WO2002058142A3 - Leistungsmodul - Google Patents
Leistungsmodul Download PDFInfo
- Publication number
- WO2002058142A3 WO2002058142A3 PCT/EP2001/014464 EP0114464W WO02058142A3 WO 2002058142 A3 WO2002058142 A3 WO 2002058142A3 EP 0114464 W EP0114464 W EP 0114464W WO 02058142 A3 WO02058142 A3 WO 02058142A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- power module
- carrier body
- relates
- embodied
- electronic component
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05599—Material
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/85399—Material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/466,588 US6952347B2 (en) | 2001-01-20 | 2001-12-10 | Power module |
EP01985858A EP1378008A2 (de) | 2001-01-20 | 2001-12-10 | Leistungsmodul |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10102621A DE10102621B4 (de) | 2001-01-20 | 2001-01-20 | Leistungsmodul |
DE10102621.8 | 2001-01-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002058142A2 WO2002058142A2 (de) | 2002-07-25 |
WO2002058142A3 true WO2002058142A3 (de) | 2003-11-06 |
Family
ID=7671269
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2001/014464 WO2002058142A2 (de) | 2001-01-20 | 2001-12-10 | Leistungsmodul |
Country Status (4)
Country | Link |
---|---|
US (1) | US6952347B2 (de) |
EP (1) | EP1378008A2 (de) |
DE (1) | DE10102621B4 (de) |
WO (1) | WO2002058142A2 (de) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10204200A1 (de) * | 2002-02-01 | 2003-08-21 | Conti Temic Microelectronic | Leistungsmodul |
DE10349775B4 (de) * | 2003-10-24 | 2006-05-11 | Sitronic Gmbh & Co. Kg | Schaltungsträger für Leuchtdioden |
US9153960B2 (en) | 2004-01-15 | 2015-10-06 | Comarco Wireless Technologies, Inc. | Power supply equipment utilizing interchangeable tips to provide power and a data signal to electronic devices |
DE102004024920B4 (de) * | 2004-05-19 | 2009-06-10 | Trafag Ag | Drucksensor |
DE102004057421B4 (de) * | 2004-11-27 | 2009-07-09 | Semikron Elektronik Gmbh & Co. Kg | Druckkontaktiertes Leistungshalbleitermodul für hohe Umgebungstemperaturen und Verfahren zu seiner Herstellung |
US7236368B2 (en) * | 2005-01-26 | 2007-06-26 | Power-One, Inc. | Integral molded heat sinks on DC-DC converters and power supplies |
US7593230B2 (en) * | 2005-05-05 | 2009-09-22 | Sensys Medical, Inc. | Apparatus for absorbing and dissipating excess heat generated by a system |
TWI449137B (zh) * | 2006-03-23 | 2014-08-11 | Ceramtec Ag | 構件或電路用的攜帶體 |
DE102006028675B4 (de) | 2006-06-22 | 2008-08-21 | Siemens Ag | Kühlanordnung für auf einer Trägerplatte angeordnete elektrische Bauelemente |
US7996987B2 (en) * | 2006-10-17 | 2011-08-16 | Broadcom Corporation | Single footprint family of integrated power modules |
DE102008018841A1 (de) | 2008-04-15 | 2009-10-22 | Conti Temic Microelectronic Gmbh | Verfahren zur Herstellung und Aufbau eines Leistungsmoduls |
JP5345017B2 (ja) | 2009-08-27 | 2013-11-20 | 三菱電機株式会社 | 電力用半導体装置とその製造方法 |
US8203839B2 (en) * | 2010-03-10 | 2012-06-19 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling devices, power modules, and vehicles incorporating the same |
US20110228486A1 (en) * | 2010-03-17 | 2011-09-22 | Comarco Wireless Technologies, Inc. | Power supply with low touch-temperature surface |
DE102010062944A1 (de) * | 2010-12-13 | 2012-06-14 | Zf Friedrichshafen Ag | Leiterplatte und Verfahren zur Herstellung einer solchen |
DE102014107217A1 (de) * | 2014-05-19 | 2015-11-19 | Ceram Tec Gmbh | Leistungshalbleitermodul |
DE102015215682A1 (de) * | 2015-08-18 | 2016-09-08 | Continental Automotive Gmbh | Kühlvorrichtung, Leistungselektronikanordnung mit einer Kühlvorrichtung |
DE102016202547A1 (de) * | 2016-02-18 | 2017-08-24 | Zf Friedrichshafen Ag | Integriertes Steuergerät für ein Fahrzeug und Verfahren zum Herstellen eines integrierten Steuergerätes für ein Fahrzeug |
AT519741B1 (de) * | 2017-07-18 | 2018-10-15 | Zkw Group Gmbh | Thermische Kopplung von Kupferspreizflächen |
EP3671828A1 (de) * | 2018-12-21 | 2020-06-24 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Mikrochip-verdunstungskühlung |
DE102019202425A1 (de) | 2019-02-22 | 2020-10-22 | Volkswagen Aktiengesellschaft | Anordnung zum gleichmäßigen Kühlen von Bauteilen und Kraftfahrzeug mit zumindest einer Anordnung |
USD942403S1 (en) * | 2019-10-24 | 2022-02-01 | Wolfspeed, Inc. | Power module having pin fins |
USD963574S1 (en) * | 2020-04-10 | 2022-09-13 | Fukushima Sic Applied Engineering Inc. | Power supply |
DE102021208579A1 (de) | 2021-08-06 | 2023-02-09 | Zf Friedrichshafen Ag | Getriebe für ein Kraftfahrzeug |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3766440A (en) * | 1972-08-11 | 1973-10-16 | Gen Motors Corp | Ceramic integrated circuit convector assembly |
FR2308072A1 (fr) * | 1975-04-18 | 1976-11-12 | Burnham Europa Bv | Echangeur de chaleur pour le chauffage d'un fluide |
JPS5769768A (en) * | 1980-10-20 | 1982-04-28 | Fujitsu Ltd | Equipping structure of electronic circuit unit containing high electric power parts |
DE4238417A1 (de) * | 1991-11-14 | 1993-05-19 | Mitsubishi Electric Corp | |
EP0551726A1 (de) * | 1991-12-16 | 1993-07-21 | AT&T Corp. | Baugruppenlayout mit verbesserter Ableitung von Wärme produziert von elektronischen Hochleistungskomponenten |
DE19527867A1 (de) * | 1995-07-29 | 1997-01-30 | Schulz Harder Juergen | Metall-Substrat für elektrische und/oder elektronische Schaltkreise |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2902771A1 (de) * | 1978-07-21 | 1980-01-31 | Bbc Brown Boveri & Cie | Kuehlvorrichtung fuer halbleiterbauelemente |
US4546410A (en) * | 1983-10-31 | 1985-10-08 | Kaufman Lance R | Circuit package with membrane, containing thermoconductive material, ruptured against a heat sink |
JPH02276264A (ja) * | 1989-04-18 | 1990-11-13 | Nec Corp | ヒートシンク付セラミックパッケージ |
US5041902A (en) * | 1989-12-14 | 1991-08-20 | Motorola, Inc. | Molded electronic package with compression structures |
DE9017041U1 (de) * | 1990-12-18 | 1991-03-07 | Akyuerek, Altan, Dipl.-Ing., 8560 Lauf, De | |
EP0499707B1 (de) * | 1991-02-22 | 1996-04-03 | Asea Brown Boveri Ag | Abschaltbares Hochleistungs-Halbleiterbauelement |
US5158912A (en) * | 1991-04-09 | 1992-10-27 | Digital Equipment Corporation | Integral heatsink semiconductor package |
US5212627A (en) * | 1992-01-31 | 1993-05-18 | Motorola, Inc. | Electronic module housing and assembly with integral heatsink |
US6140571A (en) * | 1992-08-06 | 2000-10-31 | Pfu Limited | Heat-generating element cooling device |
US6326678B1 (en) * | 1993-09-03 | 2001-12-04 | Asat, Limited | Molded plastic package with heat sink and enhanced electrical performance |
US5447189A (en) * | 1993-12-16 | 1995-09-05 | Mcintyre; Gerald L. | Method of making heat sink having elliptical pins |
EP0835524A1 (de) * | 1996-01-04 | 1998-04-15 | Daimler-Benz Aktiengesellschaft | Kühlkörper mit zapfen |
DE19817333C5 (de) | 1998-04-18 | 2007-04-26 | Conti Temic Microelectronic Gmbh | Elektrische Antriebseinheit aus Elektromotor und Elektronikmodul |
US6337228B1 (en) * | 1999-05-12 | 2002-01-08 | Amkor Technology, Inc. | Low-cost printed circuit board with integral heat sink for semiconductor package |
US6729383B1 (en) * | 1999-12-16 | 2004-05-04 | The United States Of America As Represented By The Secretary Of The Navy | Fluid-cooled heat sink with turbulence-enhancing support pins |
US20020018338A1 (en) * | 2000-01-11 | 2002-02-14 | Mccullough Kevin A. | Insert molded heat sink assembly |
US6212074B1 (en) * | 2000-01-31 | 2001-04-03 | Sun Microsystems, Inc. | Apparatus for dissipating heat from a circuit board having a multilevel surface |
US6614123B2 (en) * | 2001-07-31 | 2003-09-02 | Chippac, Inc. | Plastic ball grid array package with integral heatsink |
-
2001
- 2001-01-20 DE DE10102621A patent/DE10102621B4/de not_active Expired - Lifetime
- 2001-12-10 US US10/466,588 patent/US6952347B2/en not_active Expired - Lifetime
- 2001-12-10 WO PCT/EP2001/014464 patent/WO2002058142A2/de active Application Filing
- 2001-12-10 EP EP01985858A patent/EP1378008A2/de not_active Ceased
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3766440A (en) * | 1972-08-11 | 1973-10-16 | Gen Motors Corp | Ceramic integrated circuit convector assembly |
FR2308072A1 (fr) * | 1975-04-18 | 1976-11-12 | Burnham Europa Bv | Echangeur de chaleur pour le chauffage d'un fluide |
JPS5769768A (en) * | 1980-10-20 | 1982-04-28 | Fujitsu Ltd | Equipping structure of electronic circuit unit containing high electric power parts |
DE4238417A1 (de) * | 1991-11-14 | 1993-05-19 | Mitsubishi Electric Corp | |
EP0551726A1 (de) * | 1991-12-16 | 1993-07-21 | AT&T Corp. | Baugruppenlayout mit verbesserter Ableitung von Wärme produziert von elektronischen Hochleistungskomponenten |
DE19527867A1 (de) * | 1995-07-29 | 1997-01-30 | Schulz Harder Juergen | Metall-Substrat für elektrische und/oder elektronische Schaltkreise |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 006, no. 147 (E - 123) 6 August 1982 (1982-08-06) * |
PILGRAM H R: "Ceramic Substrate with Inherent Heat Exchanger. October 1969.", IBM TECHNICAL DISCLOSURE BULLETIN, vol. 12, no. 5, 1 October 1969 (1969-10-01), New York, US, pages 728 - 729, XP002237832 * |
Also Published As
Publication number | Publication date |
---|---|
US6952347B2 (en) | 2005-10-04 |
DE10102621B4 (de) | 2006-05-24 |
WO2002058142A2 (de) | 2002-07-25 |
EP1378008A2 (de) | 2004-01-07 |
DE10102621A1 (de) | 2002-08-01 |
US20040057208A1 (en) | 2004-03-25 |
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