WO2003054790A1 - Carte a puce a module de surface etendue - Google Patents
Carte a puce a module de surface etendue Download PDFInfo
- Publication number
- WO2003054790A1 WO2003054790A1 PCT/FR2002/004429 FR0204429W WO03054790A1 WO 2003054790 A1 WO2003054790 A1 WO 2003054790A1 FR 0204429 W FR0204429 W FR 0204429W WO 03054790 A1 WO03054790 A1 WO 03054790A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- card
- support
- cavity
- chip
- module
- Prior art date
Links
- 238000000465 moulding Methods 0.000 claims description 5
- 238000003754 machining Methods 0.000 claims description 3
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 239000004033 plastic Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07737—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
- G06K19/07739—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a smart card and more specifically a smart card comprising a card carrying a module consisting of a support itself supporting at least one electronic chip, this support being fixed on a surface of the card.
- a known smart card consists of a plastic card of standardized format, two formats of which are the “bank card” type defined by ISO standard 7810 and the “mini-card” type SIM for mobile telephony. It carries an electronic module consisting of a support formed of a sheet of dielectric material possibly provided with printed circuits and supporting an electronic chip, for example an electronic memory. As a general rule, this chip is bonded to one face of the support and protected by a layer of epoxy resin forming additional thickness on the support. This face will be referred to below as the rear face.
- the module on the card the latter comprises a first cavity of a first depth and a second cavity of a second depth produced in the bottom of the first cavity and intended to receive chip and resin.
- the support is glued in the first cavity around the second cavity.
- the first cavity has a total surface equal to the surface of the module which is therefore put in place by embedding therein.
- the thickness of such a card is standardized and approximately 800 microns, the first depth is approximately 200 microns and the second depth is approximately 400 microns.
- the arrangement currently in use presents several problems.
- the bonding surface of the module support may prove to be insufficient and lead to improper fixing of the latter, in particular in the case of a large chip. Indeed, this bonding surface is limited to the bottom of the first cavity outside the second cavity receiving the chip and its protective resin. Consequently, the larger the total surface area of the chip (s), the more this bonding surface turns out to be insufficient since the module surface / bonding surface ratio decreases.
- This arrangement also poses manufacturing problems. Given the depth of the first cavity, approximately 200 microns, this cavity must be produced at a distance from the edges of the card imposed by the requirements of the molding process. This distance must also be approximately 200 microns minimum. It is indeed difficult and even impossible to reduce this distance, since it is impossible to inject the plastic on a very thin wall. This is a manufacturing imperative that goes against the need to increase the format of the modules, the format of the card being standardized.
- the invention solves these problems and proposes a chip card comprising a card carrying a module consisting of a support itself supporting at least one electronic chip, this support being fixed on a surface of the card characterized in that the surface extends to at least one of the edges of the card.
- the solution of the invention makes it possible to increase the bonding surface of the module on the card and therefore to increase the reliability of the latter. This increase in the bonding surface is obtained by increasing the surface of the support supporting the chip.
- the invention allows reliable fixing of large modules provided with one or more large chips. he it is indeed possible to enlarge the dimension of the second cavity without reducing the bonding surface of the module on the card.
- the invention simplifies the card manufacturing process simplifying the molding step at the edge of the card in question, by removing the thin wall present at the edge of the card.
- said support extends over the entire surface of the card.
- the card comprises a cavity for receiving said support extending to at least one edge of the card and produced by molding or by machining.
- the card can include at least one cavity for receiving the chip.
- the smart card is a mini-card.
- FIG. 1 is a front view of a detachable SIM (Subscriber Indentification Module in English for mobile telephony) mini-card still attached to a presentation support of “bank card” format, according to the prior art.
- Figure 2 is a sectional view along II-II of Figure 1.
- Figure 3 is a similar sectional view according to the invention.
- a chip card 1 consists of a plastic card of standardized format 2. It carries an electronic module consisting of a support 3 formed of a sheet of plastic material possibly provided with printed circuits and supporting an electronic chip 4, for example an electronic memory. Generally, this chip 4 is glued on one side of the support 3 and protected by a layer of epoxy resin forming additional thickness on the support.
- the figures represent a minimap 1 attached to a “bank card” format support card 5 having only a presentation function. To use minimap 1, the latter is detached by means of snap-off tabs surrounding it.
- Figures 1 and 2 show a smart card 1 according to the prior art.
- the latter For fixing the module 3, 4 on the card 2, the latter comprises a first cavity 6 of a first depth and a second cavity 7 of a second depth produced in the bottom of the first cavity 6 and intended to receive the chip and resin 4.
- the support 3 is glued in the first cavity 6 around the second cavity 7.
- the first cavity 6 has a total surface equal to the surface of the module 3, 4 which is therefore put in place by embedding therein.
- the bonding surface of the module is therefore equal to the surface of the first cavity S6 minus the surface of the second cavity S7.
- Figure 3 is a sectional view similar to the section of Figure 2 according to the invention.
- the bonding surface of the module 3, 4 is equal to the surface S of the card 2 minus the surface of the cavity S7 intended to receive the chip and the resin 4.
- the bonding surface extends to at least one of the edges of the card 2 and preferably, as shown, it extends to all the edges of the card 2.
- the support 3 of the glued module extends over the entire surface of the card 2.
- This cavity 7 can be produced by molding or machining. The invention therefore makes it possible, with standardized card size, to increase the bonding surface of the module 3, 4 on the card 2 and therefore to increase the reliability of the latter.
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003555433A JP2005513654A (ja) | 2001-12-20 | 2002-12-18 | 表面が拡張したモジュールを有するスマートカード |
DE60230919T DE60230919D1 (de) | 2001-12-20 | 2002-12-18 | Chip karte mit einem grossflächigen modul |
AU2002364324A AU2002364324A1 (en) | 2001-12-20 | 2002-12-18 | Smart card with extended surface module |
EP02799098A EP1459249B1 (fr) | 2001-12-20 | 2002-12-18 | Carte a puce a module de surface etendue |
US10/498,550 US7686228B2 (en) | 2001-12-20 | 2002-12-18 | Smart card with extended surface module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR01/17054 | 2001-12-20 | ||
FR0117054A FR2834103B1 (fr) | 2001-12-20 | 2001-12-20 | Carte a puce a module de surface etendue |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003054790A1 true WO2003054790A1 (fr) | 2003-07-03 |
WO2003054790A8 WO2003054790A8 (fr) | 2005-04-07 |
Family
ID=8871090
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR2002/004429 WO2003054790A1 (fr) | 2001-12-20 | 2002-12-18 | Carte a puce a module de surface etendue |
Country Status (10)
Country | Link |
---|---|
US (1) | US7686228B2 (fr) |
EP (1) | EP1459249B1 (fr) |
JP (3) | JP2005513654A (fr) |
CN (1) | CN100350426C (fr) |
AT (1) | ATE421129T1 (fr) |
AU (1) | AU2002364324A1 (fr) |
DE (1) | DE60230919D1 (fr) |
ES (1) | ES2321175T3 (fr) |
FR (1) | FR2834103B1 (fr) |
WO (1) | WO2003054790A1 (fr) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5163776B2 (ja) * | 2010-07-13 | 2013-03-13 | 株式会社デンソー | カードキー |
US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
US8950681B2 (en) | 2011-11-07 | 2015-02-10 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
USD691610S1 (en) | 2011-11-07 | 2013-10-15 | Blackberry Limited | Device smart card |
US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
USD703208S1 (en) * | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
USD701864S1 (en) * | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
CN104778492B (zh) * | 2014-01-13 | 2018-03-23 | 全宏科技股份有限公司 | 智能型贴片安装卡及应用其的安装方法 |
EP3335157B1 (fr) | 2015-08-14 | 2023-12-13 | Capital One Services, LLC | Structure de carte de transaction en deux parties |
DE102016106698A1 (de) * | 2016-04-12 | 2017-10-12 | Infineon Technologies Ag | Chipkarte und Verfahren zum Herstellen einer Chipkarte |
JP1647726S (fr) * | 2018-02-01 | 2019-12-09 | ||
WO2021116239A1 (fr) * | 2019-12-13 | 2021-06-17 | Covestro Deutschland Ag | Structures en couches avec lignes de coupe |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4218923A1 (de) * | 1992-06-10 | 1992-10-22 | Haiss Ulrich | Wertkarte mit elektronik-wert-chip |
DE29503249U1 (de) * | 1995-03-08 | 1995-11-02 | Hafner, Thomas, 78048 Villingen-Schwenningen | Chipkarte mit Wechselchip |
US5681356A (en) * | 1991-05-10 | 1997-10-28 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Method and apparatus for producing a plastic molded chip card having reduced wall thickness |
FR2783750A1 (fr) * | 1998-09-29 | 2000-03-31 | Schlumberger Ind Sa | Carte a module secable |
US6065681A (en) * | 1997-01-29 | 2000-05-23 | Orga Kartensysteme Gmbh | Method of producing data carriers |
FR2794264A1 (fr) * | 1999-05-27 | 2000-12-01 | Gemplus Card Int | Adaptateur pour dispositif electronique portable a circuit integre, de type carte a puce, d'un format reduit par rapport au format standard d'une mini-carte |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60252992A (ja) * | 1984-05-30 | 1985-12-13 | Toshiba Corp | Icカ−ド |
FR2625000B1 (fr) * | 1987-12-22 | 1991-08-16 | Sgs Thomson Microelectronics | Structure de carte a puce |
JPH0789277A (ja) * | 1993-09-24 | 1995-04-04 | Canon Inc | 複合カードの製造方法 |
KR100355209B1 (ko) * | 1994-09-22 | 2003-02-11 | 로무 가부시키가이샤 | 비접촉형ic카드및그제조방법 |
US5671525A (en) * | 1995-02-13 | 1997-09-30 | Gemplus Card International | Method of manufacturing a hybrid chip card |
US5975420A (en) * | 1995-04-13 | 1999-11-02 | Dai Nippon Printing Co., Ltd. | Apparatus and method of manufacturing an integrated circuit (IC) card with a protective IC module |
CN2268276Y (zh) * | 1996-11-11 | 1997-11-19 | 深圳市艾柯电子有限公司 | 超大容量ic卡 |
JP3960645B2 (ja) * | 1996-12-27 | 2007-08-15 | ローム株式会社 | 回路チップ搭載カードおよび回路チップモジュール |
JP4212068B2 (ja) * | 1997-05-19 | 2009-01-21 | ローム株式会社 | Icカードおよびicチップモジュール |
DE69837465T2 (de) * | 1997-06-23 | 2007-12-13 | Rohm Co. Ltd., Kyoto | Modul für ic-karte, ic-karte und verfahren zu seiner herstellung |
JPH1134553A (ja) * | 1997-07-18 | 1999-02-09 | Rohm Co Ltd | Icモジュール、およびその製造方法、ならびにこれを備えたicカード |
US6106317A (en) * | 1997-09-26 | 2000-08-22 | Thomas & Betts International, Inc. | IC chip card connector with pivotally and linearly movable cover |
US6651891B1 (en) * | 1997-11-04 | 2003-11-25 | Elke Zakel | Method for producing contactless chip cards and corresponding contactless chip card |
IL122250A (en) * | 1997-11-19 | 2003-07-31 | On Track Innovations Ltd | Smart card amenable to assembly using two manufacturing stages and a method of manufacture thereof |
FR2773900B1 (fr) * | 1998-01-22 | 2000-02-18 | Gemplus Card Int | Carte a circuit(s) integre(s) a contact, comportant une minicarte detachable |
US6193163B1 (en) * | 1998-08-31 | 2001-02-27 | The Standard Register Company | Smart card with replaceable chip |
JP4053667B2 (ja) * | 1998-09-14 | 2008-02-27 | 大日本印刷株式会社 | 板状枠体付きicキャリアおよびその製造方法 |
JP2000172814A (ja) * | 1998-12-02 | 2000-06-23 | Toppan Printing Co Ltd | 複合icモジュール及び複合icカード |
FR2788646B1 (fr) * | 1999-01-19 | 2007-02-09 | Bull Cp8 | Carte a puce munie d'une antenne en boucle, et micromodule associe |
DE19906570A1 (de) * | 1999-02-17 | 2000-08-24 | Giesecke & Devrient Gmbh | Tragbarer Datenträger mit herausnehmbarer Minichipkate |
US20030085288A1 (en) * | 2001-11-06 | 2003-05-08 | Luu Deniel V.H. | Contactless SIM card carrier with detachable antenna and carrier therefore |
US6634565B2 (en) * | 2001-11-06 | 2003-10-21 | Litronic, Inc. | Smart card having additional connector pads |
-
2001
- 2001-12-20 FR FR0117054A patent/FR2834103B1/fr not_active Expired - Fee Related
-
2002
- 2002-12-18 AT AT02799098T patent/ATE421129T1/de not_active IP Right Cessation
- 2002-12-18 JP JP2003555433A patent/JP2005513654A/ja active Pending
- 2002-12-18 US US10/498,550 patent/US7686228B2/en not_active Expired - Fee Related
- 2002-12-18 DE DE60230919T patent/DE60230919D1/de not_active Expired - Lifetime
- 2002-12-18 WO PCT/FR2002/004429 patent/WO2003054790A1/fr active Application Filing
- 2002-12-18 AU AU2002364324A patent/AU2002364324A1/en not_active Abandoned
- 2002-12-18 CN CNB028254244A patent/CN100350426C/zh not_active Expired - Fee Related
- 2002-12-18 EP EP02799098A patent/EP1459249B1/fr not_active Expired - Lifetime
- 2002-12-18 ES ES02799098T patent/ES2321175T3/es not_active Expired - Lifetime
-
2009
- 2009-03-31 JP JP2009088155A patent/JP2009187564A/ja active Pending
-
2012
- 2012-11-22 JP JP2012256477A patent/JP5840115B2/ja not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5681356A (en) * | 1991-05-10 | 1997-10-28 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Method and apparatus for producing a plastic molded chip card having reduced wall thickness |
DE4218923A1 (de) * | 1992-06-10 | 1992-10-22 | Haiss Ulrich | Wertkarte mit elektronik-wert-chip |
DE29503249U1 (de) * | 1995-03-08 | 1995-11-02 | Hafner, Thomas, 78048 Villingen-Schwenningen | Chipkarte mit Wechselchip |
US6065681A (en) * | 1997-01-29 | 2000-05-23 | Orga Kartensysteme Gmbh | Method of producing data carriers |
FR2783750A1 (fr) * | 1998-09-29 | 2000-03-31 | Schlumberger Ind Sa | Carte a module secable |
FR2794264A1 (fr) * | 1999-05-27 | 2000-12-01 | Gemplus Card Int | Adaptateur pour dispositif electronique portable a circuit integre, de type carte a puce, d'un format reduit par rapport au format standard d'une mini-carte |
Also Published As
Publication number | Publication date |
---|---|
JP5840115B2 (ja) | 2016-01-06 |
ES2321175T3 (es) | 2009-06-03 |
WO2003054790A8 (fr) | 2005-04-07 |
AU2002364324A1 (en) | 2003-07-09 |
JP2013058252A (ja) | 2013-03-28 |
DE60230919D1 (de) | 2009-03-05 |
ATE421129T1 (de) | 2009-01-15 |
FR2834103A1 (fr) | 2003-06-27 |
JP2009187564A (ja) | 2009-08-20 |
JP2005513654A (ja) | 2005-05-12 |
CN100350426C (zh) | 2007-11-21 |
US7686228B2 (en) | 2010-03-30 |
EP1459249A1 (fr) | 2004-09-22 |
EP1459249B1 (fr) | 2009-01-14 |
CN1605085A (zh) | 2005-04-06 |
US20050001039A1 (en) | 2005-01-06 |
FR2834103B1 (fr) | 2004-04-02 |
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Free format text: IN PCT GAZETTE 27/2003 ADD "DECLARATION UNDER RULE 4.17: - AS TO THE APPLICANT S ENTITLEMENT TO CLAIM THE PRIORITY OF THE EARLIER APPLICATION (RULE 4.17(III)) FOR ALL DESIGNATIONS."; ADD "DECLARATION UNDER RULE 4.17: - OF INVENTORSHIP (RULE 4.17(IV)) FOR US ONLY." |