WO2002082520A1 - Procede d'isolement de fuite dans un conteneur de gaz et conteneur comprenant une structure d'isolement de fuite de gaz interne - Google Patents

Procede d'isolement de fuite dans un conteneur de gaz et conteneur comprenant une structure d'isolement de fuite de gaz interne Download PDF

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Publication number
WO2002082520A1
WO2002082520A1 PCT/JP2002/002222 JP0202222W WO02082520A1 WO 2002082520 A1 WO2002082520 A1 WO 2002082520A1 JP 0202222 W JP0202222 W JP 0202222W WO 02082520 A1 WO02082520 A1 WO 02082520A1
Authority
WO
WIPO (PCT)
Prior art keywords
container
liquid
groove
leakage
gas
Prior art date
Application number
PCT/JP2002/002222
Other languages
English (en)
Japanese (ja)
Inventor
Shigeru Mizukawa
Katsutoshi Nakata
Shunji Matsumoto
Original Assignee
Sumitomo Precision Products Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Precision Products Co., Ltd. filed Critical Sumitomo Precision Products Co., Ltd.
Publication of WO2002082520A1 publication Critical patent/WO2002082520A1/fr

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Definitions

  • the present invention provides a container comprising: a container main body having an open upper part and having a constant internal volume; and a lid placed on the container main body and closing the opening, wherein a gas is supplied from inside the container.
  • the present invention relates to a method for blocking leakage of gas, and a container provided with a structure for blocking leakage of internal gas. Background art
  • a TFT substrate that constitutes a liquid crystal substrate is manufactured through various processes.
  • a TFT substrate is applied by applying a developing solution or a resist film, and applying a chemical solution for removing the resist film, an etching solution, or a cleaning solution.
  • Various treatment liquids are applied to.
  • a supporting means for supporting the substrate, an etching liquid jetting means arranged above the substrate and jetting an etching liquid to the substrate, etc. are appropriately disposed in a predetermined container.
  • Etching equipment is used.
  • the supporting means includes a means for rotating the supported substrate horizontally and a means for transferring the substrate in the horizontal direction.
  • the container constituting the etching apparatus has a structure with an open top, and A structure is provided in which the opening is closed by a lid, and maintenance work can be performed from the upper opening.
  • the etching solution used for the above-mentioned etching is highly corrosive and has a property of being easily vaporized. Further, when the etching solution is jetted from the etching solution jetting means, it becomes misted. If the vaporized etching gas or mist leaks out of the container, it will adversely affect machines, instruments, and the human body around the equipment.
  • a sealing member such as a packing is interposed at a contact portion between the periphery of the opening portion of the container and the lid, and in this state, the container and the lid are fastened by a number of bolts, and the vaporized gas and The mist was prevented from leaking out of the container.
  • the present invention has been made in view of the above-mentioned circumstances, And a container provided with a method for shutting off leakage of gas in a container and a structure for shutting off leakage of internal gas, in which the lid can be easily attached and detached in a short time. With the goal. Disclosure of the invention
  • the present invention relates to a container comprising: a container main body having an opening at an upper portion and having a constant internal volume; and a lid placed on the container main body and closing the opening.
  • a method of blocking gas from leaking from inside the container wherein an annular concave groove having an open upper part is formed on an outer periphery of an upper end portion of the container body, and a liquid is stored in the concave groove.
  • a hanging portion is formed on the periphery of the lid so as to hang downward from the periphery, and the hanging portion is immersed in the liquid in the groove.
  • the present invention relates to a method for shutting off leakage of gas in a container, wherein the container is externally fitted to an upper end portion of the container body so as to block the atmosphere in the container and the external atmosphere by a liquid in the groove.
  • the present invention also provides a container comprising: a container main body having an opening at an upper portion and having a constant internal volume; and a lid placed on the container main body and closing the opening.
  • An annular concave groove having an open top is formed on the outer periphery of the upper end of the main body, and a liquid is stored in the concave groove, and a hanging portion which hangs downward from the peripheral edge is formed on the periphery of the lid.
  • the hanging portion can be externally fitted to the upper end of the container body with its lower end portion immersed in the liquid in the concave groove portion. Pertains to a container with a structure.
  • the hanging part formed on the peripheral edge of the lid is externally fitted to the upper end of the container body such that the lower end is immersed in the liquid stored in the concave groove.
  • the atmosphere in the container and the outside atmosphere are shut off by the liquid in the groove.
  • the atmosphere in the container can be in contact with the liquid in the groove through the gap between the container body and the lid, but does not directly communicate with the external atmosphere. This reliably prevents the gas in the container from leaking to the outside. Also, since the lid is merely placed on the container body, it can be easily removed, and can be removed in a short time.
  • the vaporized gas or mist is soluble in the liquid in the groove, It melts when it comes into contact with the liquid in the groove, but the vaporized gas mist in the container does not leak to the outside as it is. Therefore, even if it is extremely corrosive, such as a developing solution, an etching solution, or a stripping solution, it does not adversely affect the machines, instruments, and the human body around the container.
  • a second hanging portion is formed on the lower surface inside the outer peripheral edge of the lid body along the hanging portion and hanging downward from the lower surface, and the second hanging portion is an upper end portion of the container body. It is advisable to make it fit inside.
  • a labyrinth structure in which the upper end of the container body is inserted is formed between the hanging portion of the lid and the second hanging portion, and the vaporized gas and mist in the container body are removed by the labyrinth structure. It is difficult to reach by the liquid in the concave groove.
  • an annular seal member made of an elastic body and provided in an air-tight manner with an inner surface of the lid is provided on an upper edge portion of the container body. Leakage of gas inside the main body to the outside may be prevented by this seal member.
  • the gas inside the container body is prevented from leaking to the outside by the annular seal member provided at the upper edge of the container body. Therefore, even when vaporized gas or mist exists inside the container, such vaporized gas or mist is less likely to reach the liquid in the concave groove.
  • the liquid is continuously supplied into the concave groove, and the liquid in the concave groove is continuously discharged, so that the liquid in the concave groove is continuously replaced, and the stored amount is kept constant. You may make it drip.
  • the liquid in the groove is continuously replaced by a new liquid, so that the concentration of the vaporized gas component and the mist component dissolved in the liquid in the groove increases. Can be prevented.
  • the above-mentioned outer fitting includes a case where the hanging portion is fitted to the upper end portion of the container body tightly, and a case where the hanging portion is fitted with considerable play
  • the inner fitting similarly includes (2) Including the case where the hanging part is tightly fitted to the upper end of the container body, and the case where the hanging part is fitted with considerable play ⁇ 1_ ⁇ ⁇ .
  • FIG. 1 is a plan view showing a preferred etching apparatus according to the present invention
  • FIG. 2 is a cross-sectional view in the direction of arrows in FIG. 1
  • FIG. 3 is a sectional view in FIG. It is the enlarged view which expanded and showed the part.
  • FIG. 4 is an explanatory diagram for explaining a lid and an edge plate according to another embodiment of the present invention. BEST MODE FOR CARRYING OUT THE INVENTION
  • An etching apparatus 1 is an apparatus for performing an etching process on a TFT substrate.
  • a container body hereinafter, referred to as a tank body 3 having an open upper part
  • a vessel hereinafter referred to as an etching vessel 2 comprising a lid 20 for closing the opening 11 of the vessel body 3 (hereinafter referred to as an etching vessel) 2
  • an etching solution jetting device 40 disposed in the vessel body 3
  • a transport device 50 for transporting the paper in the horizontal direction.
  • a plurality of the etching apparatuses 1 of this example are linearly connected. As shown in FIGS.
  • the tank body 3 includes a rectangular bottom plate 8, side plates 4, 5, 6, 7 erected on the periphery of the bottom plate 8, and a bottom plate 8. And a predetermined inner volume surrounded by the bottom plate 8, the side plates 4, 5, 6, 7 and the top plate 9.
  • the side plates 4, 5, 6, 7 are provided so as to extend upward from the top plate 9, respectively, and in FIGS. 1 and 2, reference numerals 4a, 5a , 6a, 7a.
  • the top plate 9 has an opening 11 having a rectangular shape, and an edge plate 10 is provided upright on the periphery of the opening 11.
  • the extended portions 4 a, 5 a, 6 a, 7 a, the top plate 9 and the edge plate 10 form an annular concave groove 12 around the opening 11.
  • a packing 30 having an H-shaped cross section is mounted on the upper end of the edge plate 10, and an O-ring 31 is provided in the upper groove 30 a of the notching 30.
  • the lid 20 has a rectangular lid body 21, a first hanging part 22, which is suspended downward from the periphery of the lid body 21, and an inner side from the periphery of the lid body 21.
  • a second hanging portion 23 is suspended along the first hanging portion 22 in parallel with the first hanging portion 22.
  • the lid 20 is in a state where the edge plate 10 of the tank body 3 is inserted between the first hanging part 22 and the second hanging part 23, that is, the first hanging part 22 is an edge. With the second hanging portion 23 fitted inside the edge plate 10 and the lower surface of the second hanging portion 23 fitted on the O-ring 31, the lower surface of the second hanging portion 23 is air-tightly contacted with the O-ring 31. It is placed and closes the opening 11 of the tank body 3.
  • a handle 24 is fixedly provided on the upper surface of the lid body 21.
  • the handle 24 can be gripped so that the lid 20 can be attached to and detached from the tank body 3. I'm wearing
  • the main window 21 is formed with a parent window 25 closed by a transparent plate so that the inside of the tank main unit 3 can be observed from the window 25. I have.
  • a water discharge section 35 connected to a water supply source (not shown) is provided in the concave groove 12 of the tank body 3. Water is discharged from the water discharge section 35 into the concave groove 12. It is being discharged. Further, a drainage part 36 is provided in the concave groove 12, and is discharged from the water discharge part 35 into the concave groove 12, and the stored water is drained from the drainage part 36. It has become. The amount of water stored in the concave groove 12 is maintained such that the water level is located above the lower end of the first hanging portion 22.
  • the transport device 50 includes transport rollers 51 and 52 arranged vertically one above the other and arranged in multiple rows in a direction perpendicular to the paper surface.
  • the substrate K is transported in a direction perpendicular to the plane of the drawing (the direction indicated by the arrow C in FIG. 1) while being sandwiched between the transport rollers 51 and 52.
  • the etching liquid injection device 40 includes a plurality of etching liquid injection nozzles 41 and an etching liquid supply nozzle for supplying a pressurized etching liquid to the etching liquid injection nozzle 41.
  • Means (not shown).
  • the etching liquid spray nozzles 41 are arranged along the width direction and the transport direction above the substrate K transported by the transport rollers 51 and 52, and are transported by the transport rollers 51 and 52.
  • the etching liquid is sprayed on the upper surface of the substrate K to be etched.
  • Cleaning liquid jet nozzles 42 connected to cleaning liquid supply means (not shown) are arranged on both sides of the substrate K in the transport direction, respectively.
  • the cleaning liquid is sprayed toward the lower surface of the lid body 21 and the second hanging part 23.
  • the transport roller 5 The substrate K is transported in the transport direction by 1 and 52, and the etching liquid is injected from the etching liquid injection nozzle 41 onto the upper surface of the transferred substrate.
  • the substrates ⁇ are sequentially conveyed to the etching devices 1 which are linearly connected and are etched in the respective etching devices 1.
  • the etching liquid has a property that it is easily vaporized, and when it is jetted from the etching liquid jet nozzle 41, it becomes mist-like. Then, the etching gas and the mist thus vaporized fill the tank body 3. Such vaporized etching gas or mist is extremely corrosive, and if it leaks out of the tank body 3, it adversely affects machines, tools and human bodies around the apparatus.
  • the packing 30 is mounted on the upper end of the edge plate 10 constituting the tank body 3, and the O-ring 31 is inserted into the upper groove 30a of the mounted packing 30. It is structured such that the lid 20 is placed on the O-ring 31 in a state where it is airtightly abutted against the O-ring 31. The outside atmosphere is cut off by the O-ring 31. Therefore, leakage of the etching gas or mist from the inside of the tank body 3 to the outside is primarily prevented by the O-ring.
  • an annular concave groove 12 is formed around the opening 11 of the tank body 3, and water is stored in the concave groove 12, and the water is stored in the concave groove 12.
  • (1) The lower part (2) and the lower end (2) are soaked in the water, so that the atmosphere in the tank body (3) and the outside atmosphere are shut off by the water in the groove (12). Since the lid 20 is only placed on the O-ring 31, the airtightness between the lid body 21 and the O-ring 31 is not always sufficient, and the lid body 21 is not always sufficient.
  • the etching gas and mist inside the tank body 3 may leak to the outside from the gap created between the lower surface and the O-ring 31. There is.
  • the atmosphere surrounded by the first hanging portion 22, the edge plate 10, the packing 30, and the O-ring 31 was stored in the groove 12. Since the water is shut off from the outside atmosphere, the etching gas and mist leaked from the gap between the lower surface of the lid body 21 and the O-ring 31 leak to the outside due to the water in the groove 12. Secondarily blocked. In this way, the water in the concave groove 12 and the O-ring 31 cooperate to reliably prevent the etching gas and mist existing in the tank body 3 from leaking to the outside.
  • the concentration of the etching gas or mist component dissolved in the water in the concave groove 12 will increase.
  • water is supplied from the water discharge section 35 into the concave groove 12, while the water stored in the concave groove 12 is drained from the drain section 36, and the water in the concave groove 12 is continuously supplied. Since the water is replaced with new water, it is possible to prevent the concentration of the etching gas or mist component dissolved in the water in the concave groove 12 from increasing.
  • the edge plate 10 of the tank body 3 is inserted between the first hanging portion 22 and the second hanging portion 23 of the lid 20, a labyrinth structure is formed by these.
  • the etching gas and mist in the tank body 3 are difficult to reach due to the gap generated between the lower surface of the lid body 21 and the O-ring 31. Therefore, even with such a structure, the leakage of the etching gas in the tank body 3 to the outside is prevented.
  • the cleaning liquid is sprayed from the cleaning liquid spray nozzle 42 toward the lower surface of the lid body 21 and the second hanging part 23. As a result, the etching liquid adhered to the lower surface of the lid body 21 and the second hanging part 23 is washed away, and the removal of the etching liquid to the outside when the lid body 21 is removed is prevented.
  • the lid 20 is merely placed on the tank body 3, it can be easily removed and removed in a short time. Therefore, maintenance work in the etching apparatus 1 can be easily performed.
  • the second hanging portion 23 the packing 30 and the O-ring 31 as described above, it is possible to more effectively prevent the leakage of the internal gas.
  • the upper end of the edge plate 10 may be in contact with the lower surface of the lid body 21.
  • the atmosphere in the tank body 3 can leak from the gap between the lower surface of the lid body 21 and the upper end surface of the edge plate 10, but since water is stored in the concave groove 12, The atmosphere in the tank body 3 does not leak outside.
  • the water discharge section 35 for supplying water to the concave groove 12 can be omitted. That is, as described above, since the lower surface of the lid main body 21 is cleaned by the cleaning liquid injected from the cleaning liquid injection nozzle 42, the cleaning liquid flows through the gap between the lower surface of the lid main body 21 and the upper end surface of the edge plate 10. This is because they leak and are stored in the concave groove 12. In this sense, as shown in FIG. 4, a concave portion 10a may be formed at the upper end portion of the edge plate 10, and the cleaning liquid may be actively leaked from the concave portion 10a. Industrial applicability
  • the present invention can be suitably applied to various devices such as a developing solution coating device, a resist film forming device, a resist film peeling device, and a cleaning device, in addition to the etching device described above. it can.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Weting (AREA)
  • Closures For Containers (AREA)
  • Gasket Seals (AREA)
  • ing And Chemical Polishing (AREA)
  • Containers And Packaging Bodies Having A Special Means To Remove Contents (AREA)

Abstract

La présente invention concerne un conteneur comportant une structure d'isolement de fuite capable d'éviter la fuite de gaz interne, comprenant un corps de conteneur (3) ouvert vers le haut et présentant un volume interne déterminé et une enveloppe de corps (21) disposée sur le corps du conteneur (3) destinée à obturer la portion d'ouverture (11), dans laquelle une portion annulaire de rainure en creux (12) ouverte vers le haut est constituée dans la partie périphérique de la portion terminale supérieure (10) du corps de conteneur (3) et du liquide est stocké dans la portion de rainure en creux (12), une portion de suspension s'étendant vers le bas à partir de la portion de rebord périphérique de l'enveloppe de corps (21) est constituée sur le rebord périphérique de l'enveloppe de corps (21), et la portion de suspension est fixée sur la portion terminale supérieure (10) du corps de conteneur (3) dans une disposition dans laquelle la portion terminale inférieure se trouve immergée dans le liquide stocké dans la rainure en creux (12).
PCT/JP2002/002222 2001-03-30 2002-03-08 Procede d'isolement de fuite dans un conteneur de gaz et conteneur comprenant une structure d'isolement de fuite de gaz interne WO2002082520A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001099127A JP3428969B2 (ja) 2001-03-30 2001-03-30 内部気体の漏出遮断構造を備えた容器
JP2001-099127 2001-03-30

Publications (1)

Publication Number Publication Date
WO2002082520A1 true WO2002082520A1 (fr) 2002-10-17

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/002222 WO2002082520A1 (fr) 2001-03-30 2002-03-08 Procede d'isolement de fuite dans un conteneur de gaz et conteneur comprenant une structure d'isolement de fuite de gaz interne

Country Status (5)

Country Link
JP (1) JP3428969B2 (fr)
KR (1) KR20030023614A (fr)
CN (1) CN1215536C (fr)
TW (1) TW535201B (fr)
WO (1) WO2002082520A1 (fr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63180927U (fr) * 1987-05-14 1988-11-22
US5845660A (en) * 1995-12-07 1998-12-08 Tokyo Electron Limited Substrate washing and drying apparatus, substrate washing method, and substrate washing apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63180927U (fr) * 1987-05-14 1988-11-22
US5845660A (en) * 1995-12-07 1998-12-08 Tokyo Electron Limited Substrate washing and drying apparatus, substrate washing method, and substrate washing apparatus

Also Published As

Publication number Publication date
JP3428969B2 (ja) 2003-07-22
CN1455949A (zh) 2003-11-12
TW535201B (en) 2003-06-01
CN1215536C (zh) 2005-08-17
KR20030023614A (ko) 2003-03-19
JP2002299311A (ja) 2002-10-11

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