WO2003060200A1 - Electrode pour galvanoplastie et dispositif de galvanoplastie - Google Patents

Electrode pour galvanoplastie et dispositif de galvanoplastie Download PDF

Info

Publication number
WO2003060200A1
WO2003060200A1 PCT/JP2002/000282 JP0200282W WO03060200A1 WO 2003060200 A1 WO2003060200 A1 WO 2003060200A1 JP 0200282 W JP0200282 W JP 0200282W WO 03060200 A1 WO03060200 A1 WO 03060200A1
Authority
WO
WIPO (PCT)
Prior art keywords
plating
case
porous
solution
conductivity
Prior art date
Application number
PCT/JP2002/000282
Other languages
English (en)
Japanese (ja)
Inventor
Eishirou Kawana
Kiyoshi Hyodo
Seiji Yamaguchi
Original Assignee
Fujitsu Limited
Suruga Seiki Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Limited, Suruga Seiki Co., Ltd. filed Critical Fujitsu Limited
Priority to JP2003560276A priority Critical patent/JP4105633B2/ja
Priority to CNB028272145A priority patent/CN100334259C/zh
Priority to PCT/JP2002/000282 priority patent/WO2003060200A1/fr
Priority to AU2002226680A priority patent/AU2002226680A1/en
Priority to KR1020047010596A priority patent/KR100706851B1/ko
Priority to TW091101036A priority patent/TW593781B/zh
Publication of WO2003060200A1 publication Critical patent/WO2003060200A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method

Definitions

  • the present invention relates to a plating method using a porous material. More specifically, for example, the ⁇ S «layer uses resin particles to form a porous bracelet, imparts conductivity to at least its surface, and improves electrode efficiency by increasing its conversion with plating liquid. Regarding the killed meat.
  • the present invention relates to a Mekki® i using such a multi-hole as a case. View
  • plating Sfls that have been used, for example, those shown in FIGS. 1 to 5 are known.
  • Figure 1 is a diagram showing the outline of the resolvable net electrode.
  • a net ins2 made of metal net material is suspended from a support that also serves as a thread.
  • the larger the size of the surface the more ⁇ 3 ⁇ 4 can flow at low E.
  • FIG. 2 and FIG. 3 show a detail of a plating tank provided with the above-mentioned circulation means.
  • the material to be plated which is plated between the nets 5 and 5 in the plating liquid, is arranged in a force of 4 S.
  • the air is discharged from the air nozzle 6 while being discharged by the flow nozzle 7. Agitating flow of the liquid is used to perform air publishing.
  • the air is discharged from the air nozzle 6 and the stirring flow to the plating material 4 is generated at zero flow nozzle / revolution 8.
  • the conversion rate between the plating solution and the net 1 can be increased, and the rate can be improved.
  • Fig. 4 shows an example of a cell with a built-in agitation nozzle, which is called Cell II!
  • Fig. 4 ( ⁇ ) shows a cross section of the cell # 1 in the longitudinal direction
  • Fig. 4 ( ⁇ ) shows a cross section of this wisteria.
  • This nozzle has a nozzle pipe 11 disposed in a housing 10 and is configured to blow out an outer plating liquid from the nozzle pipe 11 to stir.
  • the housing 10 has an arc shape, and the chord portion has a surface 12 formed so as to allow the liquid to drip.
  • the net surface 12 is formed of a plate material having punch holes as described above.
  • This cell can be used, and the plating solution can be eclipsely stirred, so that the efficiency can be improved.
  • Note that the upper cell fl ⁇ ⁇ is shown in Fig. 4, but in actual plating processing, a pair of upper and lower cells are arranged so that they face each other, and the plating material is placed between them. Processing is completed.
  • FIG. 5 shows only the conventional dissolving type 3 ⁇ 415.
  • the «S 15, which contains the anode ball 17, which is formed of copper, ⁇ » is contained in the net of the ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ : By doing so, plating processing is performed on the plating material.
  • the net No. 1 improves the insect repellency against the plating liquid rather than the plate leakage, but it is necessary to further improve the efficiency compared with the severer plating conditions that have been required recently.
  • it is necessary to provide a rotatable guide as described above there is a limit to reducing the distance between the nets, and there is also a limit to making the net itself thin. Therefore, it is not possible to further increase the surface area, and there is a limit to improving production efficiency. Further, as described above, there is a limit to improving the production efficiency even if the circulation means for circulating the plating liquid is provided.
  • a main object of the present invention is to provide an m that can perform uniform plating with high efficiency. Disclosure of the invention
  • the present invention relates to a novel plating St ⁇ using a porous material.
  • ⁇ solution itself, in which ⁇ S ion in the plating solution is plated on the material to be plated
  • * S in Fig. 5 Melt the node ball in the IK into the case There is a dissolvable type that causes material sticking.
  • a plate-like material obtained by forming a porous (porous) material having a conductive property at least on its surface can be suitably used.
  • a porous plate can be obtained by heating and orificing an m-shaped material.
  • a desired porous film can be formed by appropriately adjusting the material used, the conditions, the pressing conditions, the processing time, and the like for the porous plate.
  • an i-type metal such as titanium, and a metal material having a conductive property such as platinum can be preferably used as the granular material.
  • a material prepared by heating and applying pressure using such a s material is referred to as “ ⁇ ”.
  • the above-mentioned titanium is poor in conductivity.
  • a conductive plating such as copper, platinum, or iridium on its surface, it is possible to impart conductive regeneration.
  • resin particles can be used as the granular material.
  • resin does not have conductivity, so even in the case of resin, conductivity can be imparted by plating the surface with a conductive material such as platinum or iridium.
  • the particles As the granular material, titanium particles, resin particles, etc., which need to be plated in order to impart conductivity, are used. ⁇ Alternatively, the particles may be subjected to a plating treatment, or the particles may be subjected to a plating treatment in advance, and then may be formed into a porous material by heating with heat and pressure.
  • the porous, non-dissolving, and electrically conductive plating electrode has a very large surface area per volume, so that the amount of s3 ⁇ 4 that can be flowed in proportion to the table can be increased and the efficiency is high. Become.
  • the above-mentioned collective metal register may be used in the form of being immersed in the plating liquid as it is.
  • the rate can be further improved by adding an E sending means.
  • a hollow frame into which a plating solution is press-fitted is formed, and a nozzle type plating 1 in which tiilS Porous® IS is provided in a part of the frame can be used.
  • the S case is formed with the above-mentioned multi-hole structure.
  • This ®3 ⁇ 4 case has a very small gap compared to the conventional net material, and therefore has a high filtration capacity. Therefore, it is possible to suppress a situation in which the consumed and reduced anode ball jumps out.
  • By introducing a plating solution with pressure applied to such a register case it is possible to further improve the m3 ⁇ 4 efficiency.
  • an outer case is provided as an anode case for storing anode balls and an inner case is provided inside the outer case, and the anode balls are provided between these cases can also be adopted.
  • the outer case and the inner case is formed of the above-described open and conductive porous braid, it is possible to prevent the anode pole from jumping out while suppressing the * and the removal of the plating solution and the anode pole. It is possible to construct a dissolving powder with improved ⁇ . Even in such an anode case, the efficiency can be further improved by pumping the plating solution inward.
  • the above-mentioned porosity has a small gap (opening) between the formed nets and has uniformity. Therefore, there is an advantage that the plating solution can be jetted out in a uniform state when the carotenized plating solution has passed through the pores.
  • Fig. 1 is a diagram showing a conventional view of the net of intellectuality.
  • FIG. 2 is a diagram showing a detail of a plating tank provided with a circulation means.
  • FIG. 3 is a view showing another slave rack of the plating tank provided with the circulation means.
  • FIG. 4 is a diagram showing a conventional cell electrode.
  • FIG. 5 is a diagram showing the conventional dissolved ⁇ .
  • FIG. 6 shows an example of making a porous
  • Fig. 7 shows a porous plate made of a base material separated for plating; is there.
  • FIG. 8 is a diagram showing a case where a porous plate manufactured by Nissan is applied to a nozzle-type plating scythe.
  • FIG. 9 is a view showing that a manufactured porous plate is configured as a nozzle for stirring.
  • FIG. 10 is a diagram illustrating the nozzle type plating ma of the first example.
  • FIG. 11 is a diagram showing a second example of a nozzle-type plating layer for plating!
  • FIG. 12 is a diagram showing a third difficulty example of a nozzle type fl® for plating.
  • FIGS. 13 to 20 are views showing an example of a process of using a porous plate having density in the third cat example.
  • FIG. 21 is a diagram showing an example of ⁇ in which a multi-layer plate is formed on an actual plating S.
  • FIG. 22 is a diagram showing an example in which the present invention is applied to senole ⁇ 3 ⁇ 4 to obtain an improved plating H3 ⁇ 4.
  • FIG. 23 is a diagram showing an example of the age at which a porous plate having coarse and dense is formed at an actual distance for plating.
  • FIG. 27 is a diagram showing a cross section of the cylindrical shape shown in FIG. 26 (A).
  • the porous material used in the present invention can be obtained by, for example, the process shown in FIG. FIGS. 6 (I) to (III) show an example of manufacturing a porous element S.
  • Seed particles of the desired particle size ⁇ Seed particles (I), and pressurize: pressurize (II) c
  • Recorded particles are softened when pressed to a specified temperature, and adhere to each other by pressing. is there. Utilize this property ⁇ ;
  • a porous wing plate as shown in (III) can be obtained.
  • a porous plate having a myriad of desired gaps can be obtained by adjusting the size of the particles used, the particle diameter, the heating temperature, the pressure, and the processing time.
  • a porous plate having a gap that is preferable to be used for measuring the particle diameter from a range of 5 to 30 mm to 51 mm is used.
  • a porous plate prepared as shown in FIG. 6 can be directly used as ®S.
  • a conductive support 11 also serving as an electrode ⁇ for plating can be obtained. Since such a is extremely large in terms of a3 ⁇ 4, it is highly efficient for use even when simply immersed in the plating liquid.
  • a small gap force is applied between the particle materials. Since the plating liquid passes through this gap, the insects can be remarkably widened.
  • a material similar to that of the porous plate 10 can be processed into a nozzle for ejecting a plating liquid as shown in FIG.
  • the nozzle shown in FIG. 9 can be used as a nozzle for plating and stirring.
  • the porous plate 10 can be expanded into a cylindrical shape as shown in FIG. 9 ( ⁇ ) or a desired shape with a square as shown in FIG. 9 ( ⁇ ). According to the nozzle formed in this way, as shown in FIGS. 9 ( ⁇ ) and ( ⁇ ), the plating liquid PL introduced inside with pressure can be ejected outward ⁇ J. .
  • this nozzle puts the anode ball in IRI! ⁇ ! Can be used as a case.
  • This case unlike the conventional net-like case, has a very small gap and therefore has a high function. Therefore, the situation in which the consumed and reduced anode ball jumps out does not occur.
  • FIG. 10 is a diagram showing the nozzle type ⁇ for the nozzle of the first spirit example.
  • FIG. 10 ( ⁇ ) is an overall view of the jS 20 for the tip / sleeve-type plating
  • FIG. 10 (B) is a view showing a cross section at the center.
  • the metal frame 20 has a hollow ⁇ ⁇ body shape fitted into one side of the T-frame 21 with the above-described metal porous plate 10 force S.
  • the upper portion of the frame 21 has a metal frame.
  • a conduit 22 is provided for flowing the liquid PL into the frame 21.
  • a nozzle type plating electrode 20 when the plating liquid PL having a portion 1 is introduced into the frame 21, it can be discharged outside through the gap of the porous plate 10. it can.
  • the porous plate 10 has a large air per unit, so that the plating liquid is guided outward while insects are removed on a wide surface.
  • sufficient electricity can be supplied during the night, so that cations (+) can be reliably adhered to the plating material.
  • the stirring of the plating solution is simultaneously performed. Therefore, precipitation of plating can be accelerated, and a highly efficient plating can be obtained.
  • the depth ⁇ and ⁇ ⁇ ⁇ of 13 ⁇ 4 shown in FIG. 10 may be designed so as to correspond to a plate-shaped or band-shaped material to be welded.
  • a plating material s has a wide surface area and thus has a good efficiency, and a plating force s having a uniform thickness can be obtained even when a plating key is formed in a state where the plating material and the plating material are joined.
  • the plating liquid can be sprayed toward the entire surface of the plating material, the plating liquid is agitated, and the adhesion to the plating surface is suppressed even if the plating liquid has a floating force in the plating tank. V-free plated surface can be obtained.
  • FIG. 11 is a diagram showing a second example of a nozzle type paint dragon relating to the first difficult example of Ernie.
  • FIG. 11 (A) is an overall perspective view of a nozzle type dining room 25, and
  • FIG. 11 (B) is a diagram showing a cross section at the center.
  • This difficult example is a modification of the first difficult example, in which the porous plate 10 0— :! Plating with embedded 10-4 It is.
  • the porous plate 10 is located on all sides, so that the number of ® withdrawn from the plating solution is further increasing. Therefore, it will be used for fishing with improved dragon efficiency. Further, since the plating solution is uniformly sprayed in all directions, the stirring of the plating solution in the plating tank can be promoted.
  • the above-described metal porous plate 10 is employed on all four side surfaces. However, if necessary, two opposing surfaces, two, three surfaces, or three surfaces may be used. You can do it.
  • FIG. 12 is also a view showing the nozzle type plating electrode of the third example related to the first ⁇ 5 ⁇ example.
  • FIG. 12 (A) is an overall perspective view of a nozzle-shaped plating electrode 30, and
  • FIG. 12 (B) is a view showing a cross section at the center.
  • This example is also a modified example of the first example, and is a MEKKI® S in which the porous shape of the metal porous plate 10 provided on one surface of the body-shaped frame has density.
  • the porous plate 10 of this difficult example is formed in a state in which a sparse porosity 10 Lo in the center and a dense porosity 1 O Hi in the periphery coexist.
  • Such a porous plate 10 can be affected by the steps shown in FIGS. 13 to 20, for example.
  • FIGS. 13 to 20 for example.
  • FIGS. 13 to 20 examples of a porous plate with a dense and dense structure will be described.
  • sake 102 is set on a flat lower mold 101.
  • Fig. 14 set the jig 103 in the jig 102 to separate the large ⁇ * ⁇ material from the small male material.
  • the middle jig 103 shown in FIG. 14 has a ring shape; the shape may be changed as needed.
  • granular g having a different diameter from the inside of the middle jig 103 is loaded.
  • the outside of the middle jig 103 is loaded with a small waste material 105 for forming a dense porous material.
  • a metallic material 106 with a large ⁇ 2 ⁇ is loaded to form a sparse porous membrane.
  • the male may have the large material 106 on the outside and the small material 105 on the inside.
  • ⁇ when the middle jig 103 is taken out, ⁇ the materials 105 and 106 are removed. It can be in a state.
  • the upper mold 104 for pressing the above-mentioned materials 105 and 106 into the frame mold 103 is placed.
  • this is mixed and, as shown in Fig. 20, if the lower mold 101, the lighter 102 and the upper frame 104 are removed, the porous mold 1 is in close contact with each other and is sparse in the center.
  • the condition of the plating liquid spouting toward the plating material can be adjusted even in the plating mi® of this example, it can be supplied according to the shape of the plating material. Therefore, it is possible to improve the efficiency and to apply a uniform plating to a workpiece having a different shape.
  • the plated electrode 30 shown in FIG. 12 corresponds to a modified example of the first embodiment, and shows an example in which the porous plate 10 having only one surface has density.
  • the present invention is not limited to this, and as a modification of the second example, a porous plate 10 having unevenness on four sides may be used. Alternatively, a porous plate 10 in which only the selected one of the four side surfaces has a density may be used.
  • a porous material 10 Lo in a sparse state is formed in a central portion and a porous material 10 Hi in a dense state is formed in a peripheral portion.
  • the present invention is not limited to this, and it may be formed in a state in which a dense porous TO 1 OH i and a dense porous porosity 1 OL o are present in the peripheral portion.
  • FIG. 21 and FIG. 23 illustrate an example of ⁇ in which the above-described porous plate 10 is formed by actual plating.
  • FIG. 21 (A) has a configuration similar to that of FIG. 10g of the first difficult example shown in FIG.
  • the frame 21 is electrically conductive and is fixed to ⁇ 23, which also serves as a support. Therefore, it is immersed in the plating liquid tank and shelved in the state where it was erected in Thanks 23.
  • FIG. 21 ( ⁇ ) shows an example in which two pipes 22 into which the plating liquid PL force S is introduced are provided, three or more pipes may be provided.
  • Fig. 21 (B) shows an electrode for plating in which the porous plate 10 is annular and the whole is cylindrical. The poles are shown. As shown in Fig.
  • the plating solution can be spouted evenly in such a cylindrical shape. As shown in Fig. 21 (B), it is used by being immersed in a plating solution tank while being supported in Appendix 23.
  • FIG. 22 is a diagram showing a plated electrode improved by applying the present invention to the cell electrode shown in FIG. FIG. 22 (A) is a front view of the cell mochi 50, and FIG. 22 (B) is a cross-sectional view.
  • the porous plate 10 of the above-mentioned record is adopted on the surface of the blowout portion. According to this cell, the surface is porous, so that the plating liquid can be jetted out more uniformly than the conventional cell S shown in FIG.
  • FIG. 23 (A) has a structure having the same density as the rattan shown in FIG. 12 of the third example.
  • This frame 21 is conductive, and is fixed to ⁇ 3 ⁇ 423 which also serves as a support. Therefore, it is immersed in the plating tank and turned over while being supported by attachment 23.
  • FIG. 23 ( ⁇ ) shows an example of a ⁇ formed by forming a porous plate 10 having a coarse and dense shape in a ring shape. As shown in FIG. 23, these are also used by being immersed in a plating solution tank with the support in place.
  • FIG. 24 is a diagram showing an example of the arrangement of the meditation tentacles in the meditation layer.
  • reference symbols A P and P E denote a plating shop and a material to be plated, respectively.
  • the tUlB porous plate 10 functions not only as a wide orchid ⁇ but also as an outlet for spouting the sap. Then, as in the configuration shown in FIG. 11, for example, the number of ejection surfaces can be adjusted as needed.
  • Fig. 25 shows an example of a plating apparatus equipped with a nozzle-type resolvable plating shop that introduces a plating solution into the interior at a predetermined pressure and ejects the plating solution.
  • the plating tank 61 is filled with a plating solution containing cations.
  • Meat tank 60 In the middle ⁇ , the plating material to be subjected to the plating process, AP force S is arranged.
  • a nozzle-type lightning raid is arranged so as to face the surface of the light-receiving material AP.
  • a plating electrode 10 s in which a porous plate made of ⁇ S is provided on one side shown in FIG. 10 is employed.
  • the plating solution that has flowed over in the upper part of the plating tank 61 enters the cation supply tank 65 via the return pipe 63, and for example, copper ions are brought into a rich state. Then, the plating liquid is pressure-fed into the plating electrode 10 by a pump 67 as a plating sending means.
  • the plating step can be performed with high efficiency and the plating surface having a uniform thickness can be formed on the plating material.
  • a dissolution type plating using a case will be described as a fourth example of the present invention.
  • the examples shown in FIGS. 10 to 12 are shown as 1 ".
  • these ⁇ 3 ⁇ 4 can also be used as a case
  • the force that cations were eluted in the plating liquid was treated as a ®S case.
  • the porosity used in the dragon case is preferably selected from a range of particle diameters from 0.1 to 30 mm.
  • FIGS. 26 and 27 show a soluble plating No. 1 using the improved case of the fifth example ⁇ fe example.
  • Figure 26 shows the two Fujinari models with a case inside the outer case.
  • FIG. 26 (A) shows the outer case 71 in which the outer case 71 has a cylindrical shape
  • FIG. 26 (B) shows the outline of the outer case ⁇ 1 JM (W80).
  • Both shoguns shown in FIG. 26 have ⁇ cases 73 and 83, and the anode pole AN is housed in the space between the inner case and the outer case.
  • FIG. 27 is a diagram showing a cross section of the cylindrical electrode 70 shown in FIG. 26 ( ⁇ ).
  • the case 71 and the inner case 73 are both formed of a material capable of forming a plating solution. It is preferable that the outer case 71 and the case 73 are formed with the above-mentioned perforated screw. Then, one of the outer case 71 and the inner case 73 has conductivity, so that it can function as a fl case. Therefore, for example, if the outer case 71 is a regenerated porous plate as described above, the inner case 73 may be porous made of a resin resin stand having conductivity.
  • the plating solution PL of a predetermined pressure flows t deep into the inside, and evenly flows out toward the inside.
  • the plating liquid efficiently woven into the anode ball AN of copper (Cu) or the like is ejected to the outer case 71 1 ⁇ , so that the plating liquid sufficiently containing cations can be sent out.
  • the plating liquid can be sent between the anode balls, which was difficult in the past, so that the S3 ⁇ 4 efficiency can be improved. Also, the anode pole which has become smaller as shown in FIG. 3 does not fly out, and the anode ball can be consumed until the end, so that the cost can be reduced.
  • the plating solution can also be sprayed out to the entire surface of the material to be plated by the dissolving type plating electrode using the g case shown in Fig. 26, so that the plating solution is sufficiently agitated and Despite the buoyancy force, it is possible to obtain a plated surface without pits by suppressing the dimensional attachment to the plating surface.
  • porous plate 10 made of fiber has been described.
  • a porous plate in which a porous layer is formed using resin particles and the surface thereof is led can be similarly used.
  • the process of forming the dense and dense porous plate 10 by using the different metal particles shown in FIGS. 13 to 20 described above is shown.
  • the use of the conductive porous material for the dissolving type plating improves the ⁇ 3 ⁇ 4 rate, It is possible to efficiently perform uniform plating by simultaneously preventing fiber agitation.

Abstract

L'invention concerne une électrode pour galvanoplastie comprenant un matériau poreux apte à conduire l'électricité au moins à sa surface et ayant été obtenu par chauffage et compression d'un matériau particulaire.
PCT/JP2002/000282 2002-01-17 2002-01-17 Electrode pour galvanoplastie et dispositif de galvanoplastie WO2003060200A1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2003560276A JP4105633B2 (ja) 2002-01-17 2002-01-17 メッキ用電極及びメッキ装置
CNB028272145A CN100334259C (zh) 2002-01-17 2002-01-17 电镀用电极以及电镀装置
PCT/JP2002/000282 WO2003060200A1 (fr) 2002-01-17 2002-01-17 Electrode pour galvanoplastie et dispositif de galvanoplastie
AU2002226680A AU2002226680A1 (en) 2002-01-17 2002-01-17 Electrode for metal plating and plating device
KR1020047010596A KR100706851B1 (ko) 2002-01-17 2002-01-17 도금 장치
TW091101036A TW593781B (en) 2002-01-17 2002-01-23 Electrode used for plating and plating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2002/000282 WO2003060200A1 (fr) 2002-01-17 2002-01-17 Electrode pour galvanoplastie et dispositif de galvanoplastie

Publications (1)

Publication Number Publication Date
WO2003060200A1 true WO2003060200A1 (fr) 2003-07-24

Family

ID=11738138

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/000282 WO2003060200A1 (fr) 2002-01-17 2002-01-17 Electrode pour galvanoplastie et dispositif de galvanoplastie

Country Status (6)

Country Link
JP (1) JP4105633B2 (fr)
KR (1) KR100706851B1 (fr)
CN (1) CN100334259C (fr)
AU (1) AU2002226680A1 (fr)
TW (1) TW593781B (fr)
WO (1) WO2003060200A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012219372A (ja) * 2011-04-14 2012-11-12 Sumitomo Electric Ind Ltd アルミニウム多孔体の製造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201006076D0 (en) 2010-04-12 2010-05-26 Xeros Ltd Novel cleaning apparatus and method
GB201015277D0 (en) 2010-09-14 2010-10-27 Xeros Ltd Novel cleaning method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0953200A (ja) * 1995-08-11 1997-02-25 Nippon Steel Corp 不溶性電極及びその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4043891A (en) * 1976-01-14 1977-08-23 Bell Telephone Laboratories, Incorporated Electrolytic cell with bipolar electrodes
US4179350A (en) * 1978-09-05 1979-12-18 The Dow Chemical Company Catalytically innate electrode(s)
EP0310401B1 (fr) * 1987-10-01 1994-04-20 Furukawa Circuit Foil Co., Ltd. Electrode insoluble
CN2175238Y (zh) * 1993-09-29 1994-08-24 北京科技大学 锌-镍合金电镀用阳极
CN1064721C (zh) * 1998-10-27 2001-04-18 中国科学院广州化学研究所 一种塑料滤网镀膜电极及其制法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0953200A (ja) * 1995-08-11 1997-02-25 Nippon Steel Corp 不溶性電極及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012219372A (ja) * 2011-04-14 2012-11-12 Sumitomo Electric Ind Ltd アルミニウム多孔体の製造方法

Also Published As

Publication number Publication date
CN100334259C (zh) 2007-08-29
JP4105633B2 (ja) 2008-06-25
KR100706851B1 (ko) 2007-04-13
KR20040072704A (ko) 2004-08-18
CN1615379A (zh) 2005-05-11
AU2002226680A1 (en) 2003-07-30
TW593781B (en) 2004-06-21
JPWO2003060200A1 (ja) 2005-05-19

Similar Documents

Publication Publication Date Title
CN108094298A (zh) 一种方便水产养殖用排污装置
WO2003060200A1 (fr) Electrode pour galvanoplastie et dispositif de galvanoplastie
CN102021609B (zh) 增大接触比表面积的有价金属回收用电解槽
JP5375596B2 (ja) 噴流式めっき方法および装置
CN110468393B (zh) 化学镀镍系统
CN208987516U (zh) 一种宠物饮水机
JP2012107267A (ja) メッキ装置
WO2020073716A1 (fr) Élément filtrant de type fermé
CN214142492U (zh) 一种熔炼炉内铝液除气装置
CN220223745U (zh) 一种废水处理用电化学氧化装置
JP2004176116A (ja) めっき液供給用のノズルおよびこれを用いたカップ式のめっき装置
CN110291043A (zh) 净化装置
CN214668064U (zh) 一种食品农药残留检测挤出装置
JP7111068B2 (ja) めっき装置およびめっき方法
CN215365383U (zh) 一种重金属分离处理的装置
CN202297813U (zh) 电镀液稳压分流装置
JPS62170500A (ja) 電気めつきにおける金属イオン供給方法および装置
CN213012021U (zh) 一种河水水体治理自流加药装置
CN213835604U (zh) 一种槽液在线循环过滤系统
JP3884150B2 (ja) 高速メッキ装置及び高速メッキ方法
JP6567929B2 (ja) 電鋳方法及び電鋳装置
CN206435823U (zh) 用于连接器外壳加工的便于换装的火花机打磨平台
JPS5913592A (ja) 半田粒及び半田粒供給装置
CN106817842A (zh) 一种高效pcb板自动蚀刻装置
JPS5916000B2 (ja) 電気メツキ処理方法

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TN TR TT TZ UA UG US UZ VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2003560276

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 1020047010596

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 20028272145

Country of ref document: CN

122 Ep: pct application non-entry in european phase