WO2003009368A2 - Transistor bipolaire à hétérojonction grande vitesse à base de gaas comportant des contacts à faible résistance d'émission - Google Patents
Transistor bipolaire à hétérojonction grande vitesse à base de gaas comportant des contacts à faible résistance d'émission Download PDFInfo
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- WO2003009368A2 WO2003009368A2 PCT/US2002/023278 US0223278W WO03009368A2 WO 2003009368 A2 WO2003009368 A2 WO 2003009368A2 US 0223278 W US0223278 W US 0223278W WO 03009368 A2 WO03009368 A2 WO 03009368A2
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- Prior art keywords
- layer
- bipolar transistor
- heterojunction bipolar
- collector
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- 239000000463 material Substances 0.000 claims description 100
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 24
- 239000004065 semiconductor Substances 0.000 claims description 23
- 150000001875 compounds Chemical class 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 21
- 239000011810 insulating material Substances 0.000 claims 6
- 239000002674 ointment Substances 0.000 claims 1
- 239000012535 impurity Substances 0.000 description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 238000011084 recovery Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- -1 for example Substances 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000001451 molecular beam epitaxy Methods 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 229910052714 tellurium Inorganic materials 0.000 description 2
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/6631—Bipolar junction transistors [BJT] with an active layer made of a group 13/15 material
- H01L29/66318—Heterojunction transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0804—Emitter regions of bipolar transistors
- H01L29/0817—Emitter regions of bipolar transistors of heterojunction bipolar transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
- H01L29/452—Ohmic electrodes on AIII-BV compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/73—Bipolar junction transistors
- H01L29/737—Hetero-junction transistors
- H01L29/7371—Vertical transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
- H01L29/161—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System including two or more of the elements provided for in group H01L29/16, e.g. alloys
Definitions
- This invention relates generally to semiconductor transistors.
- the invention relates to heterojunction bipolar transistors.
- Heterojunction bipolar transistors offer much higher speed of operation than the more prevalent metal-oxide- semiconductor field-effect transistors (MOSFETs) or even conventional homojunction bipolar transistors, e.g., pnp or npn silicon transistors. Because HBTs offer high speed, a high current driving capability, and a low 1/f noise levels, HBTs are becoming popular for use as integrated switching devices and microwave devices in wireless communications systems and sub-systems, satellite broadcast systems, automobile collision avoidance systems, global positioning systems, and other high-frequency applications.
- MOSFETs metal-oxide- semiconductor field-effect transistors
- HBTs are becoming popular for use as integrated switching devices and microwave devices in wireless communications systems and sub-systems, satellite broadcast systems, automobile collision avoidance systems, global positioning systems, and other high-frequency applications.
- HBT high-power Bluetooth
- wireless electronic devices such as wireless telephones and other like electronic devices that are capable of communicating with a network in a wireless manner.
- HBT's offer many benefits over bipolar silicon transistors, there remains a need to improve or extend the frequency response of HBT's.
- the present invention provides an GaAs based HBT having an increased or extended frequency response.
- the GaAs based HBT provides an improved frequency response by reducing an emitter resistance value of the HBT.
- a heterojunction bipolar transistor is provided that includes a substrate, a collector portion having at least one layer of a first material disposed on the substrate to form a first stack, a base portion having at least one layer of a second material disposed on a portion of the collector portion to form a second stack.
- the HBT further includes an emitter portion having at least one layer of the first material disposed over a portion of the base portion to form a third stack and a contact portion having at least one layer of the first material and at least one layer of an In x Ga ! .
- the In x Ga 1-x (As 1-y Sb y ) (0 ⁇ x ⁇ 0.7) (0 ⁇ y ⁇ 0.5)material of the contact portion and the first material of the contact portion provide a minimal conduction band offset in the contact region of the HBT, when compared to other material types.
- a conduction band discontinuity between in the contact region is minimized to improve the flow of electrons between the contact region and the emitter region, and, as such, realizes a reduction in the resistance value of the emitter region.
- the reduced resistance value of the emitter significantly increases the frequency response of the HBT. As such, the current gain cutoff frequency (fir) of the HBT is improved above 200 GHz.
- a heterojunction bipolar transistor in another embodiment, includes a substrate, a collector portion having at least one layer of a first material disposed on the substrate to form a first stack, a base portion having at least one layer of a second material disposed on a portion of the collector portion to form a second stack.
- the HBT further includes an emitter portion having at least one layer of a third material disposed over a portion of the base portion to form a third stack and a contact portion having at least one layer of the first material and at least one layer of an In x Ga 1-x (As 1-y Sb y ) (0 ⁇ x ⁇ 0.7) (0 ⁇ y ⁇ 0.5)material disposed over a portion of the emitter portion to form a fourth stack.
- the (0 ⁇ x ⁇ 0.7) (0 ⁇ y ⁇ 0.5) of the contact portion and the first material of the contact portion provide a minimal conduction band offset in the contact region of the HBT, when compared to other material types.
- a conduction band discontinuity in the contact region is minimized to improve the flow of electrons between the emitter region and the contact region, and as such, reduce the resistance value of the emitter region.
- the reduced resistance value realized by the emitter significantly increases the frequency response of the HBT. As such, the current gain cutoff frequency (fir) of the HBT is improved above 100 GHz.
- a method for forming a compound semiconductor device having an extended frequency response includes steps for forming a collector stack having at least one layer of a first material on a substrate and forming a base stack having at least one layer of a second material on a portion of the collector stack.
- the method further provides the steps for forming an emitter stack having at least one layer of the first material on a portion of the base stack, and forming a contact stack having at least one layer of the first material and at least one layer of an In x Ga 1-x (As 1-y Sb y ) (0 ⁇ x ⁇ 0.7) (0 ⁇ y ⁇ 0.5) material on a portion of the emitter stack.
- the forming of the contact stack of the In x Ga 1-x (As 1-y Sb y ) (0 ⁇ x ⁇ 0.7) (0 ⁇ y ⁇ 0.5)material and first material allows the fabricated compound semiconductor device to realize a significant reduction in emitter resistance due to a minimal conduction band offset value in the contact stack.
- the resulting compound semiconductor device realizes an improved or extended fir of about 100 GHz.
- a method for forming a compound semiconductor device having an extended frequency response includes steps for forming a collector stack having at least one layer of a first material on a substrate and forming a base stack having at least one layer of a second material on a portion of the collector stack.
- the method further provides the steps for forming an emitter stack having at least one layer of a third material on a portion of the base stack, and forming a contact stack having at least one layer of the first material and at least one layer of an In x Ga 1-x (As 1-y Sb y ) (0 ⁇ x ⁇ 0.7) (0 ⁇ y ⁇ 0.5) material on a portion of the emitter stack.
- the forming of the contact stack of the In x Ga 1-x (As 1-y Sb y ) (0 ⁇ x ⁇ 0.7) (0 ⁇ y ⁇ 0.5)material and the first material allows the fabricated compound semiconductor device to realize a significant reduction in emitter resistance due to a minimal conduction band offset value in the contact stack.
- the resulting compound semiconductor device realizes an improved or extended r greater than 100 GHz.
- Figure 1 is a cross-sectional view of a heterojunction bipolar transistor according to a first illustrative embodiment of the present invention.
- Figure 2 is a cross-sectional view of a heterojunction bipolar transistor according to a second illustrative embodiment of the present invention.
- Figure 3 is a block-fold diagram illustrating steps taking to fabricate one of the heterojunction bipolar transistors illustrated in Figures 1 -2.
- the compound semiconductor of the present invention employs a contact region in communication with an emitter region to allow the compound semiconductor device to realize an improved or extended frequency response.
- the fr realized by the compound semiconductor device extends or improves the frequency response of the device to about 100 G Hz.
- the improved cutoff frequency of the compound semiconductor is particularly suitable for applications where the compound semiconductor device operates as part of a clock data recovery circuit, as a multiplexer circuit or part of a multiplexer circuit, as a transimpedance amplifier, or as a laser driver.
- each of the illustrative embodiments described below are directed to GaAs based HBT device for use in portable or mobile electronic devices, such as cellular telephones, laptop computers with wireless modems and other like portable consumer devices, or other wireless communication devices and systems, such as satellite systems, terrestrial based systems, or a hybrid of terrestrial and satellite based systems.
- the compound semiconductor device of the present invention is configurable to suit a selected application as illustrated in the exemplary embodiments described in more detail below.
- the compound semiconductor device of the present invention provides a range of significant benefits to engineers that design electronic devices capable of communicating with a network in a wireless manner.
- the compound semiconductor device of the present invention can extend or increase the cutoff frequency of the electronic device that communicates with a network in a wireless manner to provide the device or network with an improved bandwidth.
- the compound semiconductor device of the present invention is able to improve or extend the fa of an GaAs HBT to greater than 100 GHz. In this manner, the GaAs HBT of the present invention is well suited for applications that benefit from a device with a high switching speed, for example a multiplexer, a clock and data recovery circuit, or other like high speed operation.
- FIG. 1 illustrates a cross-sectional view of an HBT according to a first illustrative embodiment of the present invention.
- the HBT 10 includes a collector region, a base region, an emitter region, and a contact region.
- the collector region of the HBT 10 includes a sub-collector layer 12 formed over a portion of a substrate 11 and a collector layer 14 formed over a portion of the sub-collector layer 12.
- the base region of the HBT 10 includes a base layer 16.
- the HBT 10 includes an emitter layer 18.
- the contact region of the HBT 10 includes a contact 20, and a contact layer 22.
- the HBT 10 further includes an emitter electrode 24 formed over a portion of the contact layer 22, base electrodes 26 A and 26B formed over portions of the base layer 16, and collector electrodes 28 A and 28B formed over portions of the sub-collector layer 12.
- the sub-collector layer 12 is a GaAs material formed over an GaAs substrate 11 and has a thickness of about 500 nm with an n-type impurity concentration of about 4x10 18 cm ⁇ 3 .
- the thickness of the sub-collector layer 12 can be incrementally changed in 1 nm increments in a range from between about 500 nm and about 1,500 nm to reach a desired value.
- the collector layer 14 is formed over a portion of the sub-collector layer 12.
- the formed GaAs material of the collector layer 14 has a thickness of about 300 nm and is doped to have an n-type impurity concentration of about lx 10 16 cm -3 .
- the collector layer 14 can have its thickness incrementally changed in 1 nm increments in a range from between about 100 nm and about 2000 nm to reach a desired thickness.
- the base layer 16 is a GaAs material formed over a portion of the collector layer
- the base layer 16 is doped with p + impurities to have a high impurity concentration of about 4 x 10 19 cm ⁇ 3 . It is further desirable to form the base layer 16 to have a thickness of between about 20 nm and about 40 nm. The thickness of the base layer 16 can be incrementally changed in 1 nm increments across the range of thickness to reach a desired value.
- the impurity concentration in the base layer can range from 1 x 10 tO l x lO cm " .
- the emitter layer 18 is formed of an Al x Ga 1-x As (0 ⁇ x ⁇ 0.5) material over a portion of the base layer 16.
- the emitter layer 18 is doped with TST 1" impurities in a concentration of about 3 x 10 17 cm “ ⁇ 3 .
- the emitter layer 18 is formed to have a thickness of about 50 nm, but can have a thickness of between about 10 nm and about 200 nm. The thickness of the emitter layer 18 can be incrementally changed in 1 nm increments across the thickness range to reach a desired thickness value.
- the contact 20 is an GaAs material doped with N type impurities in a high concentration of about 4 x 10 cm ⁇ .
- the contact 20 is formed to have a thickness of about 100 nm and is formed over a portion of the emitter layer 18.
- the thickness of the contact 20 can range from between about 50 nm to about 300 nm in 1 nm increments.
- the contact layer 22 is formed from an In x Ga 1-x (As 1-y Sb y ) (0 ⁇ x ⁇ 0.7) (0 ⁇ y ⁇
- the contact layer 22 is formed to have a thickness of between about 30 nm and about 150 nm, and is formed over a portion of the contact 20.
- the thickness of the contact layer 22 can range from between about 30 nm and about 150 nm in increments of 1 nm.
- the contact layer 22 formed from the material and the contact 20 formed of the GaAs material provides a significant reduction in an emitter resistance value.
- the minimal conduction band offset or discontinuity between the In x Ga 1-x (As 1-y Sb y ) (0 ⁇ x ⁇ 0.7) (0 ⁇ y ⁇ 0.5) material and the GaAs material that form the contact portion of the HBT 10 allow the emitter portion of the HBT 10 to realize a significant reduction in an emitter resistance value.
- the contact portion of the HBT 10 can be doped with a variety of n-type dopants, for example, silicon, tellurium, sulfur, tin, or selenium to realize a lower emitter resistance.
- the use of indium in the contact portion of the HBT 10 provides an increase in the electron mobility, which, in turn, provides a reduction in the resistance value associated with the emitter portion of the HBT 10.
- the HBT 10 is well suited for use in or as a high speed multiplexer or in a high speed clock or data recovery circuit.
- FIG. 2 illustrates a cross-sectional view of an HBT 40 according to a second illustrative embodiment of the present invention.
- the HBT 40 includes a collector region, a base region, an emitter region, and a contact region.
- the collector region of the HBT 40 includes a sub-collector layer 42 formed over a portion of a substrate 41, and a collector layer 44 formed over a portion of the sub-collector layer 42.
- the base region of the HBT 40 includes a base layer 46.
- the emitter region of the HBT 40 includes an emitter layer 48.
- the contact region of the HBT 40 includes a contact 50, and a contact layer 52.
- the HBT 40 further includes an emitter electrode 54 formed over a portion of the contact layer 52, base electrodes 56A and 56B formed over portions of the base layer 46, and collector electrodes 58 A and 58B formed over portions of the sub-collector layer 52.
- the substrate is an GaAs material.
- the sub-collector layer 52 is an InP material formed over the substrate 41 and has a thickness of about 500 nm with an n-type impurity concentration of about 4x10 cm .
- the sub-collector layer 52 can have a thickness from between about 500 nm to about 1,500 nm.
- the thickness of the sub-collector layer 52 can be changed in increments of about 1 nm.
- the collector layer 44 is formed of an GaAs material over a portion of the sub-collector layer 52.
- the formed GaAs material of the collector layer 44 has a thickness of about 300 nm and is doped with an n-type impurity concentration of about lx 10 16 cm -3 .
- the collector layer 44 can have its thickness changed in 1 nm increments in a range from between about 100 nm to about 2,000 nm.
- the base layer 46 is a p-type GaAs material formed over a portion of the collector layer 44, and is formed to have a thickness of less than about 40 nm.
- the base layer 46 is doped to have an acceptor impurity concentration of about 4 x 10 19 cm ⁇ 3 . It is further desirable to form the base layer 46 to have a thickness of between about 20 nm and about 40 nm.
- the thickness of the base layer 46 can be changed in increments of 1 nm.
- the impurity concentration in the base layer can range from 1 x 10 19 tO 1 x 10 20 cm "
- the emitter layer 48 is formed of an In 0 51 Gao. 49 p material over a portion of the base layer 46.
- the emitter layer 48 is doped with N type impurities in a concentration of about 3 x 10 cm .
- the emitter layer 48 is formed to have a thickness of between about 50 nm to about 300 nm in 1 nm increments. It is desirable to form the emitter layer 48 with a thickness of about 50 nm.
- the contact 50 is an GaAs material doped with N "1" type impurities in a high concentration of about 4 x 10 cm .
- the contact 50 is formed to have a thickness of between about 5 nm and about 300 nm in 1 nm increments, and is formed over a portion of the emitter layer 48. It is desirable to form the contact 50 to have a thickness of about 100 nm.
- the contact layer 52 is formed from an In x Ga 1-x (As 1-y Sb y ) (0 ⁇ x ⁇ 0.7) (0 ⁇ y ⁇
- the contact layer 52 is desirably formed to have a thickness of between about 30 nm and about 150 nm in 1 nm increments. The contact layer 52 is formed over a portion of the contact 50.
- the contact layer 52 formed from the In x Ga 1-x (As 1-y Sb y ) (0 ⁇ x ⁇ 0.7) (0 ⁇ y ⁇ 0.5) ) material and the contact 50 formed of the InP material provides a significant reduction in an emitter resistance value.
- the minimal conduction band offset or discontinuity between the (0 ⁇ x ⁇ 0.7) (0 ⁇ y ⁇ 0.5) material and the InP material that form the contact portion of the HBT 40 allow the emitter portion of the HBT 40 to realize a significant reduction in an emitter resistance value.
- the contact portion of the HBT 40 can be doped with a variety of n-type dopants, for example, silicon, tellurium, sulfur, tin, or selenium
- the use of indium in the contact portion of the HBT 40 provides an increase in the electron mobility, which, in turn, provides a reduction in the resistance value associated with the emitter portion of the HBT 40.
- the HBT 40 is well suited for use in or as a high speed multiplexer or in a high speed clock or data recovery circuit.
- FIG. 3 illustrate the steps taken to form one of the illustrative compound semiconductor devices of the present invention.
- a collector region is formed having at least one layer to form a first stack (step 64). Suitable techniques for forming the collector region include metal organic chemical vapor deposition (MOCND) or molecular beam epitaxy (MBE).
- MOCND metal organic chemical vapor deposition
- MBE molecular beam epitaxy
- a base region is formed or grown over a portion of the collector region (step 66).
- the base region is formed to include at least one layer and forms a second stack.
- An emitter region is grown or formed over a portion of the base region to form a third stack (step 68).
- the emitter region is formed to have at least one layer.
- a contact region is grown or formed over a portion of the emitter region to form a fourth stack (step 70).
- the contact region is formed to have at least one layer.
- the emitter electrode, the base electrodes, and the collector electrodes are formed by metal deposition and liftoff, self-aligned or non-self-aligned, using a material of Ti, Au, ⁇ i, W, Ge, Pt. (step 72).
- the applications of the various compound semiconductor devices described herein are not limited solely to high speed data manipulation, for example, the compound semiconductor devices of the present invention are well suited for operations portable or mobile electronic devices capable of communicating with a network in a wireless manner to increase or improve the bandwidth capacity of the network.
- One possible example for the compound semiconductor devices of the present invention is the use in a mobile telephone or "cellphone" capable of communicating with a satellite network, a terrestrial network or a hybrid network of terrestrial network entities and satellite network entities.
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US30683301P | 2001-07-20 | 2001-07-20 | |
US60/306,833 | 2001-07-20 |
Publications (2)
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WO2003009368A2 true WO2003009368A2 (fr) | 2003-01-30 |
WO2003009368A3 WO2003009368A3 (fr) | 2003-11-27 |
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PCT/US2002/023278 WO2003009368A2 (fr) | 2001-07-20 | 2002-07-22 | Transistor bipolaire à hétérojonction grande vitesse à base de gaas comportant des contacts à faible résistance d'émission |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1314088C (zh) * | 2003-11-10 | 2007-05-02 | 四川大学 | 一种低开启电压砷化镓基异质结双极晶体管 |
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US5598015A (en) * | 1992-09-18 | 1997-01-28 | Hitachi, Ltd. | Hetero-junction bipolar transistor and semiconductor devices using the same |
US6232624B1 (en) * | 1999-07-12 | 2001-05-15 | Hughes Electronics Corporation | InPSb channel HEMT on InP for RF application |
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US6320212B1 (en) * | 1999-09-02 | 2001-11-20 | Hrl Laboratories, Llc. | Superlattice fabrication for InAs/GaSb/AISb semiconductor structures |
US6429468B1 (en) * | 2000-12-30 | 2002-08-06 | National Science Council | In0.34A10.66AsSb0.15/InP HFET utilizing InP channels |
Family Cites Families (1)
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JPH0338834A (ja) * | 1989-07-06 | 1991-02-19 | Nec Corp | 半導体結晶 |
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2002
- 2002-07-22 WO PCT/US2002/023278 patent/WO2003009368A2/fr not_active Application Discontinuation
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US5598015A (en) * | 1992-09-18 | 1997-01-28 | Hitachi, Ltd. | Hetero-junction bipolar transistor and semiconductor devices using the same |
US6287946B1 (en) * | 1999-05-05 | 2001-09-11 | Hrl Laboratories, Llc | Fabrication of low resistance, non-alloyed, ohmic contacts to InP using non-stoichiometric InP layers |
US6232624B1 (en) * | 1999-07-12 | 2001-05-15 | Hughes Electronics Corporation | InPSb channel HEMT on InP for RF application |
US6320212B1 (en) * | 1999-09-02 | 2001-11-20 | Hrl Laboratories, Llc. | Superlattice fabrication for InAs/GaSb/AISb semiconductor structures |
US6429468B1 (en) * | 2000-12-30 | 2002-08-06 | National Science Council | In0.34A10.66AsSb0.15/InP HFET utilizing InP channels |
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CN1314088C (zh) * | 2003-11-10 | 2007-05-02 | 四川大学 | 一种低开启电压砷化镓基异质结双极晶体管 |
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