JP2004088107A - エミッタ・ベース・グレーディング構造が改良されたヘテロ接合バイポーラ・トランジスタ(hbt) - Google Patents
エミッタ・ベース・グレーディング構造が改良されたヘテロ接合バイポーラ・トランジスタ(hbt) Download PDFInfo
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- KXNLCSXBJCPWGL-UHFFFAOYSA-N [Ga].[As].[In] Chemical compound [Ga].[As].[In] KXNLCSXBJCPWGL-UHFFFAOYSA-N 0.000 description 56
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 42
- 229910052751 metal Inorganic materials 0.000 description 13
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 230000006798 recombination Effects 0.000 description 3
- 238000005215 recombination Methods 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- AUCDRFABNLOFRE-UHFFFAOYSA-N alumane;indium Chemical compound [AlH3].[In] AUCDRFABNLOFRE-UHFFFAOYSA-N 0.000 description 2
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- 238000001020 plasma etching Methods 0.000 description 2
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- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- MDPILPRLPQYEEN-UHFFFAOYSA-N aluminium arsenide Chemical compound [As]#[Al] MDPILPRLPQYEEN-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- -1 but not limited to Inorganic materials 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical group [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
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- 239000002356 single layer Substances 0.000 description 1
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- 238000000927 vapour-phase epitaxy Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/73—Bipolar junction transistors
- H01L29/737—Hetero-junction transistors
- H01L29/7371—Vertical transistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0804—Emitter regions of bipolar transistors
- H01L29/0817—Emitter regions of bipolar transistors of heterojunction bipolar transistors
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1004—Base region of bipolar transistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/15—Structures with periodic or quasi periodic potential variation, e.g. multiple quantum wells, superlattices
- H01L29/151—Compositional structures
- H01L29/152—Compositional structures with quantum effects only in vertical direction, i.e. layered structures with quantum effects solely resulting from vertical potential variation
- H01L29/155—Comprising only semiconductor materials
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- Bipolar Transistors (AREA)
Abstract
【解決手段】ヘテロ接合バイポーラ・トランジスタ(400)は、エミッタ(214)とベース(208)の間に、エミッタ及びベースを構成する半導体材料には存在しない少なくとも1つの元素を含有する半導体材料を含むグレーディング構造(250)を含む。この構造(250)は、ベース(208)との界面では、ベース(208)の伝導帯エネルギーにほぼ等しい伝導帯エネルギーを有し、エミッタ(214)との界面においては、エミッタ(214)の伝導帯エネルギーにほぼ等しい伝導帯エネルギーを有する。
【選択図】図2
Description
214 エミッタ
250 グレーディング構造
251 シート状挿入物
300 交互層
350 漸変組成
400 ヘテロ接合バイポーラ・トランジスタ
Claims (10)
- ヘテロ接合バイポーラ・トランジスタであって、
第1の半導体材料から形成されたエミッタと、
第2の半導体材料から形成されたベースと、
前記第1及び第2の半導体材料には存在しない少なくとも1つの元素を含有する半導体材料を含む、前記エミッタと前記ベースの間にあるグレーディング構造が含まれており、前記グレーディング構造が、前記ベースと前記グレーディング構造の間の界面において、前記ベースの伝導帯エネルギーにほぼ等しい伝導帯エネルギーを有することと、前記グレーディング構造が、前記エミッタと前記グレーディング構造の間の界面において、前記エミッタの伝導帯エネルギーにほぼ等しい伝導帯エネルギーを有することを特徴とするヘテロ接合バイポーラ・トランジスタ。 - 前記エミッタがInPから形成されることと、前記ベースがInGaAsから形成されることと、前記グレーディング構造に、InGaAs及びInAlAsの交互層が含まれることを特徴とする、請求項1に記載のヘテロ接合バイポーラ・トランジスタ。
- 前記エミッタがInPから形成されることと、前記ベースがInGaAsから形成されることと、前記グレーディング構造に、漸変組成のInGaAlAs層が含まれることを特徴とする、請求項1に記載のヘテロ接合バイポーラ・トランジスタ。
- 前記漸変組成のInGaAlAs層が、前記グレーディング構造の前記エミッタ側におけるInPの伝導帯エネルギーにほぼ整合する組成と、前記グレーディング構造の前記ベース側におけるInGaAsの伝導帯エネルギーにほぼ整合する組成を備えることを特徴とする、請求項3に記載のヘテロ接合バイポーラ・トランジスタ。
- 前記グレーディング構造が前記エミッタに対してエッチング選択性を備えることを特徴とする、請求項1に記載のヘテロ接合バイポーラ・トランジスタ。
- さらに、前記エミッタと前記グレーディング構造の間に配置されたドーパント原子のシート状挿入物が含まれることを特徴とする、請求項1に記載のヘテロ接合バイポーラ・トランジスタ。
- ヘテロ接合バイポーラ・トランジスタの製造方法であって、
第1の半導体材料からエミッタを形成するステップと、
第2の半導体材料からベースを形成するステップと、
前記第1及び第2の半導体材料には存在しない少なくとも1つの元素を含有する半導体材料を含むグレーディング構造を、前記エミッタと前記ベースの間に形成するステップが含まれており、前記グレーディング構造が、前記ベースと前記グレーディング構造の間の界面において、前記ベースの伝導帯エネルギーにほぼ等しい伝導帯エネルギーを有することと、前記グレーディング構造が、前記エミッタと前記グレーディング構造の間の界面において、前記エミッタの伝導帯エネルギーにほぼ等しい伝導帯エネルギーを有することを特徴とする方法。 - 前記エミッタがInPから形成されることと、
前記ベースがInGaAsから形成されることと、
前記グレーディング構造に、InGaAs及びInAlAsの交互層が含まれることを特徴とする、請求項7に記載の方法。 - ヘテロ接合バイポーラ・トランジスタのためのグレーディング構造であって、前記グレーディング構造には、前記ヘテロ接合バイポーラ・トランジスタのエミッタまたはベースに存在しない少なくとも1つの元素を含有する半導体材料が含まれており、前記グレーディング構造が、前記ベースと前記グレーディング構造の間の界面において、前記ベースの伝導帯エネルギーにほぼ等しい伝導帯エネルギーを有することと、前記グレーディング構造が、前記エミッタと前記グレーディング構造の間の界面において、前記エミッタの伝導帯エネルギーにほぼ等しい伝導帯エネルギーを有することを特徴とするグレーディング構造。
- 前記グレーディング構造に、InGaAs及びInAlAsの交互層が含まれることを特徴とする、請求項9に記載のグレーディング構造。
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US10/226,771 US6768141B2 (en) | 2002-08-23 | 2002-08-23 | Heterojunction bipolar transistor (HBT) having improved emitter-base grading structure |
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JP2004088107A5 JP2004088107A5 (ja) | 2006-09-14 |
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EP (1) | EP1391938A3 (ja) |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US7482643B2 (en) | 2005-01-26 | 2009-01-27 | Sony Corporation | Semiconductor device |
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US20050035370A1 (en) * | 2003-08-12 | 2005-02-17 | Hrl Laboratories, Llc | Semiconductor structure for a heterojunction bipolar transistor and a method of making same |
US7655529B1 (en) * | 2004-08-20 | 2010-02-02 | Hrl Laboratories, Llc | InP based heterojunction bipolar transistors with emitter-up and emitter-down profiles on a common wafer |
FR2878078B1 (fr) * | 2004-11-18 | 2007-01-19 | Cit Alcatel | Transistor bipolaire et procede de fabrication de ce transistor |
US7038256B1 (en) * | 2004-12-03 | 2006-05-02 | Northrop Grumman Corp. | Low turn-on voltage, non-electron blocking double HBT structure |
GB0612805D0 (en) * | 2006-06-28 | 2006-08-09 | Xact Pcb Ltd | Registration system and method |
US20080185038A1 (en) * | 2007-02-02 | 2008-08-07 | Emcore Corporation | Inverted metamorphic solar cell with via for backside contacts |
CN102646703B (zh) * | 2012-05-07 | 2014-12-10 | 中国电子科技集团公司第五十五研究所 | 单晶InP基化合物半导体材料薄膜的外延结构 |
US9530708B1 (en) | 2013-05-31 | 2016-12-27 | Hrl Laboratories, Llc | Flexible electronic circuit and method for manufacturing same |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05226358A (ja) * | 1992-02-10 | 1993-09-03 | Furukawa Electric Co Ltd:The | ヘテロ接合バイポーラトランジスタ |
JPH10500257A (ja) * | 1994-11-01 | 1998-01-06 | インテバック・インコーポレイテッド | ヘテロ接合エネルギー傾斜構造 |
JP2000068286A (ja) * | 1998-08-20 | 2000-03-03 | Nec Corp | バイポーラトランジスタ |
WO2001031685A2 (en) * | 1999-10-28 | 2001-05-03 | Hrl Laboratories, Llc | InPSb/InAs BJT DEVICE AND METHOD OF MAKING |
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US5349201A (en) * | 1992-05-28 | 1994-09-20 | Hughes Aircraft Company | NPN heterojunction bipolar transistor including antimonide base formed on semi-insulating indium phosphide substrate |
US5631477A (en) * | 1995-06-02 | 1997-05-20 | Trw Inc. | Quaternary collector InAlAs-InGaAlAs heterojunction bipolar transistor |
US6670653B1 (en) * | 1999-07-30 | 2003-12-30 | Hrl Laboratories, Llc | InP collector InGaAsSb base DHBT device and method of forming same |
JP3341740B2 (ja) * | 1999-11-15 | 2002-11-05 | 日本電気株式会社 | ヘテロバイポーラ型トランジスタ及びその製造方法 |
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2002
- 2002-08-23 US US10/226,771 patent/US6768141B2/en not_active Expired - Fee Related
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2003
- 2003-05-14 EP EP03010839A patent/EP1391938A3/en not_active Withdrawn
- 2003-08-22 JP JP2003298196A patent/JP2004088107A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05226358A (ja) * | 1992-02-10 | 1993-09-03 | Furukawa Electric Co Ltd:The | ヘテロ接合バイポーラトランジスタ |
JPH10500257A (ja) * | 1994-11-01 | 1998-01-06 | インテバック・インコーポレイテッド | ヘテロ接合エネルギー傾斜構造 |
JP2000068286A (ja) * | 1998-08-20 | 2000-03-03 | Nec Corp | バイポーラトランジスタ |
WO2001031685A2 (en) * | 1999-10-28 | 2001-05-03 | Hrl Laboratories, Llc | InPSb/InAs BJT DEVICE AND METHOD OF MAKING |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7482643B2 (en) | 2005-01-26 | 2009-01-27 | Sony Corporation | Semiconductor device |
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EP1391938A3 (en) | 2005-10-26 |
US20040036082A1 (en) | 2004-02-26 |
EP1391938A2 (en) | 2004-02-25 |
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