially planar in the relaxed state, and may include protrusions as described above.
  • a contact conductor 1520 makes contact with terminals 1524 and 1526. Note that the conductive path between the terminals 1524 and 1526 through contact conductor 1520 is not shown in its entirety, because a portion of the conductive path is out of the plane of this cross-sectional view (as in Figure 12 as well).
  • the edges of the plate 1511 are pulled downward, breaking the contact between the contact conductor 1520 and the terminals 1524 and 1526.
  • additional terminals 1523 and 1525 may be included.
  • the terminals 1523, 1525 may be contacted and bridged by the plate 1511. If a contact conductor that is isolated from the plate 1511 is desired, a second contact conductor (not shown) may be provided on the bottom of the plate 1511 that is insulated from the plate 1511 itself and that makes contact with the terminals 1523 and 1525.
  • the conductive elements shown in Figures 15 A and 15B are electrically isolated from one another by the dielectric material 1500.
  • combinations of assert open and assert closed MEMS switches can be used to create digital logic functions, such as AND, NAND, NOR, OR, XOR, XNOR, and AOI. Other digital logic functions and combinations are also possible.
  • Logic blocks comprising assert open or combinations of assert open and assert closed MEMS switches may be arranged together to provide logical functions typically found in external components, thereby saving system cost.
  • MEMS switches may be arranged for use in the capacity of low leakage transistors, shift registers, or decoders.
  • MEMS switches may be used in conjunction with row drivers or column drivers, for example.
  • MEMS switches may be manufactured on various substrates, such as glass substrates, silicon or plastic substrates, for example.
  • the present invention may be embodied within a form that does not provide all of the features and benefits set forth herein, as some features may be used or practiced separately from others, and features of one embodiment may be combined with features of other embodiments.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Micromachines (AREA)
  • Push-Button Switches (AREA)

Abstract

L'invention concerne des micro-commutateurs électromécaniques constitués de membranes ou de couches déformables sous l'application d'une tension. Selon certains modes de réalisation, l'application d'une tension ouvre des contacts de commutateur.
PCT/US2005/032782 2004-09-27 2005-09-14 Micro-commutateurs electromecaniques a membranes deformables WO2006036560A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP05798437A EP1809568A2 (fr) 2004-09-27 2005-09-14 Micro-commutateurs electromecaniques a membranes deformables
MX2007003577A MX2007003577A (es) 2004-09-27 2005-09-14 Conmutadores mems con membranas de deformacion.
JP2007533542A JP2008515150A (ja) 2004-09-27 2005-09-14 変形する薄膜を備えたｍｅｍｓスイッチ

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US61346504P 2004-09-27 2004-09-27
US61350104P 2004-09-27 2004-09-27
US60/613,465 2004-09-27
US60/613,501 2004-09-27
US11/144,546 2005-06-03
US11/144,546 US8008736B2 (en) 2004-09-27 2005-06-03 Analog interferometric modulator device
US11/150,407 2005-06-10
US11/150,407 US7345805B2 (en) 2004-09-27 2005-06-10 Interferometric modulator array with integrated MEMS electrical switches
US11/198,925 2005-08-05
US11/198,925 US7724993B2 (en) 2004-09-27 2005-08-05 MEMS switches with deforming membranes

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Publication number Priority date Publication date Assignee Title
EP1850360A1 (fr) * 2006-04-26 2007-10-31 Seiko Epson Corporation Microrupteur avec une première pièce commandable et une seconde pièce de contact
US7745747B2 (en) 2006-04-26 2010-06-29 Seiko Epson Corporation Microswitch with a first actuated portion and a second contact portion
JP2011209751A (ja) * 2006-06-01 2011-10-20 Qualcomm Mems Technologies Inc 静電気動作と解放を備えたアナログ光干渉変調器デバイス
WO2008076448A1 (fr) * 2006-12-19 2008-06-26 Qualcomm Mems Technologies, Inc. Commutateurs mems avec membranes déformantes
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EP2398028A3 (fr) * 2010-06-17 2012-09-05 General Electric Company Réseau de commutateur MEMS ayant un substrat agencé pour conduire un courant de commutation
US8576029B2 (en) 2010-06-17 2013-11-05 General Electric Company MEMS switching array having a substrate arranged to conduct switching current
RU2532684C2 (ru) * 2013-05-23 2014-11-10 Общество с ограниченной ответственностью "СПИНТЕК" Переключатель и коммутатор

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TW200635845A (en) 2006-10-16
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JP2008515150A (ja) 2008-05-08
WO2006036560A3 (fr) 2006-05-04

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