WO2002095795A3 - Vorrichtung zur aufnahme von scheibenförmigen objekten - Google Patents

Vorrichtung zur aufnahme von scheibenförmigen objekten Download PDF

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Publication number
WO2002095795A3
WO2002095795A3 PCT/EP2002/004790 EP0204790W WO02095795A3 WO 2002095795 A3 WO2002095795 A3 WO 2002095795A3 EP 0204790 W EP0204790 W EP 0204790W WO 02095795 A3 WO02095795 A3 WO 02095795A3
Authority
WO
WIPO (PCT)
Prior art keywords
carrier
receiving plate
shaped objects
recesses
support pins
Prior art date
Application number
PCT/EP2002/004790
Other languages
English (en)
French (fr)
Other versions
WO2002095795A2 (de
Inventor
Arthur Pelzmann
Martin Drechsler
Juergen Niess
Michael Grandy
Hin Yiu Chung
Paul Mantz
Ottmar Graf
Original Assignee
Mattson Thermal Products Gmbh
Arthur Pelzmann
Martin Drechsler
Juergen Niess
Michael Grandy
Hin Yiu Chung
Paul Mantz
Ottmar Graf
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10156441A external-priority patent/DE10156441A1/de
Application filed by Mattson Thermal Products Gmbh, Arthur Pelzmann, Martin Drechsler, Juergen Niess, Michael Grandy, Hin Yiu Chung, Paul Mantz, Ottmar Graf filed Critical Mattson Thermal Products Gmbh
Priority to US10/478,285 priority Critical patent/US20040126213A1/en
Priority to JP2002592161A priority patent/JP4116449B2/ja
Priority to EP02771633A priority patent/EP1393355A2/de
Priority to KR1020037014971A priority patent/KR100885343B1/ko
Publication of WO2002095795A2 publication Critical patent/WO2002095795A2/de
Publication of WO2002095795A3 publication Critical patent/WO2002095795A3/de
Priority to US11/333,727 priority patent/US20060245906A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Eine Vorrichtung zur Aufnahme von scheibenförmigen Objekten, vorzugsweise Halbleiterwafern, zu deren thermischer Behandlung ermöglicht das Prozessieren insbesondere von Wafern aus Verbindungshalbleitern in besonders einfacher Weise, mit hoher Produktivität und geringem Schadensrisiko, wenn ein Träger wenigstens zwei Ausnehmungen zur Aufnahme jeweils eines Objekts aufweist. Die Ausnehmungen auf dem Träger sind vorzugsweise mit Abdeckungen abdeckbar. Zum Be- und Entladen sind vorzugsweise Stütztifte vorgesehen, wobei der Träger und die Stützstifte relativ zueinander in vertikaler Richtung bewegbar sind. Weiterhin ist Handhabungsvorrichtung für Objekte angegeben.
PCT/EP2002/004790 2001-05-18 2002-05-02 Vorrichtung zur aufnahme von scheibenförmigen objekten WO2002095795A2 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US10/478,285 US20040126213A1 (en) 2001-05-18 2002-05-02 Device for accommodating disk-shaped objects and apparatus for handling objects
JP2002592161A JP4116449B2 (ja) 2001-05-18 2002-05-02 対象物の操作のための操作装置
EP02771633A EP1393355A2 (de) 2001-05-18 2002-05-02 Vorrichtung zur aufnahme von scheibenförmigen objekten
KR1020037014971A KR100885343B1 (ko) 2001-05-18 2002-05-02 판형 대상물을 수용하기 위한 장치 및 상기 대상물을핸들링하기 위한 장치
US11/333,727 US20060245906A1 (en) 2001-05-18 2006-01-17 Device for accommodating disk-shaped objects and apparatus for handling objects

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE10124647 2001-05-18
DE10124647.1 2001-05-18
DE10156441.4 2001-11-16
DE10156441A DE10156441A1 (de) 2001-05-18 2001-11-16 Vorrichtung zur Aufnahme von scheibenförmigen Objekten und Vorrichtung zur Handhabung von Objekten

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/333,727 Continuation US20060245906A1 (en) 2001-05-18 2006-01-17 Device for accommodating disk-shaped objects and apparatus for handling objects

Publications (2)

Publication Number Publication Date
WO2002095795A2 WO2002095795A2 (de) 2002-11-28
WO2002095795A3 true WO2002095795A3 (de) 2003-10-23

Family

ID=26009354

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2002/004790 WO2002095795A2 (de) 2001-05-18 2002-05-02 Vorrichtung zur aufnahme von scheibenförmigen objekten

Country Status (6)

Country Link
US (1) US20060245906A1 (de)
EP (1) EP1393355A2 (de)
JP (1) JP4116449B2 (de)
CN (1) CN1271678C (de)
TW (1) TW584919B (de)
WO (1) WO2002095795A2 (de)

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US7064749B1 (en) 1992-11-09 2006-06-20 Adc Technology Inc. Portable communicator
JP2008166729A (ja) * 2006-12-08 2008-07-17 Canon Anelva Corp 基板加熱処理装置及び半導体製造方法
JP5109376B2 (ja) * 2007-01-22 2012-12-26 東京エレクトロン株式会社 加熱装置、加熱方法及び記憶媒体
US20120223048A1 (en) * 2009-08-26 2012-09-06 Veeco Process Equipment Inc. System for Fabricating a Pattern on Magnetic Recording Media
FR2971885A1 (fr) * 2011-02-18 2012-08-24 Commissariat Energie Atomique Procédé de réalisation d'un support de substrat
JP5346982B2 (ja) * 2011-04-28 2013-11-20 大日本スクリーン製造株式会社 熱処理装置
US10316412B2 (en) 2012-04-18 2019-06-11 Veeco Instruments Inc. Wafter carrier for chemical vapor deposition systems
US10167571B2 (en) * 2013-03-15 2019-01-01 Veeco Instruments Inc. Wafer carrier having provisions for improving heating uniformity in chemical vapor deposition systems
US10014205B2 (en) * 2015-12-14 2018-07-03 Kawasaki Jukogyo Kabushiki Kaisha Substrate conveyance robot and operating method thereof
US11961817B2 (en) * 2021-02-26 2024-04-16 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for forming a package structure

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EP0488722A1 (de) * 1990-11-29 1992-06-03 Canon Kabushiki Kaisha Vorrichtung des Vakuumtyps zum Halten eines Substrats
JPH04199614A (ja) * 1990-11-29 1992-07-20 Toshiba Ceramics Co Ltd 縦型気相成長用サセプター
EP0746009A1 (de) * 1995-05-30 1996-12-04 Moore Epitaxial, Inc. Mehrschichtige Susceptor für schnelle thermische Behandlungsreaktoren
US5850071A (en) * 1996-02-16 1998-12-15 Kokusai Electric Co., Ltd. Substrate heating equipment for use in a semiconductor fabricating apparatus
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US5863170A (en) * 1996-04-16 1999-01-26 Gasonics International Modular process system
US6123502A (en) * 1997-07-08 2000-09-26 Brooks Automation, Inc. Substrate holder having vacuum holding and gravity holding
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JP2000077436A (ja) * 1998-08-31 2000-03-14 Matsushita Electric Ind Co Ltd チップ吸着用のダイコレットおよびチップのボンディング装置
US6113165A (en) * 1998-10-02 2000-09-05 Taiwan Semiconductor Manufacturing Co., Ltd. Self-sensing wafer holder and method of using
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WO2000078654A1 (en) * 1999-06-17 2000-12-28 Speedfam-Ipec Corporation Improved wafer handling apparatus
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PATENT ABSTRACTS OF JAPAN vol. 2000, no. 06 22 September 2000 (2000-09-22) *

Also Published As

Publication number Publication date
US20060245906A1 (en) 2006-11-02
JP2004527136A (ja) 2004-09-02
CN1271678C (zh) 2006-08-23
WO2002095795A2 (de) 2002-11-28
TW584919B (en) 2004-04-21
JP4116449B2 (ja) 2008-07-09
EP1393355A2 (de) 2004-03-03
CN1526155A (zh) 2004-09-01

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