WO2003034419A1 - Porte-substrats - Google Patents

Porte-substrats Download PDF

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Publication number
WO2003034419A1
WO2003034419A1 PCT/EP2002/010783 EP0210783W WO03034419A1 WO 2003034419 A1 WO2003034419 A1 WO 2003034419A1 EP 0210783 W EP0210783 W EP 0210783W WO 03034419 A1 WO03034419 A1 WO 03034419A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
substrate holder
receptacles
holding
gripping
Prior art date
Application number
PCT/EP2002/010783
Other languages
German (de)
English (en)
Inventor
Gerd Kreuder
Hans Günther KAUSSEN
Frank Michels
Original Assignee
Steag Hamatech Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Steag Hamatech Ag filed Critical Steag Hamatech Ag
Priority to EP02779423A priority Critical patent/EP1451817A1/fr
Publication of WO2003034419A1 publication Critical patent/WO2003034419A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor

Definitions

  • the present invention relates to a substrate holder with at least two substrate receptacles for receiving disk-shaped substrates between them, which are held together by at least one magnet. Furthermore, the present invention relates to a device for receiving substrates with first and second substrate receptacles for receiving disk-shaped substrates therebetween, which are held together by magnetic force, and a method and a device for separating the substrate receptacles.
  • a known substrate holder which is suitable for holding plastic disks, has two flat substrate receptacles for receiving the plastic disks in between.
  • recesses for receiving the plastic disks are provided in one of the substrate receptacles. After the plastic discs have been inserted into the recesses of the one substrate holder, the other substrate holder is placed on the one and held there by magnetic force.
  • the present invention is therefore based on the object of providing a substrate holder, a method and a device for receiving substrates with at least two substrate receptacles for receiving disk-shaped substrates, in which the substrate receptacles can be easily also without Generation of abrasion must be separated.
  • this object is achieved by a substrate holder with at least two substantially identical circumferential substrate receptacles for receiving disk-shaped substrates therebetween, at least one of the substrate receptacles having a recess for receiving the substrates, at least one magnet on at least one of the substrate receptacles for holding the Substrate receptacles, at least one recess in a first substrate receptacle, which allows a second substrate receptacle to reach behind, and at least one opening in the second substrate receptacle for the passage of a holding element of a handling device.
  • the recess in the first substrate holder allows the second substrate holder to be reached behind a corresponding gripping device in order to be able to pull the substrate receptacles apart against the magnetic force. When reaching behind and pulling apart, there is no abrasion, so that contamination of the substrates or the substrate receptacles can be prevented.
  • a holding element of a handling device can be passed through the second substrate receptacle in order to press the first substrate receptacle against a support element and to prevent the first substrate receptacle from moving with the second substrate receptacle.
  • the first substrate holder can be held stationary, so that substrates lying thereon do not jump when the substrate holders are separated.
  • two diametrically opposite recesses are provided in the first substrate holder in order to enable the second substrate holder to grip uniformly. Furthermore, the diametrically opposite recesses result in a uniform application of force to the second substrate holder when it is moved away from the first.
  • four openings are provided for passing a holding element of a handling device in the second substrate holder in order to be able to apply an evenly distributed holding force to the first substrate holder.
  • the first and / or the second substrate receptacle has at least one positioning recess which engages with a corresponding positioning element when the substrate receptacles are separated.
  • At least one of the substrate receptacles preferably has at least one process opening which enables access to a substrate accommodated in the substrate holder.
  • the object on which the invention is based is also achieved by a device for receiving substrates with at least first and second substantially identical circumferential substrate receptacles for receiving disk-shaped substrates therebetween, at least one of the substrate receptacles having at least one magnet for holding the substrate receptacles together and a handling device for separating the substrate receptacles, which has at least one holding element for holding the first substrate receptacle stationary and at least one gripping element which can be relatively assigned to the holding element for gripping and moving the second substrate receptacle, the gripping element being in an open, the second substrate receptacle releasing and a closed, the second substrate receptacle engaging position is movable and is movable in a direction substantially perpendicular to a connecting plane of the substrate receptacles.
  • Providing a holding element for holding the first substrate receptacle stationary prevents the first substrate receptacle from moving with the second substrate receptacle when the two substrate receptacles are separated. This prevents a relative movement between substrates and the first substrate holder.
  • the gripping element which can be moved relative to the holding element and can grip behind the second substrate receptacle and is movable in a direction essentially perpendicular to a connecting plane of the substrate receptacles, enables the second substrate receptacle to be detached from the first by generating abrasion.
  • At least one opening is provided in the second substrate receptacle, through which the holding element of the handling device can be passed, as a result of which the holding element and the gripping element can act on the substrate receptacles from the same side.
  • the substrate receptacle preferably has a recess into which the force element can be moved at least partially for movement into the closed position, in order to ensure that the second substrate is gripped behind. would take to ensure substantially the same circumferential dimensions of the substrate receptacles.
  • the first substrate receptacle preferably has two diametrically opposed recesses in order to enable access from opposing gripping elements for uniform force distribution when the substrate receptacles are separated.
  • the second substrate receptacle preferably has at least one positioning recess which interacts with the gripping element.
  • the gripping element preferably has a positioning element on which, in the closed position, the gripping element engages with the positioning recess of the second substrate receptacle.
  • the gripping element is preferably movable essentially parallel to the connection plane of the substrate receptacles.
  • a stop is preferably provided on the gripping element, which at least partially overlaps the second substrate holder in the closed position of the gripping element.
  • the first substrate holder is preferably pressed against the gripping element by a biasing element, in particular a spring, in order to suppress jumping.
  • the holding element is movably received in a housing of a holding device and is biased to move out of the housing.
  • This arrangement of the holding element makes it possible to move the housing of the holding device together with the gripping element. Because the holding element is accommodated in the housing and biased therefrom, it can remain in contact with the first substrate receptacle over a certain size of the movement of the gripping element until the first and second substrate receptacles are separated from one another.
  • the holding element is preferably a piston with a head part, which prevents the piston from moving out of the housing of the holding device.
  • a spring is provided in the housing, which prestresses the holding element out of the housing. In order to keep the first substrate receptacle stationary when it is separated from the second substrate receptacle, the spring has a sufficient pretensioning force to overcome the magnetic force acting between the substrate receptacles.
  • the housing of the holding element and the gripping element are preferably arranged fixed to one another in the direction substantially perpendicular to the combustion plane of the substrate holder in order to enable their movement with a single drive element.
  • the gripping element and the holding device are preferably attached to a common carrier.
  • the holding device is preferably attached to the carrier by means of elongated holes.
  • Four holding elements are preferably provided in order to provide a uniformly distributed holding force for the first substrate holder.
  • At least one second device for receiving substrates is provided, the handling devices for separating the substrate receptacles being attached to a common carrier in order to be able to actuate the handling devices with a common drive element.
  • the carrier is preferably connected centrally to a shaft which can be displaced in the longitudinal direction, and the handling devices are attached to the free ends of the carrier.
  • the above object is also achieved by a method for separating first and second substrate receptacles of a substrate holder, which are held together by magnetic force, in which the first The substrate receptacle is contacted with at least one holding element in order to keep it stationary, the second substrate receptacle is gripped behind with at least one gripping element and a relative movement is generated between the holding element and the gripping element, the relative movement being directed essentially perpendicular to a connecting plane between the substrate receptacles.
  • the method according to the invention enables the frictionless separation of first and second substrate receptacles of a substrate holder in such a way that the one substrate receptacle is kept stationary during the separation process.
  • the holding element for contacting the first substrate receptacle is passed through an opening in the second substrate receptacle in order to allow access to the substrate receptacles of the substrate holder through the holding element and the gripping element from one side.
  • FIG. 1 is a perspective view of an apparatus for loading and unloading substrate holders according to the present invention
  • Fig. 2 is an enlarged perspective view of part of Fig. 1
  • FIG. 3 shows a schematic sectional view of part of the device according to FIG. 1;
  • FIG. 4 shows a schematic top view of part of the device according to FIG. 1.
  • the device 1 shows a device 1 for loading and unloading substrate holders 2.
  • the device 1 has a transport device with a turntable 4 for the substrate holder 2 and a handling device 6 for opening and closing the substrate holder 2.
  • the substrate holders 2, which are also referred to as trays, are formed by first and second substrate receiving elements (substrate receptacles) 8, 9.
  • the substrate receiving element 8 is referred to as the upper part, while the substrate receiving element 9 is referred to as the lower part, although they could also be used vice versa.
  • the upper and lower parts 8, 9 of the substrate holder 2 have essentially the same circumferential dimensions and are formed by round plates made of magnetic material.
  • the upper part 8 has six process openings 11.
  • the process openings 11 are each centered into a magical circle which is concentric with respect to a central axis of the upper part 8.
  • the process openings 11 are evenly spaced apart on the imaginary circle.
  • Each of the process openings 11 of the upper part 8 has a bevel 12 on its side facing away from the lower part 9.
  • the underside of the upper part 8, not shown, is flat.
  • the upper part 8 also has four through openings 14 which, as will be described in more detail below, are used to pass holding elements of the handling device 6 through.
  • the through openings 14 are located in the edge region of the upper part 8 in order not to impair the stability of the upper part 8 in the region of the process openings 11. Furthermore, they are thus outside a working area of a processing device in which substrates received in the substrate holder are treated.
  • three centering openings 16 are formed which are spaced apart at irregular angles, the function of which will be explained in more detail below.
  • the uneven spacing allows the top to be put down in just one orientation.
  • two diametrically opposite position notches 18 are also provided, the functions of which will be described in more detail below.
  • the through openings 14 are arranged in pairs symmetrically to a line connecting the position notches 18.
  • the lower part 9, like the upper part 8, has six process openings 20.
  • the process openings 20 are in turn centered on a circle concentric with the central axis of the lower part 9.
  • the size, position and shape of the process openings 20 of the lower part 9 correspond to those of the process openings 11 in the upper part 8.
  • bevels are again formed, but these cannot be seen in the figures.
  • recesses (not shown in detail) for receiving substrate disks, in particular plastic disks for the production of optical data carriers, are formed in the surface of the lower part 9 facing the upper part 8.
  • the depth of the recesses corresponds to the height of the substrate wafers to be received, in order to enable the substrate wafers to be received without stress between the upper part 8 and the lower part 9 of the substrate holder 2.
  • the depth of the recess can also be only half the thickness of the substrate wafers to be accommodated if corresponding recesses are provided in the upper part 8.
  • the recesses receiving the substrate wafers are provided exclusively in the upper part 8.
  • the lower part 9 has three centering openings which correspond to the centering openings 16 in the upper part 8.
  • the centering openings in the upper and lower part work with frustoconical, centering projections 22 of a support in order to ensure correct alignment of the upper and lower part 8, 9.
  • internal centering elements (not shown) can be provided between the upper and lower parts 8, 9, which ensure proper alignment.
  • the lower part 9 has two diametrically opposite recesses 24.
  • the recesses 24 lie in a properly assembled state of the upper part 8 and the lower part 9 in the area of the positioning notches 18.
  • the recesses 24 are larger than the positioning notches 18 in the upper part 8 in order thereby to allow parts of the upper part 8 to reach behind, as described in more detail below becomes.
  • a corresponding centering notch 26 can be provided in the upper and lower parts 8, 9, as indicated schematically in FIG. 2.
  • the centering notch 26 has in particular the function of positioning the substrate holder 2 in a processing device.
  • a large number of magnets 28 are inserted in the surface of the lower part 9 facing the upper part 8, as can best be seen in the sectional view according to FIG. 3.
  • the magnets 28 hold the upper part 8 and the lower part 9 of the substrate holder 2 together in a closed state of the substrate holder 2.
  • the magnets 28 exert sufficient magnetic force to hold the upper and lower parts 8, 9 of the substrate holder securely together during treatment of the substrate wafers received between them.
  • the magnets 28 can also be provided in the upper part 8 or magnets can be provided in the upper and lower parts 8, 9. It is only essential that the upper and lower parts 8, 9 are held together by magnetic force, so that the need for external clamping elements and / or other devices for holding the upper and lower parts 8, 9 together is not necessary.
  • the transport device 4 has a round, plate-shaped turntable 30.
  • the transport device 4 has a suitable drive for the turntable 30, which rotates the turntable 30 by 90 ° during each movement step.
  • the turntable 30 has a central opening (not shown in more detail) for carrying out a non-rotatable but longitudinally displaceable shaft 32, the function of which will be described in more detail below.
  • the turntable 30 also has eight openings 34 which are centered on a circumferential circle which is concentric with the central opening and which are evenly spaced on the circumferential circle.
  • the support units 36 extend through the openings 34 in the turntable 30 and are fastened to the turntable in a suitable manner.
  • the support units 36 each have a support plate 40, the circumferential dimensions of which essentially correspond to the circumferential dimensions of the substrate holder 2.
  • the support plate 40 has the frustoconical centering projections 22 which cooperate with the centering openings in the upper and lower parts 8, 9.
  • centering and aligning devices can also be provided on the support plate 40, which cooperate with suitable centering and aligning devices on the upper and / or lower part 8, 9 of the substrate holder 2 in order to center them with respect to the support plate 40 and align.
  • Six centering pins 42 are provided on the support plate 40, which are each arranged centrally with respect to the process openings 20 of the lower part 9 when the lower part is placed on the support plate 40, in order to ensure that the substrate disks are centered when placed on the lower part 9.
  • the support plate 40 also has two diametrically opposite recesses 44 which are aligned with the recesses 24 in the lower part 9 of the substrate holder 2 and which have a corresponding shape and size.
  • the handling device 6 for opening and closing the substrate holder 2 is attached to the shaft 32.
  • the shaft 32 is stationary in the direction of rotation but can be displaced in the longitudinal direction of the shaft 32 by means of a suitable lifting mechanism.
  • the handling device 6 has a cross member 50 attached to the shaft 32, which is connected to the shaft 32 in a suitable manner in the region of a central opening.
  • a handling unit 52 of the handling device 6 is attached to the opposite ends of the carrier 50. Because of this special arrangement, the handling device 6 is also referred to as bridge handling.
  • the handling units 52 each have a further carrier 54 attached to the carrier 50.
  • Four hold-down devices 56 and two gripping devices 58 offset by 180 ° are attached to the carrier.
  • the hold-down devices 56 are attached to the carrier 54 via so-called elongated holes in order to enable the hold-down devices 56 to be attached in an adjustable manner in the direction of displacement of the shaft 32.
  • the structure of the hold-down device is best shown schematically in FIG. 3, the support 54 and the attachment of the hold-down device 56 to the support 54 not being shown in the illustration according to FIG. 3.
  • the hold-down device 56 has a housing 60 with a closed end wall 61, side walls 62, and a second end wall 63 opposite the end wall 61 and having a through opening.
  • a chamber 65 is formed in the interior of the housing 60, in which a spring 66 and the head end 67 of a piston 68 are arranged.
  • a shaft part 69 of the piston 68 which adjoins the head part 67, extends through the opening in the end wall 63 and is guided in a longitudinally displaceable manner therein.
  • the spring 66 biases the piston 68 outward from the housing 60.
  • the head portion 67 of the piston 68 is sized so that it does not fit through the opening in the end wall 63 of the housing 60, thereby limiting the movement of the piston 68 out of the housing 60.
  • the piston 68 is prestressed out of the housing 60 by a spring 66, this prestressing can also be done in another way can be achieved, such as by a fluid in chamber 65.
  • the preload of the piston 68 can be controlled by introducing and discharging a fluid into the chamber 65. This control of the pretension can take place in addition or as an alternative to the pretension by the spring 66.
  • the prestressing of the piston 68 generated by the spring 66 or a fluid is sufficient, as will be described in more detail below, to press the lower part 9 firmly against the support plate 40, while the upper part 8 from the lower part 9 counteracts the magnetic force acting therebetween is lifted off.
  • the pretensioning of the piston 68 over the entire stroke movement of the piston 68 is sufficient to prevent the lower part 9 from being lifted off the support plate 40 during the detachment of the upper part 8.
  • the gripping device 58 has two support arms 75 which are opposite each other by 180 ° and which extend essentially parallel to the support lath 40 or the substrate support 2.
  • the support arms 75 can be moved essentially parallel to the support plate 40 by means of a suitable actuating unit in order to bring about an opening and closing of the gripping device 58.
  • a fastening flange 77 which extends essentially perpendicular to the support arms 75.
  • a gripping flange 79 is attached to the free end of the carrier flange 77 spaced from the carrier arm 75 and extends essentially parallel to the carrier arm 75.
  • the width and height of the gripping flange 79 is dimensioned such that the gripping flange 79 fits into the recesses 24 and 44 of the lower part 9 or the support plate 40.
  • a positioning bolt 81 is also attached to the carrier flange 77 and, as can best be seen in FIG. 4, can be inserted into the positioning notch 18 in order to prevent the upper part 8 from rotating with respect to the lower part 9 during separation.
  • a stop element 82 is provided which prevents excessive jumping of the Upper part 8 prevented when detaching from the lower part 9.
  • a spring element can be provided on the stop element 82, which acts against the upper part 8 in order to prevent it from jumping and to press the upper part 8 against the gripping flange 79.
  • the carrier flange 77 with the gripping flange 79 and the positioning bolt 81 can be moved according to FIG. 3 both in the vertical direction and in the horizontal direction, as indicated by the double arrows.
  • the vertical movement takes place via a longitudinal movement of the shaft 32, while the horizontal movement takes place via the actuation units for the support arms 75, which are not shown in detail.
  • a suitable element such as, for example, a spring can also be provided between the housing 60 of the holding element 56 and the upper part 8 of the substrate holder 2, which element causes the upper part 8 to snap when the upper part 8 is separated from the lower part 9 prevented.
  • the device 1 is in the position shown in FIG. 1.
  • substrate disks such as plastic disks for the formation of optical data carriers, in particular data play disks, CDs, DVDs etc.
  • the handling device 6 is lowered in the vertical direction via the shaft 32 in order to place the upper part 8 of the substrate holder 2 on the lower part 9.
  • the pistons 68 of the holding elements 56 first come into contact with the lower part 9 and are moved upward against the prestressed spring 66 in the housing 60.
  • the upper and lower parts 8, 9 are centered on one another when they are placed one on top of the other, although centering of the two elements with respect to one another is generally not necessary since the upper and Bottoms 8, 9 are only moved in the vertical direction when separating and assembling.
  • the substrate holder 2 in position A is now closed and loaded. Then the turntable 30 is rotated counterclockwise by 90 °. The closed and loaded substrate holder 2 is now in position B. The substrate holder 2 can be removed from this position in order to coat the substrate wafers, for example in a sputtering device. After coating, the substrate holder 2 is again placed in position B. Then the turntable 30 is again rotated through 90 °, so that the substrate carrier 2 with the now coated substrates is in position C.
  • the substrate carrier 2 is first opened by the handling device 6.
  • the handling device 6 is lowered via the shaft 32.
  • the pistons 68 of the holding elements 56 extend through the corresponding through openings 14 in the upper part 8 and contact the lower part 9.
  • the pistons 68 are moved in the housing 60 against the bias of the spring 66.
  • the grippers 58 are moved radially inward so that the gripping flanges 79 extend into the recesses in the lower part 9 or the support plate 40 and a partial area reach behind the upper part 8.
  • the portion of the upper part 8 which is gripped behind is provided with the reference symbol 90 in FIGS. 3 and 4.
  • the entire handling device 6 is then raised via the shaft 32.
  • the gripping flange 79 comes into contact with the recessed portion 90 of the upper part 8.
  • the upper part 8 is now lifted off the lower part 9.
  • the pistons 68 press the lower part 9 against the support plate 40.
  • the stroke length of the piston 68 in the housing 60 is selected in such a way that it is long enough to exert a force on the lower part 9 until the upper part 8 and the lower part 9 are sufficiently spaced from one another that a magnetic attraction between the two elements is no longer sufficient to raise the lower part 9.
  • the force of the spring 66 is selected such that it provides sufficient force over the movement of the piston 68 to overcome the magnetic force acting between the upper and lower part.
  • the upper part 8 can jump onto the gripping flange 79. Excessive jumping of the upper part 8 is prevented by the stop 82 and / or another element which presses the upper part 8 against the gripping flange 79 and is arranged, for example, between the housing 60 of the holding element 56 and the upper part 8.
  • the positioning bolt 81 is also located in the positioning notch 18 of the upper part 8 in order to prevent rotation with respect to the lower part 9 when the upper part 8 is released.
  • the substrate holder 2 is open, the now coated plastic disks are unloaded by a handling device, not shown. Subsequently, the substrate holder 2 is closed in the reverse order to the opening process.
  • the turntable 30 is again rotated through 90 °, so that the unloaded substrate holder 2 is now in position D.
  • the substrate holder 2 can be removed and, for example, fed to a cleaning device.
  • the substrate holder 2 is again placed on the support plate 40, and the rotary table 30 is rotated through 90 °.
  • the empty, cleaned substrate holder 2 is now in position A, where it is opened by the handling device 6 in the manner described above. Now the substrate holder 2 is again in a loading position.
  • the opening and closing of the substrate holder 2 takes place simultaneously in positions A and C, which is possible in a simple manner by designing the handling device 6 as a bridge handling device.
  • the substrate holder 2 can have a different number of process openings than the illustrated.
  • the upper part or the lower part can have process openings.
  • a different number of grippers 58 can also be provided, but these should be distributed uniformly around the circumference of the substrate holder 2 in order to apply a force that is as uniform as possible.
  • a single holding element 56 could be provided which extends through a central opening in the Upper part 8 extends.
  • a single gripping element for gripping and lifting the upper part 8 is also conceivable.
  • the present invention is also not limited to substrate holders for holding thin plastic disks for coating them.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Packaging For Recording Disks (AREA)

Abstract

L'objectif de l'invention est de créer un porte-substrats dans lequel les substrats peuvent être séparés facilement et sans frottement. Cet objectif est atteint grâce à un porte-substrats comprenant au moins deux éléments de maintien (8, 9) de substrats, sensiblement de même circonférence, destinés à maintenir des substrats en forme de disque placés entre ces deux éléments, au moins un des éléments de maintien (9) comportant une cavité (12) dans laquelle viennent se loger les substrats. Au moins un des éléments de maintien de substrats est pourvu d'au moins un aimant destiné à maintenir ensemble lesdits éléments de maintien. Par ailleurs, au moins un évidement (24) ménagé dans un premier des éléments de maintien de substrats permet de saisir par l'arrière un deuxième élément de maintien, tandis qu'au moins une ouverture (14) dans ce deuxième élément de maintien permet d'introduire un élément de retenue d'un dispositif de manipulation. L'invention concerne en outre un procédé, ainsi qu'un dispositif destiné à maintenir des substrats, ce dispositif comprenant au moins un premier et un deuxième élément de maintien de substrats, sensiblement de même circonférence, destinés à maintenir des substrats en forme de disque placés entre ces deux éléments, au moins un de ces éléments de maintien de substrats étant pourvu d'au moins un aimant destiné à maintenir ensemble lesdits éléments de maintien. Un dispositif de manipulation est utilisé pour séparer les éléments de maintien de substrats, ce dispositif comprenant au moins un élément de retenue servant à immobiliser le premier élément de maintien, ainsi qu'au moins un élément de préhension, mobile par rapport à l'élément de retenue, servant à saisir et déplacer le deuxième élément de maintien. L'élément de préhension peut être déplacé entre une position ouverte, libérant le deuxième élément de maintien, et une position fermée, dans laquelle le deuxième élément de maintien est saisi par l'arrière, ledit élément de préhension étant mobile dans une direction sensiblement perpendiculaire à un plan de jonction des éléments de maintien de substrats.
PCT/EP2002/010783 2001-10-15 2002-09-26 Porte-substrats WO2003034419A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP02779423A EP1451817A1 (fr) 2001-10-15 2002-09-26 Porte-substrats

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10150809.3 2001-10-15
DE2001150809 DE10150809B4 (de) 2001-10-15 2001-10-15 Substrathalter

Publications (1)

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WO2003034419A1 true WO2003034419A1 (fr) 2003-04-24

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PCT/EP2002/010783 WO2003034419A1 (fr) 2001-10-15 2002-09-26 Porte-substrats

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EP (1) EP1451817A1 (fr)
DE (1) DE10150809B4 (fr)
TW (1) TWI220139B (fr)
WO (1) WO2003034419A1 (fr)

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EP1630260A2 (fr) * 2004-08-20 2006-03-01 JDS Uniphase Inc. Verrou magnétique pour un appareil de dépôt en phase vapeur
US7785456B2 (en) 2004-10-19 2010-08-31 Jds Uniphase Corporation Magnetic latch for a vapour deposition system
WO2016162071A1 (fr) * 2015-04-09 2016-10-13 Applied Materials, Inc. Système de support pour substrats à traiter
CN115053010A (zh) * 2019-12-19 2022-09-13 欧瑞康表面处理解决方案股份公司普费菲孔 用于在基材表面加工期间保持基材的保持系统
CN115053014A (zh) * 2019-12-19 2022-09-13 欧瑞康表面处理解决方案股份公司普费菲孔 在基片表面加工期间对可磁化基片进行保持的保持装置

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DE102005021831A1 (de) * 2005-05-11 2006-11-23 Mühlbauer Ag Vorrichtung zum Transportieren von Plättchen

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1630260A2 (fr) * 2004-08-20 2006-03-01 JDS Uniphase Inc. Verrou magnétique pour un appareil de dépôt en phase vapeur
EP1630260A3 (fr) * 2004-08-20 2008-11-05 JDS Uniphase Inc. Verrou magnétique pour un appareil de dépôt en phase vapeur
US7790004B2 (en) 2004-08-20 2010-09-07 Jds Uniphase Corporation Substrate holder for a vapour deposition system
US7785456B2 (en) 2004-10-19 2010-08-31 Jds Uniphase Corporation Magnetic latch for a vapour deposition system
WO2016162071A1 (fr) * 2015-04-09 2016-10-13 Applied Materials, Inc. Système de support pour substrats à traiter
CN115053010A (zh) * 2019-12-19 2022-09-13 欧瑞康表面处理解决方案股份公司普费菲孔 用于在基材表面加工期间保持基材的保持系统
CN115053014A (zh) * 2019-12-19 2022-09-13 欧瑞康表面处理解决方案股份公司普费菲孔 在基片表面加工期间对可磁化基片进行保持的保持装置
CN115053014B (zh) * 2019-12-19 2024-06-04 欧瑞康表面处理解决方案股份公司普费菲孔 在基片表面加工期间对可磁化的基片进行保持的保持装置

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DE10150809A1 (de) 2003-04-30
DE10150809B4 (de) 2005-06-16
EP1451817A1 (fr) 2004-09-01
TWI220139B (en) 2004-08-11

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