WO2002102127A1 - Vorrichtung zur montage von bauelementen auf einem substrat - Google Patents
Vorrichtung zur montage von bauelementen auf einem substrat Download PDFInfo
- Publication number
- WO2002102127A1 WO2002102127A1 PCT/DE2002/001840 DE0201840W WO02102127A1 WO 2002102127 A1 WO2002102127 A1 WO 2002102127A1 DE 0201840 W DE0201840 W DE 0201840W WO 02102127 A1 WO02102127 A1 WO 02102127A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- unit
- component
- positioning
- optical
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
Definitions
- the invention relates to a device for assembling components, in particular semiconductor chips, according to the preamble of claim 1.
- Cartesian precision pick-and-place machines which pick up a chip at a first location from a chip carrier (sawn wafer, magazine, ...) with the aid of a gripper and laterally offset at its mounting location on the substrate drop.
- Mounting devices of the type specified above are known as so-called die bonders. These systems are characterized by the spatially separate image recordings of the chip and the mounting position on the substrate.
- the gripped chip is first moved over a first camera which is arranged in a fixed manner in the work area and is directed upwards and an image of the underside of the chip is recorded.
- the placement head then moves over the substrate and uses a second camera, which is carried on the side of the placement head, to locate the mounting location on the substrate. If the position of the two image recording locations is known, the position of the chip or substrate determined in the respective camera field of view is transformed into the machine coordinate system and the positional deviation between chip and substrate is calculated in axis coordinates.
- the deviation of the chip relative to the substrate can then be determined by means of image processing and corrected by the axes of the xy table. After aligning the chip with respect to the substrate structures, the position of the chip and substrate can be measured again with the optics and readjusted if necessary until the deviation of the two actual positions has reached a predetermined, permissible tolerance value.
- the optics are moved out of the way between the two workpieces into a rest position laterally outside the area of the substrate and the bondhead carries out the settling movement in the z coordinate.
- the bond head can only be moved in the z direction and the splitfield optics can only be moved between two end positions (measuring position and rest position)
- an additional, complex handling or loading device is required to insert the workpieces (substrates and chips) into the Bring - or field of view of the optics.
- a carousel or turret head which can be moved in the xy plane takes a substrate and a chip from a substrate or chip magazine and transfers them to the xy table or the bond head. If necessary, the corresponding magazines must be replaced or refilled manually.
- the machine configuration described above mainly allows the handling of individual substrates with the turret head, while the processing of multiple blanks or workpiece carriers to increase productivity does not seem possible. Due to the discontinuous, manual loading of the machine, it is not possible to link it with other production facilities in a line with a directed, continuous material flow for reasons of productivity and lot tracking (traceability, Kno n Good Die). Disadvantages are the comparatively low throughput rate of the device of approx. 200 to 3-00 components per hour, the high design effort for material handling within the machine and the associated relatively high costs and the high cost Degree of specialization exclusively for the assembly of flip chips. Furthermore, a high level of effort is required for image processing because the structures of the chip and the substrate overlap in a common image by using the optics specified above and must therefore be selected and differentiated by the image evaluation software.
- the object of the invention is to propose a device for assembling components, in particular semiconductor chips, which enables fully automated assembly of a wide variety of components on substrates and at the same time has a high throughput in a linked production and a very high positioning accuracy.
- a device according to the invention is characterized in that the substrate is arranged on a transport device for largely continuously feeding and removing numerous substrates to and from the device.
- the transport device according to the invention With the aid of the transport device according to the invention, a comparatively high throughput of the substrates or components in a production line is achieved with high accuracy.
- the transport device according to the invention is designed as a transfer belt or the like and is integrated in an automatic production line with other, different production systems or systems for semiconductor components or is linked to them.
- Transport device provided a buffer segment for 'adaptation of the transport speed of the transport device with the or the transport speeds of an automatic production line.
- the transport speed of the substrate in the device according to the invention can be adapted to the speed of the assembly of the component on the substrate.
- the transport speed of the substrate in the device according to the invention can be adapted to the speed of the assembly of the component on the substrate.
- Transport speed of the substrate at least at the moment of positioning or joining almost zero, which improves the accuracy of the positioning or assembly.
- the transport speed of the substrate on the transport device is preferably outside the Positioning period at least temporarily well above the transport speed of the automatic production line, which means that a possibly provided hold of the substrate or the transport device during positioning or assembly without sacrificing the throughput rate or the continuous supply and discharge of the numerous substrates to and from the Device can be realized according to the invention.
- the position measuring unit advantageously comprises at least one optical device with two opposite measuring directions for determining the two actual positions.
- the optical device is advantageously combined with the transport device.
- This optical device comprises a diametrically imaging optical head with two opposite measuring directions for simultaneous image recording of the actual positions of the substrate fed on the transport device and the component or chip held above it by a gripper or placement head.
- the structures of the chip and substrate are mapped onto a camera in the optical head via a deflection prism.
- the two cameras are arranged horizontally behind the deflection prism in order to achieve a short beam path.
- a high numerical aperture and thus a relatively high optical resolution can be achieved with a comparatively compact and light design of the optics.
- Such a compact optics can be moved comparatively quickly into and out of the area between the substrate and the component due to its relatively low mass to be accelerated, as a result of which the cycle time for mounting components can be largely minimized by means of the device according to the invention.
- An optical unit according to the publication is preferred JP 32 17 095 and the as yet unpublished publication DE 100 12 043 AI are used, which are characterized in particular by the features described above and thus by their relatively compact embodiment and small mass to be moved.
- a relative positioning principle is preferably implemented by means of the position measuring unit or optical unit, as a result of which, for example, a first traversing unit or a handling system can be used which moves comparatively quickly and possibly inaccurately from the first location over a relatively large distance to the area of the substrate.
- multi-position assembly devices e.g. Pick-and-place devices, with a standing and / or hanging axis portal system
- Corresponding mounting devices have a comparatively large usable working space, it being possible, for example, for a component to be picked up from any location in the working space and to be positioned comparatively quickly and optionally roughly with the first displacement unit at any location above the substrate.
- the exact determination of the actual position of the component relative to the actual position of the substrate or the mounting location is advantageously carried out by means of the optical device.
- the transport device comprises at least one substrate travel unit with at least one positioning axis, which is arranged almost parallel to the plane formed by the substrate, and in particular is adjustable, for moving the substrate in the x / y plane.
- the substrate can be moved, for example, orthogonally to the transport direction.
- the interaction of the substrate travel unit and the transport device advantageously makes it possible to freely move the substrate in the x / y Position level.
- the substrate travel unit has two, in particular , adjustable positioning axes which are arranged almost perpendicular to one another and largely parallel to the plane formed by the substrate. With the aid of this measure, it is possible that the substrate positioning can optionally be realized along the two positioning axes, in particular parallel to the substrate plane, without additional method or positioning of the substrate with the transport device.
- the optical movement unit has at least two, in particular, arranged almost perpendicular to one another and largely parallel to the plane formed by the substrate.
- adjustable positioning axes The position measuring unit can be moved back and forth along these two positioning axes, as a result of which it can be moved flexibly and at least over the entire area of the substrate.
- the optical device can be used to approach several different mounting locations on a substrate without the substrate having to be moved relatively strongly.
- the optical movement unit has a focus, which can be arranged almost perpendicular to the plane formed by the substrate, in particular an adjustable axis for focusing the first and / or the second location, in particular the respective mounting location on the substrate.
- a focus which can be arranged almost perpendicular to the plane formed by the substrate, in particular an adjustable axis for focusing the first and / or the second location, in particular the respective mounting location on the substrate.
- At least one fine positioning unit with two to each other Almost perpendicular and, in particular, adjustable positioning axes arranged largely parallel to the plane formed by the substrate, for fine positioning of one or both actual positions or of the substrate and / or the component.
- the first travel unit for the feed movement of the component and / or the substrate travel unit preposition the component or the substrate relatively roughly, ie with comparatively low accuracy, in the field of view of the optical device, as a result of which these travel units are carried out relatively inexpensively can.
- the positional deviation of the component relative to the substrate determined with the aid of the position measuring unit is then compensated for by the much more precise fine positioning drive of the fine positioning unit.
- a maximum travel range of the fine positioning unit is many times smaller than a maximum travel range of the first travel unit.
- the integrated fine positioning unit can then be moved by the integrated fine positioning unit to correct the actual position of the substrate in the xy plane.
- two Substratver can for example be provided ahreint ⁇ eiten ', wherein in particular one of the two movement units is formed as Feinpositionierü for fine positioning.
- the first substrate displacement unit can, for example, move the substrate comparatively roughly and, above all, the fine positioning unit can position the substrate comparatively precisely or finely.
- FIG. 1 shows a schematic section of a device according to the invention
- Figure 2 shows a schematic section of another device according to the invention.
- the transfer belt 1 shows a transfer belt 1, an optics module 2 and a placement head 3 of a device according to the invention.
- the optics module 2 essentially consists of an optics positioning unit and an optics head 11.
- a substrate 4 which is arranged individually or in a multipurpose on a workpiece carrier 5, is continuously fed or removed to the device according to the invention .
- the transfer belt 1 comprises ⁇ rT * P3 PH ö g; ⁇ P- S o P tr N ⁇ P PJ d to 3 Pl N tö 3 iQ PJ nj ⁇ J - ⁇ -j ⁇
- 01 rt P ⁇ ⁇ iQ P P- 3 ⁇ P-? I- 1 01 P ⁇ rr ⁇ tr ⁇ _ ⁇ P- PJ ⁇ N ⁇ XPP DI rr P- p- P
- the component 10 is positioned by means of the placement head 3 over the substrate 4 by means of a travel unit, not shown in detail.
- the moving unit, together with the placement head 3, enables the component 10 to be picked up at any location in the relatively large working space or travel range of the moving unit and a relatively coarse and rapid positioning of the component 10 over the substrate 4.
- a corresponding moving unit can be comparatively economical and inexpensive very flexible pick up any Ba ⁇ implant 10 at any place within the work space and position on the substrate.
- the optical head 11 by means of the
- Optics travel unit of the optics module 2 sweep over the entire substrate 4 or a multiple use.
- the optical head 11 can already be positioned via corresponding axes of the optical module 2, the substrate 4 and the substrate 4 can be securely fixed by lifting the workpiece carrier 5. If necessary, the actual position of the substrate 4 is determined while the component 10 is being moved by means of the placement head 3 or its displacement unit, and after the component 10 has been positioned above the substrate 4 or the optical head 11 of the optical module 2, the actual position of the Exactly ermi11e11.
- the actual position of the component 10 is then calculated using an evaluation unit (not shown in more detail) with the actual position of the substrate 4 or the joining location on the substrate 4 and, if the two actual positions deviate too much from one another, this deviation largely compensated by means of the micromanipulator 8.
- Both the component 10 and the mounting location on the substrate 4 are always in the field of view of the optical head 11, so that the position correction or adjustment is carried out in a closed control loop between the image processing and the axes X, Y and / or an axis of rotation theta of the micromanipulator 8 can.
- the axis of rotation Theta is aligned parallel to the Z axis.
- this control circuit again detects the positional deviation of the two actual positions relative to one another and, if the permissible assembly tolerances are exceeded, initiates a repetition of the adjustment process by means of the axes X, Y, Theta of the micromanipulator 8. Only after the required accuracy of adjustment has been achieved is the optical head 11 withdrawn laterally from the joining area (Y axis of the optical module 2) and the component 10 placed or joined along the axis Z of the placement head 3 on the substrate 4 at the predetermined location.
- the moving unit of the placement head 3 can be part of an automatic assembly machine, for example.
- Corresponding automatic assembly machines are referred to, among other things, as so-called pick-and-place devices or as so-called di ⁇ bonders.
- FIG. 2 shows a further device according to the invention, similar or comparable elements being identified by the corresponding reference numerals according to FIG. 1.
- the device according to FIG. 2 has a stator 12 on which a rotor 13 is arranged.
- the rotor 13 can additionally have a micromanipulator 8 with a comparatively small working area for fine positioning of the substrate 4 or of the workpiece carrier 5 include.
- the rotor 13 moves to the input buffer segment 7, so that it receives a workpiece carrier 5 'with a substrate 4' and moves to the position shown in FIG. In this position, the actual position of the substrate 4 or the mounting location and the actual position of the component 10 are determined relative to one another by means of the optical head 11 and in accordance with the previously carried out measuring and control methods until the required adjustment accuracy along the X- or move the Y axes.
- the respective mounting position on the substrate 4 can always take place in the same area ⁇ below the optical head 11, even if there are several mounting locations on a substrate 4.
- the optical head 11 can only be moved into the joining area of the component 10 or assembly location and by means of a relatively simple, single-axis lifting drive of the optical module 2, for example a pneumatic cylinder or the like . can be moved into a rest position, not shown, outside the area of the substrate 4. This means that different mounting positions on the substrate 4 can be achieved in that the rotor 13 is moved relative to the optical head 11 which is fixed with respect to its measuring position.
- Both the approach to the assembly positions and the position correction after the measurement can be carried out by the same drive, i.e. by the rotor 13 or by means of a separate micromanipulator 8 according to FIG. 1 on the rotor 13.
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- Engineering & Computer Science (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02735072A EP1400159A1 (de) | 2001-06-11 | 2002-05-22 | Vorrichtung zur montage von bauelementen auf einem substrat |
US10/344,435 US20040036041A1 (en) | 2001-06-11 | 2002-05-22 | Device for assembling components on a substrate |
JP2003504725A JP2004521514A (ja) | 2001-06-11 | 2002-05-22 | 基板に構成部品を実装するための装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10128111.0 | 2001-06-11 | ||
DE10128111A DE10128111A1 (de) | 2001-06-11 | 2001-06-11 | Vorrichtung zur Montage von Bauelementen auf einem Substrat |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002102127A1 true WO2002102127A1 (de) | 2002-12-19 |
Family
ID=7687804
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2002/001840 WO2002102127A1 (de) | 2001-06-11 | 2002-05-22 | Vorrichtung zur montage von bauelementen auf einem substrat |
Country Status (5)
Country | Link |
---|---|
US (1) | US20040036041A1 (de) |
EP (1) | EP1400159A1 (de) |
JP (1) | JP2004521514A (de) |
DE (1) | DE10128111A1 (de) |
WO (1) | WO2002102127A1 (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH711570A1 (de) * | 2015-09-28 | 2017-03-31 | Besi Switzerland Ag | Vorrichtung für die Montage von Bauelementen auf einem Substrat. |
CN117124046A (zh) * | 2023-10-26 | 2023-11-28 | 中电建(西安)港航船舶科技有限公司 | 一种定日镜总装线 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006050964A1 (de) * | 2006-10-28 | 2008-04-30 | Man Roland Druckmaschinen Ag | Applikator für elektrische oder elektronische Bauelemente |
DE102015112518B3 (de) * | 2015-07-30 | 2016-12-01 | Asm Assembly Systems Gmbh & Co. Kg | Bestückmaschine und Verfahren zum Bestücken eines Trägers mit ungehäusten Chips |
DE102015013495B4 (de) | 2015-10-16 | 2018-04-26 | Mühlbauer Gmbh & Co. Kg | Empfangseinrichtung für Bauteile und Verfahren zum Entnehmen fehlerhafter Bauteile aus dieser |
DE102015013494B3 (de) | 2015-10-16 | 2017-04-06 | Mühlbauer Gmbh & Co. Kg | Bauteilhandhabungsvorrichtung und Verfahren zum Entnehmen von Bauteilen von einem strukturierten Bauteilvorrat und zum Ablegen an einer Empfangseinrichtung |
DE102016009765B4 (de) * | 2016-08-11 | 2018-07-05 | Mühlbauer Gmbh & Co. Kg | Vorrichtung und Verfahren zum Übertragen eines elektronischen Bauteils von einem Träger zu einem Substrat |
DE102016123362B3 (de) * | 2016-12-02 | 2018-03-08 | Asm Assembly Systems Gmbh & Co. Kg | Bestückmaschine mit einer Verschiebevorrichtung zum Verschieben einer Aufnahmevorrichtung für einen Träger mit Bestückmedium und ein Verfahren zum Bestücken |
WO2018188731A1 (de) * | 2017-04-11 | 2018-10-18 | Muehlbauer GmbH & Co. KG | Bauteil-empfangseinrichtung mit optischem sensor |
CN107175506B (zh) * | 2017-06-21 | 2023-05-23 | 惠州市德赛自动化技术有限公司 | 一种车载镜头生产组装线 |
CN108772684A (zh) * | 2018-07-02 | 2018-11-09 | 深圳市智信精密仪器有限公司 | 一种手机屏幕和中框的精密贴合设备及方法 |
DE102022106124A1 (de) | 2022-03-16 | 2023-09-21 | Herbert Ginzinger | Bestückanlage |
CN114993385B (zh) * | 2022-07-13 | 2022-11-11 | 浙江金火科技实业有限公司 | 一种提高数控车床主轴箱部件装配精度的装配检测装置 |
TWI828441B (zh) * | 2022-11-24 | 2024-01-01 | 陽程科技股份有限公司 | 自動組裝機之光學模組對位方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5233745A (en) * | 1991-03-04 | 1993-08-10 | Matsushita Electric Industrial Co., Ltd. | Electronic-component mounting apparatus with monitoring device |
EP1063875A1 (de) * | 1999-06-16 | 2000-12-27 | Mirae Corporation | Vorrichtung zur Oberflächenmontage |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60103700A (ja) * | 1983-11-11 | 1985-06-07 | 株式会社日立製作所 | 部品の位置決め装置 |
US5271139A (en) * | 1989-04-04 | 1993-12-21 | Walter Sticht | Production installation |
JPH04291795A (ja) * | 1991-03-20 | 1992-10-15 | Matsushita Electric Ind Co Ltd | 電子部品装着装置 |
US5265330A (en) * | 1991-05-28 | 1993-11-30 | Matsushita Electric Industrial Co., Ltd. | Method of packaging chip on substrate |
JPH07115300A (ja) * | 1993-10-18 | 1995-05-02 | M & M Prod Kk | 電子部品位置決め装置 |
GB9323978D0 (en) * | 1993-11-22 | 1994-01-12 | Dek Printing Machines Ltd | Alignment systems |
US5559727A (en) * | 1994-02-24 | 1996-09-24 | Quad Systems Corporation | Apparatus and method for determining the position of a component prior to placement |
WO1997002708A1 (en) * | 1995-06-30 | 1997-01-23 | Precision Assembly Systems, Inc. | Automated system for placement of components |
JPH11154799A (ja) * | 1997-11-21 | 1999-06-08 | Matsushita Electric Ind Co Ltd | 電子部品の実装装置および実装方法 |
US6079098A (en) * | 1998-09-08 | 2000-06-27 | Siemens Aktiengesellschaft | Method and apparatus for processing substrates |
-
2001
- 2001-06-11 DE DE10128111A patent/DE10128111A1/de not_active Withdrawn
-
2002
- 2002-05-22 JP JP2003504725A patent/JP2004521514A/ja not_active Abandoned
- 2002-05-22 EP EP02735072A patent/EP1400159A1/de not_active Withdrawn
- 2002-05-22 WO PCT/DE2002/001840 patent/WO2002102127A1/de not_active Application Discontinuation
- 2002-05-22 US US10/344,435 patent/US20040036041A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5233745A (en) * | 1991-03-04 | 1993-08-10 | Matsushita Electric Industrial Co., Ltd. | Electronic-component mounting apparatus with monitoring device |
EP1063875A1 (de) * | 1999-06-16 | 2000-12-27 | Mirae Corporation | Vorrichtung zur Oberflächenmontage |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH711570A1 (de) * | 2015-09-28 | 2017-03-31 | Besi Switzerland Ag | Vorrichtung für die Montage von Bauelementen auf einem Substrat. |
CN117124046A (zh) * | 2023-10-26 | 2023-11-28 | 中电建(西安)港航船舶科技有限公司 | 一种定日镜总装线 |
CN117124046B (zh) * | 2023-10-26 | 2024-01-30 | 中电建(西安)港航船舶科技有限公司 | 一种定日镜总装线 |
Also Published As
Publication number | Publication date |
---|---|
US20040036041A1 (en) | 2004-02-26 |
EP1400159A1 (de) | 2004-03-24 |
JP2004521514A (ja) | 2004-07-15 |
DE10128111A1 (de) | 2003-02-20 |
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